JPWO2019093108A1 - Sheet for processing assistance of adherend - Google Patents

Abstract

It does not cause deformation or clogging of through holes in the green sheet after punching, and while exhibiting sufficient holding power for the green sheet after punching, it can be peeled off cleanly without breaking. Provided is a processing auxiliary sheet for a ceramic green sheet. The processing auxiliary sheet of the present invention is used by laminating it on the ceramic green sheet prior to punching through holes in the ceramic green sheet, and has a piercing strength of 10 N or less and a thickness of 10 μm. It is characterized by containing the above resin film. The resin film preferably has a piercing strength of 0.2 N or less per 1 μm of thickness.

Description

The present invention comprises a sheet for assisting processing of an adherend, which is used by laminating it on an adherend (ceramic green sheet, etc.) used in the manufacturing process of various laminated ceramic products, and a processing method using the sheet. Regarding.

When punching (punching) minute through holes for interlayer connection to a ceramic green sheet as an example of an adherend used in the manufacturing process of various laminated ceramic products, an adhesive layer is formed on the upper surface of the green sheet. A punching processing auxiliary sheet containing a resin film, which is temporarily attached (laminated) through the sheet, is known (Patent Documents 1 and 2).

JP-A-9-132762 JP-A-9-279102

The conditions required for this type of processing auxiliary sheet are high punching workability (that is, low shear strength with respect to punching), and that the green sheet after punching can be peeled off cleanly without breaking. It is necessary.

However, the conventional processing auxiliary sheet such as the technique according to Patent Documents 1 and 2 is not sufficiently workable, and as a result, the punched shape of the through hole in the processing auxiliary sheet is deteriorated and bites into the green sheet side. Burrs (small pieces or hangnail of the auxiliary sheet) or chips may occur in the direction, and the through holes formed in the green sheet may be deformed or clogged.

Further, the processing auxiliary sheet according to Patent Documents 1 and 2 is punched in advance corresponding to the conductor pattern (wiring circuit pattern) to be formed on the surface of the ceramic green sheet to obtain a drilled processing auxiliary sheet. Above, it is also conceivable to temporarily attach (laminate) the green sheet to the upper surface of the green sheet for use. However, also in this aspect, there is a concern that the punching shape due to the punching process may be deteriorated and burrs or chips may be generated in the direction of biting into the green sheet side, as in the case of the conventional punching processing auxiliary sheet. As a result, for example, the following inconveniences (a) to (c) may occur.
(A) After temporary attachment to the ceramic green sheet, the pattern shape of the conductor paste filled through the punched holes is deformed.
(B) Due to the burrs being caught in the conductor paste, peeling failure occurs when the conductor paste is removed from the green sheet after the intended use.
(C) Cracks occur in the conductor pattern after firing.

If the resin film (base material) is made of an ultra-thin (several μm) thickness so as to improve workability, it may break when peeled from the green sheet after punching or conductor paste printing, resulting in Sometimes it couldn't be peeled off cleanly.

It should be noted that this type of processing auxiliary sheet is also required to have a holding force (adhesive force) that does not cause floating with respect to the green sheet after punching or conductor paste printing.

In one aspect of the present invention, the adherend after punching does not deform or clog the through hole, and the adherend after punching exhibits sufficient holding force while breaking. Provided are a processing assisting sheet for an adherend, which can be peeled off cleanly without any trouble, and a processing method using the sheet.

In another aspect of the present invention, the conductor paste pattern formed on the adherend does not deform or crack the conductor pattern after firing, and the adherend after printing the conductor paste is not formed. Provided are a processing auxiliary sheet for an adherend, which can be neatly peeled off without breaking while exhibiting sufficient holding power, and a processing method using the sheet.

The present inventors have found that by controlling the puncture strength and thickness of the resin film used, punching characteristics, retention, and peelability can all be satisfied at the same time regardless of the material of the resin film used. , The present invention has been completed.

The sheet for assisting processing of an adherend according to the present invention (the sheet of the present invention) is a resin film which is laminated on an adherend and has a puncture strength of 10 N or less and a thickness of 10 μm or more. It is characterized by including.

In the first processing method according to the present invention, when the through hole is punched in the adherend in a state where the auxiliary sheet is laminated on the adherend, the processing auxiliary sheet of the present invention is used as the auxiliary sheet. It is characterized by being there.

