JPWO2017135338A1 - Polyamide resin composition - Google Patents
Polyamide resin composition Download PDFInfo
- Publication number
- JPWO2017135338A1 JPWO2017135338A1 JP2017565609A JP2017565609A JPWO2017135338A1 JP WO2017135338 A1 JPWO2017135338 A1 JP WO2017135338A1 JP 2017565609 A JP2017565609 A JP 2017565609A JP 2017565609 A JP2017565609 A JP 2017565609A JP WO2017135338 A1 JPWO2017135338 A1 JP WO2017135338A1
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- glass fiber
- polyamide
- resin composition
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 68
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- 239000003365 glass fiber Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 67
- 229920006020 amorphous polyamide Polymers 0.000 claims abstract description 35
- 229920006039 crystalline polyamide Polymers 0.000 claims abstract description 25
- 239000000835 fiber Substances 0.000 claims description 12
- 229920002292 Nylon 6 Polymers 0.000 claims description 11
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 7
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 claims description 5
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 4
- 229920000571 Nylon 11 Polymers 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- 229920000299 Nylon 12 Polymers 0.000 claims 1
- -1 aliphatic diamine Chemical class 0.000 description 22
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 20
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 18
- 238000000465 moulding Methods 0.000 description 18
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 8
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 239000004953 Aliphatic polyamide Substances 0.000 description 7
- 229920003231 aliphatic polyamide Polymers 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Substances [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 3
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 3
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 229920006060 Grivory® Polymers 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N N-undecane Natural products CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 1
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- XDOLZJYETYVRKV-UHFFFAOYSA-N 7-Aminoheptanoic acid Chemical compound NCCCCCCC(O)=O XDOLZJYETYVRKV-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- JJOJFIHJIRWASH-UHFFFAOYSA-N Eicosanedioic acid Natural products OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- NDJKXXJCMXVBJW-UHFFFAOYSA-N Heptadecane Natural products CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BGHCVCJVXZWKCC-UHFFFAOYSA-N Tetradecane Natural products CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- RZJRJXONCZWCBN-UHFFFAOYSA-N alpha-octadecene Natural products CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- YCOZIPAWZNQLMR-UHFFFAOYSA-N heptane - octane Natural products CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 1
- FBQUUIXMSDZPEB-UHFFFAOYSA-N hexadecane-1,1-diamine Chemical compound CCCCCCCCCCCCCCCC(N)N FBQUUIXMSDZPEB-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LQERIDTXQFOHKA-UHFFFAOYSA-N n-nonadecane Natural products CCCCCCCCCCCCCCCCCCC LQERIDTXQFOHKA-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- CBFCDTFDPHXCNY-UHFFFAOYSA-N octyldodecane Natural products CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- TUWYJOPPRPXZQX-UHFFFAOYSA-N tetradecane-2,3-dione Chemical compound CCCCCCCCCCCC(=O)C(C)=O TUWYJOPPRPXZQX-UHFFFAOYSA-N 0.000 description 1
- FRXCPDXZCDMUGX-UHFFFAOYSA-N tridecane-1,1-diamine Chemical compound CCCCCCCCCCCCC(N)N FRXCPDXZCDMUGX-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Abstract
ポリアミド樹脂(A)及びガラス繊維(B)を含み、前記ポリアミド樹脂(A)は、結晶性ポリアミド樹脂(A−1)と、ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが50ml/10分以上である非晶性ポリアミド樹脂(A−2)とを含み、前記ガラス繊維(B)は、非円形断面のガラス繊維(B−1)を含み、前記ガラス繊維(B)の総含有率が40質量%以上80質量%以下である樹脂組成物が提供される。 The polyamide resin (A) includes a polyamide resin (A) and a glass fiber (B). The polyamide resin (A) has a crystalline polyamide resin (A-1) and an MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 at 50 ml / ml. Including an amorphous polyamide resin (A-2) that is 10 minutes or longer, and the glass fiber (B) includes a glass fiber (B-1) having a non-circular cross section, and the total content of the glass fiber (B). A resin composition having a rate of 40% by mass to 80% by mass is provided.
Description
本発明は、ポリアミド樹脂組成物に関する。 The present invention relates to a polyamide resin composition.
ポリアミド樹脂は、ガラス繊維を配合することで高い剛性等を実現することができる。しかしながら、ガラス繊維は樹脂の流れ方向に配向する性質があるため、強度の異方性が生じて反りの原因となる場合があった。低反り性を実現する技術として、扁平断面のガラス繊維を配合する技術が提案されている(例えば、特許文献1及び2参照)。また高い耐振動特性を実現する技術として、特定の断面積を有するガラス繊維に脂肪族ポリアミドとポリメタキシレンアジパミドとを併用するガラス繊維強化ポリアミド樹脂組成物が提案されている(例えば、特許文献3参照)。 Polyamide resin can realize high rigidity and the like by blending glass fibers. However, since glass fibers have a property of being oriented in the resin flow direction, anisotropy of strength may occur and cause warping. As a technique for realizing low warpage, a technique for blending a glass fiber having a flat cross section has been proposed (see, for example, Patent Documents 1 and 2). Further, as a technique for realizing high vibration resistance characteristics, a glass fiber reinforced polyamide resin composition in which aliphatic polyamide and polymetaxylene adipamide are used in combination with glass fiber having a specific cross-sectional area has been proposed (for example, patents). Reference 3).
しかしながら、従来技術では高い剛性と低反り性とを維持しつつ、成形品を形成した場合の良好な表面外観を実現することは困難な場合があった。
本発明は、成形品において高い剛性、低反り性及び良好な表面外観を実現可能なポリアミド樹脂組成物を提供することを課題とする。However, in the prior art, it may be difficult to achieve a good surface appearance when a molded product is formed while maintaining high rigidity and low warpage.
An object of the present invention is to provide a polyamide resin composition capable of realizing high rigidity, low warpage and good surface appearance in a molded product.
前記課題を解決するための具体的手段は以下の通りである。
ポリアミド樹脂(A)及びガラス繊維(B)を含み、前記ポリアミド樹脂(A)は、1種類からなる結晶性ポリアミド樹脂(A−1)と非晶性ポリアミド樹脂(A−2)とを含み、前記ガラス繊維(B)は、非円形断面のガラス繊維(B−1)を含み、前記ガラス繊維(B)の総含有率が40質量%以上80質量%以下であるポリアミド樹脂組成物である。Specific means for solving the above problems are as follows.
The polyamide resin (A) and the glass fiber (B) are included, and the polyamide resin (A) includes a single type of crystalline polyamide resin (A-1) and an amorphous polyamide resin (A-2), The glass fiber (B) is a polyamide resin composition including a glass fiber (B-1) having a non-circular cross section, and a total content of the glass fiber (B) is 40% by mass or more and 80% by mass or less.
本発明によれば、成形品において高い剛性、低反り性及び良好な表面外観を実現可能なポリアミド樹脂組成物を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the polyamide resin composition which can implement | achieve high rigidity, low curvature, and a favorable surface appearance in a molded article can be provided.
本明細書において組成物中の各成分の含有量は、組成物中に各成分に該当する物質が複数存在する場合、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。 In the present specification, the content of each component in the composition is the total amount of the plurality of substances present in the composition unless there is a specific notice when there are a plurality of substances corresponding to each component in the composition. means.
