JPWO2020068345A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2020068345A5
JPWO2020068345A5 JP2021515551A JP2021515551A JPWO2020068345A5 JP WO2020068345 A5 JPWO2020068345 A5 JP WO2020068345A5 JP 2021515551 A JP2021515551 A JP 2021515551A JP 2021515551 A JP2021515551 A JP 2021515551A JP WO2020068345 A5 JPWO2020068345 A5 JP WO2020068345A5
Authority
JP
Japan
Prior art keywords
spectrum
monitoring system
situ
window
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021515551A
Other languages
Japanese (ja)
Other versions
JP2022501207A (en
JP7472111B2 (en
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/048636 external-priority patent/WO2020068345A1/en
Publication of JP2022501207A publication Critical patent/JP2022501207A/en
Publication of JPWO2020068345A5 publication Critical patent/JPWO2020068345A5/ja
Application granted granted Critical
Publication of JP7472111B2 publication Critical patent/JP7472111B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

例1
インシトゥモニタリングシステム100は、分光モニタリングシステムでありうる。同一のウインドウ36が、この分光モニタリングシステムとインシトゥ撮像システム150のセンサによって使用されうる。基板10のスペクトルが収集された部分の二次元画像を再構築するために、インシトゥ撮像システム150のラインスキャンカメラからのデータのウインドウであって、インシトゥモニタリングシステム100によるスペクトルの取得時間を中心とするウインドウが、使用されうる。
Example 1
In situ monitoring system 100 may be a spectroscopic monitoring system. The same window 36 can be used by the sensors of this spectroscopic monitoring system and the in-situ imaging system 150 . To reconstruct a two-dimensional image of the portion of the substrate 10 for which the spectrum was collected, a window of data from the linescan camera of the in-situ imaging system 150, centered around the acquisition time of the spectrum by the in-situ monitoring system 100. window can be used.

分類は、変換アルゴリズムモジュール220によって使用されうる。例えば、コントローラ90は、各参照スペクトルが関連測定値(例えば指標値)を有している、参照スペクトルの複数のライブラリを格納しうる。コントローラ90は、ニューラルネットワーク210から受信した分類に基づいて、ライブラリのうちの1つを選択しうる。次いで、例えば、測定スペクトルとの差の二乗の最小和を有する参照スペクトルを見出すことによって、選択されたライブラリから、測定スペクトルと最も良く一致する参照スペクトルが特定されうる。この最も良く一致する参照スペクトルの指標値が次いで、測定値として使用されうる。
The classification may be used by transform algorithm module 220 . For example, controller 90 may store multiple libraries of reference spectra, each reference spectrum having an associated measurement value (eg, index value). Controller 90 may select one of the libraries based on the classification received from neural network 210 . A reference spectrum that best matches the measured spectrum can then be identified from the selected library, eg, by finding the reference spectrum that has the lowest sum of squared differences from the measured spectrum. The index value of this best matching reference spectrum can then be used as the measured value.

JP2021515551A 2018-09-24 2019-08-28 Machine Vision as Input to CMP Process Control Algorithms Active JP7472111B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862735772P 2018-09-24 2018-09-24
US62/735,772 2018-09-24
PCT/US2019/048636 WO2020068345A1 (en) 2018-09-24 2019-08-28 Machine vision as input to a cmp process control algorithm

Publications (3)

Publication Number Publication Date
JP2022501207A JP2022501207A (en) 2022-01-06
JPWO2020068345A5 true JPWO2020068345A5 (en) 2022-09-07
JP7472111B2 JP7472111B2 (en) 2024-04-22

Family

ID=69883039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515551A Active JP7472111B2 (en) 2018-09-24 2019-08-28 Machine Vision as Input to CMP Process Control Algorithms

Country Status (6)

Country Link
US (2) US11577356B2 (en)
JP (1) JP7472111B2 (en)
KR (1) KR20210052559A (en)
CN (2) CN112823080B (en)
TW (1) TW202027908A (en)
WO (1) WO2020068345A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020131353A (en) * 2019-02-19 2020-08-31 パナソニックIpマネジメント株式会社 Polishing system, learning device, and learning method of learning device
US11602821B2 (en) * 2020-01-17 2023-03-14 Taiwan Semiconductor Manufacturing Company Ltd. Wafer polishing head, system thereof, and method using the same
CN111523645B (en) * 2020-04-16 2023-04-18 北京航天自动控制研究所 Convolutional neural network design method for improving small-scale target detection and identification performance
US11791224B2 (en) * 2020-05-14 2023-10-17 Applied Materials, Inc. Technique for training neural network for use in in-situ monitoring during polishing and polishing system
US11847776B2 (en) 2020-06-29 2023-12-19 Applied Materials, Inc. System using film thickness estimation from machine learning based processing of substrate images
CN112102268A (en) * 2020-09-01 2020-12-18 北京航空航天大学 Intelligent laser polishing module based on machine learning ultra-thin mask version of polishing
EP4263131A1 (en) * 2020-12-18 2023-10-25 Applied Materials, Inc. Adaptive slurry dispense system
CN114211397B (en) * 2021-12-14 2023-11-17 常州先进制造技术研究所 Surface polishing control method for paper structural member
TWI800195B (en) * 2021-12-30 2023-04-21 大量科技股份有限公司 Intelligent analysis system for measuring signal of polishing pad surface, method and the computer readable medium thereof
CN114918817A (en) * 2022-05-27 2022-08-19 河南科技学院 Roll-to-Roll chemical mechanical polishing device and method
JP2024047495A (en) * 2022-09-26 2024-04-05 株式会社Screenホールディングス LEARNING APPARATUS, INFORMATION PROCESSING APPARATUS, SUBSTRATE ... SYSTEM, LEARNING METHOD, AND PROCESSING CONDITION DETERMINATION METHOD

