JPWO2018110588A1 - Wireless communication device and article provided with the same - Google Patents

Abstract

  The wireless communication device 10 includes a flat conductor 24, an RFIC element 12 including first and second input / output terminals 12 a and 12 b, a loop antenna 14, and a connection conductor that connects the loop antenna 14 and the flat conductor 24. 28. The loop antenna 14 is disposed along the flat conductor 24, and is disposed along the flat conductor 24 with the first conductor portion 14a connected to the first input / output terminal 12a, and the second input / output terminal. A second conductor 14b connected to 12b, a third conductor 14c extending from the flat conductor 24 from the first conductor 14a, and extending from the flat conductor 24 from the second conductor 14b. A fourth conductor portion 14d, and a fifth conductor portion 14e connecting the third conductor portion 14c and the fourth conductor portion 14d. A connection conductor 28 connects the second conductor portion 14 b and the flat conductor 24.

Description

  The present invention relates to a wireless communication device capable of wireless communication even when attached to a metal surface, and an article provided with the wireless communication device.

  Conventionally, a wireless communication device including an RFIC (Radio Frequency Integrated Circuit) element and an antenna is known. For example, the wireless communication device described in Patent Document 1 includes an RFIC element and an antenna configured from a helical coil. The RFIC element and a part of the antenna are sealed and protected in a resin block.

International Publication No. 2016/031408

  However, in the case of the wireless communication device described in Patent Document 1, since the antenna is a magnetic field antenna composed of a helical coil, when the metal surface is disposed near the metal surface, the formation of the magnetic field is hindered by the metal surface. The As a result, communication cannot be performed with a sufficient communication distance.

  Therefore, an object of the present invention is to obtain a sufficient communicable distance even in a wireless communication device having an RFIC element and an antenna even if it is disposed in the vicinity of a metal surface.

In order to solve the above technical problem, according to one aspect of the present invention,
A flat conductor;
An RFIC element comprising first and second input / output terminals;
A loop antenna having one end connected to the first input / output terminal and the other end connected to the second input / output terminal;
A connection conductor connecting the loop antenna and the flat conductor,
The loop antenna is
A first conductor portion disposed along the flat conductor on one side of the flat conductor and connected to a first input / output terminal;
A second conductor portion disposed on one side of the flat conductor along the flat conductor and connected to a second input / output terminal;
A third conductor portion extending in a direction away from the flat conductor from the first conductor portion;
A fourth conductor portion extending in a direction away from the flat conductor from the second conductor portion;
A fifth conductor portion connecting the third conductor portion and the fourth conductor portion, and
A wireless communication device is provided in which the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.

According to another aspect of the present invention,
A metal surface;
A wireless communication device attached to the metal surface,
The wireless communication device is
A flat conductor disposed opposite to the metal surface;
An RFIC element comprising first and second input / output terminals;
A loop antenna having one end connected to the first input / output terminal and the other end connected to the second input / output terminal;
A connection conductor connecting the loop antenna and the flat conductor,
The loop antenna is
A first conductor portion disposed along the flat conductor on one side of the flat conductor and connected to a first input / output terminal;
A second conductor portion disposed on one side of the flat conductor along the flat conductor and connected to a second input / output terminal;
A third conductor portion extending in a direction away from the flat conductor from the first conductor portion;
A fourth conductor portion extending in a direction away from the flat conductor from the second conductor portion;
A fifth conductor portion connecting the third conductor portion and the fourth conductor portion, and
An article is provided in which the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.

  According to the present invention, in a wireless communication device having an RFIC element and an antenna, a sufficient communicable distance can be obtained even if it is disposed in the vicinity of a metal surface.

1 is a perspective view of a wireless communication device according to Embodiment 1 of the present invention. A perspective view of a wireless communication device attached to a metal surface of an article Sectional view of the wireless communication device attached to the metal surface of the article Equivalent circuit diagram of wireless communication device according to embodiment 1 Sectional drawing which shows one process in the manufacturing method of an example of a wireless communication device Sectional drawing which shows the manufacturing process of a radio | wireless communication device following FIG. 5A Sectional drawing which shows the manufacturing process of a wireless communication device following FIG. FIG. 5C is a cross-sectional view illustrating a manufacturing process of the wireless communication device following FIG. FIG. 5D is a cross-sectional view illustrating the manufacturing process of the wireless communication device following FIG. Sectional drawing of the radio | wireless communication device which concerns on Embodiment 2 of this invention A perspective view of a wireless communication device according to a third embodiment of the present invention Equivalent circuit diagram of wireless communication device according to Embodiment 3 A perspective view of a loop antenna in a wireless communication device according to a further embodiment Sectional drawing of the radio | wireless communication device which concerns on another another embodiment Exploded view of the wireless communication device shown in FIG.

