JP6017844B2 - Flowmeter - Google Patents
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- JP6017844B2 JP6017844B2 JP2012128800A JP2012128800A JP6017844B2 JP 6017844 B2 JP6017844 B2 JP 6017844B2 JP 2012128800 A JP2012128800 A JP 2012128800A JP 2012128800 A JP2012128800 A JP 2012128800A JP 6017844 B2 JP6017844 B2 JP 6017844B2
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- conductive film
- fixing member
- capillary
- thermal
- resistor
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 83
- 229910052697 platinum Inorganic materials 0.000 claims description 41
- 239000012530 fluid Substances 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000000615 nonconductor Substances 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000012212 insulator Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Measuring Volume Flow (AREA)
Description
本発明は計測技術に関し、特に流量計に関する。 The present invention relates to measurement technology, and more particularly to a flow meter.
半導体装置の製造工程、工業炉、ボイラ、及び空調熱源機器等においては、適切な流量の流体が供給されることが求められている。そのため、流量を正確に計測するための流量計が種々開発されている。特に半導体装置の製造工程においては、熱式質量流量キャピラリセンサが多く用いられている（例えば、特許文献１参照。）。 In a semiconductor device manufacturing process, an industrial furnace, a boiler, an air conditioning heat source device, and the like, it is required that an appropriate flow rate of fluid is supplied. For this reason, various flow meters for accurately measuring the flow rate have been developed. In particular, in a semiconductor device manufacturing process, a thermal mass flow capillary sensor is often used (for example, see Patent Document 1).
熱式質量流量キャピラリセンサにおいては、流体が流れる管にバイパス管路としてキャピラリが設けられ、キャピラリの少なくとも２カ所において、絶縁被膜された感熱抵抗体の細線が巻き付けられる。キャピラリ内部に流体が流れていない場合は、２カ所における感熱抵抗体の抵抗値は同じである。しかし、キャピラリに流体が流れると、キャピラリの上流側に巻き付けられた感熱抵抗体から下流側に巻き付けられた感熱抵抗体に、流体が熱を運搬する。そのため、キャピラリの下流側に巻き付けられた感熱抵抗体のほうが、上流側に巻き付けられた感熱抵抗体よりも抵抗値が高くなる。二つの感熱抵抗体の間に生じた抵抗値の差は、キャピラリ内部を流れる流体の流量に依存するため、二つの感熱抵抗体の間に生じた抵抗値の差から、キャピラリ内部を流れる流体の流量を求めることが可能である。 In the thermal mass flow capillary sensor, a capillary is provided as a bypass line in a pipe through which a fluid flows, and a thin wire of a heat-sensitive resistor with an insulating coating is wound around at least two locations of the capillary. When no fluid is flowing inside the capillary, the resistance values of the thermal resistors at the two locations are the same. However, when fluid flows through the capillary, the fluid carries heat from the thermal resistor wound around the upstream side of the capillary to the thermal resistor wound around the downstream side. Therefore, the resistance value of the thermal resistor wound on the downstream side of the capillary is higher than that of the thermal resistor wound on the upstream side. Since the difference in resistance value generated between the two thermal resistors depends on the flow rate of the fluid flowing inside the capillary, the difference between the resistance values generated between the two thermal resistors causes the difference in the fluid flowing inside the capillary. It is possible to determine the flow rate.
しかし、従来の熱式質量流量キャピラリセンサにおいては、感熱抵抗体及び絶縁被膜の均一性に個体差があり、キャピラリに流体が流れていない場合における、上流側に巻き付けられた感熱抵抗体の抵抗値と、下流側に巻き付けられた感熱抵抗体の抵抗値と、の差が、流量計の個体毎に異なる場合があった。そこで、本発明は、個体差の少ない流量計を提供することを目的の一つとする。 However, in the conventional thermal mass flow capillary sensor, there is individual difference in the uniformity of the thermal resistor and the insulation coating, and the resistance value of the thermal resistor wound upstream is when no fluid is flowing through the capillary. And the resistance value of the thermal resistor wound on the downstream side may differ for each individual flow meter. Accordingly, an object of the present invention is to provide a flow meter with little individual difference.
