JPWO2020049279A5 - - Google Patents
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- JPWO2020049279A5 JPWO2020049279A5 JP2021512946A JP2021512946A JPWO2020049279A5 JP WO2020049279 A5 JPWO2020049279 A5 JP WO2020049279A5 JP 2021512946 A JP2021512946 A JP 2021512946A JP 2021512946 A JP2021512946 A JP 2021512946A JP WO2020049279 A5 JPWO2020049279 A5 JP WO2020049279A5
- Authority
- JP
- Japan
- Prior art keywords
- hts
- current lead
- cable
- terminal block
- leak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000463 material Substances 0.000 claims 13
- 230000000087 stabilizing Effects 0.000 claims 11
- 238000002844 melting Methods 0.000 claims 5
- 230000015556 catabolic process Effects 0.000 claims 4
- 230000004059 degradation Effects 0.000 claims 4
- 238000006731 degradation reaction Methods 0.000 claims 4
- 238000005452 bending Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000008188 pellet Substances 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- 229910001369 Brass Inorganic materials 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 239000002654 heat shrinkable material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002407 reforming Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Claims (20)
複数のHTSテープを含むHTSケーブルと、
前記HTSケーブルの周りの編組スリーブと、
前記HTSケーブル及び前記編組スリーブに含浸させた安定化材であって、290Kよりも高く、前記HTSテープの熱劣化温度よりも低い融点を有する安定化材と
を含むHTS電流リード。 A high temperature superconducting (HTS) current lead comprising:
an HTS cable including a plurality of HTS tapes;
a braided sleeve around the HTS cable;
a stabilizing material impregnated into the HTS cable and the braided sleeve, the stabilizing material having a melting point greater than 290K and less than the thermal degradation temperature of the HTS tape ;
HTS current leads containing .
複数のHTSテープを含むHTSケーブルを提供することと、
前記ケーブルの周りに編組スリーブを配置することと、
前記編組スリーブの周りに漏出防止シースを配置することと、
290Kよりも高く、前記HTSテープの熱劣化温度よりも低い融点を有する安定化材を前記漏出防止シースに充填することと、
前記漏出防止シースを密封することと
を含む方法。 A method of manufacturing an HTS current lead, comprising:
providing an HTS cable including a plurality of HTS tapes;
placing a braided sleeve around the cable;
disposing a leak-proof sheath around the braided sleeve;
filling the leakproof sheath with a stabilizing material having a melting point higher than 290K and lower than the thermal degradation temperature of the HTS tape;
sealing the leak-proof sheath ;
method including .
前記安定化材のペレットを前記漏出防止シースに挿入することと、
前記ペレットを溶かすことと
を含む、請求項13に記載の方法。 The step of filling the leak-proof sheath with the stabilizing material comprises:
inserting the stabilizer pellet into the leakproof sheath;
14. The method of claim 13 , comprising melting the pellets.
前記HTS電流リードは、
複数のHTSテープを含むHTSケーブルと、
前記HTSケーブルの周りの編組スリーブと、
前記HTSケーブル及び前記編組スリーブに含浸させた安定化材であって、前記HTSテープの臨界温度よりも高く、前記HTSテープの熱劣化温度よりも低い融点を有する安定化材と、
前記安定化材を封入する漏出防止シースと
を含み、
前記方法は、
前記HTS電流リードを、前記安定化材の融点よりも高く、前記HTSテープの劣化温度よりも低い温度に加熱することと、
前記HTS電流リードを所望の形状に曲げることと、
前記HTS電流リードを前記所望の形状に保ちながら前記HTS電流リードが冷却できるようにすることと
を含む方法。 A method of reforming an HTS current lead, comprising:
The HTS current lead comprises:
an HTS cable including a plurality of HTS tapes;
a braided sleeve around the HTS cable;
a stabilizing material impregnated in the HTS cable and the braided sleeve, the stabilizing material having a melting point above the critical temperature of the HTS tape and below the thermal degradation temperature of the HTS tape;
a leak-proof sheath enclosing the stabilizing material;
The method includes
heating the HTS current leads to a temperature above the melting point of the stabilizer and below the degradation temperature of the HTS tape;
bending the HTS current lead into a desired shape;
allowing the HTS current lead to cool while maintaining the HTS current lead in the desired shape.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1814582.1A GB2576933A (en) | 2018-09-07 | 2018-09-07 | Flexible HTS current leads |
GB1814582.1 | 2018-09-07 | ||
PCT/GB2019/052433 WO2020049279A1 (en) | 2018-09-07 | 2019-08-30 | Flexible hts current leads |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022500817A JP2022500817A (en) | 2022-01-04 |
JPWO2020049279A5 true JPWO2020049279A5 (en) | 2022-09-02 |
Family
ID=63921356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021512946A Pending JP2022500817A (en) | 2018-09-07 | 2019-08-30 | Flexible HTS current lead, its manufacturing method and reforming method |
Country Status (9)
Country | Link |
---|---|
US (1) | US20220084725A1 (en) |
EP (2) | EP3847676B1 (en) |
JP (1) | JP2022500817A (en) |
KR (1) | KR20210043713A (en) |
CN (2) | CN115547571A (en) |
AU (1) | AU2019334792A1 (en) |
CA (1) | CA3111857A1 (en) |
GB (1) | GB2576933A (en) |
WO (1) | WO2020049279A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111613383B (en) * | 2020-06-16 | 2021-12-21 | 深圳供电局有限公司 | High-temperature superconducting tape for improving thermal stability |
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2018
- 2018-09-07 GB GB1814582.1A patent/GB2576933A/en not_active Withdrawn
-
2019
- 2019-08-30 CN CN202211247211.6A patent/CN115547571A/en active Pending
- 2019-08-30 AU AU2019334792A patent/AU2019334792A1/en active Pending
- 2019-08-30 JP JP2021512946A patent/JP2022500817A/en active Pending
- 2019-08-30 US US17/274,145 patent/US20220084725A1/en active Pending
- 2019-08-30 EP EP19763068.4A patent/EP3847676B1/en active Active
- 2019-08-30 EP EP22188038.8A patent/EP4105949A1/en active Pending
- 2019-08-30 KR KR1020217010235A patent/KR20210043713A/en not_active Application Discontinuation
- 2019-08-30 WO PCT/GB2019/052433 patent/WO2020049279A1/en active Search and Examination
- 2019-08-30 CN CN201980071080.0A patent/CN112997260B/en active Active
- 2019-08-30 CA CA3111857A patent/CA3111857A1/en active Pending
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