  A wireless communication device of one embodiment of the present invention includes a flat conductor, an RFIC element including first and second input / output terminals, one end connected to the first input / output terminal, and the other end connected to the second input / output terminal. A loop antenna connected to the input / output terminal of the antenna, and a connecting conductor connecting the loop antenna and the flat conductor, and the loop antenna is connected to the flat conductor on one side of the flat conductor. And a first conductor portion connected to the first input / output terminal, and arranged along the flat conductor on one side of the flat conductor and connected to the second input / output terminal. A second conductor portion; a third conductor portion extending in a direction away from the flat conductor from the first conductor portion; and a direction extending away from the flat conductor from the second conductor portion. Connecting the fourth conductor portion, the third conductor portion, and the fourth conductor portion A fifth conductor portion, and the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.

  According to this aspect, even if the wireless communication device is disposed in the vicinity of the metal surface, the wireless communication device can obtain a sufficient communicable distance.

  It is preferable that the inductance of the loop antenna is larger than the inductance of the connection conductor. As a result, it is possible to suppress the resonance circuit including the inductance of the loop antenna and the capacitance of the RFIC element from being in an unbalanced state. As a result, the wireless communication device can perform communication over a stable communicable distance.

  It is preferable that the flat conductor has a size that overlaps the entire loop antenna when viewed in the normal direction of the flat conductor. As a result, the resonance frequency of the loop antenna is suppressed from being affected by the metal surface.

For example, preferably, the wireless communication device includes a substrate having a first main surface and a second main surface facing each other. In this case, the first and second conductor portions of the loop antenna are provided as a conductor pattern on the first main surface, and the flat conductor is provided as a conductor layer on the second main surface. The connection conductor is provided as an interlayer connection conductor that penetrates the substrate and connects the second conductor portion and the flat conductor in the loop antenna, and the third and fourth conductor portions are made of metal. Provided on the first main surface as a pin;
The first to fourth conductor portions of the RFIC element and the loop antenna are sealed in a resin block that covers the first main surface of the substrate, and the fifth conductor portion is formed of the resin block. On the surface.

  The RFIC element may be disposed between the third and fourth conductor portions that are metal pins. Thereby, the compression deformation of the resin block is suppressed, and damage to the RFIC element due to the compression deformation is reduced.

  The wireless communication device may include an excitation conductor having one end connected to the fifth conductor portion of the loop antenna and the other end being an open end. Thereby, the wireless communication device can obtain a larger antenna gain, and as a result, a longer communicable distance can be obtained.

  The RFIC element may be configured to communicate at a UHF band frequency.

  An article according to another aspect of the present invention is an article having a metal surface and a wireless communication device attached to the metal surface, the flat plate on which the wireless communication device is disposed to face the metal surface. An RFIC element including a first conductor and a first input / output terminal; a loop antenna having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; A connection conductor connecting the loop antenna and the flat conductor, and the loop antenna is disposed along the flat conductor on one side of the flat conductor, and is connected to the first input / output terminal. A first conductor portion to be connected; a second conductor portion disposed on one side of the flat conductor along the flat conductor and connected to a second input / output terminal; and the first conductor A third conductor extending in a direction away from the flat conductor from the portion A body part, a fourth conductor part extending in a direction away from the flat conductor from the second conductor part, and a fifth conductor connecting the third conductor part and the fourth conductor part And the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.

  According to this aspect, even if the wireless communication device is attached to the metal surface of the article, the wireless communication device can obtain a sufficient communicable distance.

  In the article, the flat conductor and the metal surface may be electrically connected via a capacitance, or may be electrically connected in a direct current manner.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view of a wireless communication device according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of the wireless communication device attached to the metal surface of the article. FIG. 3 is a cross-sectional view of the wireless communication device.

  The XYZ coordinate system shown in the figure is a coordinate system in which the X-axis direction is the depth direction of the wireless communication device, the Y-axis direction is the width direction, and the Z-axis direction is the height direction. . This XYZ coordinate system is for facilitating understanding of the invention and does not limit the invention. For example, the wireless communication device is not always used in a state where the height direction (Z-axis direction) is parallel to the vertical direction. The wireless communication device of the present invention can be used in any posture.

  As shown in FIG. 1, the wireless communication device 10 is a device that performs wireless communication at a communication frequency in the UHF band, and includes a radio frequency integrated circuit (RFIC) element 12 and a loop antenna 14 for that purpose. In the case of the first embodiment, the wireless communication device 10 includes a substrate 16 and a resin block 18 provided on the substrate 16.