本発明の態様によれば、（ａ）流体が流れるキャピラリと、（ｂ）キャピラリの表面に配置された第１の熱伝導膜と、（ｃ）第１の熱伝導膜上に配置された第１の感熱抵抗素子と、（ｄ）キャピラリの表面に、第１の熱伝導膜と間隔をおいて配置された第２の熱伝導膜と、（ｅ）第２の熱伝導膜上に配置された第２の感熱抵抗素子と、を備え、（ｆ）第１の感熱抵抗素子が、電気絶縁体からなる第１の固定部材と、第１の固定部材の内部に挿入された第１の白金抵抗体と、を備え、（ｇ）第２の感熱抵抗素子が、電気絶縁体からなる第２の固定部材と、第２の固定部材の内部に挿入された第２の白金抵抗体と、を備える、流量計が提供される。 According to an aspect of the present invention, (a) a capillary through which a fluid flows, (b) a first thermal conductive film disposed on the surface of the capillary, and (c) a first thermal conductive film disposed on the first thermal conductive film. 1 heat-sensitive resistive element, (d) a second heat conductive film disposed on the surface of the capillary and spaced from the first heat conductive film, and (e) disposed on the second heat conductive film. (F) a first fixing member made of an electrical insulator and a first platinum inserted into the first fixing member. A resistor, and (g) a second thermosensitive resistor element, a second fixing member made of an electrical insulator, and a second platinum resistor inserted inside the second fixing member. A flow meter is provided.
本発明によれば、個体差の少ない流量計を提供可能である。 According to the present invention, it is possible to provide a flow meter with little individual difference.
以下に本発明の実施の形態を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号で表している。但し、図面は模式的なものである。したがって、具体的な寸法等は以下の説明を照らし合わせて判断するべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。 Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic. Therefore, specific dimensions and the like should be determined in light of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
実施の形態に係る流量計は、上面図である図１及びＩＩ−ＩＩ方向から見た断面図である図２に示すように、流体が流れる流路３が設けられた基体１を備える。基体１には、流路３のバイパス流路であるキャピラリ５が挿入される。キャピラリ５の部分拡大図である図３に示すように、流量計は、キャピラリ５の表面に配置された第１の熱伝導膜１１と、第１の熱伝導膜１１上に配置された第１の感熱抵抗素子１２と、図３に示すキャピラリ５の表面に、第１の熱伝導膜１１と間隔をおいて配置された第２の熱伝導膜２１と、第２の熱伝導膜２１上に配置された第２の感熱抵抗素子２２と、をさらに備える。第１の感熱抵抗素子１２は、電気絶縁体からなる第１の固定部材と、第１の固定部材の内部に挿入された第１の白金抵抗体１３と、を備え、第２の感熱抵抗素子２２は、電気絶縁体からなる第２の固定部材と、第２の固定部材の内部に挿入された第２の白金抵抗体２３と、を備える。 As shown in FIG. 1 which is a top view and FIG. 2 which is a cross-sectional view seen from the II-II direction, the flow meter according to the embodiment includes a base body 1 provided with a flow path 3 through which a fluid flows. A capillary 5 that is a bypass flow path of the flow path 3 is inserted into the substrate 1. As shown in FIG. 3, which is a partially enlarged view of the capillary 5, the flow meter includes a first heat conductive film 11 disposed on the surface of the capillary 5 and a first heat conductive film 11 disposed on the first heat conductive film 11. On the surface of the capillary 5 shown in FIG. 3, the second heat conductive film 21 spaced from the first heat conductive film 11, and the second heat conductive film 21. And a second heat-sensitive resistance element 22 arranged. The first thermal resistance element 12 includes a first fixing member made of an electrical insulator and a first platinum resistor 13 inserted into the first fixing member, and the second thermal resistance element 22 includes a second fixing member made of an electrical insulator, and a second platinum resistor 23 inserted into the second fixing member.
基体１は例えば金属からなる。基体１は、例えば直方体である。流路３は、基体１の第１の側面から、第１の側面と対向する第２の側面に貫通する貫通孔である。流路３を流れる流体は、気体であっても、液体であってもよい。上面図である図４及びＶ−Ｖ方向から見た断面図である図５に示すように、基体１には、第１の側面及び第２の側面と隣り合い、第１の側面及び第２の側面と垂直な上面から、流路３に向かって二つの貫通孔３１、３２が設けられている。流路３の貫通孔３１、３２の間には、層流素子４０が配置されている。流路３の貫通孔３１、３２の間には、圧損素子が配置されていてもよい。図１及び図２に示したキャピラリ５の両端は、図４及び図５に示した貫通孔３１、３２に挿入されている。 The substrate 1 is made of metal, for example. The base 1 is a rectangular parallelepiped, for example. The flow path 3 is a through-hole penetrating from the first side surface of the substrate 1 to the second side surface facing the first side surface. The fluid flowing through the flow path 3 may be a gas or a liquid. As shown in FIG. 4 which is a top view and FIG. 5 which is a cross-sectional view seen from the VV direction, the base 1 is adjacent to the first side face and the second side face, and the first side face and the second side face. Two through holes 31 and 32 are provided from the upper surface perpendicular to the side surface toward the flow path 3. A laminar flow element 40 is disposed between the through holes 31 and 32 of the flow path 3. A pressure loss element may be arranged between the through holes 31 and 32 of the flow path 3. Both ends of the capillary 5 shown in FIGS. 1 and 2 are inserted into the through holes 31 and 32 shown in FIGS. 4 and 5.