[ポリアミド樹脂組成物]
本実施形態のポリアミド樹脂組成物は、ポリアミド樹脂(A)及びガラス繊維(B)を含み、前記ポリアミド樹脂(A)は、結晶性ポリアミド樹脂(A−1)と、ISO1133に基づき温度275℃、荷重5kgで測定したMVRが50ml/10分以上である非晶性ポリアミド樹脂(A−2)とを含み、前記ガラス繊維(B)は、非円形断面のガラス繊維(B−1)を含み、前記ガラス繊維(B)の総含有率が40質量%以上80質量%以下である。結晶性ポリアミド樹脂(A−1)と特定の非晶性ポリアミド樹脂(A−2)とに、非円形断面ガラス繊維(B−1)を特定の含有率で配合することで、成形品を形成した場合に、高い剛性及び低反り性を維持したまま、良好な表面外観を実現することができる。[Polyamide resin composition]
The polyamide resin composition of the present embodiment includes a polyamide resin (A) and glass fiber (B), and the polyamide resin (A) is based on crystalline polyamide resin (A-1) and ISO 1133 at a temperature of 275 ° C., Including an amorphous polyamide resin (A-2) having an MVR measured at a load of 5 kg of 50 ml / 10 min or more, and the glass fiber (B) includes a glass fiber (B-1) having a non-circular cross section, The total content rate of the said glass fiber (B) is 40 to 80 mass%. Forming a molded product by blending non-circular cross-section glass fiber (B-1) with a specific content in crystalline polyamide resin (A-1) and specific amorphous polyamide resin (A-2) In this case, a good surface appearance can be realized while maintaining high rigidity and low warpage.
ポリアミド樹脂(A)
ポリアミド樹脂組成物は、ポリアミド樹脂として、結晶性ポリアミド樹脂(A−1)の少なくとも1種類と、ISO1133に基づき温度275℃、荷重5kgで測定したMVRが50ml/10分以上である非晶性ポリアミド樹脂(A−2)の少なくとも1種とを含む。結晶性ポリアミド樹脂(A−1)と、特定のMVR値を有する非晶性ポリアミド樹脂(A−2)とを組合せることで、成形品において、高い剛性及び低反り性を維持したまま、良好な表面外観を実現することができる。Polyamide resin (A)
The polyamide resin composition comprises at least one kind of crystalline polyamide resin (A-1) as a polyamide resin and an amorphous polyamide having an MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 of 50 ml / 10 min or more. And at least one resin (A-2). Combined with the crystalline polyamide resin (A-1) and the amorphous polyamide resin (A-2) having a specific MVR value, the molded article is good while maintaining high rigidity and low warpage. Surface appearance can be realized.
結晶性ポリアミド樹脂(A−1)
本明細書における結晶性ポリアミド樹脂(A−1)とは、10℃/minの昇温条件の示差走査熱量計(DSC)分析において、融解に起因する明確な吸熱ピークを示すポリアミド樹脂を意味し、具体的には、結晶融解熱量が1cal/gを超えるポリアミド樹脂を意味する。Crystalline polyamide resin (A-1)
The crystalline polyamide resin (A-1) in this specification means a polyamide resin that exhibits a clear endothermic peak due to melting in a differential scanning calorimeter (DSC) analysis under a temperature rising condition of 10 ° C./min. Specifically, it means a polyamide resin having a heat of crystal fusion exceeding 1 cal / g.
結晶性ポリアミド樹脂(A−1)としては、脂肪族ジアミン及び脂肪族ジカルボン酸からなる脂肪族ポリアミド樹脂、ラクタム又はアミノカルボン酸からなる脂肪族ポリアミド樹脂等を挙げることができる。結晶性ポリアミド樹脂(A−1)は、脂肪族ポリアミド樹脂であることが好ましい。 Examples of the crystalline polyamide resin (A-1) include an aliphatic polyamide resin composed of an aliphatic diamine and an aliphatic dicarboxylic acid, and an aliphatic polyamide resin composed of a lactam or an aminocarboxylic acid. The crystalline polyamide resin (A-1) is preferably an aliphatic polyamide resin.
脂肪族ポリアミド樹脂を構成するモノマー成分としては、炭素数2〜20、好ましくは炭素数4〜12の脂肪族ジアミンと、炭素数2〜20、好ましくは炭素数6〜12の脂肪族ジカルボン酸の組合せ、炭素数6〜12のラクタム又はアミノカルボン酸等を挙げることができる。 As the monomer component constituting the aliphatic polyamide resin, an aliphatic diamine having 2 to 20 carbon atoms, preferably 4 to 12 carbon atoms, and an aliphatic dicarboxylic acid having 2 to 20 carbon atoms, preferably 6 to 12 carbon atoms. Examples thereof include a combination, a lactam having 6 to 12 carbon atoms, and an aminocarboxylic acid.
脂肪族ジアミンとしては、エチレンジアミン、テトラメチレンジアミン、ペンタメチレンジアミン、ヘキサメチレンジアミン、ペプタメチレンジアミン、オクタメチレンジアミン、ノナメチレンジアミン、デカメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、トリデカンジアミン、テトラデカンジアミン、ペンタデカンジアミン、ヘキサデカンジアミン、ヘプタデカンジアミン、オクタデカンジアミン、ノナデカンジアミン、エイコサンジアミン等が挙げられる。また脂肪族ジカルボン酸としては、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ウンデカンジオン酸、ドデカンジオン酸、トリデカンジオン酸、テトラデカンジオン酸、ペンタデカンジオン酸、ヘキサデカンジオン酸、オクタデカンジオン酸、エイコサンジオン酸等が挙げられる。 Aliphatic diamines include ethylene diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, peptamethylene diamine, octamethylene diamine, nonamethylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, tridecane diamine, Examples include tetradecane diamine, pentadecane diamine, hexadecane diamine, heptadecane diamine, octadecane diamine, nonadecane diamine, and eicosane diamine. Aliphatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedione Examples include acid, pentadecanedioic acid, hexadecanedioic acid, octadecanedioic acid, and eicosandioic acid.
脂肪族ジアミンと脂肪族ジカルボン酸の組合せとして、ヘキサメチレンジアミンとアジピン酸の組合せ、ヘキサメチレンジアミンとセバシン酸の組合せ、ヘキサメチレンジアミンとドデカンジオン酸の組合せ等が挙げられ、これらの組合せの等モル塩が好ましく用いられる。 Examples of combinations of aliphatic diamines and aliphatic dicarboxylic acids include hexamethylene diamine and adipic acid, hexamethylene diamine and sebacic acid, hexamethylene diamine and dodecanedioic acid, etc. A salt is preferably used.
ラクタムとしては、ε−カプロラクタム、エナントラクタム、ウンデカンラクタム、ドデカンラクタム、α−ピロリドン、α−ピペリドン等が挙げられる。また、アミノカルボン酸としては6−アミノカプロン酸、7−アミノヘプタン酸、9−アミノノナン酸、11−アミノウンデカン酸、12−アミノドデカン酸が挙げられる。これらの中でも重合生産の観点から、ε−カプロラクタム、ウンデカンラクタム及びドデカンラクタムからなる群から選択される少なくとも1種が好ましい。 Examples of the lactam include ε-caprolactam, enantolactam, undecane lactam, dodecane lactam, α-pyrrolidone, α-piperidone and the like. Examples of the aminocarboxylic acid include 6-aminocaproic acid, 7-aminoheptanoic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid. Among these, from the viewpoint of polymerization production, at least one selected from the group consisting of ε-caprolactam, undecane lactam and dodecane lactam is preferable.
脂肪族ポリアミド樹脂を構成するモノマー成分は、1種単独でもよく、2種以上の組合せであってもよい。ここで、脂肪族ジアミンと脂肪族ジカルボン酸の組み合わせは、1種の脂肪族ジアミンと1種の脂肪族ジカルボン酸の組合せで1種のモノマー成分とみなす。 The monomer component constituting the aliphatic polyamide resin may be a single type or a combination of two or more types. Here, the combination of the aliphatic diamine and the aliphatic dicarboxylic acid is regarded as one monomer component by a combination of one kind of aliphatic diamine and one kind of aliphatic dicarboxylic acid.