  Specifically, as shown in FIG. 3, the substrate 16 includes a first main surface 16 a and a second main surface 16 b that face each other in the height direction (Z-axis direction). The RFIC element 12 and the loop antenna 14 are mounted on the first main surface 16a. A resin block 18 is formed on the first main surface 16a. Thereby, a part of the RFIC element 12 and the loop antenna 14 is sealed and protected in the resin block 18.

  As shown in FIG. 3, the loop antenna 14 includes five conductors (conductor portions) 14a to 14e. Specifically, the loop antenna 14 includes first and second conductor portions 14a and 14b, which are conductor patterns formed on the first main surface 16a of the substrate 16, and the first conductor portion 14a to the substrate 16. A third conductor portion 14c extending in a direction away from the substrate (Z-axis direction), a fourth conductor portion 14d extending in a direction away from the substrate 16 from the second conductor portion 14b, and a third conductor portion 14c. And a fourth conductor portion 14e connecting the fourth conductor portion 14d.

  As shown in FIG. 3, one end of the first conductor portion 14 a of the loop antenna 14 is connected to the first input / output terminal 12 a of the RFIC element 12. On the other hand, the other end is connected to the third conductor portion 14c.

  One end of the second conductor portion 14 b of the loop antenna 14 is connected to the second input / output terminal 12 b of the RFIC element 12. On the other hand, the other end is connected to the fourth conductor portion 14d.

  Each of the first and second conductor portions 14a and 14b is connected to a capacitor chip 20 arranged in parallel with the RFIC element 12, as shown in FIG. 4 showing an equivalent circuit of the wireless communication device 10. . Details of this equivalent circuit will be described later.

  In the case of the first embodiment, the third conductor portion 14c of the loop antenna 14 is composed of a metal pin. The third conductor portion 14 c also extends in the height direction (Z-axis direction) from the first conductor portion 14 a and reaches the upper surface 18 a of the resin block 18.

  In the case of this Embodiment 1, the 4th conductor part 14d of the loop antenna 14 is comprised with the metal pin. The fourth conductor portion 14 d also extends from the second conductor portion 14 b in the height direction (Z-axis direction) and reaches the upper surface 18 a of the resin block 18.

  In the case of the first embodiment, the third and fourth conductor portions 14c and 14d are formed of metal pins and sealed in the resin block 18. Further, as shown in FIG. 1, the RFIC element 12 and the capacitor chip 20 are disposed between the third and fourth conductor portions 14c and 14d. The third and fourth conductor portions 14c and 14d that are such metal pins suppress the compressive deformation of the resin block 18 in the height direction (Z-axis direction). As a result, damage to the RFIC element 12 and the capacitor chip 20 due to compression deformation of the resin block 18 is reduced.

  The fifth conductor portion 14 e of the loop antenna 14 is formed as a rectangular conductor layer on the upper surface 18 a of the resin block 18 formed on the first main surface 16 a of the substrate 16. Thereby, the 5th conductor part 14e has connected the 3rd conductor part 14c and the 4th conductor part 14d. The fifth conductor portion 14e is covered and protected by the protective layer 22.

  By being configured by such a plurality of conductor portions 14a to 14e, the loop antenna 14 has the first main direction of the substrate 16 in which the opening direction of the loop opening 14f (substantially X-axis direction) is as shown in FIG. The first main surface 16a of the substrate 16 is provided so as to be substantially parallel to the surface 16a.

  As shown in FIG. 3, a flat conductor 24 is provided on the second main surface 16 b of the substrate 16. In the case of the first embodiment, the flat conductor 24 is a conductor layer formed over substantially the entire second main surface 16b.

  Since the flat conductor 24 is provided on the second main surface 16 b, the first and second conductor portions 14 a and 14 b in the loop antenna 14 are arranged substantially parallel along the flat conductor 24. The third conductor portion 14c extends in the direction away from the flat conductor 24 (Z-axis direction) from the first conductor portion 14a. Furthermore, the fourth conductor portion 14d extends in a direction away from the flat conductor 24 from the second conductor portion 14b. Therefore, the flat conductor 24 is provided on the substrate 16 substantially in parallel along the opening direction (substantially X-axis direction) of the loop opening 14 f of the loop antenna 14.

  As shown in FIG. 2, although details will be described later, the wireless communication device 10 is configured to be usable by being attached to the metal surface 100 a of the article 100, and the flat conductor 24 is substantially omitted from the metal surface 100 a. Opposed in parallel. For example, as shown in FIG. 3, the flat conductor 24 is disposed so as to face the metal surface 100 a in a state where the flat conductor 24 is attached via the conductive adhesive 26. Thereby, the flat conductor 24 is electrically (direct current) connected to the metal surface 100a.