図１乃至図３に示したキャピラリ５は、例えばＳＵＳ３１６Ｌなどのステンレス鋼等の金属からなり、熱伝導率は例えば１６Ｗ／ｍＫである。キャピラリ５の外径は例えば３５０乃至１０００μｍであり、肉厚が５０μｍである。ただし、キャピラリ５の材料、熱伝導率、及び形状は、これらに限定されない。 The capillary 5 shown in FIGS. 1 to 3 is made of a metal such as stainless steel such as SUS316L, and has a thermal conductivity of 16 W / mK, for example. The outer diameter of the capillary 5 is, for example, 350 to 1000 μm and the wall thickness is 50 μm. However, the material, thermal conductivity, and shape of the capillary 5 are not limited to these.
図３に示した第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれは、キャピラリ５の表面の一部に固定されていてもよいし、キャピラリ５の表面を周回するように巻き付けられていてもよい。第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれは、例えば銅（Ｃｕ）、金（Ａｕ）、銀（Ａｇ）、又はアルミニウム（Ａｌ）等の金属等の熱伝導性物質からなる。第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれの熱伝導率は例えば４２０Ｗ／ｍＫであり、キャピラリ５の熱伝導率よりも高い。第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれの膜厚は、例えば５μｍである。第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれは、例えばスパッタリング法や、電気メッキ法により、キャピラリ５上に成膜される。ただし、第１の熱伝導膜１１及び第２の熱伝導膜２１のそれぞれの材料、熱伝導率、形状、及び形成方法は、これらに限定されない。 Each of the first heat conductive film 11 and the second heat conductive film 21 shown in FIG. 3 may be fixed to a part of the surface of the capillary 5 or wound around the surface of the capillary 5. It may be done. Each of the first heat conductive film 11 and the second heat conductive film 21 is made of a heat conductive material such as a metal such as copper (Cu), gold (Au), silver (Ag), or aluminum (Al). Become. The thermal conductivity of each of the first thermal conductive film 11 and the second thermal conductive film 21 is, for example, 420 W / mK, which is higher than the thermal conductivity of the capillary 5. Each film thickness of the first heat conductive film 11 and the second heat conductive film 21 is, for example, 5 μm. Each of the first thermal conductive film 11 and the second thermal conductive film 21 is formed on the capillary 5 by, for example, sputtering or electroplating. However, each material, thermal conductivity, shape, and formation method of the first thermal conductive film 11 and the second thermal conductive film 21 are not limited to these.
