JPWO2020175390A1 - - Google Patents

Info

Publication number
JPWO2020175390A1
JPWO2020175390A1 JP2021502212A JP2021502212A JPWO2020175390A1 JP WO2020175390 A1 JPWO2020175390 A1 JP WO2020175390A1 JP 2021502212 A JP2021502212 A JP 2021502212A JP 2021502212 A JP2021502212 A JP 2021502212A JP WO2020175390 A1 JPWO2020175390 A1 JP WO2020175390A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021502212A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020175390A1 publication Critical patent/JPWO2020175390A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021502212A 2019-02-25 2020-02-21 Pending JPWO2020175390A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019032007 2019-02-25
PCT/JP2020/007175 WO2020175390A1 (ja) 2019-02-25 2020-02-21 防水部品およびそれを備えた電子機器、インサート成形体を用いる防水方法ならびに電子機器の防水方法

Publications (1)

Publication Number Publication Date
JPWO2020175390A1 true JPWO2020175390A1 (ja) 2020-09-03

Family

ID=72238470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021502212A Pending JPWO2020175390A1 (ja) 2019-02-25 2020-02-21

Country Status (5)

Country Link
US (1) US20220056268A1 (ja)
EP (1) EP3932979A4 (ja)
JP (1) JPWO2020175390A1 (ja)
CN (1) CN113474408A (ja)
WO (1) WO2020175390A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024048508A1 (ja) * 2022-09-02 2024-03-07 三井化学株式会社 ポリアミド樹脂組成物、金属樹脂接合体およびその製造方法、バスバーユニット、駆動ユニットならびに移動体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123461A (ja) * 1989-12-27 1992-04-23 Polyplastics Co リードフレームインサート用樹脂材料及びその成形部品
JPH04211916A (ja) * 1990-03-09 1992-08-03 Polyplastics Co 金属をインサートした成形品
JP2013249363A (ja) * 2012-05-31 2013-12-12 Toray Ind Inc ポリアミド樹脂組成物および樹脂金属複合体
WO2016103470A1 (ja) * 2014-12-26 2016-06-30 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
JP2016124885A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
WO2017110646A1 (ja) * 2015-12-22 2017-06-29 ポリプラスチックス株式会社 液晶性樹脂組成物及びインサート成形品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3273688B2 (ja) 1993-12-24 2002-04-08 株式会社クラレ ポリアミド
JP5145535B2 (ja) * 2005-03-14 2013-02-20 日立化成工業株式会社 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008156616A (ja) * 2006-11-28 2008-07-10 Toray Ind Inc 樹脂組成物およびそれからなる成形品
JP5271894B2 (ja) * 2007-03-30 2013-08-21 三井化学株式会社 難燃性ポリアミド組成物
KR20140109944A (ko) * 2012-01-11 2014-09-16 가부시키가이샤 구라레 열가소성 중합체 조성물 및 성형품
JP2014141630A (ja) * 2012-12-27 2014-08-07 Toray Ind Inc ポリアミド樹脂組成物
JP6195766B2 (ja) * 2013-09-02 2017-09-13 旭化成株式会社 ポリアミド樹脂組成物及び成形品
EP3409713B1 (en) * 2016-01-29 2022-06-15 Kuraray Co., Ltd. Molded article and method for production thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123461A (ja) * 1989-12-27 1992-04-23 Polyplastics Co リードフレームインサート用樹脂材料及びその成形部品
JPH04211916A (ja) * 1990-03-09 1992-08-03 Polyplastics Co 金属をインサートした成形品
JP2013249363A (ja) * 2012-05-31 2013-12-12 Toray Ind Inc ポリアミド樹脂組成物および樹脂金属複合体
WO2016103470A1 (ja) * 2014-12-26 2016-06-30 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
JP2016124885A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物及びインサート成形品
WO2017110646A1 (ja) * 2015-12-22 2017-06-29 ポリプラスチックス株式会社 液晶性樹脂組成物及びインサート成形品

Also Published As

Publication number Publication date
US20220056268A1 (en) 2022-02-24
WO2020175390A1 (ja) 2020-09-03
EP3932979A1 (en) 2022-01-05
CN113474408A (zh) 2021-10-01
EP3932979A4 (en) 2022-12-28

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