  As shown in FIGS. 1 and 3, the flat conductor 24 is electrically (DC) connected to the loop antenna 14. Specifically, the flat conductor 24 is connected to the second conductor portion 14 b of the loop antenna 14 via the connection conductor 28. In the present embodiment, the connection conductor 28 is an interlayer connection conductor such as a via-hole conductor or a through-hole conductor formed on the substrate 16.

  Up to this point, the structure of the wireless communication device 10 has been described. From here, the communication method of the wireless communication device 10 will be described.

  First, as shown in FIGS. 2 and 3, the wireless communication device 10 is used by being attached to a metal surface 100 a of an article 100. Specifically, as shown in FIG. 3, the flat conductor 24 is disposed to face the metal surface 100 a via the conductive adhesive 26. Thereby, the flat conductor 24 is electrically (direct current) connected to the metal surface 100a.

  As shown in FIG. 4, a resonance circuit is configured by the inductance L1 of the loop antenna 14, the capacitance C1 of the capacitor chip 20, and the capacitance C2 of the RFIC element 12. Specifically, the capacitance of the capacitor chip 20 and the shape of the loop antenna 14 are determined so that the resonance frequency of the resonance circuit substantially matches the communication frequency in the UHF band, which is the communication frequency used by the RFIC element 12.

  As shown in FIG. 3, the opening direction of the loop opening 14f of the loop antenna 14 is substantially parallel to the flat conductor 24, that is, the metal surface 100a. Therefore, the magnetic field formed by the loop antenna 14 is not easily affected by the metal surface 100a. Therefore, when a radio wave having a frequency in the UHF band is received from an external communication device (for example, an RFID tag reader / writer), a current flows through the loop antenna 14 and the current is supplied to the RFIC element 12. The RFIC element 12 that is driven by receiving a current supply transmits information stored in a storage unit such as an internal memory to the outside through the loop antenna 14 and the metal surface 100a of the article 100. A method for transmitting (radiating) radio waves via the metal surface 100a will be described later.

  As shown in FIG. 4, as described above, the inductance L1 of the loop antenna 14, the capacitance C1 of the capacitor chip 20, and the capacitance C2 of the RFIC element 12 constitute a resonance circuit. Therefore, the impedance becomes maximum at one end (one end of the capacitor 20) P1 of the RFIC element 12 in the first conductor portion 14a. Thereby, this end P1 can be regarded as a voltage maximum point. Further, the other end P2 of the RFIC element 12 in the second conductor portion 14b can be regarded as a ground potential.

  The other end P <b> 2 (that is, the second conductor portion 14 b) of the RFIC element 12 is electrically connected to the metal surface 100 a of the article 100 via the connection conductor 28 and the flat conductor 24. Therefore, the metal surface 100a can also be regarded as a ground potential. Therefore, the metal surface 100a can be used as a radiation plate. That is, the metal surface 100a functions as a booster for the loop antenna 14. By using this metal surface 100a as a radiation plate, the communicable distance of the wireless communication device 10 becomes long.

  As shown in FIG. 3, the flat conductor 24 of the wireless communication device 10 and the metal surface 100 a of the article 100 are connected in a direct current manner via a conductive adhesive 26. Instead of the conductive adhesive 26, solder may be used. Furthermore, an insulating adhesive may be used. When an insulating adhesive is used, the flat conductor 24 and the metal surface 100a are capacitively coupled. The larger the capacitance, that is, the shorter the distance between the flat conductor 24 and the metal surface 100a, or the higher the dielectric constant of the insulating adhesive, the higher the radiation efficiency of the metal surface 100a as the radiation plate, As a result, the communicable distance becomes long.

  Further, as shown in FIG. 4, the connection conductor 28 also has an inductance L2. In consideration of communication stability, the inductance L1 of the loop antenna 14 is preferably larger than the inductance L2 of the connection conductor 28. On the other hand, when the inductance L1 is smaller than the inductance L2, the resonance circuit composed of the inductance L1 of the loop antenna 14, the capacitance C1 of the capacitor chip 20, and the capacitance C2 of the RFIC element 12 can be in an unbalanced state. As a result, communication at the resonance frequency can become unstable. Therefore, it is preferable that the length of the connection conductor 28, that is, the thickness of the substrate 16, is as small as possible.

  Furthermore, as shown in FIGS. 1 and 3, the flat conductor 24 preferably has a size that overlaps the entire loop antenna 14 when viewed in the normal direction (Z-axis direction). Thereby, the loop antenna 14 is affected by the current flowing through the metal surface 100a of the article 100, and the resonance frequency is suppressed from changing.

  From here, an example of a method for manufacturing the wireless communication device 10 will be described with reference to FIGS. 5A to 5E.

