JPWO2018070287A1 - Fluid sensor, fluid control device including the fluid sensor, and adjustment method - Google Patents

Abstract

In order to provide a fluid sensor that can facilitate adjustment work for suppressing variations in the output from the sensor body with respect to the physical quantity of the fluid and that is more accurate than the conventional one, and a fluid control device including the fluid sensor. A sensor body that is provided in a flow path through which the fluid flows, and whose output changes according to the physical quantity of the fluid; an output of the sensor body that is input; A lead-out interposed between the sensor body and the conversion circuit and bridging the output of the sensor body to the conversion circuit, wherein the lead-out has a first end to which the sensor body 7 is connected; And a second end to which the conversion circuit is connected, and a pattern formed between the first end and the second end, and including a conduction portion through which a current flows and a plurality of missing portions. .

Description

  The present invention relates to a fluid sensor used for measuring a physical quantity of a fluid, a fluid control device including the fluid sensor, and a method for adjusting them.

  An example of a fluid sensor that measures a flow rate, which is a kind of physical quantity of fluid, is a thermal flow sensor. As shown in Patent Document 1, the thermal flow sensor is wound by winding resistances, which are heater and temperature sensors, at two locations on the sensor flow path that branches from the main flow path through which the fluid flows and returns to the main flow path. The flow rate of the fluid is calculated based on the temperature difference when a constant current is passed through each winding resistance or the power consumption difference at each winding resistance when the temperature difference at each winding resistance is kept constant. Things are known.

  By the way, in this type of fluid sensor, for example, the initial fluctuation of the zero point output and the drift after stabilization change due to variations in manufacturing accuracy and component accuracy for each individual. For this reason, in the production site, adjustment work is appropriately performed so that the dimensions and physical property values of various components in the fluid sensor are within a predetermined allowable range.

  For example, in the thermal flow sensor described above, an allowable range is predetermined for the resistance value of the winding resistance, and if the resistance value exceeds the upper limit of the allowable range, a part of the winding resistance is manually removed. Thus, the adjustment is performed by shortening and reducing the resistance value. Thus, when the physical quantity of a certain fluid is measured, the variation in the output from the sensor body for each fluid sensor is suppressed to a required level.

  However, the high accuracy of adjusting the resistance value, for example, by this method has almost reached its limit, and it is possible to cope with the miniaturization of the recent semiconductor manufacturing process, and further suppress the variation in measurement error. It is difficult to realize.

JP 2009-300403 A

  The present invention has been made in view of the above-described problems, and can facilitate adjustment work for suppressing variations in output from the sensor body with respect to the physical quantity of the fluid. And it aims at providing the fluid control apparatus provided with the said fluid sensor.

  That is, a fluid sensor according to the present invention is provided in a flow path through which a fluid flows, and a sensor body whose output changes according to the physical quantity of the fluid, and an output of the sensor body is input, and the output is converted into a physical quantity of the fluid. A conversion circuit for converting and outputting, and a lead-out interposed between the sensor body and the conversion circuit for bridging the output of the sensor body to the conversion circuit, wherein the lead-out comprises the sensor body Are connected between the first end, the second end to which the conversion circuit is connected, the first end and the second end, and a current-carrying portion and a plurality of defects. The pattern which consists of a part comprises.

  In such a case, for example, when the resistance value of the sensor body exceeds the upper limit of the design allowable value and a measurement error occurs, the defective portion of the pattern is closed with a conductor, and the sensor body It can be adjusted by reducing the resistance value from to the conversion circuit. Moreover, it is easy to perceive sensuously without using a measuring instrument as to how much the resistance value can be lowered depending on the number of closed portions. Therefore, it is possible to standardize fine adjustments that depend on the experience, intuition, or skill of engineers at the production site, and to achieve higher accuracy. For this reason, the dispersion | variation regarding the measurement error for every individual | flux of a fluid sensor can be reduced significantly compared with the past, for example, it becomes possible to advance further refinement | miniaturization in a semiconductor manufacturing process.