In the second processing method according to the present invention, a conductor to be formed on the surface of an adherend as an auxiliary sheet when forming a conductor pattern on the surface of the adherend in a state where an auxiliary sheet is laminated on the adherend. It is characterized by using the processing auxiliary sheet of the present invention in a form in which a hole corresponding to a pattern is punched.
Hereinafter, the above-mentioned first processing method and the second processing method are collectively abbreviated as "the method of the present invention".

The sheet of the present invention can be a sheet for assisting punching of an adherend, which is used by being laminated on the adherend prior to punching a through hole in the adherend.
The sheet of the present invention is punched to correspond to the conductor pattern to be formed on the surface of the adherend, and then laminated on the adherend to form a conductor pattern on the surface of the adherend. It can be an auxiliary sheet.

In the sheet of the present invention and the method of the present invention, the resin film preferably has a piercing strength of 0.2 N or less per 1 μm of thickness.
In the sheet of the present invention and the method of the present invention, it is preferable to have a removable adhesive layer on the side of the resin film to be laminated on the adherend.

The adherend referred to in the present invention means an unfired product or a fired product after firing, which is used in the manufacturing process of various laminated ceramic products (for example, multilayer ceramic capacitors, ceramic multilayer circuit boards, etc.). For example, a ceramic green sheet (unfired product), a fired product containing the sheet, and the like can be mentioned.

Since the sheet of the present invention contains a resin film having a predetermined characteristic and a predetermined thickness as a base base material, the adherend after punching does not deform or clog the through holes. In addition, the conductor paste pattern formed on the adherend does not deform or crack the conductor pattern after firing. In addition to these, it can be peeled off cleanly without breaking while exhibiting sufficient holding power for the adherend after processing (punching or conductor paste printing).

Since the method of the present invention uses the processing auxiliary sheet of the present invention, burrs (small pieces or hangnail of the auxiliary sheet) or chips do not occur in the direction of biting into the adherend side. Therefore, the first processing method does not cause deformation or clogging of the through holes in the adherend after punching. The second processing method does not cause deformation of the conductor paste pattern formed on the adherend or cracks in the conductor pattern after firing. In addition to these, the method of the present invention does not cause floating with the adherend after processing (punching or conductor paste printing), but does not break during peeling. Therefore, the auxiliary sheet that has finished its intended use can be cleanly removed from the adherend.

Hereinafter, a case where the adherend is an unfired material (ceramic green sheet) that is fragile and is deformed or damaged by a slight impact will be described as an example.

The ceramic green sheet according to an example of the adherend is formed by thinly spreading a slurry containing a ceramic raw material powder, an organic binder and a solvent on a carrier tape by a doctor blade method (so-called tape molding). This tape-formed ceramic green sheet is generally cut to a predetermined size, and minute through holes (via holes) for interlayer connection are punched (punched) by an NC mold punching device or the like. After that, a laminated ceramic product (ceramic multilayer circuit board, etc.) is manufactured through each process of printing a conductor pattern on the sheet surface, laminating a plurality of ceramic green sheets, and firing.

The processing auxiliary sheet according to an example (this example) of the present invention is used by being temporarily attached (laminated) to the upper surface of the green sheet prior to punching a through hole in the ceramic green sheet, and the purpose of use thereof. It can be suitably used for applications (a ceramic green sheet punching auxiliary sheet) that are removed from the green sheet after finishing (punching of through holes).
In addition to the punching auxiliary sheet, the processing auxiliary sheet of this example is punched in advance to correspond to the conductor pattern (wiring circuit pattern) to be formed on the surface of the ceramic green sheet. Then, the processed auxiliary sheet can be temporarily attached (laminated) to the upper surface of the green sheet (a conductor pattern forming auxiliary sheet on the surface of the ceramic green sheet, that is, a masking sheet). After the purpose of use (printing of the conductor paste filled through the punched holes after temporary attachment to the ceramic green sheet) is completed, it is removed from the green sheet in the same manner as punching through holes.

The processing auxiliary sheet of this example includes a base base material. The base base material used in this example is composed of a resin film having predetermined characteristics. In this example, a resin film having a piercing strength of 10 N or less and a thickness of 10 μm or more is used.

