JPWO2019092077A5 - - Google Patents

Description

It is known to counteract these undesirable electrical effects by using a DC link capacitor in a constant voltage DC link. The success of this method depends inter alia on establishing the best electrical and mechanical connection of the DC link capacitor to the power semiconductor or power semiconductor module using suitable assembly and connection techniques. A DC link capacitor is typically formed from two electrode plates facing each other between which one or more wound capacitor elements are held. Each wound capacitor element has two opposite end faces that are electrically contactable by shooping. Shooped end faces are typically soldered or welded to corresponding electrode plates. The electrode plates are then firmly connected to busbars having terminal elements for connection to external circuits, cables and the like.

In one embodiment, the electrode plates with the wound capacitor elements held therebetween and the busbars, excluding the terminal elements provided therein, are encapsulated in a potting compound. DC link capacitors are typically purchased by a manufacturer from a supplier that manufactures DC link capacitors according to the manufacturer's specifications for the power electronics device. Therefore, if the manufacturer's specifications change, it is necessary for the supplier to manufacture correspondingly matching DC link capacitors. This is cumbersome and costly.

According to a first aspect of the invention, a wound capacitor element is conductively attached to two electrode plates facing each other and is detachable or detachable from corresponding second connection means attached to the busbars of the power electronics module. A DC link capacitor module is proposed in which a plurality of first connection means forming a non-removable plug connection are provided on each electrode plate.

The DC link capacitor module may have another wound capacitor element conductively attached to the electrode plate. The DC link capacitor module may be provided by the supplier with a different number of wound capacitor elements and/or with different characteristics of the wound capacitor elements, depending on the requirements of the manufacturer of the power electronic device. Regardless of this, the shape of the electrode plates and the arrangement and design of the first connection means can be maintained. This allows the manufacturer to quickly and easily install e.g. DC link capacitor modules with different capacitances while maintaining the mounting geometry of the busbar mounted on the power electronics module. On the part of the supplier, the costly and time consuming step of attaching the busbars to the electrode plates is eliminated. Alternatively, such DC link capacitor modules may be provided in smaller units by the supplier and then the manufacturer may mount multiple units on the busbar using plug connections.

According to another advantageous embodiment, a first pair of electrode plates formed from electrode plates between which a first turn-type capacitor element is arranged and one or more second turn-type capacitor elements are interposed. A second pair of electrode plates formed from two separate electrode plates arranged opposite each other are provided in a parallel arrangement. Subdivision of the DC link capacitor module into first and second pairs of electrode plates, each with a wound capacitor element held therebetween, reduces the area spread between the plates while maintaining a predetermined shape. make it possible. This reduces the leakage inductance of the DC link capacitor module. Such DC link capacitor modules are particularly suitable for fast switching operations.

The power electronic device of the invention may further comprise a cover element that hermetically encloses the wound capacitor element . The cover element protects the wound capacitor element from moisture and heat, which can damage the wound capacitor element, especially during shipping. It is particularly preferred that the cover element is deformable so as to allow pressure equalization without gas exchange between the wound capacitor element housed in the cover element and the ambient environment. Among other things, this makes it possible to eliminate the commonly used disposable metal foils to which conventional wound capacitor elements are adhered during transport.

FIG. 1 shows a DC link capacitor module, generally indicated by reference number 1 . The DC link capacitor module 1 includes a first electrode plate 2a and a second electrode plate 2b that are arranged to face each other to form a first electrode plate pair 2, and a second electrode plate pair 3 that is arranged to face each other. It has a third electrode plate 3a and a fourth electrode plate 3b to be formed. A plurality of first wound capacitor elements 4 are provided between the first electrode plate pairs 2, and a plurality of second wound capacitor elements 5 are provided between the second electrode plate pairs 3. there is The wound capacitor elements 4 and 5 are shoeed on the front side. The wound capacitor element 4 is connected to the electrode plates 2a, 2b and the wound capacitor element 5 is connected to the electrode plates 3a, 3b by soldering, welding or other bonding techniques.

