JPWO2019175950A1 - Electronic module and power supply - Google Patents

Abstract

A substrate, a first conductor layer extending in a first direction on the upper surface of the substrate, and a second direction that is connected to the first conductor layer and is different from the first direction in the second direction. A second conductor layer extending across the first conductor layer; and an electronic element provided on the substrate at a position different from the first conductor layer and the second conductor layer. And a terminal provided on the first conductor layer, wherein the first conductor layer is a current of a current flowing between the electronic element and the terminal. It is connected to the electronic element at a position away from the terminal in the first direction so as to form a path.

Description

  The present invention relates to an electronic module and a power supply device.

  2. Description of the Related Art Conventionally, a power supply device has an electronic module mounted with a substrate having electronic elements. It is known that such a substrate may warp due to a manufacturing process. For example, when the substrate is sealed by the sealing member, the substrate is warped by being pushed by the sealing member. Specifically, when the height of the end portion provided on the circumference of the sealing member (for example, a resin case) is uneven, when the substrate is pushed by the sealing member, the substrate may warp. Further, if the distribution of the heat dissipation agent (for example, grease) between the back surface of the substrate and the housing is uneven, the substrate may warp when the substrate is screwed to the housing. Further, since the chips are put in a high-temperature furnace when soldered to the substrate, the substrate may be warped due to high heat.

  In order to solve such a problem, Patent Document 1 (JP-A-2002-280393) discloses that a warp is prevented by providing a metal layer for grounding on the back surface of a semiconductor substrate, and Patent Document 2 (JP-A-2003). -204128), it is disclosed that the second conductor pattern is provided with an opening reaching the substrate to prevent the substrate from being warped after the heat treatment.

  On the other hand, in addition to the problem that the substrate may warp due to the manufacturing process, the current generated from the electronic element flows through the conductor layer (for example, copper foil) provided on the substrate, which causes heat generated in the conductor layer. Therefore, there is a problem that the temperature of the conductor layer rises.

  Then, this invention is made | formed in view of the said problem, and an object of this invention is to provide the electronic module which can reduce the possibility that a board | substrate may warp, and can accelerate | stimulate the heat dissipation of a conductor layer.

[Concept 1]
The electronic module according to concept 1 of the present invention comprises:
Board,
A first conductor layer extending in a first direction on the upper surface of the substrate;
A second conductor layer that is connected to the first conductor layer and extends in a second direction different from the first direction with the first conductor layer interposed therebetween;
An electronic element provided on the substrate at a position different from the first conductor layer and the second conductor layer;
A terminal provided on the first conductor layer,
Equipped with
The first conductor layer is connected to the electronic element at a position distant from the terminal in the first direction so as to form a current path of a current flowing between the electronic element and the terminal.

[Concept 2]
In an electronic module according to concept 1 of the present invention,
There are a plurality of electronic elements,
The terminal is connected to ground,
The plurality of electronic elements are arranged in the second direction with the first conductor layer interposed therebetween.

[Concept 3]
In an electronic module according to concept 2 of the present invention,
Further comprising a sealing member for sealing the substrate and having a through hole,
It further comprises a second terminal provided on the upper surface of the substrate and extending substantially perpendicularly to the substrate through the through hole.

[Concept 4]
In an electronic module according to any one of the concepts 1 to 3 of the present invention,
A third conductor layer that is substantially parallel to the second conductor layer with a space provided and that extends in a third direction different from the first direction with the first conductor layer interposed therebetween. Further prepare.

[Concept 5]
In an electronic module according to any one of the concepts 1 to 4 of the invention,
The terminal is bifurcated, and the bifurcated end is connected to the first conductor layer.

[Concept 6]
A power supply device according to concept 6 of the present invention comprises:
An electronic module according to any one of the inventive concepts 1 to 5 is provided.