The present inventors have confirmed that the punching workability of the processing auxiliary sheet is improved (reduction of burrs and chipping) by reducing the thickness of the resin film (for example, PET) used for the base base material. When the material thickness was reduced to less than 10 μm, the shear strength of the resin film was sufficiently reduced, and as a result, good results were obtained in reducing the occurrence of burrs and chips. On the other hand, if the base material thickness is as thin as less than 10 μm, the base material breaks or the adhesive layer (described later) remains on the green sheet side when peeling from the green sheet after processing (punching or conductor paste printing). The processing auxiliary sheet could not be peeled off cleanly from the green sheet.

Therefore, the present inventors are working diligently to reduce the occurrence of burrs and chips, to peel off the green sheet cleanly, and to simultaneously satisfy the development of sufficient holding power for the green sheet after processing (punching or conductor paste printing). As a result of repeated studies, if the piercing strength of the resin film used for the base base material is equal to or less than a predetermined value, the base material thickness is 10 μm, which is the thickness at which the processing auxiliary sheet exhibits a beautiful peeling effect from the green sheet. Even as described above, it is possible to prevent the green sheet after punching from being deformed or clogged with through holes, and to prevent the conductor paste pattern formed on the green sheet from being deformed or cracks in the conductor pattern after firing. I found out what I could do.
If the thickness of the base material is as thin as less than 10 μm, the difficulty of laminating or laminating on the green sheet increases, and as a result, alignment may be difficult, wrinkles may occur, and workability may decrease. obtain.

First, the resin film used in this example needs to have a puncture strength of 10 N or less (preferably 9 N or less, more preferably 8 N or less). If the puncture strength of the resin film used exceeds 10 N, the punching workability of the auxiliary sheet containing the resin film deteriorates. In addition to this, when the adhesive layer (described later) is formed with a thickness (thinness) that does not easily cause misalignment of the green sheet, sufficient holding power is exhibited for the green sheet after processing (punching or conductor paste printing). It is difficult to make it.

For the puncture strength, a Tencilon universal material tester (manufactured by A & D, RTC-1210A) set with a cateran needle (manufactured by Kyowa Surface Chemical Co., Ltd., size: 22 G (= outer diameter 0.7 mm) x length: 33 mm) was used. It means the maximum load (unit: N) applied to the resin film until the needle penetrates the resin film at a speed of 50 mm / min with the tip of the needle facing the resin film.

Secondly, the resin film used in this example needs to have a thickness of 10 μm or more. If the thickness of the resin film used is less than 10 μm, it is difficult to exhibit the effect of neatly peeling the auxiliary sheet containing the resin film from the green sheet after processing (punching or conductor paste printing).

The thickness of the resin film is preferably 20 μm or more, more preferably 50 μm or more, from the viewpoint of improving the peelability from the green sheet (exhibiting a beautiful peeling effect from the green sheet). On the other hand, if the thickness is too thick, it is difficult to achieve a puncture strength of 10 N or less, so the upper limit of the thickness can be set to about 100 μm.

In addition to the above two conditions, the resin film used in this example preferably has a piercing strength of 0.2 N or less per 1 μm of thickness. In this case, it is expected that the punching workability and the beautiful peeling effect from the green sheet are more highly balanced.

The material of the resin film used in this example is not particularly limited. For example, polyethylene-based resin; polypropylene-based resin; cyclic polyolefin-based resin such as norbornene resin; polystyrene-based resin such as syndiotactic polystyrene resin; acrylonitrile-styrene copolymer (AS resin); acrylonitrile-butadiene-styrene copolymer ( ABS resin); Polyvinyl chloride resin; Fluorine resin; Poly (meth) acrylic resin; Polycarbonate resin; Polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); Polyethylene such as various nylons Based resin; Polyethylene based resin; Polyamiimide resin; Polyarylphthalate resin; Silicone resin; Polysulfone resin; Polyphenylene sulfide resin; Polyethersulfone resin; Polyurethane resin; Acetal resin; Cellulosic resin; etc. , A resin material can be used.

As the resin film used in this example, for example, one formed by using one kind or two or more kinds of the above resin materials can be used. The resin film made of the above materials may be used alone, or may be laminated in two or more layers by using an adhesive or the like.

In this example, when a resin film made of polypropylene resin having the above characteristics and thickness and having microvoids (microvoids) is used, particularly good results can be obtained.

