JPWO2017123899A5 - - Google Patents
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- JPWO2017123899A5 JPWO2017123899A5 JP2018536800A JP2018536800A JPWO2017123899A5 JP WO2017123899 A5 JPWO2017123899 A5 JP WO2017123899A5 JP 2018536800 A JP2018536800 A JP 2018536800A JP 2018536800 A JP2018536800 A JP 2018536800A JP WO2017123899 A5 JPWO2017123899 A5 JP WO2017123899A5
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- glass element
- device assembly
- main surface
- electronic device
- foldable electronic
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- 239000011521 glass Substances 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000006120 scratch resistant coating Substances 0.000 claims description 7
- 238000010998 test method Methods 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 claims 8
- 150000002500 ions Chemical class 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 238000005452 bending Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 4
- 229920001721 Polyimide Polymers 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 230000003068 static Effects 0.000 claims 1
Description
第２６の例示的態様によると、上記ポリマー層の上に配置された耐引掻きコーティングを更に備え、上記コーティングは、ＡＳＴＭ試験法Ｄ３３６３による少なくとも５Ｈの鉛筆硬度を有し、また更に上記折畳式電子デバイス組立体は、上記層又は上記コーティングを有しない上記折畳式電子デバイス組立体の対照ペン落下高さの少なくとも１．５倍のペン落下高さに耐える能力を備え、ここで上記ペン落下高さは、落下試験１に従って測定され、上記ガラス要素の側部に配置された上記層及び上記コーティングがペンに対面する、例示的態様１６～２５のいずれか１つのデバイス組立体が提供される。 According to the 26th exemplary embodiment, it further comprises a scratch resistant coating placed on top of the polymer layer, the coating having a pencil hardness of at least 5H according to ASTM test method D3363, and further the foldable electron . The device assembly is capable of withstanding a pen drop height of at least 1.5 times the control pen drop height of the foldable electronic device assembly without the layer or coating, wherein the pen drop height. The device assembly of any one of the exemplary embodiments 16-25 is provided, which is measured according to drop test 1 and in which the layer and coating facing the side of the glass element face the pen.
第３６の例示的態様によると、上記ポリマー層の上に配置された耐引掻きコーティングを更に備え、上記耐引掻きコーティングは、ＡＳＴＭ試験法Ｄ３３６３による少なくとも５Ｈの鉛筆硬度を有し、また更に上記折畳式電子デバイス組立体は、上記層又は上記コーティングを有しない上記折畳式電子デバイス組立体の対照ペン落下高さの少なくとも１．５倍のペン落下高さに耐える能力を備え、ここで上記ペン落下高さは、落下試験１に従って測定され、上記ガラス要素の側部に配置された上記層及び上記コーティングがペンに対面する、例示的態様２７～３５のいずれか１つのデバイス組立体が提供される。 According to a thirty-six exemplary embodiment, the scratch resistant coating further comprises a scratch resistant coating disposed on top of the polymer layer, the scratch resistant coating having a pencil hardness of at least 5H according to ASTM test method D3363 and further the folding . The formal electronic device assembly is capable of withstanding a pen drop height of at least 1.5 times the control pen drop height of the foldable electronic device assembly without the layer or coating, wherein the pen. Drop height is measured according to Drop Test 1 and provides a device assembly according to any one of the exemplary embodiments 27-35, wherein the layer and coating disposed on the side of the glass element face the pen. To.