  In the production process of the fluid sensor, the resistance value of the sensor body can be adjusted together during the work for electrically connecting the sensor body and the conversion circuit, and the production efficiency can be increased. What is necessary is just to further provide the conductor provided so that at least 1 of a some defect | deletion part might be blocked | closed and to contact the said conduction | electrical_connection part.

  For example, in order to make it easier to check the number of defective portions blocked by a conductor such as solder and to make it easier to understand how much the resistance value from the sensor body to the conversion circuit has been reduced, It suffices if the missing portions are formed in a line.

  In order to make the adjustment easy to make the relationship between the amount of decrease in the resistance value from the sensor body to the conversion circuit and the number of missing parts blocked by the conductor substantially proportional, The plurality of missing portions of the sensor body may have the same shape and are formed at equal intervals.

  As a specific example of the pattern that facilitates the adjustment of the resistance value, the defective portion is formed in a cutout shape with respect to the conductive portion, and the pattern is configured to form a meandering pattern. Things.

  As another specific example of the pattern, there is one in which the defect portion is formed at a central portion with respect to the conductive portion, and the pattern is configured to form a ladder pattern.

  By providing the lead-out with the pattern, it is possible to improve the adjustment accuracy of the resistance value from the sensor body to the conversion circuit, and greatly reduce the variation of the zero point error between individuals. Preferably, the sensor body is a pair of winding resistors provided side by side in the flow direction with respect to the fluid flow path, and the resistance value of the pair of winding resistors or the applied voltage value For example, the conversion circuit is configured to convert the output of the sensor body into a flow rate.

  As long as at least one lead-out is provided for each of the pair of winding resistances, any winding resistance can be adjusted even when the resistance value is larger than the design value. It is easy to adjust the resistance value difference.

  If the conductor is solder, the resistance value can be adjusted together with the soldering operation for electrically connecting the sensor body and the conversion circuit to the lead-out.

  For example, in order to reduce the influence of the thermal siphon phenomenon that the vertical direction occurs in the mounting direction of the fluid sensor and the zero point changes due to the thermal convection of the fluid, a heating element is provided for the flow path. It is necessary to perform temperature compensation. At this time, if there is variation in the resistance value between the heating element and the power source, the expected amount of heat generation cannot be obtained, and thus the influence of the thermal siphon phenomenon may not be completely eliminated. In order to solve such a problem, a heating element provided in a flow path through which a fluid flows, a power supply for supplying a current to the heating element, and the heating element and the power supply are interposed. A lead-out that bridges between the heating element and the power source, wherein the lead-out has a first end to which the heating element is connected, and a second end to which the power source is connected, Any fluid sensor may be used as long as it is formed between the first end portion and the second end portion and includes a conduction portion through which a current flows and a pattern including a plurality of defect portions.

  If the fluid control device includes the fluid sensor according to the present invention, a valve provided in the flow path, and a valve control unit that controls the opening of the valve based on the output of the fluid sensor, the fluid control device Variations in the control accuracy of each device can be suppressed.

  An adjustment method according to the present invention is provided in a flow path through which a fluid flows, and a sensor body whose output changes according to the physical quantity of the fluid, and an output of the sensor body is input, and the output is converted into a physical quantity of the fluid. And a conversion circuit that is interposed between the sensor body and the conversion circuit, and that bridges the output of the sensor body to the conversion circuit. The readout is connected to the sensor body. Formed between the first end portion, the second end portion to which the conversion circuit is connected, the first end portion and the second end portion, and a current-carrying portion and a plurality of missing portions. The method of adjusting a fluid sensor comprising: a pattern comprising: a step of closing at least one of the plurality of deficient portions with solder so as to be in contact with the conducting portion.

  With such a method, the resistance value from the sensor body to the conversion circuit can be adjusted while accurately grasping the amount of decrease even when the resistance value is changed minutely.

