JPWO2020068345A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020068345A5 JPWO2020068345A5 JP2021515551A JP2021515551A JPWO2020068345A5 JP WO2020068345 A5 JPWO2020068345 A5 JP WO2020068345A5 JP 2021515551 A JP2021515551 A JP 2021515551A JP 2021515551 A JP2021515551 A JP 2021515551A JP WO2020068345 A5 JPWO2020068345 A5 JP WO2020068345A5
- Authority
- JP
- Japan
- Prior art keywords
- spectrum
- monitoring system
- situ
- window
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001228 spectrum Methods 0.000 description 9
- 238000011065 in-situ storage Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 2
- 238000013528 artificial neural network Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Description
例1
インシトゥモニタリングシステム100は、分光モニタリングシステムでありうる。同一のウインドウ36が、この分光モニタリングシステムとインシトゥ撮像システム150のセンサによって使用されうる。基板10のスペクトルが収集された部分の二次元画像を再構築するために、インシトゥ撮像システム150のラインスキャンカメラからのデータのウインドウであって、インシトゥモニタリングシステム100によるスペクトルの取得時間を中心とするウインドウが、使用されうる。
Example 1
In
分類は、変換アルゴリズムモジュール220によって使用されうる。例えば、コントローラ90は、各参照スペクトルが関連測定値(例えば指標値)を有している、参照スペクトルの複数のライブラリを格納しうる。コントローラ90は、ニューラルネットワーク210から受信した分類に基づいて、ライブラリのうちの1つを選択しうる。次いで、例えば、測定スペクトルとの差の二乗の最小和を有する参照スペクトルを見出すことによって、選択されたライブラリから、測定スペクトルと最も良く一致する参照スペクトルが特定されうる。この最も良く一致する参照スペクトルの指標値が次いで、測定値として使用されうる。
The classification may be used by transform algorithm module 220 . For example,
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862735772P | 2018-09-24 | 2018-09-24 | |
US62/735,772 | 2018-09-24 | ||
PCT/US2019/048636 WO2020068345A1 (en) | 2018-09-24 | 2019-08-28 | Machine vision as input to a cmp process control algorithm |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022501207A JP2022501207A (en) | 2022-01-06 |
JPWO2020068345A5 true JPWO2020068345A5 (en) | 2022-09-07 |
JP7472111B2 JP7472111B2 (en) | 2024-04-22 |
Family
ID=69883039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021515551A Active JP7472111B2 (en) | 2018-09-24 | 2019-08-28 | Machine Vision as Input to CMP Process Control Algorithms |
Country Status (6)
Country | Link |
---|---|
US (2) | US11577356B2 (en) |
JP (1) | JP7472111B2 (en) |
KR (1) | KR20210052559A (en) |
CN (2) | CN112823080B (en) |
TW (1) | TW202027908A (en) |
WO (1) | WO2020068345A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020131353A (en) * | 2019-02-19 | 2020-08-31 | パナソニックIpマネジメント株式会社 | Polishing system, learning device, and learning method of learning device |
US11602821B2 (en) * | 2020-01-17 | 2023-03-14 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer polishing head, system thereof, and method using the same |
CN111523645B (en) * | 2020-04-16 | 2023-04-18 | 北京航天自动控制研究所 | Convolutional neural network design method for improving small-scale target detection and identification performance |
US11791224B2 (en) * | 2020-05-14 | 2023-10-17 | Applied Materials, Inc. | Technique for training neural network for use in in-situ monitoring during polishing and polishing system |
US11847776B2 (en) | 2020-06-29 | 2023-12-19 | Applied Materials, Inc. | System using film thickness estimation from machine learning based processing of substrate images |
CN112102268A (en) * | 2020-09-01 | 2020-12-18 | 北京航空航天大学 | Intelligent laser polishing module based on machine learning ultra-thin mask version of polishing |
EP4263131A1 (en) * | 2020-12-18 | 2023-10-25 | Applied Materials, Inc. | Adaptive slurry dispense system |
CN114211397B (en) * | 2021-12-14 | 2023-11-17 | 常州先进制造技术研究所 | Surface polishing control method for paper structural member |
TWI800195B (en) * | 2021-12-30 | 2023-04-21 | 大量科技股份有限公司 | Intelligent analysis system for measuring signal of polishing pad surface, method and the computer readable medium thereof |
CN114918817A (en) * | 2022-05-27 | 2022-08-19 | 河南科技学院 | Roll-to-Roll chemical mechanical polishing device and method |
JP2024047495A (en) * | 2022-09-26 | 2024-04-05 | 株式会社Screenホールディングス | LEARNING APPARATUS, INFORMATION PROCESSING APPARATUS, SUBSTRATE ... SYSTEM, LEARNING METHOD, AND PROCESSING CONDITION DETERMINATION METHOD |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