Voids are formed by using inorganic fine particles or organic fillers. The average particle size of the inorganic fine particles or the organic filler is, for example, 0.01 to 15 μm, more preferably 0.01 to 8 μm.

The abundance of the voids in the resin film is preferably 1.0% or more, more preferably 2.0% or more. This is because if the void abundance rate is too small, the piercing strength becomes too high and the punching characteristics may be deteriorated. On the other hand, the void abundance rate is preferably 60% or less, more preferably 35% or less. If the abundance of voids is too large, it may be difficult to secure the mechanical strength of the entire auxiliary sheet.

Examples of a commercially available product particularly suitable as the resin film used in this example include FPG60 (manufactured by Yupo Corporation, 60 μm in thickness, porous polypropylene film in which voids are formed by stretching treatment) and the like.

In the processing auxiliary sheet of this example, an adhesive layer may be laminated on the side to be laminated on the green sheet of the base base material. The adhesive layer may be laminated on both sides of the base base material.
The adhesive layer contains at least a resin component. The resin component may be any as long as it has re-peelability and does not leave adhesive residue at the time of peeling. Such a component is not particularly limited, but is, for example, acrylic, rubber, polyvinyl ether, or silicone. Examples include resin components such as based, urethane, and polyester.

In this example, a cross-linking agent may be blended with the resin component to form an adhesive layer. Examples of the cross-linking agent include isocyanate compounds, aluminum chelates, aziridinyl compounds, epoxy compounds and the like. The amount of the cross-linking agent to be blended may be about 0.01 to 20 parts by mass when the total solid content of the resin component is 100 parts by mass.

The adhesive strength of the adhesive layer is preferably 0.01 to 5.0 N / 25 mm, more preferably 0.01 to 4.5 N / 25 mm, still more preferably 0.01 to 4.0 N / 25 mm with respect to the green sheet. .. In particular, 0.01 to 3.0 N / 25 mm is preferable, 0.01 to 2.8 N / 25 mm is more preferable, and 0.01 to 2.5 N / 25 mm is further preferable. By setting the temperature within this range, the adhesive strength with the green sheet can be suitably maintained, and when the processing auxiliary sheet of this example is peeled from the green sheet, adhesive residue is generated on the green sheet side. Never. If it is less than 0.01 N / 25 mm, the adhesive force with the green sheet may be insufficient, and the processing auxiliary sheet tends to be misaligned during punching or the like. If it exceeds 5.0 N / 25 mm, the adhesive force with the green sheet increases. Therefore, when the purpose of use is finished and the processing auxiliary sheet is peeled off from the green sheet, adhesive residue is generated on the green sheet side, and the green There is also a risk of roughening the surface of the sheet.

By increasing the thickness of the adhesive layer, the adhesive strength with the green sheet is improved (when compared with the same components), but the thickness is generally in the range of 1 to 15 μm.

When the processing auxiliary sheet according to this example contains an adhesive layer, a coating material for forming an adhesive layer in which the resin component constituting the adhesive layer is dissolved and dispersed in an organic solvent is applied to a base base material (resin film) and dried. Can be formed by

When the processing auxiliary sheet contains an adhesive layer, it is preferable to provide a separator on the surface having the adhesive layer from the viewpoint of handleability. The separator is not particularly limited, and paper, synthetic paper, polyethylene laminated paper, plastic film and the like can be used. In order to improve the releasability from the adhesive layer, the separator may be one obtained by applying a polyethylene wax or a silicone mold release agent to the surface in contact with the adhesive layer and performing a mold release treatment.

In the first processing method (punching method) according to this example, the processing auxiliary sheet of this example is laminated on the upper surface of the ceramic green sheet with the adhesive layers facing each other, and the green is combined with the processing auxiliary sheet. Punch through holes in the sheet. The processing auxiliary sheet is removed from the green sheet after the intended use (punching of through holes) is completed.

In the second processing method (conductor pattern forming method) according to this example, first, the processing auxiliary sheet of this example is punched according to the conductor pattern (wiring circuit pattern) to be formed on the surface of the ceramic green sheet. Prepare the punched material (drilled auxiliary sheet). Next, the prepared auxiliary sheet with holes has been laminated on the upper surface of the ceramic green sheet with the adhesive layers facing each other. In this state, the conductor paste is filled in the perforated portion (punched hole) of the auxiliary sheet to form a conductor pattern on the green sheet. The perforated auxiliary sheet is removed from the green sheet after the intended use (printing of conductor paste) is completed.