  The sensor body is a pair of winding resistors provided side by side in a flow direction with respect to a fluid flow path, and outputs a resistance value of the pair of winding resistors or an applied voltage value. The conversion circuit is configured to convert the output of the sensor body into a flow rate, and at least one lead-out is provided for each of the pair of winding resistors, and the pair of windings If the adjustment method further includes the step of determining the difference in the number of the plurality of missing portions in each lead-out so that the difference in resistance value of the line resistance is reduced, the zero point error generated in the thermal type flow sensor can be reduced. Variations between individuals can be greatly reduced. That is, as a result of intensive studies, the inventors of the present application have found that the variation of the zero point error in the thermal type flow sensor is affected by various design parameters, but the resistance value of the pair of winding resistors as the sensor body. It was the first time that the difference had a major impact.

  In the fluid sensor according to the present invention, the resistance value from the sensor body to the conversion circuit is closed to the design value even by a small error by closing the missing portion in the lead-out with a conductor. It can be easily approached. For this reason, the dispersion | variation regarding the measurement error for every individual | fluid of a fluid sensor can be reduced, and high precision can be implement | achieved.

The typical perspective view shown about the fluid control apparatus provided with the fluid sensor which concerns on this invention. The typical sectional view of the fluid control device in the embodiment. The schematic diagram which shows the structure of the fluid sensor in the embodiment. The schematic diagram which shows the readout of the fluid sensor in the embodiment. The schematic diagram which shows the procedure of the adjustment method of the resistance value in the embodiment. The experimental data which show the relationship between the number which closed the defect | deletion part in the same embodiment, and the fall amount of resistance value. The schematic diagram which shows the lead-out in another embodiment of the fluid sensor which concerns on this invention. The schematic diagram which shows the lead-out in another embodiment of the fluid sensor which concerns on this invention. The schematic diagram which shows different embodiment of the fluid sensor which concerns on this invention.

200: Mass flow controller (fluid control device)
100 ... Flow sensor (fluid sensor)
7 ・ ・ ・ Sensor body 71 ・ ・ ・ Upstream winding resistance 72 ・ ・ ・ Downstream winding resistance 8 ・ ・ ・ Leadout 81 ・ ・ ・ Pattern 82 ・ ・ ・ Conducting portion 83 ・ ・ ・ Deficient portion 9・ Conversion circuit

  The fluid sensor according to the present embodiment is a thermal flow sensor 100. The fluid control device C is a thermal mass flow controller 200 that controls the flow rate so that the fluid flows at a target flow rate based on the output of the thermal flow sensor 100.

  More specifically, the mass flow controller 200 of this embodiment controls, for example, the flow rate of the component gas to the target flow rate with respect to the vacuum chamber of the semiconductor manufacturing apparatus. The mass flow controller 200 has a substantially thin rectangular parallelepiped shape as shown in FIG. 1 and is connected to a line through which component gas flows. As shown in FIG. 2, the mass flow controller 200 is connected to a line through which a component gas flows, and a block body 1 in which a main flow path 2 forming a part of the line is formed, and component attachment on the upper surface of the block body 1 The thermal flow sensor 100 attached to the surface, the valve 4 attached to the downstream side of the flow sensor 100, and the control device C are provided. The control device C is a so-called computer having a CPU, a memory, an A / D / D / A converter, and various input / output means, and a program for a mass flow controller stored in the memory is executed so that each device Will work as a valve control unit. The valve control unit is configured to feedback control the opening degree of the valve 4 so that a deviation between a target flow rate and an actual flow rate measured by the flow sensor 100 is small. That is, when the measured flow rate is larger than the target flow rate, the opening degree of the valve 4 is made smaller than the current opening degree, and when the measured flow rate is smaller than the target flow rate, the opening degree of the valve 4 is opened. The voltage applied to the valve 4 is controlled to be greater than the degree.

  Next, details of the flow sensor 100 will be described.

