JPWO2020150017A5

JPWO2020150017A5 -

Info

Publication number: JPWO2020150017A5
Application number: JP2021540490A
Authority: JP
Publication date: 2022-12-06
Anticipated expiration: 2040-01-04

Claims

A removable storage device, the removable storage device comprising:
a memory configured to store data;
a processor in communication with the memory;
The processor is
responsive to initializing operation of the removable storage device, identifying an environment around the removable storage device as a thermally enhanced environment or a non-thermally enhanced environment;
Adjusting a thermal control loop algorithm of the removable storage device based on the environment to provide an expected temperature rise per unit of processing work by the processor in response to identifying the thermally enhanced environment. reduce and
operable to control processing operations of the processor in response to the thermal control loop algorithm;
Removable storage device.

To adjust the thermal control loop algorithm, the processor comprises:
selecting a first set of one or more control loop parameters for use in the thermal control loop algorithm in response to identifying the thermally enhanced environment; and the non-thermally enhanced environment. responsive to identifying an environment, selecting a second set of one or more control loop parameters for the thermal control loop algorithm;
The thermal control loop algorithm using the first set of the one or more control loop parameters is compared to the thermal control loop algorithm using the second set of the one or more control loop parameters. 2. The removable storage device of claim 1, wherein a lower expected temperature rise per unit of processing work is performed by said processor.

The thermal control loop algorithm is a first thermal control loop algorithm, and to adjust the thermal control loop algorithm, the processor comprises:
selecting a second thermal control loop algorithm in response to identifying the thermally enhanced environment; and selecting a third thermal control loop algorithm in response to identifying the non-thermally enhanced environment. select, is configured to
2. The removable storage device of claim 1, wherein the second thermal control loop algorithm provides a lower predicted temperature rise per unit of process work as compared to the third thermal control loop algorithm.

To control processing operations of the processor, the processor:
receive processor work requests;
determining an expected temperature rise according to the thermal control loop algorithm;
identify the current temperature,
comparing the sum of the current temperature and the expected temperature rise to a thermal threshold;
accepting the processor work request in response to the sum being less than or equal to the thermal threshold; and delaying the processor work request in response to the sum being greater than the thermal threshold. The removable storage device of claim 1, further configured to:

The memory comprises non-volatile memory, and the removable storage device comprises:
further comprising at least one of a processor temperature sensor configured to detect a current temperature of said processor or a memory temperature sensor configured to detect a current temperature of said non-volatile memory;
to determine the expected temperature rise, the processor is further configured to determine at least one of an expected temperature rise of a processor or an expected temperature rise of a non-volatile memory;
to determine the current temperature, the processor is further configured to determine at least one of the current temperature of the processor or the current temperature of the non-volatile memory;
the thermal thresholds include at least one of a processor thermal threshold or a memory thermal threshold;
the processor comparing a first sum of the current temperature of the processor and an expected temperature rise of the processor to the processor thermal threshold to compare the sum to the thermal threshold; or further configured to perform at least one of comparing a second sum of the current temperature of the non-volatile memory and the expected elevated temperature of the non-volatile memory to the memory thermal threshold;
The processor accepts the processor work request in response to at least one of the first sum being less than or equal to the processor thermal threshold or the second sum being less than or equal to the memory thermal threshold. is further configured as
The processor delays the processor work request in response to at least one of the first sum being greater than the processor thermal threshold or the second sum being greater than the memory thermal threshold. It is further configured to allow 5. The removable storage device of claim 4.

The processor
detecting a change in the thermally enhanced environment after the initialization;
generating an updated thermal control loop by updating the thermal control loop algorithm of the removable storage device based on the change in the thermally enhanced environment; and the updated thermal control loop algorithm. 2. The removable storage device of claim 1, further configured to control processing operations of the processor in response to.

To detect changes in the thermally enhanced environment, the processor comprises:
a cooling device turned on in said thermally enhanced environment;
7. The apparatus of claim 6 further configured to detect at least one of a cooling device being turned off in the thermally enhanced environment or a change in heat dissipation rate of the thermally enhanced environment. Removable storage device as described.

further comprising at least one input/output (I/O) pin in communication with the processor, the input/output (I/O) pin being responsive to the thermally enhanced environment or the thermal interface during the initialization; 2. The removable storage device of claim 1, configured to receive an environment identification signal that identifies any of the unenhanced environments.

a housing in which the memory and the processor are mounted, the housing having an outer surface;
a heat-conducting element defining a portion of or connected to the exterior surface of the housing, the heat-conducting element configured to dissipate at least some heat from within the housing. 2. The removable storage device of claim 1, comprising:

further comprising at least one input/output (I/O) pin having an electrical path in communication with the processor and connecting to the thermally conductive element, the I/O pin being responsive to the thermal interface during the initialization; 10. The removable storage device of claim 9, configured to receive an environment identification signal over the electrical path that identifies either the thermally enhanced environment or the non-thermally enhanced environment.

The thermally conductive element is aligned with a contact area of a thermal interface member of the host device in response to movement of the removable storage device to a second position relative to the host device. 10. The removable storage device of claim 9, having one position, said second position including an insertion position.

the processor is further configured to detect the initialization by determining whether the removable storage device is connected to a host device;
The host device includes a structure that defines the environment around the removable storage device, and initializes the operation of the removable storage device when determined to be connected to the host device. 2. The removable storage device of claim 1, wherein the removable storage device indicates that

A method of operating a removable storage device, the method comprising:
identifying an environment around the removable storage device as a thermally enhanced environment or a non-thermally enhanced environment in response to initializing operation of the removable storage device;
adjusting a thermal control loop algorithm of the removable storage device based on the environment;
controlling processing operations of a processor in response to the thermal control loop algorithm;
The controlling step includes:
determining an expected temperature rise according to the thermal control loop algorithm;
accepting or delaying a processor work request based on said expected temperature rise and current temperature;
How it works.

Adjusting the thermal control loop algorithm comprises:
selecting a first set of one or more control loop parameters for use in the thermal control loop algorithm in response to identifying the thermally enhanced environment;
selecting a second set of one or more control loop parameters for the thermal control loop algorithm in response to identifying the non-thermally enhanced environment;
The thermal control loop algorithm using the first set of the one or more control loop parameters is compared to the thermal control loop algorithm using the second set of the one or more control loop parameters. 14. The method of operation of claim 13, further comprising reducing the expected temperature rise per unit of processing work by said processor.

The thermal control loop algorithm is a first thermal control loop algorithm, and adjusting the thermal control loop algorithm comprises:
selecting a second thermal control loop algorithm in response to identifying the thermally enhanced environment;
selecting a third thermal control loop algorithm in response to identifying the non-thermally enhanced environment;
14. The method of operation of claim 13, wherein said second thermal control loop algorithm provides a lower predicted temperature rise per unit of process work as compared to said third thermal control loop algorithm.