  Therefore, in the electronic module according to the present invention, the first conductor layer extends in the first direction on the upper surface of the substrate, and the second conductor layer extends in the second direction different from the first direction. Therefore, the rigidity of the substrate is improved not only in the first direction but also in the second direction, so that the possibility that the substrate is warped can be reduced. Furthermore, the heat generated by the current flowing in the first conductor layer, which is the current path of the current flowing between the electronic element and the terminal, can be released to the second conductor layer, and the heat of the first conductor layer Heat dissipation can be promoted.

FIG. 1 is a view of the configuration of part of the electronic module according to the first embodiment, which is an aspect of the present invention, seen from above with the sealing member removed. FIG. 2 is a perspective view showing the configuration of part of the power supply device according to the first embodiment when the sealing member 32 is transparent for the sake of explanation. FIG. 3 is a perspective view when the electrode E1, the terminal T1, and the relay element R1 of FIG. 2 are extracted. FIG. 4 is a sectional view taken along the line A-A ′ of FIG. FIG. 5 is a view of the configuration of part of the electronic module according to the second embodiment, which is an aspect of the present invention, as seen from above with the sealing member removed.

  Embodiments according to the present invention will be described below with reference to the drawings.

<First Embodiment>
As shown in FIG. 2, the power supply device 1 according to the first embodiment, which is an aspect of the present invention, has a housing 2, a transformer 4, and is fixed to the housing 2 and connected to the transformer 4. And an electronic module 5. Here, the housing 2 is, for example, a heat sink. The transformer 4 is a type of electronic component, is an electronic component that converts the voltage of AC power using electromagnetic induction, and is also called a transformer.
The electronic module 5 includes a pressed member 3, and the pressed member 3 includes a substrate 31 and a sealing member 32 that seals the substrate. Although FIG. 2 shows the case where the sealing member 32 is transparent for the sake of explanation, the sealing member 32 may be transparent or not transparent.

  The electronic module 5 further has elastic bodies EB1 and EB2 connected to the sealing member 32 of the pressed member 3, and the elastic bodies EB1 and EB2 are fixed to the housing 2 by the corresponding locking members S1 and S2. Has been done. Here, the locking members S1 and S2 according to the present embodiment are screws as an example.

  As shown in FIG. 1, the electronic module 5 includes a conductor layer C3 provided on a substrate 31, and an electrode E1 and electronic elements D1 and D2 provided on the conductor layer C3. Further, a conductor layer C4 is provided on the substrate 31, and an electrode E2 and electronic elements D3 and D4 are provided on the conductor layer. The conductor layers C3 and C4 are, for example, copper foil.

  As shown in FIG. 2, the electrode E1 of the electronic module 5 is connected to the terminal T1 of the transformer 4 via the relay element R1. Here, the electrode E1, the relay R1, and the terminal T1 have conductivity. As a result, the electronic elements D1 and D2 of the substrate 31 are electrically connected to the transformer 4 via the conductor layer C3, the electrode E1, the relay R1, and the terminal T1. Further, the relay element R1 has elasticity. Due to the elasticity of the relay element R1 as described above, in the manufacturing process before the relay element R1 is connected to the electrode E1 and the terminal T1, the terminals T1 and E1 are positioned horizontally with respect to the substrate 31 from the original position. Or, even if it is vertically displaced, the relay element R1 sandwiched between the terminal T1 and the electrode E1 pushes both the terminal T1 and the electrode E1 by the returning force due to the elastic force, so that the relay element R1 is connected to the terminal T1 and the electrode E1. be able to.

  The electrode E1 is bifurcated, and the bifurcated end is connected to the conductor layer C3. Here, as an example, the electrode E1 is bifurcated in the direction from the electrode E1 to the electrode E1 (the y direction in FIG. 2). With this configuration, the end of the electrode E1 is branched and connected in the direction from the electrode E1 to the electrode E1 (the y direction in FIG. 2), and thus the first direction from the relay R1 to the electrode E1 due to vibration or the like. It is possible to prevent the electrode E1 from falling over even when a load is applied (in the y direction in FIG. 2).