  As shown in FIGS. 2 and 3, the thermal flow sensor 100 is divided into a main flow path 2 through which a component gas flows, a main flow is branched from the main flow path 2, and the main flow is at a merging point downstream of the branch point. Provided between the sensor flow path 6 set as a part of the branch flow path returning to the path 2, the flow rate detection mechanism for detecting the flow rate of the component gas, and the branch point and the junction point in the main flow path 2. And a laminar flow element 3 as a resistor. The laminar flow element 3 is configured so that the diversion ratio between the main flow path 2 and the sensor flow path 6 becomes a predetermined design value, and is composed of a resistance member such as a bypass element having constant flow characteristics. As this laminar flow element 3, one formed by inserting a plurality of thin tubes into the outer tube, or one formed by laminating a plurality of thin discs having a large number of through holes is used. Can do.

  As shown in FIGS. 2 and 3, the sensor flow path 6 is formed by a thin tube made of metal (for example, stainless steel) and is accommodated so as to pass through the casing 5.

  As shown in FIG. 3, the flow rate detection mechanism includes a sensor body 7 for detecting a flow rate divided into the sensor flow path 6 and a component gas that flows through the main flow path 2 by acquiring an output signal from the sensor body 7. A conversion circuit 9 for converting at least a mass flow rate, and a lead-out 8 that is interposed between the sensor body 7 and the conversion circuit 9 and bridges the output of the sensor body 7 to the conversion circuit 9. Yes.

  The sensor body 7 is composed of an upstream winding resistance 71 and a downstream winding resistance 72 formed by winding a heating resistance wire whose electrical resistance value increases or decreases with changes in temperature around the outer peripheral surface of the thin tube. is there. The upstream winding resistance 71 and the downstream winding resistance 72 serve both as a heater and a temperature sensor.

  The conversion circuit 9 receives the output of the sensor body 7, converts the output into a flow rate that is a kind of physical quantity of fluid, and outputs the flow rate. Specifically, the conversion circuit 9 is configured such that the upstream winding resistor 71 and the downstream winding resistor 72 are connected to each other to form a bridge circuit 91. The conversion circuit 9 includes an amplifier circuit 92 that amplifies the output of the bridge circuit 91, a compensation circuit 93 that corrects the output, and the like. In terms of function, the conversion circuit 9 detects the instantaneous flow rate of the component gas as an electrical signal (voltage value) from the upstream winding resistance 71 and the downstream winding resistance 72 to detect the flow rate in the sensor flow path 6. And the flow rate of the component gas in the main flow path 2 is calculated based on the diversion ratio between the main flow path 2 and the sensor flow path 6, and the sensor output signal (flow measurement signal) corresponding to the calculated flow rate Is output. The specific circuit configuration of the conversion circuit 9 is different between the constant temperature control type and the constant current control type, but since this is known, detailed description thereof is omitted.

  The lead-out 8 includes a portion formed of a metal film and a defective portion 83 where no metal film is formed, and both ends of the upstream side winding resistor 71 and the downstream side winding resistor 72. The part is soldered. As shown in FIGS. 3 and 4, there are a total of four lead-outs 8. In this embodiment, a predetermined pattern 81 is formed on each of the upstream winding resistance 71 and the downstream winding resistance 72. Is included. Hereinafter, the lead-out 8 having the predetermined pattern 81 will be described in detail.

  Each lead-out 8 having a predetermined pattern 81 includes a first end R1 to which the ends of the upstream winding resistance 71 and the downstream winding resistance 72 as the sensor body 7 are connected, and the conversion circuit 9. And a second end R2 to which the bridge circuit 91 is connected. The pattern 81 is formed between the first end portion R1 and the second end portion R2 and includes a conductive portion 82 made of a single metal film and a plurality of defective portions 83. Here, the defect portion 83 is configured such that the conductive grains 82 are adjacent to each other between the first end R1 and the second end R2, and no metal film is formed, so that no current flows. Say the part.