Since the punching method and the conductor pattern forming method of this example use the processing auxiliary sheet of this example, burrs and chips do not occur in the direction of biting into the green sheet side. Therefore, the punching method of this example does not cause deformation or clogging of the through holes in the green sheet after punching. Further, the conductor pattern forming method of this example does not cause deformation of the conductor paste pattern formed on the green sheet or cracks in the conductor pattern after firing. In addition to these, the punching method and the conductor pattern forming method of this example do not cause floating with the green sheet after punching or conductor paste printing, but do not break during peeling. Therefore, the auxiliary sheet that has finished its intended use can be removed cleanly from the green sheet. Further, when laminating or laminating on the green sheet, there is little difficulty in alignment, and wrinkles do not occur during laminating or laminating. Therefore, it can be expected that the workability of laminating or laminating on the green sheet will be improved.

Hereinafter, the present invention will be further described with reference to Examples. Unless otherwise specified, "parts" and "%" are based on weight.

1. 1. Preparation of resin film The following resin film (commercially available) was prepared.
-Film a: Polyethylene terephthalate (PET) film with a thickness of 12 μm and no voids (manufactured by Mitsubishi Chemical Corporation, O310)
-Film b: PET film with a thickness of 23 μm and no voids (manufactured by Toyobo Co., Ltd., A4300)
-Film c: PET film with a thickness of 38 μm and no voids (manufactured by Toyobo Co., Ltd., A4300)

-Film d: 40 μm thick, biaxially stretched polypropylene (OPP) film (manufactured by Santox, PA21)
-Film e-1: Thickness 50 μm, PPS film (Toray Industries, Inc., Trerina)
-Film e-2: PET film with a thickness of 50 μm and no voids (manufactured by Toyobo Co., Ltd., A4300)

-Film f-1: thickness 60 μm, triacetyl cellulose (TAC) film film f-2: thickness 60 μm, OPP film (manufactured by Santox, PA21)
-Film f-3: Thickness 60 μm, void-containing PP film (manufactured by Yupo Corporation, FPG60)

-Film g-1: PET film with a thickness of 75 μm and no voids (manufactured by Toyobo Co., Ltd., A4300)
-Film g-2: 75 μm thick, void-containing PET film (manufactured by Toyobo Co., Ltd., Crisper)
-Film h: Thickness 80 μm, TAC film

-Film i: PET film with a thickness of 100 μm and no voids (manufactured by Toyobo Co., Ltd., A4300)
-Film j: PET film with a thickness of 6 μm and no voids (manufactured by Mitsubishi Chemical Corporation, K200)

2. 2. Characteristics of resin film (2-1) Puncture strength Cateran needles (manufactured by Kyowa Surface Chemical Co., Ltd., size: 22 G (= outer diameter 0.7 mm) x length: 33 mm) were set for each of the above resin films a to j. Using a Tencilon universal material tester (RTC-1210A, manufactured by A & D), the needle is made to enter each resin film at a speed of 50 mm / min with the tip of the needle facing each resin film, and the needle penetrates. The absolute value (unit: N) of the maximum load applied to each resin film was read. The measurement was performed 5 times for each resin film, and the average value was shown. The results are shown in Table 1.

(2-2) Puncture strength per unit thickness By dividing each value measured in (2-1) above by the thickness of each resin film, the piercing strength (N) per unit thickness (1 μm) / Μm) was calculated. The results are shown in Table 1.

3. 3. Preparation of sheet sample [Experimental Examples 1 to 14]
The above a to j are used as the base material, and 100 parts of an acrylic pressure-sensitive adhesive (acrylic acid ester copolymer (manufactured by Lion Specialty Chemicals, AS409) and a curing agent (manufactured by Lion Specialty Chemicals, B-) are used on one side thereof. 45) (a mixture of two parts) was applied to a thickness of 4 μm and dried to form an adhesive layer, and sheet samples of each experimental example were prepared.

4. Evaluation The following items were evaluated for the sheet samples obtained in each experimental example. The results are shown in Table 1.