  The electrode E2 of the electronic module 5 is connected to the terminal T2 of the transformer 4 via the relay element R2. Here, the electrode E2, the relay R2, and the terminal T2 have conductivity. As a result, the electronic elements D3 and D4 of the substrate 31 are electrically connected to the transformer 4 via the conductor layer C4, the electrode E2, the relay R2, and the terminal T2. The relay R2 has elasticity. Since the relay element R2 has elasticity in this way, in the manufacturing process before the relay element R2 is connected to the electrodes E2 and the terminals T2, the terminals T2 and the electrodes E2 are horizontally positioned with respect to the substrate 31 from the original positions. Or, even if it is vertically displaced, the relay element R2 sandwiched between the terminal T2 and the electrode E2 pushes both the terminal T2 and the electrode E2 by the force of returning by the elastic force, so that the relay element R2 is connected to the terminal T2 and the electrode E2. be able to.

  The electrode E2 is bifurcated, and the bifurcated end is connected to the conductor layer C4. Here, as an example, the electrode E2 is bifurcated in the direction from the electrode E2 to the terminal T2 (the y direction in FIG. 2). With this configuration, the end portion of the electrode E2 is branched and connected in the direction from the electrode E2 to the terminal T2 (the y direction in FIG. 2), so that the first direction from the relay R2 to the electrode E2 due to vibration or the like. It is possible to prevent the electrode E2 from falling over even if a load is applied (in the y direction in FIG. 2).

  The relays R1 and R2 have the same configuration, the electrodes E1 and E2 have the same configuration, and the terminals T1 and T2 have the same configuration. Therefore, the configurations of the relay R1, the electrode E1, and the terminal T1 will be representatively described below.

  As shown in FIG. 3, the electrode E1 provided on the substrate 31 has shoulder portions E11 and E12 provided on the sides of the ends and a central portion E13 provided at the center of the ends.

  As shown in FIG. 4, the relay element R1 is curved in a U shape between the electrode E1 and the terminal T1 in a vertical cross-sectional view. Here, as an example, the relay element R1 is curved in a U shape so as to be convex in a direction approaching the substrate 31 in a longitudinal sectional view. The vertical cross-sectional view is a cut end cut along a plane perpendicular to the substrate 31.

  With this configuration, even if the position of the electrode E1 or the terminal T1 is deviated horizontally or vertically with respect to the substrate 31 from the original position in the manufacturing process before the relay R1 is connected to the electrode E1 and the terminal T1, the relay is relayed. Since the child R1 is curved in a U shape, one end of the relay R1 is pressed against the electrode E1 by the elastic force and the other end of the relay R1 is pressed against the terminal T1 so that the relay R1 is connected to the electrodes E1 and It is fixed while being sandwiched between the terminals T1. In this way, the displacement in the height direction and the displacement in the horizontal direction of the electrode E1 and the terminal T1 can be absorbed.

  Further, as shown in FIG. 4, the relay element R1 is curved in a U shape so that one end portion sandwiches the end portion of the electrode E1 and the other end portion sandwiches the end portion of the terminal T1 in a longitudinal sectional view. It is curved in a U shape. Here, as an example, one end portion and the other end portion of the relay element R1 are curved in a U shape so as to be convex in a direction away from the substrate 31.

  With this configuration, even if the position of the electrode E1 or the terminal T1 is deviated horizontally or vertically with respect to the substrate 31 from the original position in the manufacturing process before the relay R1 is connected to the electrode E1 and the terminal T1, the relay is relayed. One end of the child R1 can be fixed to the electrode E1 by sandwiching the electrode E1, and the other end of the relay R1 can be fixed to the terminal T1 by sandwiching the terminal T1. In this way, the displacement in the height direction and the displacement in the horizontal direction of the electrode E1 and the terminal T1 can be absorbed.