結晶性ポリアミド樹脂(A−1)は、生産性の観点から、ポリアミド6、ポリアミド66、ポリアミド6/66、ポリアミド6/12、ポリアミド610、ポリアミド612、ポリアミド6/66/12、ポリアミド11及びポリアミド12からなる群から選択されることが好ましく、ポリアミド6及び/又はポリアミド66がより好ましい。
結晶性ポリアミド樹脂(A−1)は、1種単独でも、2種以上を組合せて含んでいてもよい。結晶性ポリアミド樹脂を2種以上含む場合、含有量が最も大きい結晶性ポリアミド樹脂に対する他の結晶性ポリアミド樹脂の総含有率は、例えば25質量%以下であり、5質量%以下が好ましい。From the viewpoint of productivity, the crystalline polyamide resin (A-1) is polyamide 6, polyamide 66, polyamide 6/66, polyamide 6/12, polyamide 610, polyamide 612, polyamide 6/66/12, polyamide 11 and polyamide. It is preferably selected from the group consisting of 12, and polyamide 6 and / or polyamide 66 is more preferred.
The crystalline polyamide resin (A-1) may be used alone or in combination of two or more. When two or more kinds of crystalline polyamide resins are included, the total content of other crystalline polyamide resins with respect to the crystalline polyamide resin having the largest content is, for example, 25% by mass or less, and preferably 5% by mass or less.
結晶性ポリアミド樹脂(A−1)の相対粘度は特に制限されないが、JIS K 6810に準じて、98%硫酸中濃度1%の結晶性ポリアミド樹脂(A−1)について、25℃で測定した相対粘度が1.8以上5.0以下であることが好ましい。 The relative viscosity of the crystalline polyamide resin (A-1) is not particularly limited, but relative to the crystalline polyamide resin (A-1) having a concentration of 1% in 98% sulfuric acid measured at 25 ° C. according to JIS K 6810. The viscosity is preferably 1.8 or more and 5.0 or less.
結晶性ポリアミド樹脂(A−1)のポリアミド樹脂組成物の総量中における含有率は、機械物性と表面外観の観点から、例えば20質量%以上60質量%未満が好ましく、30質量%以上50質量%以下がより好ましい。 From the viewpoint of mechanical properties and surface appearance, the content of the crystalline polyamide resin (A-1) in the total amount of the polyamide resin composition is, for example, preferably 20% by mass or more and less than 60% by mass, and 30% by mass or more and 50% by mass. The following is more preferable.
非晶性ポリアミド樹脂(A−2)
本明細書における非晶性ポリアミド樹脂(A−2)とは、結晶化がほとんど起こらないか、結晶化速度が非常に小さいポリアミド樹脂を意味する。具体的には、10℃/minの昇温条件の示差走査熱量計(DSC)分析において、融解に起因する明確な吸熱ピークを示さないポリアミド樹脂を意味し、結晶融解熱量が1cal/g以下であることを意味する。
また非晶性ポリアミド樹脂(A−2)は、ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが50ml/10分以上であり、好ましくは60ml/10分以上である。当該MVRが50ml/10分未満では、成形体において良好な表面外観を達成することが困難な場合がある。MVRの上限は例えば200ml/分であり、100ml/分が好ましい。
また非晶性ポリアミド樹脂を2種類以上含む場合、これらを混合して非晶質ポリアミド樹脂全体としてのMVRを測定し、ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが50ml/10分以上である場合、非晶性ポリアミド樹脂全体を非晶性ポリアミド樹脂(A−2)とすることができる。MVRの測定は、上記内容で測定されるのが好ましいが、それぞれの非晶性ポリアミド樹脂のMVRとその混合比が判明している場合、それぞれのMVRにその混合比を乗じた値を合計して算出される平均値を、非晶性ポリアミド樹脂全体のMVRとすることができる。Amorphous polyamide resin (A-2)
The amorphous polyamide resin (A-2) in the present specification means a polyamide resin in which crystallization hardly occurs or the crystallization rate is very small. Specifically, in a differential scanning calorimeter (DSC) analysis under a temperature rising condition of 10 ° C./min, it means a polyamide resin that does not show a clear endothermic peak due to melting, and the heat of crystal melting is 1 cal / g or less. It means that there is.
The amorphous polyamide resin (A-2) has an MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 of 50 ml / 10 minutes or more, preferably 60 ml / 10 minutes or more. If the MVR is less than 50 ml / 10 minutes, it may be difficult to achieve a good surface appearance in the molded body. The upper limit of MVR is, for example, 200 ml / min, preferably 100 ml / min.
When two or more kinds of amorphous polyamide resins are contained, they are mixed to measure the MVR of the entire amorphous polyamide resin, and the MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 is 50 ml / 10 minutes. When it is the above, the whole amorphous polyamide resin can be made into an amorphous polyamide resin (A-2). The measurement of MVR is preferably performed as described above. However, when the MVR of each amorphous polyamide resin and the mixing ratio thereof are known, the value obtained by multiplying each MVR by the mixing ratio is summed up. The average value calculated as above can be used as the MVR of the entire amorphous polyamide resin.
非晶性ポリアミド樹脂(A−2)は、結晶化を阻害するような構造を有するポリアミド樹脂が好ましく、たとえば、分岐構造を有する脂肪族又は、脂環族、芳香族等の官能基を主鎖又は側鎖に有するポリアミドが挙げられる。また、結晶化を阻害する観点から、共重合体であることがより好ましい。非晶性ポリアミド樹脂(A−2)は、例えば芳香族系モノマー成分を少なくとも2成分含む共重合ポリアミド樹脂が好ましく、動的粘弾性の測定によって得られた絶乾時の損失弾性率のピーク温度によって求められたガラス転移温度が100℃以上であることがより好ましい。非晶性ポリアミドの重合方法は、公知の方法であればよく、特に限定されるものではない。 The amorphous polyamide resin (A-2) is preferably a polyamide resin having a structure that inhibits crystallization. For example, an aliphatic, alicyclic, or aromatic functional group having a branched structure has a main chain. Or the polyamide which has in a side chain is mentioned. Further, from the viewpoint of inhibiting crystallization, a copolymer is more preferable. The amorphous polyamide resin (A-2) is preferably a copolymerized polyamide resin containing at least two aromatic monomer components, for example, and the peak temperature of the loss elastic modulus at the time of absolute drying obtained by measuring dynamic viscoelasticity. It is more preferable that the glass transition temperature calculated | required by (100) is 100 degreeC or more. The polymerization method of the amorphous polyamide may be a known method and is not particularly limited.
非晶性ポリアミド樹脂(A−2)を構成するジカルボン酸としては、例えば、テレフタル酸、イソフタル酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、1,4−ナフタレンジカルボン酸、1,4−フェニレンジオキシジ酢酸、1,3−フェニレンジオキシジ酢酸、ジ安息香酸、4,4’−オキシジ安息香酸、ジフェニルメタン−4,4’−ジカルボン酸、ジフェニルスルホン−4,4’−ジカルボン酸、4,4’−ビフェニルジカルボン酸等の芳香族ジカルボン酸;1,3−シクロペンタンジカルボン酸、1,4−シクロヘキサンジカルボン酸等の脂環式ジカルボン酸が挙げられる。 Examples of the dicarboxylic acid constituting the amorphous polyamide resin (A-2) include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, dibenzoic acid, 4,4′-oxydibenzoic acid, diphenylmethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4 ′ -Aromatic dicarboxylic acids such as dicarboxylic acid and 4,4'-biphenyldicarboxylic acid; and alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid.