第１の感熱抵抗素子１２の第１の固定部材及び第２の感熱抵抗素子２２の第２の固定部材のそれぞれは、電気絶縁体からなる。第１の固定部材及び第２の固定部材の熱伝導率は高い方が好ましく、熱容量は小さい方が好ましい。電気絶縁体としては、例えばガラスやアルミナ（Ａｌ2Ｏ3）等のセラミックスが挙げられる。セラミックスの純度が低いと、第１の固定部材及び第２の固定部材に挿入される第１の白金抵抗体１３及び第２の白金抵抗体２３が不純物で汚染され、第１の白金抵抗体１３及び第２の白金抵抗体２３の抵抗値のドリフトの原因となったり、切断の原因となったりする。そのため、第１の固定部材及び第２の固定部材のそれぞれの材料となるセラミックスは、高純度セラミックスが好ましい。第１の固定部材及び第２の固定部材のそれぞれは、例えば円柱状であり、第１の白金抵抗体１３及び第２の白金抵抗体２３が挿入される一又は複数の穴が設けられている。第１の白金抵抗体１３及び第２の白金抵抗体２３が挿入される穴の直径は、キャピラリ５の直径よりも小さい。ただし、第１の固定部材及び第２の固定部材のそれぞれの材料及び形状は、これらに限定されない。 Each of the first fixing member of the first thermal resistance element 12 and the second fixing member of the second thermal resistance element 22 is made of an electrical insulator. The first fixing member and the second fixing member preferably have higher thermal conductivities, and preferably have smaller heat capacities. Examples of the electrical insulator include ceramics such as glass and alumina (Al 2 O 3 ). When the purity of the ceramic is low, the first platinum resistor 13 and the second platinum resistor 23 inserted into the first fixing member and the second fixing member are contaminated with impurities, and the first platinum resistor 13 And it causes the drift of the resistance value of the second platinum resistor 23 or causes the cutting. For this reason, high-purity ceramics are preferable as the ceramics that are the materials of the first fixing member and the second fixing member. Each of the first fixing member and the second fixing member has, for example, a cylindrical shape, and is provided with one or a plurality of holes into which the first platinum resistor 13 and the second platinum resistor 23 are inserted. . The diameter of the hole into which the first platinum resistor 13 and the second platinum resistor 23 are inserted is smaller than the diameter of the capillary 5. However, the materials and shapes of the first fixing member and the second fixing member are not limited to these.
例えば、第１の熱伝導膜１１と第１の感熱抵抗素子１２の第１の固定部材は、ろう付けにより接合されており、第２の熱伝導膜２１と第２感熱抵抗素子２２の第２の固定部材も、ろう付けにより接合されている。ろう材の材料としては、銀、リン銅等が使用可能であるが、これらに限定されない。また、第１の熱伝導膜１１と第１の感熱抵抗素子１２の第１の固定部材とを、半田により固定してもよい。第２の熱伝導膜２１及び第２感熱抵抗素子２２の第２の固定部材についても同様である。 For example, the first heat conductive film 11 and the first fixing member of the first heat sensitive resistor element 12 are joined by brazing, and the second heat conductive film 21 and the second heat sensitive resistor element 22 are second. These fixing members are also joined by brazing. As a material for the brazing material, silver, phosphor copper or the like can be used, but is not limited thereto. Moreover, you may fix the 1st heat conductive film 11 and the 1st fixing member of the 1st thermosensitive resistance element 12 with solder. The same applies to the second fixing member of the second thermal conductive film 21 and the second thermal resistance element 22.
図２に示した第１の白金抵抗体１３及び第２の白金抵抗体２３のそれぞれは、抵抗値のドリフトを抑制する観点から、純白金（Ｐｔ１００）からなることが好ましい。第１の白金抵抗体１３及び第２の白金抵抗体２３のそれぞれは、例えば直径が数μｍの細線からなる巻線であってもよい。ただし、第１の白金抵抗体１３及び第２の白金抵抗体２３のそれぞれの材料及び形状は、これらに限定されない。 Each of the first platinum resistor 13 and the second platinum resistor 23 shown in FIG. 2 is preferably made of pure platinum (Pt100) from the viewpoint of suppressing resistance value drift. Each of the first platinum resistor 13 and the second platinum resistor 23 may be a winding made of a thin wire having a diameter of several μm, for example. However, the materials and shapes of the first platinum resistor 13 and the second platinum resistor 23 are not limited to these.