Claims (9)
前記カバー要素は：
厚さ２５μｍ～２００μｍの折畳式ガラス要素であって、前記ガラス要素は更に：
（ａ）第１の主表面、
（ｂ）第２の主表面、及び
（ｃ）前記ガラス要素の前記第１の主表面から前記ガラス要素内の第１の深さまで延在する圧縮応力領域
を備え、前記領域は、前記ガラス要素の前記第１の主表面における、少なくとも１００ＭＰａの圧縮応力によって規定される、折畳式ガラス要素；並びに
厚さ１０μｍ～１００μｍの、前記ガラス要素の前記第１の主表面上に配置されたポリマー層
を備え、
前記ガラス要素は、前記ガラス要素を、曲率中心を前記第２の主表面の側として標的曲げ半径１ｍｍ～２０ｍｍまで曲げることにより、前記第１の主表面に引張応力としての曲げ応力σＢを誘発した場合に、０＜σＩ＋σＢ＜４００ＭＰａ（引張応力）となるような、応力プロファイルを特徴とし、
前記カバー要素は、前記層を有しない前記カバー要素の対照ペン落下高さの少なくとも１．５倍のペン落下高さに耐える能力を備え、ここで前記ペン落下高さは、落下試験１に従って測定され、前記ガラス要素の側部に配置された前記層がペンに対面する、カバー要素。 A cover element for foldable electronic devices,
The cover element is:
A foldable glass element with a thickness of 25 μm to 200 μm, wherein the glass element is further:
(A) First main surface,
It comprises a second main surface and (c) a compressive stress region extending from the first main surface of the glass element to a first depth within the glass element, where the region is the glass element. Foldable glass element defined by a compressive stress of at least 100 MPa on the first main surface of the glass element; and a polymer layer of 10 μm to 100 μm thick arranged on the first main surface of the glass element. Equipped with
The glass element induces a bending stress σ B as a tensile stress on the first main surface by bending the glass element to a target bending radius of 1 mm to 20 mm with the center of curvature as the side of the second main surface. It features a stress profile such that 0 <σ I + σ B <400 MPa (tensile stress) when
The cover element is capable of withstanding a pen drop height of at least 1.5 times the control pen drop height of the cover element without the layer, wherein the pen drop height is measured according to drop test 1. A cover element, wherein the layer is placed on the side of the glass element and faces the pen.
更に前記圧縮応力領域は、複数のイオン交換性金属イオン及び複数のイオン交換済み金属イオンを含み、
前記イオン交換済み金属イオンは、前記イオン交換性金属イオンの原子半径より大きな原子半径を備える、請求項１または２に記載のカバー要素。 The stress on the first main surface of the glass element is 700 MPa to 2000 MPa as a compressive stress.
Further, the compressive stress region contains a plurality of ion-exchangeable metal ions and a plurality of ion-exchanged metal ions.
The cover element according to claim 1 or 2, wherein the ion-exchanged metal ion has an atomic radius larger than the atomic radius of the ion-exchangeable metal ion.
前記コーティングは、ＡＳＴＭ試験法Ｄ３３６３による少なくとも５Ｈの鉛筆硬度を有し、
更に、前記層及び前記コーティングを備えた前記カバー要素は、前記層又は前記コーティングを有しない前記カバー要素の対照ペン落下高さの少なくとも１．５倍のペン落下高さに耐える能力を備え、ここで前記ペン落下高さは、落下試験１に従って測定され、前記ガラス要素の側部に配置された前記層及び前記コーティングがペンに対面する、請求項１～３のいずれか１項に記載のカバー要素。 Further provided with a scratch resistant coating placed on top of the polymer layer,
The coating has a pencil hardness of at least 5H according to ASTM test method D3333 and has a pencil hardness of at least 5H.
Further, the layer and the cover element with the coating are capable of withstanding a pen drop height of at least 1.5 times the control pen drop height of the layer or the cover element without the coating. The cover according to any one of claims 1 to 3, wherein the pen drop height is measured according to the drop test 1, and the layer and the coating arranged on the side portion of the glass element face the pen. element.