US5985032A (en) | 1995-05-17 | 1999-11-16 | Matsushita Electric Industrial Co., Ltd. | Semiconductor manufacturing apparatus |
US6075883A (en) | 1996-11-12 | 2000-06-13 | Robotic Vision Systems, Inc. | Method and system for imaging an object or pattern |
JPH10166262A (en) * | 1996-12-10 | 1998-06-23 | Nikon Corp | Polishing device |
JPH10294297A (en) * | 1997-04-18 | 1998-11-04 | Nikon Corp | Polishing device |
US6390019B1 (en) | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
JP2000233369A (en) * | 1999-02-15 | 2000-08-29 | Noritake Co Ltd | Grinding condition monitoring device and dressing condition monitoring device |
JP2001287159A (en) * | 2000-04-05 | 2001-10-16 | Nikon Corp | Surface condition measuring method and measuring device, polishing machine, and semiconductor device manufacturing method |
US7374477B2 (en) * | 2002-02-06 | 2008-05-20 | Applied Materials, Inc. | Polishing pads useful for endpoint detection in chemical mechanical polishing |
US6924641B1 (en) * | 2000-05-19 | 2005-08-02 | Applied Materials, Inc. | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
US6722946B2 (en) * | 2002-01-17 | 2004-04-20 | Nutool, Inc. | Advanced chemical mechanical polishing system with smart endpoint detection |
TWI273947B (en) | 2002-02-06 | 2007-02-21 | Applied Materials Inc | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
KR100979071B1 (en) | 2002-02-22 | 2010-08-31 | 에이저 시스템즈 인크 | Chemical mechanical polishing of dual orientation polycrystalline materials |
US6937915B1 (en) | 2002-03-28 | 2005-08-30 | Lam Research Corporation | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
JP4020739B2 (en) | 2002-09-27 | 2007-12-12 | 株式会社荏原製作所 | Polishing device |
US6807503B2 (en) | 2002-11-04 | 2004-10-19 | Brion Technologies, Inc. | Method and apparatus for monitoring integrated circuit fabrication |
WO2004090502A2 (en) | 2003-04-01 | 2004-10-21 | Filmetrics, Inc. | Whole-substrate spectral imaging system for cmp |
US7001243B1 (en) * | 2003-06-27 | 2006-02-21 | Lam Research Corporation | Neural network control of chemical mechanical planarization |
TWI316754B (en) | 2004-03-17 | 2009-11-01 | Taiwan Semiconductor Mfg | Image sensor fabrication method and structure |
US7076320B1 (en) | 2004-05-04 | 2006-07-11 | Advanced Micro Devices, Inc. | Scatterometry monitor in cluster process tool environment for advanced process control (APC) |
US20060025048A1 (en) * | 2004-07-28 | 2006-02-02 | 3M Innovative Properties Company | Abrasive article detection system and method |
US7409260B2 (en) * | 2005-08-22 | 2008-08-05 | Applied Materials, Inc. | Substrate thickness measuring during polishing |
KR101423579B1 (en) | 2005-08-22 | 2014-07-25 | 어플라이드 머티어리얼스, 인코포레이티드 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US7226339B2 (en) | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
WO2007024807A2 (en) | 2005-08-22 | 2007-03-01 | Applied Materials, Inc. | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US20070077671A1 (en) * | 2005-10-03 | 2007-04-05 | Applied Materials | In-situ substrate imaging |
JP2007266235A (en) | 2006-03-28 | 2007-10-11 | Ebara Corp | Polishing device |
KR20080013059A (en) * | 2006-08-07 | 2008-02-13 | 삼성전자주식회사 | Equipment and method for checking wafer of chemical mechanical polishing process device trereof |
JP2008137103A (en) | 2006-11-30 | 2008-06-19 | Ebara Corp | Substrate holding device, substrate polishing device, and substrate polishing method |
WO2009051815A1 (en) | 2007-10-19 | 2009-04-23 | Bipar Sciences, Inc. | Methods and compositions for the treatment of cancer using benzopyrone-type parp inhibitors |
JP2009129970A (en) | 2007-11-20 | 2009-06-11 | Ebara Corp | Polishing apparatus and polishing method |
JP5361299B2 (en) * | 2008-09-12 | 2013-12-04 | 株式会社東京精密 | Polishing completion prediction / detection method and apparatus |