図６に示すように、第１の白金抵抗体１３及び第２の白金抵抗体２３は、抵抗素子Ｒ1、Ｒ2と共に、ブリッジ回路を構成する。第１の白金抵抗体１３及び第２の白金抵抗体２３と、抵抗素子Ｒ1、Ｒ2と、には、電圧Ｅが印可される。抵抗素子Ｒ1、Ｒ2の接続点ｘと、第１の白金抵抗体１３及び第２の白金抵抗体２３の接続点ｙと、は、増幅器３０の入力端子に接続されている。増幅器３０は、接続点ｘ、ｙの電位差を取り出す。キャピラリ５に流体が流れると、上流側に配置された第１の熱伝導膜１１から、下流側に配置された第２の熱伝導膜２１に流体が熱を運搬する。そのため、第１の白金抵抗体１３の温度よりも第２の白金抵抗体２３の温度が高くなり、第１の白金抵抗体１３の抵抗値よりも第２の白金抵抗体２３の抵抗値が高くなる。これに伴い、接続点ｘ、ｙの電位差に変化が生じる。接続点ｘ、ｙの電位差の変化は、キャピラリ５を流れる流体の流量に依存する。したがって、接続点ｘ、ｙの電位差に基づき、キャピラリ５を流れる流体の流量を求めることが可能となる。 As shown in FIG. 6, the first platinum resistor 13 and the second platinum resistor 23, the resistance element R 1, R 2, constitute a bridge circuit. A voltage E is applied to the first platinum resistor 13 and the second platinum resistor 23 and the resistance elements R 1 and R 2 . A connection point x between the resistance elements R 1 and R 2 and a connection point y between the first platinum resistor 13 and the second platinum resistor 23 are connected to an input terminal of the amplifier 30. The amplifier 30 takes out the potential difference between the connection points x and y. When a fluid flows through the capillary 5, the fluid carries heat from the first heat conductive film 11 disposed on the upstream side to the second heat conductive film 21 disposed on the downstream side. Therefore, the temperature of the second platinum resistor 23 is higher than the temperature of the first platinum resistor 13, and the resistance value of the second platinum resistor 23 is higher than the resistance value of the first platinum resistor 13. Become. Along with this, a change occurs in the potential difference between the connection points x and y. The change in the potential difference between the connection points x and y depends on the flow rate of the fluid flowing through the capillary 5. Accordingly, the flow rate of the fluid flowing through the capillary 5 can be obtained based on the potential difference between the connection points x and y.
従来の流量計においては、キャピラリに絶縁被膜された感熱抵抗体の細線を巻き付けている。そのため、巻き付けられた感熱抵抗体の細線の残留応力が強く、感熱抵抗体の抵抗値のドリフトの原因となっている。また、感熱抵抗体をキャピラリに巻き付けると、感熱抵抗体を覆う絶縁膜が変形し、感熱抵抗体とキャピラリの接触面積が一定でなくなるという問題がある。よって、従来の流量計は、流体が流れていないときの出力が一定でなく、また個体差が大きいという問題がある。 In a conventional flow meter, a thin wire of a thermal resistor having an insulating coating is wound around a capillary. For this reason, the residual stress of the thin wire of the wound thermal resistor is strong, which causes a drift of the resistance value of the thermal resistor. Further, when the thermal resistor is wound around the capillary, there is a problem that the insulating film covering the thermal resistor is deformed and the contact area between the thermal resistor and the capillary is not constant. Therefore, the conventional flowmeter has a problem that the output when the fluid is not flowing is not constant and individual differences are large.
これに対し、実施の形態に係る流量計においては、第１の白金抵抗体１３及び第２の白金抵抗体２３のそれぞれは、第１の感熱抵抗素子１２の第１の固定部材及び第２感熱抵抗素子２２の第２の固定部材に設けられた、キャピラリ５の直径よりも小さい穴の中で巻線されているため、残留応力が小さい。また、第１の感熱抵抗素子１２の第１の固定部材及び第２感熱抵抗素子２２の第２の固定部材がセラミックスからなる場合、第１の固定部材及び第２の固定部材は経年劣化しにくい。そのため、実施の形態に係る流量計は、流体が流れていないときの出力を一定に保ちやすく、また個体差を抑制することが可能となる。 On the other hand, in the flowmeter according to the embodiment, the first platinum resistor 13 and the second platinum resistor 23 are respectively the first fixing member and the second thermosensitive member of the first thermosensitive resistor element 12. Since the coil is wound in a hole smaller than the diameter of the capillary 5 provided in the second fixing member of the resistance element 22, the residual stress is small. Further, when the first fixing member of the first thermal resistance element 12 and the second fixing member of the second thermal resistance element 22 are made of ceramics, the first fixing member and the second fixing member are unlikely to deteriorate over time. . Therefore, the flow meter according to the embodiment can easily maintain a constant output when no fluid is flowing, and can suppress individual differences.
（その他の実施の形態）
上記のように、本発明は実施の形態によって記載したが、この開示の一部をなす記述及び図面はこの発明を限定するものであると理解するべきではない。この開示から当業者には様々な代替実施の形態、実施の形態及び運用技術が明らかになるはずである。例えば、第１の感熱抵抗素子１２の第１の固定部材及び第２感熱抵抗素子２２の第２の固定部材のそれぞれの材料としては、ポリイミド等の高分子も使用可能である。また、キャピラリの表面に、第２の熱伝導膜と間隔をおいてさらに第３の熱伝導膜を配置し、第３の熱伝導膜上に第３のセラミック碍子を配置し、第３のセラミック碍子の内部に第３の白金抵抗体を挿入してもよい。このように、本発明はここでは記載していない様々な実施の形態等を包含するということを理解すべきである。
(Other embodiments)
As described above, the present invention has been described according to the embodiment. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, embodiments, and operation techniques should be apparent to those skilled in the art. For example, as materials of the first fixing member of the first thermal resistance element 12 and the second fixing member of the second thermal resistance element 22, polymers such as polyimide can be used. Further, a third heat conductive film is further arranged on the surface of the capillary at a distance from the second heat conductive film, a third ceramic insulator is arranged on the third heat conductive film, and a third ceramic is provided. A third platinum resistor may be inserted inside the insulator. Thus, it should be understood that the present invention includes various embodiments and the like not described herein.