非晶性ポリアミド樹脂(A−2)を構成するジアミンとしては、例えば、シクロヘキサンジアミン、メチルシクロヘキサンジアミン、イソホロンジアミン等の脂環式ジアミン;p−フェニレンジアミン、m−フェニレンジアミン、p−キシレンジアミン、m−キシレンジアミン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルエーテル等の芳香族ジアミンが挙げられる。 Examples of the diamine constituting the amorphous polyamide resin (A-2) include alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine; p-phenylenediamine, m-phenylenediamine, p-xylenediamine, Examples include aromatic diamines such as m-xylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, and 4,4′-diaminodiphenylether.
非晶性ポリアミド樹脂(A−2)として具体的には、イソフタル酸/テレフタル酸/ヘキサメチレンジアミン/ビス(3−メチル−4−アミノシクロヘキシル)メタンの重縮合体、テレフタル酸/2,2,4−トリメチルヘキサメチレンジアミン/2,4,4−トリメチルヘキサメチレンジアミンの重縮合体、イソフタル酸/ビス(3−メチル−4−アミノシクロヘキシル)メタン/ω−ラウロラクタムの重縮合体、イソフタル酸/テレフタル酸/ヘキサメチレンジアミンの重縮合体(ポリアミド6T/6I)、イソフタル酸/2,2,4−トリメチルヘキサメチレンジアミン/2,4,4−トリメチルヘキサメチレンジアミンの重縮合体、イソフタル酸/テレフタル酸/2,2,4−トリメチルヘキサメチレンジアミン/2,4,4−トリメチルヘキサメチレンジアミンの重縮合体、イソフタル酸/ビス(3−メチル−4−アミノシクロヘキシル)メタン/ω−ラウロラクタムの重縮合体等が挙げられる。これらの中でも、非晶性ポリアミド樹脂(A−2)は、例えば、ポリアミド6T/6Iのような芳香環を有した共重合体が結晶性ポリアミド樹脂の結晶化を阻害するため好ましい。 Specifically, as the amorphous polyamide resin (A-2), a polycondensate of isophthalic acid / terephthalic acid / hexamethylenediamine / bis (3-methyl-4-aminocyclohexyl) methane, terephthalic acid / 2,2, 4-trimethylhexamethylenediamine / 2,4,4-trimethylhexamethylenediamine polycondensate, isophthalic acid / bis (3-methyl-4-aminocyclohexyl) methane / ω-laurolactam polycondensate, isophthalic acid / Polycondensate of terephthalic acid / hexamethylenediamine (polyamide 6T / 6I), polycondensate of isophthalic acid / 2,2,4-trimethylhexamethylenediamine / 2,4,4-trimethylhexamethylenediamine, isophthalic acid / terephthalate Acid / 2,2,4-trimethylhexamethylenediamine / 2,4,4-tri Polycondensate chill hexamethylenediamine, a polycondensate of isophthalic acid / bis (3-methyl-4-aminocyclohexyl) methane / .omega.-laurolactam can be cited. Among these, the amorphous polyamide resin (A-2) is preferable because, for example, a copolymer having an aromatic ring such as polyamide 6T / 6I inhibits crystallization of the crystalline polyamide resin.
非晶性ポリアミド樹脂(A−2)として具体的には、テレフタル酸成分単位40〜95モル%およびイソフタル酸成分単位5〜60モル%と、脂肪族ジアミンとからなるものが好ましい。非晶性ポリアミド樹脂(A−2)を構成するモノマー成分の好ましい組合せとしては、ヘキサメチレンジアミンとテレフタル酸の等モル塩とヘキサメチレンジアミンとイソフタル酸の等モル塩が挙げられる。
また非晶性ポリアミド樹脂(A−2)は、脂肪族ジアミンとイソフタル酸およびテレフタル酸とからなるモノマー成分に由来する単位を60質量%以上99質量%以下で含み、脂肪族ポリアミド成分の単位を1質量%以上40質量%以下で含む共重合体が好ましい。Specifically, the amorphous polyamide resin (A-2) is preferably composed of 40 to 95 mol% of terephthalic acid component units and 5 to 60 mol% of isophthalic acid component units and an aliphatic diamine. Preferable combinations of the monomer components constituting the amorphous polyamide resin (A-2) include an equimolar salt of hexamethylene diamine and terephthalic acid and an equimolar salt of hexamethylene diamine and isophthalic acid.
Further, the amorphous polyamide resin (A-2) includes a unit derived from a monomer component composed of an aliphatic diamine, isophthalic acid, and terephthalic acid in an amount of 60% by mass to 99% by mass, and the unit of the aliphatic polyamide component. A copolymer containing 1 to 40% by mass is preferable.
非晶性ポリアミド樹脂(A−2)の相対粘度は特に制限されないが、JIS K 6810に準じて、98%硫酸中濃度1%の非晶性ポリアミド樹脂(A−2)について、温度25℃で測定した相対粘度が、1.5から4.0であることが好ましく、より好ましくは1.8〜3.0である。 The relative viscosity of the amorphous polyamide resin (A-2) is not particularly limited. However, according to JIS K 6810, the amorphous polyamide resin (A-2) having a concentration of 1% in 98% sulfuric acid is at a temperature of 25 ° C. The measured relative viscosity is preferably 1.5 to 4.0, more preferably 1.8 to 3.0.
非晶性ポリアミド樹脂(A−2)のポリアミド樹脂組成物の総量中における含有率は、機械物性と表面外観の観点から、0.5質量%以上30質量%以下が好ましく、0.5質量%以上20質量%以下であることがより好ましく、3質量%以上25%質量以下がより好ましく、3質量%以上20%質量以下がより好ましく、3質量%以上8%質量以下がさらに好ましい。ポリアミド樹脂組成物は、非晶性ポリアミド樹脂を1種単独でも、2種以上を組合せて含んでいてもよい。 The content of the amorphous polyamide resin (A-2) in the total amount of the polyamide resin composition is preferably 0.5% by mass or more and 30% by mass or less from the viewpoint of mechanical properties and surface appearance, and is 0.5% by mass. It is more preferably 20% by mass or less, more preferably 3% by mass or more and 25% by mass or less, more preferably 3% by mass or more and 20% by mass or less, and further preferably 3% by mass or more and 8% by mass or less. The polyamide resin composition may contain one kind of amorphous polyamide resin or two or more kinds in combination.
ガラス繊維(B)
ポリアミド樹脂組成物は、ガラス繊維(B)として少なくとも非円形断面のガラス繊維(B−1)を含み、ガラス繊維(B)の総含有率が40質量%以上80質量%以下である。これにより、成形品において、高い剛性及び低反り性を維持したまま、良好な表面外観を実現することができる。Glass fiber (B)
The polyamide resin composition includes at least non-circular cross-sectional glass fibers (B-1) as glass fibers (B), and the total content of glass fibers (B) is 40% by mass or more and 80% by mass or less. Thereby, in a molded article, a favorable surface appearance can be realized while maintaining high rigidity and low warpage.