  In the present embodiment, the lead-out 8 extends in one direction as a whole, and a plurality of missing portions 83 are formed in a line at equal intervals, so that only the central portion is formed as a meandering pattern 81 (serpentite pattern 81). It is. More specifically, when viewed from the first end R1 to the second end R2, the respective defect portions 83 are formed in a notch at equal intervals, and their opening directions are alternately left and right in the drawing view. It is made to appear in. In addition, as shown in FIG. 4, the width dimension of the conducting part 82 and the width dimension of the defect part 83 in the traveling direction of the meandering pattern 81 are set to substantially the same dimension.

  The meandering pattern 81 is used for adjustment to make a difference in resistance value between the upstream winding resistance 71 and the downstream winding resistance 72 within a preset tolerance. More specifically, the resistance value from the center body to the conversion circuit 9 is decreased by enlarging the conductive region by closing each of the defective portions 83 by soldering, and the upstream winding resistance 71 is reduced. And the downstream winding resistance 72 are adjusted so as to reduce the resistance value difference. Further, since each of the defective portions 83 has the same degree, the amount of decrease in the resistance value can be made substantially proportional to the number of the closed portions 83. More specifically, as shown in FIG. 5, when the number of portions 83 of each lead-out 8 that are closed by soldering is increased by one, the defective portions 83 are closed as shown in the experimental data of FIG. 6. The resistance value can be reduced almost linearly with respect to the number. From this experimental data, it can be seen that the adjustment operator can intuitively determine how much the resistance value can be lowered depending on the number of the closed portions 83 to be closed. Here, in FIG. 5, the order in which the defect portion 83 is closed by soldering is not particularly limited. For example, the defect portion 83 may be closed in order from the end R2 side, or the debt in order from the end R1 side. But you can.

  In addition, after adjustment work is performed when there is a resistance value difference between the upstream winding resistance 71 and the downstream winding resistance 72, at least a part of the missing portion 83 is closed and the conduction portion 82 is closed. The solder which is a conductor provided so as to come into contact with the lead 8 is present on the lead-out 8.

  Next, an operation procedure for adjusting a resistance value difference between the upstream winding resistance 71 and the downstream winding resistance 72 of the flow rate sensor 100 will be described.

  First, the resistance values of the upstream winding resistance 71 and the downstream winding resistance 72 are measured using a resistance measuring instrument. Next, a resistance value difference between the upstream winding resistance 71 and the downstream winding resistance 72 is calculated. Further, it is calculated how many resistance portions difference can be minimized when the number of missing portions 83 is closed. For example, the amount of decrease in the resistance value caused by closing one defect portion 83 may be grasped beforehand from experimental data such as the graph of FIG. Finally, soldering is performed so that the calculated number of defects 83 is blocked.

  By adjusting according to the above procedure, the resistance value from the upstream winding resistance 71 to the conversion circuit 9 and the resistance value from the downstream winding resistance 72 to the conversion circuit 9 are almost equal. The same value can be set, and the resistance value difference can be minimized.

  Next, the effect by comprising like the flow sensor 100 of this embodiment is demonstrated.

  In the thermal type flow sensor 100 of the present embodiment, since the defect portions 83 of the same size are arranged at equal intervals in the lead-out 8, the resistance value is adjusted by closing the defect portions 83 by soldering. be able to.

  In addition, the number of closed portions 83 and the amount of decrease in resistance value can be made approximately proportional. Therefore, for example, by adjusting the width and size of the defect portion 83 as appropriate, the amount of resistance value that decreases when the defect portion 83 is blocked is approximately the same as the required tolerance accuracy, and the adjustment operator It can be adjusted so that the soldering size can be realized with the work accuracy of. In other words, in the case of the defect portion 83 whose size and shape are adjusted, the adjuster closes one defect portion 83 in comparison with the minimum unit that can reduce the resistance value by cutting and shortening the winding resistance. Therefore, the amount of decrease in resistance can be reduced. Thus, the precision of the adjustment work required to reduce the resistance value can be greatly relaxed, so that the upstream winding resistance 71 and the downstream winding resistance 72 of each individual flow sensor 100 can be reduced. Variation in resistance value difference can be suppressed as compared with the conventional case.