  As shown in FIG. 5A, first, a through-hole penetrating from the first main surface 16a toward the second main surface 16b is formed in the substrate 16. The through hole is filled with a conductor such as copper. Thereby, the connection conductor 28 which is an interlayer connection conductor is produced.

  Next, as shown in FIG. 5B, on the first main surface 16a of the substrate 16, the first and second conductor portions 14a and 14b that are part of the loop antenna 14 are made of a conductor material such as copper. Is done. Further, the flat conductor 24 is made of a conductor material such as copper on the second main surface 16b of the substrate 16. As a result, the second conductor portion 14 b and the flat conductor 24 are electrically connected via the connection conductor 28.

  Subsequently, as shown in FIG. 5C, the RFIC element 12 is mounted on the first main surface 16 a of the substrate 16. The first input / output terminal 12a of the RFICS element 12 and the first conductor portion 14a are electrically connected by soldering or the like, and the second input / output terminal 12b and the second conductor portion 14b are electrically connected in the same manner. Connected to. In addition, a third conductor portion 14c, which is a metal pin made of a conductor material such as copper, is erected on the first conductor portion 14a, and the fourth conductor portion 14d is similarly the second conductor portion 14b. Standing on top.

  Subsequently, as illustrated in FIG. 5D, the resin block 18 is formed on the first main surface 16 a of the substrate 16. Thereby, the RFIC element 12 and the first to fourth conductor portions 14 a to 14 d are sealed in the resin block 18.

  Subsequently, as shown in FIG. 5E, the fifth conductor portion 14 e is made of a conductor material such as copper on the upper surface 18 a of the resin block 18. Thereby, the third conductor portion 14c and the fourth conductor portion 14d are electrically connected by the fifth conductor portion 14e. Then, by covering the fifth conductor portion 14e with the protective layer 22, the wireless communication device 10 as shown in FIG. 3 is completed.

  According to the first embodiment, the wireless communication device 10 can obtain a sufficient communicable distance even if it is disposed in the vicinity of the metal surface 100a. In other words, the wireless communication device 10 can ensure a sufficient communicable distance by using the metal surface 100a as a radiation plate.

(Embodiment 2)
The second embodiment is an improved form of the first embodiment described above. Therefore, the second embodiment will be described focusing on the different points. In addition, the same code | symbol is attached | subjected to the component substantially the same as the component of the above-mentioned Embodiment 1. FIG.

  FIG. 6 is a cross-sectional view of the wireless communication device according to the second embodiment.

  As shown in FIG. 6, in the wireless communication device 210 of the second embodiment, the substrate 16 is covered with a resin block 218 in addition to the first main surface 16 a and the end surface 16 c. In this case, as in the first embodiment described above (as shown in FIG. 3), the RFIC element 12 on the first main surface 16a is compared with the case where the resin block 18 covers only the first main surface 16a. And the capacitor chip 20 is further protected. For example, it is difficult for moisture to reach the RFIC element and the capacitor chip through the interface between the resin block and the substrate. Therefore, in the case of the second embodiment, the reliability of the RFIC element 12 and the capacitor chip 20 is further improved. In the second embodiment, the resin block and the substrate can be bonded with higher bonding strength.

  Further, as shown in FIG. 6, in the case of the second embodiment, the flat conductor 24 can be sized beyond the outline of the second main surface 16 b of the substrate 16. That is, the flat conductor 24 is provided on the entire second main surface 16 b of the substrate 16 and a part of the lower surface 218 b of the resin block 218. Thereby, the radiation efficiency of the metal surface 100a that functions as a radiation plate facing the flat conductor 24 is increased, and as a result, a higher communicable distance can be obtained (a flat plate is formed only on the second main surface 16b). Compared to the case where the conductor 24 is provided).

  According to the second embodiment, a sufficient communicable distance can be obtained even if the wireless communication device 10 according to the first embodiment is arranged near the metal surface 100a.

(Embodiment 3)
The third embodiment is an improved form of the above-described first embodiment, and is a form for obtaining a larger antenna gain. Therefore, the third embodiment will be described focusing on the different points. In addition, the same code | symbol is attached | subjected to the component substantially the same as the component of the above-mentioned Embodiment 1. FIG.

  FIG. 7 is a perspective view of the wireless communication device according to the third embodiment, and FIG. 8 is an equivalent circuit diagram.

  As shown in FIGS. 7 and 8, the wireless communication device 310 according to the third embodiment includes an excitation conductor 330 for obtaining a larger antenna gain. As shown in FIG. 7, the excitation conductor 330 is a meander-shaped conductor, and one end 330 a of the excitation conductor 330 is connected to the fifth conductor portion 314 e in the loop antenna 314. On the other hand, the other end 330b is an open end.