非円形断面のガラス繊維(B−1)
非円形断面のガラス繊維(B−1)は、断面が非円形のものであれば特に制限はない。断面が非円形とは、ガラス繊維の長さ方向に垂直な断面において、断面の外周の2点のうち、距離が最大となる2点を結ぶ長径と、長径に直交する直線のうち断面の外周と交差する2点間の距離が最大となる2点を結ぶ短径とが存在し、長径と短径の長さが異なる形状を意味する。ガラス繊維の長径の短径に対する比は、1より大きければよく、力学特性の観点から、例えば1.2以上10以下であり、1.5以上6以下が好ましく、1.7以上4.5以下がより好ましい。Non-circular cross-section glass fiber (B-1)
The glass fiber (B-1) having a non-circular cross section is not particularly limited as long as the cross-section is non-circular. The non-circular cross section means that, in a cross section perpendicular to the length direction of the glass fiber, out of two points on the outer periphery of the cross section, the long diameter connecting the two points where the distance is maximum, and the outer periphery of the cross section among the straight lines orthogonal to the long diameter There is a minor axis connecting two points where the distance between two points intersecting with each other is the maximum, and the major axis and the minor axis have different lengths. The ratio of the major axis to the minor axis of the glass fiber may be larger than 1, and is, for example, 1.2 or more and 10 or less, preferably 1.5 or more and 6 or less, and preferably 1.7 or more and 4.5 or less from the viewpoint of mechanical properties. Is more preferable.
非円形断面のガラス繊維(B−1)の断面形状としては、通常、まゆ形、長円形、半円形、円弧形、長方形、平行四辺形又はこれらの類似形のものが用いられる。実用上は、流動性、力学特性、低反り性の観点から、まゆ形、長円形または長方形が好ましい。非円形断面のガラス繊維(B−1)の断面形状の具体例については、例えば特開昭62−268612号公報の記載を参照できる。 As a cross-sectional shape of the glass fiber (B-1) having a non-circular cross section, an eyebrow shape, an oval shape, a semicircular shape, an arc shape, a rectangular shape, a parallelogram shape, or a similar shape thereof is usually used. Practically, eyebrows, ovals, or rectangles are preferable from the viewpoints of fluidity, mechanical properties, and low warpage. For a specific example of the cross-sectional shape of the non-circular cross-sectional glass fiber (B-1), reference can be made to, for example, the description of JP-A-62-2268612.
非円形断面のガラス繊維(B−1)の太さは特に制限されない。非円形断面のガラス繊維(B−1)の短径は通常0.5μm以上25μm以下であり、長径は1.25μm以上300μm以下である。
非円形断面のガラス繊維(B−1)は、繊維長が、通常1mm以上15mm以下、好ましくは1.5mm以上12mm以下、より好ましくは2mm以上6mm以下のガラス繊維を用いる。
非円形断面のガラス繊維(B−1)の長径と短径の平均値で繊維長を除して得られるアスペクト比は、通常10以上であり、剛性、機械的強度、流動性の観点から、15以上100以下が好ましい。The thickness of the glass fiber (B-1) having a non-circular cross section is not particularly limited. The short diameter of the glass fiber (B-1) having a non-circular cross section is usually from 0.5 μm to 25 μm, and the long diameter is from 1.25 μm to 300 μm.
The glass fiber (B-1) having a non-circular cross section uses a glass fiber having a fiber length of usually 1 mm to 15 mm, preferably 1.5 mm to 12 mm, more preferably 2 mm to 6 mm.
The aspect ratio obtained by dividing the fiber length by the average value of the major axis and minor axis of the non-circular cross-section glass fiber (B-1) is usually 10 or more, from the viewpoint of rigidity, mechanical strength, and fluidity, 15 or more and 100 or less are preferable.
非円形断面のガラス繊維(B−1)を構成するガラスとしては、Aガラス、Cガラス、Eガラス等の組成からなるものが挙げられ、ポリアミド樹脂の熱安定性の観点から、Eガラスが好ましい。また非円形断面のガラス繊維(B−1)は、シランカップリング剤、チタンカップリング剤、その他の高分子または低分子の表面処理剤で表面処理されていてもよい。表面処理されていることで、ポリアミド樹脂中への分散性及び密着性が向上する。また、非円形断面のガラス繊維(B−1)は、樹脂との接着性を向上させる観点から、収束材で収束されていることが好ましい。収束材は特に限定されず、ポリアミド樹脂との相溶性の観点から、ウレタン樹脂及び/又はアクリル樹脂であることが好ましい。 As glass which comprises the glass fiber (B-1) of a non-circular cross section, what consists of compositions, such as A glass, C glass, E glass, is mentioned, E glass is preferable from a viewpoint of the thermal stability of a polyamide resin. . The glass fiber (B-1) having a non-circular cross section may be surface-treated with a silane coupling agent, a titanium coupling agent, other polymer or a low molecular surface treatment agent. By being surface-treated, dispersibility and adhesion in the polyamide resin are improved. Moreover, it is preferable that the glass fiber (B-1) of a non-circular cross section is converged with the convergence material from a viewpoint of improving adhesiveness with resin. The converging material is not particularly limited, and is preferably a urethane resin and / or an acrylic resin from the viewpoint of compatibility with the polyamide resin.
非円形断面のガラス繊維(B−1)のポリアミド樹脂組成物の全量中における含有率は、高い剛性、低反り性及び良好な表面外観の観点から、15質量%以上70質量%以下が好ましく、20質量%以上65質量%以下がより好ましい。 The content of the non-circular cross-section glass fiber (B-1) in the total amount of the polyamide resin composition is preferably 15% by mass or more and 70% by mass or less from the viewpoint of high rigidity, low warpage, and good surface appearance. 20 mass% or more and 65 mass% or less are more preferable.
円形断面のガラス繊維(B−2)
ポリアミド樹脂組成物は、ガラス繊維として非円形断面のガラス繊維(B−1)に加えて、円形断面のガラス繊維(B−2)をさらに含んでいてもよい。円形断面のガラス繊維(B−2)は、ガラス繊維の長さ方向に垂直な断面が円形状のガラス繊維である。円形断面のガラス繊維(B−2)の平均繊維径は、例えば4μm以上15μm以下であり、6μm以上13μm以下がより好ましい。平均繊維径が前記範囲内であると、成形体の機械特性及び寸法安定性がより向上する傾向がある。なお、円形断面のガラス繊維(B−2)の平均繊維径はJIS R3420に準じて測定することができる。Glass fiber with a circular cross section (B-2)
The polyamide resin composition may further contain glass fibers (B-2) having a circular cross section in addition to glass fibers (B-1) having a non-circular cross section as glass fibers. The glass fiber (B-2) having a circular cross section is a glass fiber having a circular cross section perpendicular to the length direction of the glass fiber. The average fiber diameter of the glass fiber (B-2) having a circular cross section is, for example, 4 μm or more and 15 μm or less, and more preferably 6 μm or more and 13 μm or less. When the average fiber diameter is within the above range, the mechanical properties and dimensional stability of the molded product tend to be further improved. In addition, the average fiber diameter of glass fiber (B-2) of a circular cross section can be measured according to JIS R3420.
円形断面のガラス繊維(B−2)は、繊維長が、通常1mm以上15mm以下、好ましくは1.5mm以上12mm以下、より好ましくは2mm以上6mm以下であるものを用いる。
円形断面のガラス繊維の平均繊維径で繊維長を除して得られるアスペクト比は、通常10以上であり、剛性、機械的強度、流動性の観点から、15以上100以下が好ましい。The glass fiber (B-2) having a circular cross section has a fiber length of usually 1 mm or more and 15 mm or less, preferably 1.5 mm or more and 12 mm or less, more preferably 2 mm or more and 6 mm or less.
The aspect ratio obtained by dividing the fiber length by the average fiber diameter of glass fibers having a circular cross section is usually 10 or more, and preferably 15 or more and 100 or less from the viewpoint of rigidity, mechanical strength, and fluidity.