US9011202B2 (en) | 2012-04-25 | 2015-04-21 | Applied Materials, Inc. | Fitting of optical model with diffraction effects to measured spectrum |
US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
US9095952B2 (en) | 2013-01-23 | 2015-08-04 | Applied Materials, Inc. | Reflectivity measurements during polishing using a camera |
US10012494B2 (en) | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US9375824B2 (en) | 2013-11-27 | 2016-06-28 | Applied Materials, Inc. | Adjustment of polishing rates during substrate polishing with predictive filters |
US10478937B2 (en) | 2015-03-05 | 2019-11-19 | Applied Materials, Inc. | Acoustic emission monitoring and endpoint for chemical mechanical polishing |
US10565701B2 (en) | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
US11580398B2 (en) | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
TWI807987B (en) | 2016-11-30 | 2023-07-01 | 美商應用材料股份有限公司 | Spectrographic monitoring using a neural network |
CN108051364A (en) | 2017-12-13 | 2018-05-18 | 中国科学院长春应用化学研究所 | A kind of EPR nuclear energy cable residue lifetime estimation method and prediction EPR nuclear energy cable remaining life methods |
-
2019
- 2019-08-28 CN CN201980066820.1A patent/CN112823080B/en active Active
- 2019-08-28 CN CN202310816202.2A patent/CN117001534A/en active Pending
- 2019-08-28 WO PCT/US2019/048636 patent/WO2020068345A1/en active Application Filing
- 2019-08-28 JP JP2021515551A patent/JP7472111B2/en active Active
- 2019-08-28 KR KR1020217011806A patent/KR20210052559A/en unknown
- 2019-08-28 US US16/554,427 patent/US11577356B2/en active Active
- 2019-09-18 TW TW108133507A patent/TW202027908A/en unknown
-
2023
- 2023-02-02 US US18/163,835 patent/US20230182258A1/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10094713B2 (en) | Hyperspectral demixing using foveated compressive projections | |
US20140022381A1 (en) | Radiometric multi-spectral or hyperspectral camera array using matched area sensors and a calibrated ambient light collection device | |
JPWO2020068345A5 (en) | ||
US9300865B2 (en) | Random imaging | |
CN108700524B (en) | Raman spectroscopy-based measurements in patterned structures | |
Aiazzi et al. | Noise modelling and estimation of hyperspectral data from airborne imaging spectrometers | |
Folch‐Fortuny et al. | Calibration transfer between NIR spectrometers: New proposals and a comparative study | |
WO2015112335A1 (en) | Measurement of film thickness on an arbitrary substrate | |
JP2014212509A (en) | Method of generating spatial and spectral object model | |
US10101206B2 (en) | Spectral imaging method and system | |
EP2153298A1 (en) | Method and system for compressed imaging | |
JP5941514B2 (en) | Discriminating from spectral and spatial object models | |
US20130208944A1 (en) | Method and apparatus for object tracking via hyperspectral imagery | |
JP2019190927A5 (en) | Analyzer, imaging system, and program | |
US20200370960A1 (en) | Spectral imaging systems, devices and methods | |
AU2011211336B2 (en) | Decomposing hyperspectral or multispectral image data | |
CN113272639B (en) | Method for extracting spectral information of substance to be detected | |
CN112974303A (en) | Hyperspectrum-based fruit quality detection method, device and medium | |
JP5807111B2 (en) | Image generation system and image generation method | |
Acito et al. | Robust technique for anomalous change detection in airborne hyperspectral imagery based on automatic and adaptive band selection | |
JP6288445B2 (en) | Spectrum processing apparatus, spectrum processing program, spectrum processing system, and spectrum processing method | |
CN207457048U (en) | A kind of self adaptive imaging device | |
De Kerf et al. | Quantitative detection of corrosion minerals in carbon steel using shortwave infrared hyperspectral imaging | |
Zhang et al. | Reflectance estimation using local regression methods | |
Bahrami et al. | Classification of Hyper Spectral Image Various Plant Classes via Coding Method in the Reflectance and its Derivatives |