  Similar to the fifth conductor portion 314e in the loop antenna 314, the excitation conductor 330 is formed as a conductor pattern on the resin block 18, and is covered and protected by the protective layer 22.

  The excitation conductor 330 is preferably connected at one end 330a to a portion on the high potential side in the fifth conductor portion 314e, in other words, a portion far from the flat conductor 24 having the ground potential in the electrical path. Therefore, the excitation conductor 330 is connected to the portion of the fifth conductor portion 314e close to the third conductor portion 314c at one end 330a.

  Further, as shown in FIG. 8, it is preferable that the distance from the end (end of the capacitor 20) P1 of the RFIC element 12 to the open end 330b is ¼ of the wavelength λ of the radio wave communicated by the wireless communication device 310. . Rather than including such an excitation conductor 330, the wireless communication device 310 can obtain a larger antenna gain than when the excitation conductor 330 is not provided. As a result, a longer communicable distance can be obtained.

8 can be adjusted by the length from one end 330a to the open end 330b of the excitation conductor 330, and the capacitance Ce is a conductor portion extending in parallel in the meandering excitation conductor 330. Can be adjusted by the distance between.

  According to the third embodiment as described above, a sufficient communicable distance can be obtained even if the wireless communication device 10 according to the first embodiment is arranged in the vicinity of the metal surface 100a.

  Although the present invention has been described with reference to the first to third embodiments, the embodiment of the present invention is not limited to this.

  For example, in the case of the above-described first embodiment, as shown in FIG. 4, the resonance circuit of the wireless communication device 10 includes the inductance L1 of the loop antenna 14, the capacitance C1 of the capacitor chip 20, and the capacitance C2 of the RFIC element 12. It is configured. However, it is possible to configure a resonance circuit by using only the capacitor C2 of the RFIC element 12 and the inductance L1 of the loop antenna 14 without using the capacitor chip 20.

  However, in that case, the shape of the loop antenna 14, for example, the length and thickness of the third and fourth conductor portions 14c and 14d, which are metal pins, are uniquely determined. Thereby, the freedom degree of design of the radio | wireless communication device 10 falls.

  Therefore, it is preferable to use the capacitor chip 20 in order to ensure the design freedom of the wireless communication device 10. By using the capacitor chip 20, the degree of freedom of selection increases with respect to the length and thickness of the metal pin of the loop antenna 14, that is, the value of the inductance L1 of the loop antenna 14. Thereby, the Q characteristic of the inductance of the loop antenna 14 is improved, matching loss is suppressed, and radiation efficiency is improved. As a result, the communicable distance of the wireless communication device 10 can be increased.

  Note that the wireless communication device 10 can communicate at various communication frequencies simply by replacing the capacitor chip 20 with a different capacitance C1. That is, various wireless communication devices 10 having different communicable distances can be easily manufactured.

  Further, for example, in the case of the above-described first embodiment, as shown in FIG. 1, the loop antenna 14 is composed of five separate conductor portions 14 a to 14 e, but the embodiment of the present invention is not limited thereto. Absent. For example, the third conductor portion 14c, the fourth conductor portion 14d, and the fifth conductor portion 14e may be integrated into one member.

  Further, for example, in the case of the above-described first embodiment, as shown in FIG. 3, in the wireless communication device 10, the flat conductor 24 is attached to the metal surface 100 a of the article 100 via the conductive adhesive 26. . However, the embodiment of the present invention is not limited to this. The flat conductor does not necessarily have to be attached to the article via an adhesive, and the flat conductor may be disposed so as to face the metal surface of the article. That is, you may fix to articles | goods in parts other than a flat conductor. By facing the flat conductor, the metal surface of the article can function as a radiation plate, that is, as a booster for the loop antenna.

  In addition, in the case of the above-described first embodiment, as shown in FIG. 1, the loop antenna 14 is a so-called one-turn loop, but the embodiment of the present invention does not limit the number of turns of the loop antenna.

  FIG. 9 is a perspective view of a loop antenna of a wireless communication device according to a further embodiment. In FIG. 9, illustration of some components such as a substrate is omitted.

  As shown in FIG. 9, a wireless communication device 410 according to a further embodiment includes a three-turn loop antenna 414.