円形断面のガラス繊維を構成するガラスとしては、Aガラス、Cガラス、Eガラス等の組成からなるものが挙げられ、ポリアミド樹脂の熱安定性の観点から、Eガラスが好ましい。また円形断面のガラス繊維は、シランカップリング剤、チタンカップリング剤、その他の高分子または低分子の表面処理剤で表面処理されていてもよい。表面処理されていることで、ポリアミド樹脂中への分散性及び密着性が向上する。また、円形断面のガラス繊維は、樹脂との接着性を向上させる観点から、収束材で収束されていることが好ましい。収束材は特に限定されず、ポリアミド樹脂との相溶性の観点から、ウレタン樹脂及び/又はアクリル樹脂であることが好ましい As glass which comprises the glass fiber of a circular section, what consists of compositions, such as A glass, C glass, E glass, is mentioned, E glass is preferable from a viewpoint of the thermal stability of a polyamide resin. The glass fiber having a circular cross section may be surface-treated with a silane coupling agent, a titanium coupling agent, other polymer or a low molecular surface treatment agent. By being surface-treated, dispersibility and adhesion in the polyamide resin are improved. Moreover, it is preferable that the glass fiber of a circular cross section is converged with the convergence material from a viewpoint of improving adhesiveness with resin. The converging material is not particularly limited, and is preferably a urethane resin and / or an acrylic resin from the viewpoint of compatibility with the polyamide resin.
ポリアミド樹脂組成物が、円形断面のガラス繊維(B−2)を含む場合、円形断面のガラス繊維(B−2)のポリアミド樹脂組成物の全量中における含有率は、5質量%以上40質量%未満が好ましく、高い剛性、低反り性及び良好な表面外観の観点から、10質量%以上35質量%以下がより好ましい。
また、円形断面のガラス繊維(B−2)と非円形断面のガラス繊維(B−1)の含有比(B−2/B−1)は、高い剛性、低反り性及び良好な表面外観の観点から、0.1以上1.2以下が好ましく、0.3以上1.0以下がより好ましい。When the polyamide resin composition includes a glass fiber (B-2) having a circular cross section, the content of the glass fiber (B-2) having a circular cross section in the total amount of the polyamide resin composition is 5% by mass or more and 40% by mass. From the viewpoint of high rigidity, low warpage and good surface appearance, it is more preferably 10% by mass or more and 35% by mass or less.
Further, the content ratio (B-2 / B-1) of the glass fiber (B-2) having a circular cross section and the glass fiber (B-1) having a non-circular cross section is high in rigidity, low warpage, and good surface appearance. From a viewpoint, 0.1 or more and 1.2 or less are preferred, and 0.3 or more and 1.0 or less are more preferred.
ポリアミド樹脂組成物には、本発明の効果を損なわない範囲で他の成分、例えば、可塑剤、耐衝撃材、耐熱材、発泡剤、耐候剤、結晶核剤、結晶化促進剤、離型剤、滑剤、帯電防止剤、難燃剤、難燃助剤、顔料、染料等の機能性付与剤等を適宜配合することができる。 In the polyamide resin composition, other components such as a plasticizer, an impact-resistant material, a heat-resistant material, a foaming agent, a weathering agent, a crystal nucleating agent, a crystallization accelerator, and a release agent may be used as long as the effects of the present invention are not impaired. Further, a functional agent such as a lubricant, an antistatic agent, a flame retardant, a flame retardant aid, a pigment, and a dye can be appropriately blended.
ポリアミド樹脂組成物は、結晶性ポリアミド樹脂(A−1)、非晶性ポリアミド樹脂(A−2)及び所定量の非円形断面のガラス繊維(B−1)を、一軸あるいは二軸押出機、バンバリーミキサー等で溶融混練することにより製造される。
得られるポリアミド樹脂組成物を成形することにより、所望の成形体を得ることができる。成形方法としては、押出成形法、ブロー成形法、射出成形法等が採用できる。The polyamide resin composition comprises a crystalline polyamide resin (A-1), an amorphous polyamide resin (A-2), and a predetermined amount of non-circular cross-sectional glass fiber (B-1), a uniaxial or biaxial extruder, Manufactured by melt-kneading with a Banbury mixer or the like.
A desired molded article can be obtained by molding the resulting polyamide resin composition. As a molding method, an extrusion molding method, a blow molding method, an injection molding method, or the like can be adopted.
本実施形態のポリアミド樹脂組成物を含む成形体は、良好な表面外観を示すことから、自動車の部品や意匠性が要求されるもの、筐体等の様々用途に好適に用いられる。また、ポリアミド樹脂組成物を射出成形して得られる成形体について、ASTM D−523に準じて測定される光沢度(グロス値)は65%以上であることが好ましく、70%以上がより好ましい。 Since the molded body containing the polyamide resin composition of the present embodiment exhibits a good surface appearance, it is suitably used for various applications such as automobile parts and those requiring a design, casings and the like. Moreover, about the molded object obtained by injection-molding a polyamide resin composition, the glossiness (gloss value) measured according to ASTM D-523 is preferably 65% or more, and more preferably 70% or more.
本実施形態のポリアミド樹脂組成物は、成形品において高い剛性、低反り性及び良好な表面外観を提供する。
(機械物性)
本実施形態のポリアミド樹脂組成物を含む成形体において、ISO527−1,2に準じて23℃で測定した引張強さは、好ましくは265MPa以上である。
本実施形態のポリアミド樹脂組成物を含む成形体において、ISO527−1,2に準じて23℃で測定した引張弾性率は、好ましくは20GPa以上である。
本実施形態のポリアミド樹脂組成物を含む成形体において、ISO179−1に準じて23℃で測定したシャルピー衝撃強さは、好ましくは20kJ/m2である。
なお、引張強さ及び引張弾性率は、以下の方法で測定することができる。ISO規格TYPE−A試験片を射出成形にて作製して機械物性のデータ取得に使用する。引張強さ及び引張弾性率については、ISO527−1,2に準じて、インストロン製引張試験機型式5567を使用して23℃で測定する。
なお、シャルピー衝撃強さは、以下の方法で測定することができる。ISO179−1に準じて、安田精機製シャルピー衝撃試験機No.258−PCを用いて、23℃において、Aノッチ入り厚み4mmの試験片を用いてエッジワイズ衝撃試験を行う。(n=10)The polyamide resin composition of this embodiment provides high rigidity, low warpage and good surface appearance in a molded product.
(Mechanical properties)
In the molded body containing the polyamide resin composition of the present embodiment, the tensile strength measured at 23 ° C. according to ISO 527-1 and 2 is preferably 265 MPa or more.
In the molded body containing the polyamide resin composition of the present embodiment, the tensile elastic modulus measured at 23 ° C. according to ISO527-1, 2 is preferably 20 GPa or more.
In the molded body containing the polyamide resin composition of the present embodiment, the Charpy impact strength measured at 23 ° C. according to ISO 179-1 is preferably 20 kJ / m 2 .
In addition, the tensile strength and the tensile modulus can be measured by the following methods. An ISO standard TYPE-A test piece is produced by injection molding and used to acquire mechanical property data. The tensile strength and the tensile modulus are measured at 23 ° C. using an Instron tensile tester model 5567 according to ISO527-1,2.
The Charpy impact strength can be measured by the following method. In accordance with ISO 179-1, Yasuda Seiki Charpy Impact Tester No. Using a 258-PC, an edgewise impact test is performed using a test piece having a thickness of 4 mm with an A notch at 23 ° C. (N = 10)
(流動性)
本実施形態のポリアミド樹脂組成物を含む成形体において、以下の条件で測定される流動長は、好ましくは85mm以上である。
日精樹脂工業株式会社製PS−40E(スクリュ径26mm、型締め力40ton)を用いて、キャビティーサイズが幅w=15mm,厚さt=1mmのスパイラルフロー型の流動性評価金型を用いて得られた成形品から流動長を測定する。成形条件は、成形温度290℃、金型温度80℃、射出圧力は100MPaとする。(Liquidity)
In the molded body containing the polyamide resin composition of the present embodiment, the flow length measured under the following conditions is preferably 85 mm or more.