As can be seen specifically from FIG. 2, another DC link capacitor module 1′ of different design may be connected to the first busbar 7a and the second busbar 7b while maintaining the same design of the busbars 7a, 7b. . The DC link capacitor module 1' comprises only a first electrode plate 2a and a second electrode plate 2b forming a plate pair 2 between which a plurality of first wound capacitor elements 4 are held. The power electronics module 8 is standardized with respect to the arrangement and design of the busbars 7a, 7b and the second connection means 9a, 9b arranged thereon so that the first DC link capacitor modules 1, 1' designed correspondingly to the arrangement and design of the connection means 6 of the can be connected by means of a plug connection. On the other hand, the DC link capacitor modules 1, 1' may be designed differently with respect to the number and design of the electrode plates 2a, 2b, 3a, 3b and the wound capacitor elements 4, 5 held therebetween. good. This makes it possible to combine the DC link capacitor modules 1, 1' having different capacitances, leakage inductances, etc. with the power electronics module 8. FIG.

A cover element 15 rests on the second busbar 7 b and is sealed by a seal 16 . The cover element 15 is designed to be deformable so as to allow pressure equalization without gas exchange between the interior 17 of the cover element 15 housing the wound capacitor elements 4, 5 and the ambient environment. ing.

Claims (10)

a DC link capacitor module (1, 1' ) in which wound capacitor elements (4, 5) are conductively attached to two electrode plates (2a, 2b) facing each other ;
a power electronics module (8) having at least two busbars (7a, 7b);
said DC link capacitor module (1, 1') is connected to said power electronics module (8) by a plug connection,
Each said electrode plate (2a, 2b) forms said plug connection with a corresponding second connection means (9a, 9b) attached to said busbar (7a, 7b) of said power electronic module (8). A plurality of first connecting means (6) are provided,
Each said busbar (7a, 7b) has said plugs with corresponding said first connecting means (6) attached to said respective electrode plates (2a, 2b) of said DC link capacitor modules (1, 1'). A power electronic device (14) provided with said second connection means (9a, 9b) forming a connection,
Said second connecting means (9a, 9b) deform or destroy said first connecting means (6) and/or said second connecting means (9a, 9b) once said plug connection is formed. power electronic device (14) deformed to form said plug connection with said first connection means (6) so that it cannot be removed without being removed. 2. A power electronic device (14) according to claim 1, wherein said first connection means (6) are integrally formed with said electrode plates (2a, 2b, 3a, 3b). 3. A power electronic device (14) according to claim 1 or 2, wherein the second connection means (9a, 9b) are integrally formed with the busbar (7a, 7b). Said second connection means (9a, 9b) are formed as contact pins extending from said busbars (7a, 7b) and said first connection means (6) are suitable for receiving and frictionally engaging said contact pins. 4. A power electronic device (14) according to any one of claims 1 to 3 , formed in the form of a flexible socket or tab. a first electrode plate pair (2) formed by said electrode plates (2a, 2b) between which a first said wound capacitor element (4) is arranged; and a second said wound capacitor element ( 5) are arranged in parallel, and a second electrode plate pair (3) formed by another two mutually opposing electrode plates (3a, 3b) between which 5 ) is arranged. A power electronics device (14) according to any one of the preceding claims. The first electrode plate (2a) of said first electrode plate pair (2) is connected to the third electrode plate (3a) of said second electrode plate pair (3) and the third electrode plate of said first electrode plate pair (2) is connected to the third electrode plate (3a) of said second electrode plate pair (3). 6. A power electronic device (14) according to claim 5 , wherein two plates (2b) are connected to a fourth plate (3b) of the second plate pair (3). Power electronic device (14) according to any one of the preceding claims, wherein the busbar (7a, 7b) has connection elements (11a, 11b) for connection with a supply line. Power electronics device ( 14) according to any one of the preceding claims, characterized in that the power electronics module (8) is designed as a charging device for electrical energy storage, such as an inverter or a DC-DC converter. . 9. A power electronic device (14) according to any one of the preceding claims, further comprising a cover element (15) enclosing the wound capacitor elements (4, 5) in an air-tight manner. 10. The power electronic device (14) of claim 9 , further comprising a sealing element (16) sealing the cover element (15) to the busbars (7a, 7b).