  Furthermore, as the inventors of the present application discovered for the first time, the smaller the resistance difference between the upstream winding resistance 71 and the downstream winding resistance 72, the more the initial fluctuation of the zero point output of the flow sensor that occurs, and the more stable the output. The absolute value of the later drift amount can be reduced. For this reason, the flow rate sensor 100 according to the present embodiment has a resistance value difference between the upstream winding resistance 71 and the downstream winding resistance 72 by soldering to block the defective portion 83 using the pattern 81 formed in the lead-out 8. Can be reduced, and variations in individual zero point drift can be suppressed. Therefore, the range of flow rate measurement accuracy that can be guaranteed for the entire product can be made narrower, and highly accurate flow rate measurement and flow rate control can be realized.

  Other embodiments will be described.

  The predetermined pattern formed in the lead-out is not limited to the meander pattern described in the above embodiment. For example, as shown in FIG. 7, a plurality of missing portions may be provided in a line at the center of the lead-out to form a ladder pattern. Even in such a case, it is possible to easily finely adjust the resistance value from the sensor body to the conversion circuit by closing the defective portion by soldering or the like, as in the above embodiment.

  Further, the sizes of the missing portions may not all be the same size. For example, as shown in FIG. 8, the size of the missing portion may be increased little by little. If this is the case, you can close the large defect when you want to increase the amount of decrease in resistance, and close the small defect when you want to make fine adjustments. It is possible to reduce the time required for work.

  In the above embodiment, the lead-out has a predetermined pattern only in the lead-out arranged at the center, but the predetermined pattern may be formed only in the lead-out arranged outside. A predetermined pattern may be formed on all the lead-outs. Further, the number of lead-outs is not limited to four as in the above-described embodiment, and more lead-outs than four may be formed.

  The lead-out is not limited to a straight one, and may be bent along the way. In short, a predetermined pattern may be formed between the first end to which the sensor body is connected and the second end to which the conversion circuit is connected.

  The method for closing the defect is not limited to soldering. For example, a conductive paste conductive sheet material such as silver may be applied on the defective portion so as to be in contact with the adjacent conductive portion, and may be sintered. In short, it suffices to be able to block the defective portion that does not pass current with a conductor so that current flows. Further, the present invention may be applied not only to a single layer but also to a multilayer substrate structure in which layers are electrically connected in multiple layers.

  In the above embodiment, a thermal flow sensor is taken as an example of a fluid sensor, but a pressure flow sensor, a pressure sensor that measures the pressure of the fluid, a temperature sensor that measures the temperature of the fluid, and the like. A lead-out with a pattern can be applied. Further, although the mass flow controller is described as an example of the fluid control device, the fluid control device may be a fluid pressure control device, a fluid temperature control device, or the like.

  In the case of a pressure type flow sensor or pressure sensor, the strain gauge that measures the strain of the diaphragm that is provided in the flow path and is configured to be deformed by the pressure of the fluid corresponds to the sensor body, and the output of the strain gauge is the pressure. A circuit for converting to the above corresponds to a conversion circuit. A predetermined pattern may be formed in a lead-out interposed between them to bridge the output of the strain gauge to the conversion circuit, so that the resistance value can be adjusted. Similarly, for the temperature sensor, a lead-out having the predetermined pattern of the present invention is provided between a temperature sensor that outputs a voltage corresponding to the temperature of the fluid and a conversion circuit that converts the output voltage of the temperature sensor into a temperature. Just do it.

  As shown in FIG. 9, the lead-out 8 as shown in the above embodiment is provided between the heating element H for compensating for the thermal siphon phenomenon and the power source PS that supplies current to the heating element H. The resistance value may be adjusted. In other words, in this embodiment, the two heating elements H are provided in the portions perpendicular to the portion where the sensor body 7 is provided in the sensor flow path 6. A minute resistance value can be adjusted by providing the lead-out 8 between the heating element H and the power source PS and filling the defective portion 83 of the lead-out 8 with solder. In such a case, even if the installation direction of the flow sensor 100 or the mass flow controller 200 is not determined until it is actually used, adjustment is performed on the spot, and the influence of the thermal siphon phenomenon is affected by the sensor body. 7 can be prevented from appearing in the output.