Using PS-40E (screw diameter: 26 mm, clamping force: 40 ton) manufactured by Nissei Plastic Industrial Co., Ltd., using a spiral flow type fluidity evaluation mold having a cavity size of width w = 15 mm and thickness t = 1 mm. The flow length is measured from the obtained molded product. The molding conditions are a molding temperature of 290 ° C., a mold temperature of 80 ° C., and an injection pressure of 100 MPa.
(表面外観(光沢度)(グロス))
本実施形態のポリアミド樹脂組成物を含む成形体において、以下の条件で測定される光沢度(グロス値)は、65%以上であることが好ましく、70%以上がより好ましい。
住友重機械工業株式会社製SE100D−C160S(スクリュ径28mm、型締め力100ton)を用いて平板100mm×70mm×厚さ2mmを作成する。成形条件は、成形温度290℃、金型温度80℃、射出速度は80mm/sec、冷却時間15秒とする。得られた試験片をASTM D−523に準じ、スガ試験機(株)製カラーコンピューターSM−5−IS−2Bを使用して、入射角60°で光沢度(グロス値)を測定する。(Surface appearance (Glossiness) (Gloss))
In the molded body containing the polyamide resin composition of the present embodiment, the gloss (gloss value) measured under the following conditions is preferably 65% or more, and more preferably 70% or more.
A plate 100 mm × 70 mm × thickness 2 mm is prepared using SE100D-C160S (screw diameter 28 mm, clamping force 100 ton) manufactured by Sumitomo Heavy Industries, Ltd. The molding conditions are a molding temperature of 290 ° C., a mold temperature of 80 ° C., an injection speed of 80 mm / sec, and a cooling time of 15 seconds. The glossiness (gloss value) of the obtained test piece is measured at an incident angle of 60 ° using a color computer SM-5-IS-2B manufactured by Suga Test Instruments Co., Ltd. according to ASTM D-523.
(反り変形)
本実施形態のポリアミド樹脂組成物を含む成形体において、以下の方法で低反り性を評価できる。
住友重機械工業株式会社製SE100D−C160S(スクリュ径28mm、型締め力100ton)を用いてISO294−3のD−1タイプ金型60mm×60mm×厚さ1tを作成する。成形条件は、成形温度290℃、金型温度80℃、射出速度97mm/秒、射出圧力60MPa、冷却時間15秒とする。成形直後にゲートカットし、防湿容器中48hr放置後、定盤上で規定隅に錘を乗せ、定盤との最大空隙を反り変形量とする。得られた変形量が3mm以上の場合を反り変形有りとして、3mm未満の場合を反り変形無しとする。(Warp deformation)
In the molded body containing the polyamide resin composition of the present embodiment, low warpage can be evaluated by the following method.
A D-1 type mold 60 mm × 60 mm × thickness 1 t of ISO294-3 is created using SE100D-C160S (screw diameter 28 mm, clamping force 100 ton) manufactured by Sumitomo Heavy Industries, Ltd. The molding conditions are a molding temperature of 290 ° C., a mold temperature of 80 ° C., an injection speed of 97 mm / second, an injection pressure of 60 MPa, and a cooling time of 15 seconds. The gate is cut immediately after molding and left in the moisture-proof container for 48 hours, and a weight is placed on the specified corner on the surface plate, and the maximum gap with the surface plate is defined as the amount of warping deformation. When the obtained deformation amount is 3 mm or more, warp deformation is present, and when it is less than 3 mm, warp deformation is absent.
以下、本発明を実施例及び比較例により更に詳細に説明するが、本発明はこれら実施例に限定されるものではない。なお、実施例および比較例において使用した樹脂及び成形品の物性評価方法を以下に示す。 EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited to these Examples. In addition, the physical property evaluation method of resin used in an Example and a comparative example and a molded article is shown below.
[機械物性]
ISO規格TYPE−A試験片を射出成形にて作製して機械物性のデータ取得に使用した。引張強さ及び引張弾性率については、ISO527−1,2に準じて、インストロン製引張試験機型式5567を使用して23℃で測定した。[Mechanical properties]
An ISO standard TYPE-A test piece was prepared by injection molding and used for data acquisition of mechanical properties. The tensile strength and tensile modulus were measured at 23 ° C. using an Instron tensile tester model 5567 according to ISO527-1,2.
[シャルピー衝撃強さ]
ISO179−1に準じて、安田精機製シャルピー衝撃試験機No.258−PCを用いて、23℃において、Aノッチ入り厚み4mmの試験片を用いてエッジワイズ衝撃試験を行った。(n=10)[Charpy impact strength]
In accordance with ISO 179-1, Yasuda Seiki Charpy Impact Tester No. Using 258-PC, an edgewise impact test was performed using a test piece having a thickness of 4 mm with an A notch at 23 ° C. (N = 10)
[流動性]
日精樹脂工業株式会社製PS−40E(スクリュ径26mm、型締め力40ton)を用いて、キャビティーサイズが幅w=15mm,厚さt=1mmのスパイラルフロー型の流動性評価金型を用いて得られた成形品から流動長を測定した。成形条件は、成形温度290℃、金型温度80℃、射出圧力は100MPaとした。[Liquidity]
Using PS-40E (screw diameter: 26 mm, clamping force: 40 ton) manufactured by Nissei Plastic Industrial Co., Ltd., using a spiral flow type fluidity evaluation mold having a cavity size of width w = 15 mm and thickness t = 1 mm. The flow length was measured from the obtained molded product. The molding conditions were a molding temperature of 290 ° C., a mold temperature of 80 ° C., and an injection pressure of 100 MPa.
[光沢度(グロス)]
住友重機械工業株式会社製SE100D−C160S(スクリュ径28mm、型締め力100ton)を用いて平板100mm×70mm×厚さ2mmを作成した。成形条件は、成形温度290℃、金型温度80℃、射出速度は80mm/sec、冷却時間15秒とした。得られた試験片をASTM D−523に準じ、スガ試験機(株)製カラーコンピューターSM−5−IS−2Bを使用して、入射角60°で光沢度(グロス値)を測定した。[Glossiness (Gloss)]
A plate 100 mm × 70 mm × thickness 2 mm was prepared using SE100D-C160S (screw diameter 28 mm, clamping force 100 ton) manufactured by Sumitomo Heavy Industries, Ltd. The molding conditions were a molding temperature of 290 ° C., a mold temperature of 80 ° C., an injection speed of 80 mm / sec, and a cooling time of 15 seconds. The glossiness (gross value) of the obtained test piece was measured at an incident angle of 60 ° using a color computer SM-5-IS-2B manufactured by Suga Test Instruments Co., Ltd. according to ASTM D-523.
[反り変形]
住友重機械工業株式会社製SE100D−C160S(スクリュ径28mm、型締め力100ton)を用いてISO294−3のD−1タイプ金型60mm×60mm×厚さ1tを作成した。成形条件は、成形温度290℃、金型温度80℃、射出速度97mm/秒、射出圧力60MPa、冷却時間15秒とした。成形直後にゲートカットし、防湿容器中48hr放置後、定盤上で規定隅に錘を乗せ、定盤との最大空隙を反り変形量とした。得られた変形量が3mm以上の場合を反り変形有りとして、3mm未満の場合を反り変形無しとした。[Warpage deformation]
Using ISO100D-C160S (screw diameter 28 mm, mold clamping force 100 ton) manufactured by Sumitomo Heavy Industries, Ltd., a D-1 type mold 60 mm × 60 mm × thickness 1 t of ISO294-3 was created. The molding conditions were a molding temperature of 290 ° C., a mold temperature of 80 ° C., an injection speed of 97 mm / second, an injection pressure of 60 MPa, and a cooling time of 15 seconds. The gate was cut immediately after molding and left in a moisture-proof container for 48 hours, and a weight was placed on the specified corner on the surface plate, and the maximum gap with the surface plate was defined as the amount of warping deformation. The case where the obtained deformation amount was 3 mm or more was warp deformation, and the case where the deformation amount was less than 3 mm was not warp deformation.