  The loop antenna 414 is disposed along the flat conductor 424 and connected to the first input / output terminal of the RFIC element 412. The loop antenna 414 is disposed along the flat conductor 424 and the RFIC element 412. A second conductor portion 414b connected to the second input / output terminal, a third conductor portion 414c extending in a direction away from the flat conductor 424 from the first conductor portion 414a, and a second conductor portion A fourth conductor portion 414d extending in a direction away from the flat conductor 424 from 414b and a fifth conductor portion 414e connecting the third conductor portion 414c and the fourth conductor portion 414d are provided. The first conductor portion 414a includes a land 414f connected to the first input / output terminal of the RFIC element 412. The second conductor portion 414 b includes a land 414 g connected to the second input / output terminal of the RFIC element 412. The land 414g and the flat conductor 424 are connected via a connection conductor 428.

  The fifth conductor 414e of the loop antenna 414 is a two-loop conductor whose one end is connected to the third conductor 414c and the other end is connected to the fourth conductor 414d. Specifically, the fifth conductor portion 414e is a first sub-conductor portion that extends along the flat conductor 424 and in parallel between the first and second conductor portions 414a and 414b. 415a and a second sub conductor portion 415b. The fifth conductor portion 414e includes third and fourth sub-conductor portions 415c and 415d such as metal pins extending from both ends of the first sub-conductor portion 415a in a direction away from the flat conductor 424. . Further, the fifth conductor portion 414e includes fifth and sixth sub-conductor portions 415e and 415f such as metal pins extending from both ends of the second sub-conductor portion 415b in a direction away from the flat conductor 424. . The fifth conductor portion 414e includes a seventh sub conductor portion 415g that connects the third conductor portion 414c and the fourth sub conductor portion 415d, a third sub conductor portion 415c, and a sixth sub conductor. An eighth sub-conductor portion 415h that connects the portion 415f and a ninth sub-conductor portion 415i that connects the fifth sub-conductor portion 415e and the fourth conductor portion 414d are provided.

  In addition, in the case of the above-described first embodiment, as shown in FIG. 1, in the loop antenna 14, the third conductor portion 14c and the fourth conductor portion 14d are metal pins, and the fifth conductor portion Although 14e is a conductor layer, that is, it is a separate member, the embodiment of the present invention is not limited to this.

  10 and 11 show a cross-sectional view and an exploded view of a wireless communication device according to yet another embodiment.

  As shown in FIG. 10, a wireless communication device 510 according to still another embodiment includes a loop antenna 514.

  The loop antenna 514 is disposed along the flat conductor 524 and connected to the first input / output terminal 512a of the RFIC element 512. The loop antenna 514 is disposed along the flat conductor 524 and the RFIC element. The second conductor portion 514b connected to the second input / output terminal 512b of 512, the third conductor portion 514c extending in a direction away from the first conductor portion 514a, and the second conductor portion 514b. A fourth conductor portion 514d extending in the direction, and a fifth conductor portion 514e connecting the third conductor portion 514c and the fourth conductor portion 514d. The second conductor portion 514 b is connected to the flat conductor 524 through the connection conductor 528.

  Specifically, in the loop antenna 514, the third conductor portion 514c, the fourth conductor portion 514d, and the fifth conductor portion 514e are integrated to form one gate-shaped member 532. That is, the third conductor portion 514 c, the fourth conductor portion 514 d, and the fifth conductor portion 514 e are different portions of the gate-shaped member 532. In other words, the gate-shaped member 532 has a rectangular shape in which the third conductor portion 514c, the fourth conductor portion 514d, and the fifth conductor portion 514e form three sides.

  The gate-shaped member 532 has a first connection terminal 532a connected to the first conductor portion 514a on the substrate 516 at one end, and a second connection connected to the second conductor portion 514b at the other end. Connection terminal 532b. The gate-shaped member 532 is also embedded in the cap-shaped resin block 518 except for the first connection terminal 532a and the second connection terminal 532b. The cap-shaped resin block 518 is formed with a recess 518a for accommodating the RFIC element 512, the first conductor portion 514a, and the second conductor portion 514b on the substrate 516. Thereby, the resin block 518 covers and protects them.

  The connection between the first connection terminal 532a and the first conductor portion 514a of the gate-shaped member 532 and the connection between the second connection terminal 532b and the second conductor portion 514b are, for example, via solder 534. Has been done. Similarly, the connection between the first input / output terminal 512a and the first conductor portion 514a of the RFIC element 512 and the connection between the second input / output terminal 512b and the second conductor portion 514b are, for example, This is done via solder 536.

  Furthermore, in the case of the first embodiment described above, as shown in FIG. 1, the RFIC element 12, the first to fourth conductor portions 14 a to 14 d in the loop antenna 14, and the capacitor chip 20 are sealed in the resin block 18. Has been. Further, the RFIC element 12, the first and second conductor portions 14 a and 14 b in the loop antenna 14, and the flat conductor 24 are provided on the substrate 16. However, the embodiment of the present invention is not limited to this.