  In addition, various combinations and modifications of the embodiments may be performed without departing from the spirit of the present invention.

According to the present invention, with respect to the resistance value from the sensor body to the conversion circuit, the missing portion in the lead-out is closed with a conductor, so that even a small error can be easily achieved with respect to the design value A fluid sensor that can be approached can be provided.

Claims (13)

A sensor body provided in a flow path through which the fluid flows, the output of which changes according to the physical quantity of the fluid;
A conversion circuit that receives the output of the sensor body and converts the output into a physical quantity of fluid;
A lead-out interposed between the sensor body and the conversion circuit, and bridging the output of the sensor body to the conversion circuit;
The lead-out
A first end to which the sensor body is connected;
A second end to which the conversion circuit is connected;
A fluid sensor, comprising: a conductive portion through which a current flows and a pattern including a plurality of deficient portions formed between the first end portion and the second end portion.   The fluid sensor according to claim 1, further comprising a conductor provided to close at least one of the plurality of deficient portions and to contact the conduction portion.   The fluid sensor according to claim 1, wherein the plurality of defective portions are formed in a line.   The fluid sensor according to claim 3, wherein the plurality of deficient portions have the same shape and are arranged at equal intervals. The defect portion is formed in a cutout shape with respect to the conduction portion;
The fluid sensor according to claim 1, wherein the pattern is configured to form a meandering pattern. The defect portion is formed in a central portion with respect to the conduction portion;
The fluid sensor according to claim 1, wherein the pattern is configured to form a ladder pattern. The sensor body is a pair of winding resistors provided side by side in a flow direction with respect to a fluid flow path, and outputs a resistance value of the pair of winding resistors or an applied voltage value. ,
The fluid sensor according to claim 1, wherein the conversion circuit is configured to convert the output of the sensor body into a flow rate.   The fluid sensor according to claim 7, wherein at least one lead-out is provided for each of the pair of winding resistors.   The fluid sensor according to claim 2, wherein the conductor is solder. A heating element provided in a flow path through which the fluid flows;
A power supply for supplying current to the heating element;
A lead-out interposed between the heating element and the power source, and bridging between the heating element and the power source,
The lead-out
A first end to which the heating element is connected;
A second end to which the power source is connected;
A fluid sensor, comprising: a conductive portion through which a current flows and a pattern including a plurality of deficient portions formed between the first end portion and the second end portion. A fluid sensor according to claim 1;
A valve provided in the flow path;
And a valve control unit that controls an opening degree of the valve based on an output of the fluid sensor. A sensor body that is provided in a flow path through which the fluid flows, and whose output changes according to the physical quantity of the fluid; an output of the sensor body that is input; A lead-out interposed between the sensor body and the conversion circuit and bridging the output of the sensor body to the conversion circuit, wherein the lead-out has a first end to which the sensor body is connected; A fluid comprising: a second end to which the conversion circuit is connected; and a pattern formed between the first end and the second end and including a conduction portion through which a current flows and a plurality of missing portions. A sensor adjustment method,
An adjustment method comprising: a step of closing at least one of the plurality of deficient portions with solder so as to be in contact with the conducting portion. The sensor body is a pair of winding resistors provided side by side in a flow direction with respect to a fluid flow path, and outputs a resistance value of the pair of winding resistors or an applied voltage value. The conversion circuit is configured to convert the output of the sensor body into a flow rate, and at least one lead-out is provided for each of the pair of winding resistors,
The adjustment method according to claim 12, further comprising a step of determining a number difference for closing the plurality of defective portions of each lead-out so that a resistance value difference between the pair of winding resistors is small.

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