・ポリアミド樹脂(A)
・結晶性ポリアミド樹脂(A−1)
PA6−1:JIS K 6810に準じて、96%硫酸中濃度1%の結晶性ポリアミド樹脂について、25℃で測定した相対粘度相対粘度2.43〜2.51であり、炭素数6のカプロラクタムからなるポリアミド6
PA6−2:JIS K 6810に準じて、96%硫酸中濃度1%の結晶性ポリアミド樹脂について、25℃で測定した相対粘度相対粘度2.16〜2.25であり、炭素数6のカプロラクタムからなるポリアミド6
・非晶性ポリアミド樹脂
・ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが50ml/10分以上である非晶性ポリアミド樹脂(A−2)
PA6T/6I−1:ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが100ml/10分であったGrivory G16(EMS−CHEMIE(Japan)製)
PA6T/6I−2:ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが25ml/10分であったGrivory G21(EMS−CHEMIE(Japan)製)・ Polyamide resin (A)
・ Crystalline polyamide resin (A-1)
PA6-1: According to JIS K 6810, a crystalline polyamide resin with a concentration of 1% in 96% sulfuric acid has a relative viscosity of 2.43 to 2.51 measured at 25 ° C., and from caprolactam having 6 carbon atoms. Polyamide 6
PA6-2: According to JIS K 6810, a crystalline polyamide resin with a concentration of 1% in 96% sulfuric acid has a relative viscosity of 2.16 to 2.25 measured at 25 ° C., and from caprolactam having 6 carbon atoms. Polyamide 6
-Amorphous polyamide resin-Amorphous polyamide resin (A-2) based on ISO 1133 with an MVR measured at a temperature of 275 ° C and a load of 5 kg of 50 ml / 10 min or more
PA6T / 6I-1: Grivory G16 (manufactured by EMS-CHEMIE (Japan)) whose MVR measured at a temperature of 275 ° C. and a load of 5 kg was 100 ml / 10 minutes based on ISO1133
PA6T / 6I-2: Grivory G21 (manufactured by EMS-CHEMIE (Japan)) whose MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 was 25 ml / 10 min.
・ガラス繊維
GF1 : 非円形断面のガラス繊維(日東紡績株式会社製 CSG3PA−820S)
長径と短径の比4、繊維径7×28μm
GF2 : 円形断面のガラス繊維(日東紡績株式会社製 CS 3DE−456S)
平均繊維径6μm
GF3 : 円形断面のガラス繊維(日本電気硝子株式会社製 ECS 03T−249)
平均繊維径13μmGlass fiber GF1: Glass fiber with a non-circular cross section (CSG3PA-820S manufactured by Nittobo Co., Ltd.)
Ratio of major axis to minor axis 4 and fiber diameter 7 × 28μm
GF2: Glass fiber having a circular cross section (CS 3DE-456S manufactured by Nitto Boseki Co., Ltd.)
Average fiber diameter 6μm
GF3: Glass fiber with a circular cross section (ECS 03T-249, manufactured by Nippon Electric Glass Co., Ltd.)
Average fiber diameter 13μm
・PA6黒MB
ポリアミド6ベースに染料成分と顔料成分を含有させた黒マスターバッチ
(宇部興産株式会社製 UBE NYLON 1013MBC・ PA6 black MB
Black masterbatch (UBE NYLON 1013MBC manufactured by Ube Industries, Ltd.) containing a dye component and a pigment component in polyamide 6 base
・成形助剤−2
ペンタリット(広栄化学工業株式会社製)
・成形助剤−2
LICOWAX OP POWDER(クラリアントジャパン株式会社製)・ Molding aid-2
Pentalit (Guangei Chemical Industry Co., Ltd.)
・ Molding aid-2
LICOWAX OP POWDER (manufactured by Clariant Japan Co., Ltd.)
・耐熱剤CuI、KI混合物(重量比1:6)
CuI ヨウ化第一銅F(伊勢化学工業株式会社製)
KI 粉末ヨウ化カリウム(三井ファイン株式会社)・ Heat-resistant agent CuI, KI mixture (weight ratio 1: 6)
CuI Cuprous iodide F (made by Ise Chemical Co., Ltd.)
KI Powdered potassium iodide (Mitsui Fine Co., Ltd.)
実施例1から9、比較例1から8
表1に記載したポリアミド樹脂およびガラス繊維をTEX44HCT二軸混練機で溶融混練し、目的とするポリアミド樹脂組成物ペレットを作製した。
次に得られたペレットを用いて各種試験片を製造し、各種物性を評価した。得られた結果を表1に示す。なお、表1中、「−」は未配合を意味する。Examples 1 to 9, Comparative Examples 1 to 8
The polyamide resin and glass fiber described in Table 1 were melt-kneaded with a TEX44HCT biaxial kneader to produce a target polyamide resin composition pellet.
Next, various test pieces were produced using the obtained pellets, and various physical properties were evaluated. The obtained results are shown in Table 1. In Table 1, “-” means not blended.
表1の結果から明らかなとおり、本発明のポリアミド樹脂組成物を用いて成形品を形成すると、高い剛性、低反り性及び良好な表面外観を達成できることが分かる。 As is apparent from the results in Table 1, it can be seen that when a molded product is formed using the polyamide resin composition of the present invention, high rigidity, low warpage and good surface appearance can be achieved.
日本国特許出願2016−018653号(出願日:2016年2月3日)の開示はその全体が参照により本明細書に取り込まれる。
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書に参照により取り込まれる。The disclosure of Japanese Patent Application No. 2006-018653 (filing date: February 3, 2016) is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards mentioned in this specification are to the same extent as if each individual document, patent application, and technical standard were specifically and individually stated to be incorporated by reference, Incorporated herein by reference.
Claims (8)
前記ポリアミド樹脂(A)は、結晶性ポリアミド樹脂(A−1)と、ISO1133に基づき温度275℃、荷重5kgで測定されるMVRが50ml/10分以上である非晶性ポリアミド樹脂(A−2)とを含み、
前記ガラス繊維(B)は、非円形断面のガラス繊維(B−1)を含み、
前記ガラス繊維(B)の総含有率がポリアミド樹脂組成物全量に対し40質量%以上80質量%以下であるポリアミド樹脂組成物。Including polyamide resin (A) and glass fiber (B),
The polyamide resin (A) is composed of a crystalline polyamide resin (A-1) and an amorphous polyamide resin (A-2) having an MVR measured at a temperature of 275 ° C. and a load of 5 kg based on ISO 1133 of 50 ml / 10 min or more. ) And
The glass fiber (B) includes a glass fiber (B-1) having a non-circular cross section,
The polyamide resin composition whose total content rate of the said glass fiber (B) is 40 to 80 mass% with respect to the polyamide resin composition whole quantity.
平均繊維径4μm以上15μm以下の円形断面のガラス繊維(B−2)を含む請求項1又は2に記載のポリアミド樹脂組成物。The glass fiber (B) is further
The polyamide resin composition of Claim 1 or 2 containing the glass fiber (B-2) of a circular section with an average fiber diameter of 4 micrometers or more and 15 micrometers or less.
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JP2015503014A (en) * | 2011-12-23 | 2015-01-29 | エムス−パテント アクチエンゲゼルシャフト | Polyamide molding materials, their use, and moldings made from them |
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