１ 基体
３ 流路
５ キャピラリ
１１ 第１の熱伝導膜
１２ 第１のセラミック碍子
１３ 第１の白金抵抗体
２１ 第２の熱伝導膜
２２ 第２のセラミック碍子
２３ 第２の白金抵抗体
３０ 増幅器
３１、３２ 貫通孔
４０ 層流素子
DESCRIPTION OF SYMBOLS 1 Base | substrate 3 Flow path 5 Capillary 11 1st heat conductive film 12 1st ceramic insulator 13 1st platinum resistor 21 2nd heat conductive film 22 2nd ceramic insulator 23 2nd platinum resistor 30 Amplifier 31 32 Through hole 40 Laminar flow element
Claims (7)
前記キャピラリの表面を周回するように配置された第１の熱伝導膜と、
前記第１の熱伝導膜上に配置された第１の感熱抵抗素子と、
前記第１の熱伝導膜と間隔をおいて、前記キャピラリの表面を周回するように配置された第２の熱伝導膜と、
前記第２の熱伝導膜上に配置された第２の感熱抵抗素子と、
を備え、
前記第１の感熱抵抗素子が、前記第１の熱伝導膜上に配置された電気絶縁体からなる第１の固定部材と、前記第１の固定部材の内部に挿入された第１の白金抵抗体と、を備え、
前記第１の固定部材に穴が設けられており、
前記第１の固定部材に設けられた穴の直径が、前記キャピラリの直径よりも小さく、
前記第１の白金抵抗体が、前記第１の固定部材に設けられた穴の中で巻線されており、
前記第２の感熱抵抗素子が、前記第２の熱伝導膜上に配置された電気絶縁体からなる第２の固定部材と、前記第２の固定部材の内部に挿入された第２の白金抵抗体と、を備え、
前記第２の固定部材に穴が設けられており、
前記第２の固定部材に設けられた穴の直径が、前記キャピラリの直径よりも小さく、
前記第２の白金抵抗体が、前記第２の固定部材に設けられた穴の中で巻線されている、
流量計。 A capillary through which fluid flows;
A first heat conducting film arranged to circulate around the surface of the capillary;
A first thermal resistance element disposed on the first thermal conductive film;
A second heat conductive film disposed around the surface of the capillary at an interval from the first heat conductive film;
A second thermal resistance element disposed on the second thermal conductive film;
With
The first thermosensitive resistor element includes a first fixing member made of an electrical insulator disposed on the first heat conductive film, and a first platinum resistor inserted into the first fixing member. With body,
A hole is provided in the first fixing member;
The diameter of the hole provided in the first fixing member is smaller than the diameter of the capillary;
The first platinum resistor is wound in a hole provided in the first fixing member;
The second thermosensitive resistor element includes a second fixing member made of an electrical insulator disposed on the second heat conductive film, and a second platinum resistor inserted into the second fixing member. With body,
A hole is provided in the second fixing member;
The diameter of the hole provided in the second fixing member is smaller than the diameter of the capillary;
The second platinum resistor is wound in a hole provided in the second fixing member;
Flowmeter.
前記第２の熱伝導膜と、前記第２の感熱抵抗素子と、が、ろう付けにより接合されている、
請求項１に記載の流量計。 The first thermal conductive film and the first thermal resistance element are joined by brazing,
The second thermal conductive film and the second thermal resistance element are joined by brazing,
The flow meter according to claim 1.
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| JPH02161318A (en) * | 1988-12-14 | 1990-06-21 | Hitachi Metals Ltd | Heat sensitive type flow rate sensor |
| DE50107052D1 (en) * | 2000-05-04 | 2005-09-15 | Sensirion Ag Zuerich | FLUID SENSOR FOR LIQUIDS |
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