(4-1) Punching Workability First, a ceramic green sheet was prepared by tape molding by the doctor blade method and heat annealing at 100 ° C. for 3 hours. Next, the sheet samples prepared in each experimental example were temporarily attached (laminated) to the upper surface of the obtained ceramic green sheet with their adhesive layers facing each other. Next, the carrier tape on the lower surface of the ceramic green sheet is peeled off, and this is Tencilon universal set with a cateran needle (manufactured by Kyowa Surface Chemical Co., Ltd., size: 22G (= outer diameter 0.7mm) x length: 33mm). It was set in a material testing machine (RTC-1210A manufactured by A & D Co., Ltd.), and through holes were punched in a ceramic green sheet through a sheet sample prepared in each experimental example.
Next, the through holes formed in the sheet sample were visually observed and evaluated at 100 times using a microscope (manufactured by KEYENCE, ultra-depth color 3D shape measuring microscope VK-9510). The evaluation criteria are as follows.

⊚: No burrs or chips are observed (very excellent).
◯: No burrs or chips are observed (excellent).
Δ: Almost no burrs or chips are observed (good).
X: Occurrence of burrs or chips is observed (defective).

(4-2) Retention after punching Using a microscope (manufactured by KEYENCE, ultra-deep color 3D shape measurement microscope VK-9510), the vicinity of the through hole of the green sheet after punching according to (4-1) above was used. By observing at 100 times, the occurrence of floating between the green sheet and the sheet sample was evaluated. The evaluation criteria are as follows.

◯: No floating is observed (excellent).
Δ: Almost no floating occurred (good).
X: Floating is observed (defective).

(4-3) Peelability Peel the sheet sample from the green sheet after punching according to (4-1) above, and visually check the peeled surface of the sheet sample of the green sheet and use a microscope (manufactured by KEYENCE, ultra-depth color 3D). It was observed and evaluated at 100 times using a shape measuring microscope VK-9510). The evaluation criteria are as follows.

◯: No adhesive residue could be confirmed visually or with a microscope (excellent).
Δ: Although it could not be confirmed visually, it could be confirmed with a microscope (good).
X: Adhesive residue could be clearly confirmed visually, or the sheet sample was broken (defective).

5. Discussion As shown in Table 1, when a resin film having a puncture strength of 10 N or less and a thickness of 10 μm or more is used as the base base material (Experimental Examples 1, 2, 4, 5, 7, 9, 12), The usefulness of the obtained sheet sample was confirmed. Above all, when the thickness of the resin film is 50 μm or more (Experimental Examples 7, 9, 12), the punching workability, peelability and retention are higher than those of other Experimental Examples (1, 2, 4, 5). The balance was excellent.

On the other hand, when the piercing strength is 10 N or less but less than 10 μm in thickness, or when the piercing strength is more than 10 N even if the thickness is 10 μm or more (Experimental Examples 3, 6, 8, 10, 11, 13, 14). ), Punching workability, peelability and retention were poor, and it was confirmed that all of them could not be satisfied at the same time.

Claims (8)

A sheet for processing assistance of an adherend, which is used by being laminated on an adherend, comprising a resin film having a puncture strength of 10 N or less and a thickness of 10 μm or more. The sheet according to claim 1, which is a sheet for assisting punching of an adherend, which is used by being laminated on the adherend prior to punching a through hole in the adherend. This is an auxiliary sheet for forming a conductor pattern on the surface of an adherend, which is used by being laminated on the adherend after punching a hole corresponding to the conductor pattern to be formed on the surface of the adherend. , The sheet according to claim 1. The sheet according to any one of claims 1 to 3, wherein the resin film has a piercing strength of less than 0.2 N per 1 μm of thickness. The sheet according to any one of claims 1 to 4, which has a removable adhesive layer on the side of the resin film to be laminated on the adherend. The sheet according to any one of claims 1 to 5, wherein the adherend is a ceramic green sheet. When punching through holes in the adherend with the auxiliary sheet laminated on the adherend,
A processing method characterized in that the processing auxiliary sheet according to any one of claims 1 to 6 is used as the auxiliary sheet. In forming a conductor pattern on the surface of the adherend in a state where the auxiliary sheet is laminated on the adherend,
The processing auxiliary sheet according to any one of claims 1 to 6 is used as the auxiliary sheet in a form in which a hole is punched corresponding to the conductor pattern to be formed on the surface of the adherend. A processing method characterized by that.