  More specifically, as shown in FIG. 3, the electrode E1 provided on the substrate 31 includes shoulder portions E11 and E12 provided on the sides of the ends and a central portion E13 provided at the center of the ends. With. On the other hand, one end of the relay R1 is branched into a plurality (here, three as an example), and the outer surface of the first branch R11 among the plurality (here, three as an example) of the branches is the electrode E1. It is fixed by welding to the central portion E13 at the end of the. Here, the 1st branch part R11 is a branch located in the center among the branches which are three as an example. Then, as shown in FIG. 3, the second branch portions R12 and R13 of the plurality (here, three as an example) of branches branch in a U shape so as to sandwich the shoulder portions E11 and E12 of the corresponding electrode E1. are doing.

  With this configuration, even if the position of the electrode E1 or the terminal T1 is deviated horizontally or vertically with respect to the substrate 31 from the original position in the manufacturing process before the relay R1 is connected to the electrode E1 and the terminal T1, the relay is relayed. The relay R1 is fixed to the electrode E1 by sandwiching the shoulders E11 and E12 of the electrode E1 by the second branch portions R12 and R13 of the child R1. In this way, the displacement in the height direction and the horizontal direction of the electrode E1 can be absorbed. Furthermore, since the second branch portions R12 and R13 of the relay element R1 sandwich the shoulder portions E11 and E12 of the electrode E1, the fixation of the relay element R1 to the electrode E1 can be strengthened.

  On the other hand, as shown in FIG. 3, the terminal T1 provided on the transformer 4 includes shoulder portions T11 and T12 provided on the sides of the ends and a central portion T13 provided on the center of the ends. Have. As shown in FIG. 3, the other end of the relay element R1 is branched into a plurality of (here, three as an example) branches, and a first branching portion among the plurality of (here, three as an example) branches. The outer surface of R14 is fixed to the central portion T13 at the end of the terminal T1 by welding, and the second branch portions R15 and R16 of the plurality of branches sandwich the shoulder portions T11 and T12 of the corresponding terminal T1. It is curved in a U shape.

  With this configuration, even if the position of the electrode E1 or the terminal T1 is deviated horizontally or vertically with respect to the substrate 31 from the original position in the manufacturing process before the relay R1 is connected to the electrode E1 and the terminal T1, the relay is relayed. The relay R1 is fixed to the terminal T1 by the second branch portions R15 and R16 of the child R1 sandwiching the shoulder portions T11 and T12 of the terminal T1. In this way, the deviation of the terminal T1 in the height direction and the horizontal direction can be absorbed. Further, since the second branch portions R15 and R16 of the relay element R1 sandwich the shoulder portions T11 and T12 of the electrode E1, the fixation of the relay element R1 to the terminal T1 can be strengthened.

  The rigidity of the relay element R1 is lower than that of the electrode E1, for example. With this configuration, even if the position of the electrode E1 shifts in the horizontal direction with respect to the substrate 31 due to the manufacturing process or the vibration after the manufacturing, the impact can be absorbed by the bending of the relay element R1. Therefore, the electrode E1 can be absorbed. Can be prevented from falling. In each of the following embodiments, the rigidity of each relay element will be described as an example, which is lower than the rigidity of the electrode to which the relay element is connected.

  As shown in FIG. 1, the electronic module 5 includes a first conductor layer C1 extending in the first direction on the upper surface of the substrate 31. Here, the first conductor layer C1 is, for example, a copper foil.

  Further, the electronic module 5 is connected to the first conductor layer C1 and has a first conductor in a second direction (eg, x direction in FIG. 1) different from the first direction (eg, y direction in FIG. 1). The second conductor layers C21 and C22 extending with the layer C1 sandwiched therebetween are provided. Here, the second direction is, for example, a direction perpendicular to the first direction, and the second conductor layers C21 and C22 are, for example, copper foil.

  As described above, the electronic elements D1 to D4 are provided on the substrate 31 at positions different from the first conductor layer C1 and the second conductor layers C21 and C22.