  That is, the wireless communication device according to the embodiment of the present invention broadly includes a flat conductor, an RFIC element including first and second input / output terminals, and one end connected to the first input / output terminal. A loop antenna having the other end connected to the second input / output terminal, and a connection conductor connecting the loop antenna and the flat conductor, wherein the loop antenna is connected to the flat conductor. A first conductor portion disposed along the flat conductor on one side and connected to a first input / output terminal; a second conductor disposed along the flat conductor on one side of the flat conductor; A second conductor portion connected to the input / output terminal, a third conductor portion extending from the first conductor portion in a direction away from the flat conductor, and the flat conductor shape from the second conductor portion. A fourth conductor portion extending in a direction away from the conductor, and the third conductor portion, A fifth conductor portion that connects the fourth conductor portion, and the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.

  In addition, the article to which the wireless communication device is attached may be an article having a metal surface as a result of being entirely made of a metal material, or a non-metal material other than a metal surface, for example, a resin material. It may be an article.

  Although the present invention has been described with reference to a plurality of embodiments, at least one embodiment as a whole or a partial combination with respect to a certain embodiment is used as a further embodiment according to the present invention. It will be apparent to those skilled in the art that this is possible.

  The present invention is applicable to a wireless communication device including an RFIC element that can be disposed in the vicinity of a metal surface.

DESCRIPTION OF SYMBOLS 10 Wireless communication device 12 RFIC element 12a 1st input / output terminal 12b 2nd input / output terminal 14 Loop antenna 14a 1st conductor part 14b 2nd conductor part 14c 3rd conductor part 14d 4th conductor part 14e 4th 5 conductor portions 24 flat conductor 28 connecting conductor

Claims (9)

A flat conductor;
An RFIC element comprising first and second input / output terminals;
A loop antenna having one end connected to the first input / output terminal and the other end connected to the second input / output terminal;
A connection conductor connecting the loop antenna and the flat conductor,
The loop antenna is
A first conductor portion disposed along the flat conductor on one side of the flat conductor and connected to a first input / output terminal;
A second conductor portion disposed on one side of the flat conductor along the flat conductor and connected to a second input / output terminal;
A third conductor portion extending in a direction away from the flat conductor from the first conductor portion;
A fourth conductor portion extending in a direction away from the flat conductor from the second conductor portion;
A fifth conductor portion connecting the third conductor portion and the fourth conductor portion, and
The wireless communication device, wherein the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.   The wireless communication device according to claim 1, wherein an inductance of the loop antenna is larger than an inductance of the connection conductor.   The wireless communication device according to claim 1, wherein the flat conductor has a size that overlaps the entire loop antenna when viewed in a normal direction of the flat conductor. A substrate having a first main surface and a second main surface facing each other;
The first and second conductor portions of the loop antenna are provided as conductor patterns on the first main surface;
The flat conductor is provided as a conductor layer on the second main surface;
The connection conductor is provided as an interlayer connection conductor that penetrates the substrate and connects the second conductor portion and the flat conductor in the loop antenna;
The third and fourth conductor portions are provided on the first main surface as metal pins,
The first to fourth conductor portions in the RFIC element and the loop antenna are sealed in a resin block that covers the first main surface of the substrate,
The wireless communication device according to any one of claims 1 to 3, wherein the fifth conductor portion is provided on a surface of the resin block.   The wireless communication device according to claim 4, wherein the RFIC element is disposed between the third and fourth conductor portions that are metal pins.   6. The wireless communication device according to claim 1, further comprising an excitation conductor having one end connected to the fifth conductor portion of the loop antenna and the other end being an open end.   The wireless communication device according to claim 1, wherein the RFIC element is configured to communicate at a frequency in a UHF band. A metal surface;
A wireless communication device attached to the metal surface,
The wireless communication device is
A flat conductor disposed opposite to the metal surface;
An RFIC element comprising first and second input / output terminals;
A loop antenna having one end connected to the first input / output terminal and the other end connected to the second input / output terminal;
A connection conductor connecting the loop antenna and the flat conductor,
The loop antenna is
A first conductor portion disposed along the flat conductor on one side of the flat conductor and connected to a first input / output terminal;
A second conductor portion disposed on one side of the flat conductor along the flat conductor and connected to a second input / output terminal;
A third conductor portion extending in a direction away from the flat conductor from the first conductor portion;
A fourth conductor portion extending in a direction away from the flat conductor from the second conductor portion;
A fifth conductor portion connecting the third conductor portion and the fourth conductor portion, and
The article, wherein the connection conductor connects the second conductor portion and the flat conductor in the loop antenna.   The article according to claim 8, wherein the flat conductor and the metal surface are electrically connected via a capacitance or DC.

Images