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5985032A (en) 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
US6075883A (en) 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
JPH10166262A (en) * 1996-12-10 1998-06-23 Nikon Corp Polishing device
JPH10294297A (en) * 1997-04-18 1998-11-04 Nikon Corp Polishing device
US6390019B1 (en) 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
JP2000233369A (en) * 1999-02-15 2000-08-29 Noritake Co Ltd Grinding condition monitoring device and dressing condition monitoring device
JP2001287159A (en) * 2000-04-05 2001-10-16 Nikon Corp Surface condition measuring method and measuring device, polishing machine, and semiconductor device manufacturing method
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
TWI273947B (en) 2002-02-06 2007-02-21 Applied Materials Inc Method and apparatus of eddy current monitoring for chemical mechanical polishing
KR100979071B1 (en) 2002-02-22 2010-08-31 에이저 시스템즈 인크 Chemical mechanical polishing of dual orientation polycrystalline materials
US6937915B1 (en) 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
JP4020739B2 (en) 2002-09-27 2007-12-12 株式会社荏原製作所 Polishing device
US6807503B2 (en) 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
WO2004090502A2 (en) 2003-04-01 2004-10-21 Filmetrics, Inc. Whole-substrate spectral imaging system for cmp
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
TWI316754B (en) 2004-03-17 2009-11-01 Taiwan Semiconductor Mfg Image sensor fabrication method and structure
US7076320B1 (en) 2004-05-04 2006-07-11 Advanced Micro Devices, Inc. Scatterometry monitor in cluster process tool environment for advanced process control (APC)
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
KR101423579B1 (en) 2005-08-22 2014-07-25 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
WO2007024807A2 (en) 2005-08-22 2007-03-01 Applied Materials, Inc. Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US20070077671A1 (en) * 2005-10-03 2007-04-05 Applied Materials In-situ substrate imaging
JP2007266235A (en) 2006-03-28 2007-10-11 Ebara Corp Polishing device
KR20080013059A (en) * 2006-08-07 2008-02-13 삼성전자주식회사 Equipment and method for checking wafer of chemical mechanical polishing process device trereof
JP2008137103A (en) 2006-11-30 2008-06-19 Ebara Corp Substrate holding device, substrate polishing device, and substrate polishing method
WO2009051815A1 (en) 2007-10-19 2009-04-23 Bipar Sciences, Inc. Methods and compositions for the treatment of cancer using benzopyrone-type parp inhibitors
JP2009129970A (en) 2007-11-20 2009-06-11 Ebara Corp Polishing apparatus and polishing method
JP5361299B2 (en) * 2008-09-12 2013-12-04 株式会社東京精密 Polishing completion prediction / detection method and apparatus
US9011202B2 (en) 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9095952B2 (en) 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US10478937B2 (en) 2015-03-05 2019-11-19 Applied Materials, Inc. Acoustic emission monitoring and endpoint for chemical mechanical polishing
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11580398B2 (en) 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
TWI807987B (en) 2016-11-30 2023-07-01 美商應用材料股份有限公司 Spectrographic monitoring using a neural network
CN108051364A (en) 2017-12-13 2018-05-18 中国科学院长春应用化学研究所 A kind of EPR nuclear energy cable residue lifetime estimation method and prediction EPR nuclear energy cable remaining life methods

Similar Documents

Publication Publication Date Title
US10094713B2 (en) Hyperspectral demixing using foveated compressive projections
US20140022381A1 (en) Radiometric multi-spectral or hyperspectral camera array using matched area sensors and a calibrated ambient light collection device
JPWO2020068345A5 (en)
US9300865B2 (en) Random imaging
CN108700524B (en) Raman spectroscopy-based measurements in patterned structures
Aiazzi et al. Noise modelling and estimation of hyperspectral data from airborne imaging spectrometers
Folch‐Fortuny et al. Calibration transfer between NIR spectrometers: New proposals and a comparative study
WO2015112335A1 (en) Measurement of film thickness on an arbitrary substrate
JP2014212509A (en) Method of generating spatial and spectral object model
US10101206B2 (en) Spectral imaging method and system
EP2153298A1 (en) Method and system for compressed imaging
JP5941514B2 (en) Discriminating from spectral and spatial object models
US20130208944A1 (en) Method and apparatus for object tracking via hyperspectral imagery
JP2019190927A5 (en) Analyzer, imaging system, and program
US20200370960A1 (en) Spectral imaging systems, devices and methods
AU2011211336B2 (en) Decomposing hyperspectral or multispectral image data
CN113272639B (en) Method for extracting spectral information of substance to be detected
CN112974303A (en) Hyperspectrum-based fruit quality detection method, device and medium
JP5807111B2 (en) Image generation system and image generation method
Acito et al. Robust technique for anomalous change detection in airborne hyperspectral imagery based on automatic and adaptive band selection
JP6288445B2 (en) Spectrum processing apparatus, spectrum processing program, spectrum processing system, and spectrum processing method
CN207457048U (en) A kind of self adaptive imaging device
De Kerf et al. Quantitative detection of corrosion minerals in carbon steel using shortwave infrared hyperspectral imaging
Zhang et al. Reflectance estimation using local regression methods
Bahrami et al. Classification of Hyper Spectral Image Various Plant Classes via Coding Method in the Reflectance and its Derivatives