  As shown in FIG. 1, the electronic module 5 includes a terminal M1 provided on the first conductor layer C1. The terminal M1 is bifurcated, and the bifurcated end is connected to the first conductor layer C1. Here, as an example, the terminal M1 is bifurcated in the first direction (the y direction in FIG. 1). With this configuration, since the end portion of the terminal M1 is branched and connected in the first direction (y direction in FIG. 1), it is connected to the terminal M1 in the first direction (y direction in FIG. 2) due to vibration or the like. It is possible to prevent the terminal M1 from falling over even if a load is applied.

  A through hole (not shown) is provided in the sealing member 32, and the terminal M1 extends substantially perpendicularly to the substrate 31 through the through hole. The terminal M1 extends outside the sealing member 32 and is connected to another electronic component or ground. In the present embodiment, as an example, the terminal M1 is connected to the ground.

  The first conductor layer C1 is separated from the terminal M1 in the first direction (for example, the positive direction of y in FIG. 1) via the electronic elements D1 to D4 and the corresponding wirings W1 to W4, respectively. The first conductor layer C1 is connected and serves as a current path for a current flowing between the electronic elements D1 to D4 and the terminal M1.

  With this configuration, the first conductor layer C1 extends in the first direction on the upper surface of the substrate 31, and the second conductor layers C21 and C22 extend in the second direction different from the first direction. Therefore, the rigidity of the substrate 31 is improved not only in the first direction but also in the second direction, so that the possibility that the substrate 31 is warped can be reduced. Furthermore, since the second conductor layers C21 and C22 do not form a current path from the electronic elements D1 to D4 to the terminal M1, no current flows through the second conductor layers C21 and C22 from the first conductor layer. The heat generated by the current flowing through the first conductor layer C1 can be released to the second conductor layers C21 and C22, and the heat dissipation of the first conductor layer C1 can be promoted.

  As shown in FIG. 1, electronic elements D1 and D3 are arranged in the second direction (the x direction in FIG. 1) with the first conductor layer C1 interposed therebetween. Similarly, the electronic elements D2 and D4 are arranged in the second direction (the x direction in FIG. 1) with the first conductor layer C1 interposed therebetween. With this configuration, since the first conductor layer is connected to the ground, the first conductor layer C1 is also connected to the ground, and electromagnetic noise generated from each electronic element is transmitted via the first conductor layer C1. Since it is absorbed by the ground, it is possible to reduce the mixing of electrical noise from the other electronic element provided on the substrate in the target electronic element.

  As shown in FIG. 1, the electronic module 5 includes a terminal M2 provided on the first conductor layer C1. A through hole (not shown) is provided in the sealing member 32, and the terminal M2 extends substantially perpendicularly to the substrate 31 through the through hole. The terminal M2 extends outside the sealing member 32 and is connected to another electronic component or the ground. In this embodiment, as an example, the terminal M2 is connected to another electronic component. Accordingly, for example, when the terminal M1 is connected to the ground as shown in the present embodiment, the terminal M2 is also connected to the ground, and other electronic components should be connected to the ground via the terminal M2. You can

  As described above, the electronic module 5 according to the first embodiment is connected to the substrate 31, the first conductor layer C1 extending in the first direction on the upper surface of the substrate 31, and the first conductor layer C1. Further, the second conductor layers C21 and C22 extending in the second direction different from the first direction with the first conductor layer C1 interposed therebetween, and the first conductor layer C1 on the substrate 31. And electronic elements D1 to D4 provided at positions different from the second conductor layers C21 and C22, and a terminal M1 provided on the first conductor layer C1. The first conductor layer C1 is located at a position away from the terminal M1 in the first direction so that the first conductor layer C1 serves as a current path of a current flowing between the electronic elements D1 to D4 and the terminal M1. It is connected to the electronic devices D1 to D4.

  With this configuration, the first conductor layer C1 extends in the first direction on the upper surface of the substrate 31, and the second conductor layers C21 and C22 extend in the second direction different from the first direction. Therefore, the rigidity of the substrate 31 is improved not only in the first direction but also in the second direction, so that the possibility that the substrate 31 is warped can be reduced. Furthermore, since the second conductor layers C21 and C22 do not form a current path from the electronic elements D1 to D4 to the terminal M1, no current flows through the second conductor layers C21 and C22 from the first conductor layer. The heat generated by the current flowing through the first conductor layer C1 can be released to the second conductor layers C21 and C22, and the heat dissipation of the first conductor layer C1 can be promoted.

<Second Embodiment>
Next, the second embodiment will be described. In the first embodiment, the second conductor layers C21 and C22 extend while sandwiching the first conductor layer C1. On the other hand, the second embodiment is different in that, in addition to the second conductor layer, the third conductor layer also extends across the first conductor layer C1. The overall configuration of the power supply device according to the second embodiment is the same as the overall configuration of the power supply device according to the first embodiment, so description thereof will be omitted.

  As shown in FIG. 5, the electronic module 5b according to the second embodiment is substantially parallel to the second conductor layers C21 and C22 with a space therebetween, and is in the first direction (the y direction in FIG. 5). It further includes third conductor layers C31 and C32 extending in a third direction (x direction in FIG. 5) different from that sandwiching the first conductor layer C1. Here, the third direction is, for example, a direction perpendicular to the first direction.

  With this configuration, in the electronic module 5b according to the second embodiment, the second conductor layers C21 and C22 and the third conductor layers C31 and C32 extend in the third direction different from the first direction. Since the rigidity of the substrate 31 in the second direction is improved as compared with the electronic module 5 of the first embodiment, the possibility that the substrate 31 is warped can be further reduced.

  In the present embodiment, the third direction is the same as the second direction as an example, but the present invention is not limited to this, and the third direction may be the same as or different from the second direction. Good.

  It should be noted that the description of each of the above-described embodiments and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and are covered by the description of each of the above-described embodiments or the disclosure of the drawings. The described invention is not limited. Further, the description of the claims at the beginning of the application is merely an example, and the description of the claims can be appropriately changed based on the description of the specification, drawings and the like.

1 Power Supply Device 2 Housing 3 Pressed Member 31 Substrate 32 Sealing Member 4 Transformer 5, 5b Electronic Module C1 First Conductor Layer C21, C22 Second Conductor Layer C31 Third Conductor Layer C4 Conductor Layer D1, D2 , D3, D4 Electronic elements E1, E2 Electrodes E11, E12 Shoulder part E13 Central part EB1, EB2 Elastic body R1, R2 Relay element R14 First branch part R15, R16 Second branch part S1, S2 Locking member M1 terminal M2 Second terminal T1, T2 Terminal T11, T12 Shoulder portion T13 Central portion W1 to W4 Wiring

Claims (6)

Board,
A first conductor layer extending in a first direction on the upper surface of the substrate;
A second conductor layer that is connected to the first conductor layer and extends in a second direction different from the first direction with the first conductor layer interposed therebetween;

An electronic element provided on the substrate at a position different from the first conductor layer and the second conductor layer;
A terminal provided on the first conductor layer,
Equipped with
The first conductor layer is connected to the electronic element at a position distant from the terminal in the first direction so as to form a current path of a current flowing between the electronic element and the terminal. module. There are a plurality of electronic elements,
The terminal is connected to ground,
The electronic module according to claim 1, wherein the plurality of electronic elements are arranged in the second direction with the first conductor layer interposed therebetween. Further comprising a sealing member for sealing the substrate and having a through hole,
The electronic module according to claim 2, further comprising a second terminal provided on the upper surface of the substrate and extending substantially perpendicularly to the substrate through the through hole. A third conductor layer that is substantially parallel to the second conductor layer with a space provided and that extends in a third direction different from the first direction with the first conductor layer interposed therebetween. The electronic module according to any one of claims 1 to 3, further comprising: The electronic module according to claim 1, wherein the terminal is bifurcated, and an end portion of the bifurcated end is connected to the first conductor layer.   A power supply device comprising the electronic module according to claim 1.

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