前記折畳式電子デバイス組立体は：
折畳式電子デバイス基板と；
前記デバイス基板上に配置された折畳式ガラス要素であって、前記ガラス要素は２５μｍ～２００μｍの厚さを備え、また更に：
（ａ）第１の主表面、
（ｂ）第２の主表面、及び
（ｃ）前記ガラス要素の前記第１の主表面から前記ガラス要素内の第１の深さまで延在する圧縮応力領域
を備え、前記領域は、前記ガラス要素の前記第１の主表面における、少なくとも１００ＭＰａの圧縮応力によって規定される、折畳式ガラス要素と；
厚さ１０μｍ～１００μｍの、前記ガラス要素の前記第１の主表面上に配置されたポリマー層と
を備え、
前記ガラス要素は、前記ガラス要素を、曲率中心を前記第２の主表面の側として標的曲げ半径１ｍｍ～２０ｍｍまで曲げることにより、前記第１の主表面に曲げ応力σＢ（引張応力）を誘発した場合に、０＜σＩ＋σＢ＜４００ＭＰａ（引張応力）となるような、応力プロファイルを特徴とし、
前記折畳式電子デバイス組立体は、前記折畳式電子デバイス組立体の永久的な反りが、比較例の折畳式電子デバイス組立体の永久的な反りより少なくとも１０％小さくなるように、永久的な反りに耐える能力を備え、ここで前記デバイス組立体の前記永久的な反りは、８５℃及び相対湿度８５％で４８０時間の試験時保持時間の後に、静的試験によって測定され、
更に、前記比較例の折畳式電子デバイス組立体は：（ａ）前記折畳式電子デバイス組立体の前記基板及び前記ポリマー層とそれぞれ同一の寸法及び組成を備える、比較例の基板及び比較例のポリマー層と；（ｂ）前記比較例の基板と前記比較例のポリマー層との間に配置され、前記折畳式電子デバイス組立体の前記ガラス要素と同一の又は前記ガラス要素より小さい厚さを備えたポリイミド（ＰＩ）で構成される、比較例の折畳式ポリマー要素とを備える、折畳式電子デバイス組立体。 A foldable electronic device assembly
The foldable electronic device assembly is:
With a foldable electronic device board;
A foldable glass element disposed on the device substrate, wherein the glass element has a thickness of 25 μm to 200 μm, and further:
(A) First main surface,
It comprises a second main surface and (c) a compressive stress region extending from the first main surface of the glass element to a first depth within the glass element, where the region is the glass element. With a foldable glass element defined by a compressive stress of at least 100 MPa on the first main surface of the above;
It comprises a polymer layer having a thickness of 10 μm to 100 μm and arranged on the first main surface of the glass element.
The glass element induces bending stress σ B (tensile stress) on the first main surface by bending the glass element to a target bending radius of 1 mm to 20 mm with the center of curvature as the side of the second main surface. It features a stress profile such that 0 <σ I + σ B <400 MPa (tensile stress) when
The foldable electronic device assembly is permanently such that the permanent warp of the foldable electronic device assembly is at least 10% less than the permanent warp of the foldable electronic device assembly of the comparative example. The permanent warp of the device assembly is measured by static testing after a 480 hour holding time at 85 ° C. and 85% relative humidity.
Further, the foldable electronic device assembly of the comparative example is: (a) the substrate of the comparative example and the comparative example having the same dimensions and composition as the substrate and the polymer layer of the foldable electronic device assembly, respectively. (B) The thickness is the same as or smaller than the glass element of the foldable electronic device assembly, which is arranged between the substrate of the comparative example and the polymer layer of the comparative example. A foldable electronic device assembly comprising a comparative example foldable polymer element composed of polyimide (PI).
更に前記圧縮応力領域は、複数のイオン交換性金属イオン及び複数のイオン交換済み金属イオンを含み、
前記イオン交換済み金属イオンは、前記イオン交換性金属イオンの原子半径より大きな原子半径を備える、請求項５～７のいずれか１項に記載のデバイス組立体。 The stress on the first main surface of the glass element is 700 MPa to 2000 MPa (compressive stress).
Further, the compressive stress region contains a plurality of ion-exchangeable metal ions and a plurality of ion-exchanged metal ions.
The device assembly according to any one of claims 5 to 7, wherein the ion-exchanged metal ion has an atomic radius larger than the atomic radius of the ion-exchangeable metal ion.
前記耐引掻きコーティングは、ＡＳＴＭ試験法Ｄ３３６３による少なくとも５Ｈの鉛筆硬度を有し、
更に、前記折畳式電子デバイス組立体は、前記層又は前記コーティングを有しない前記折畳式電子デバイス組立体の対照ペン落下高さの少なくとも１．５倍のペン落下高さに耐える能力を備え、ここで前記ペン落下高さは、落下試験１に従って測定され、前記ガラス要素の側部に配置された前記層及び前記コーティングがペンに対面する、請求項５～８のいずれか１項に記載のデバイス組立体。 Further provided with a scratch resistant coating placed on top of the polymer layer,
The scratch resistant coating has a pencil hardness of at least 5H according to ASTM test method D3363.
Further, the foldable electronic device assembly is capable of withstanding a pen drop height of at least 1.5 times the control pen drop height of the foldable electronic device assembly without the layer or coating. The drop height of the pen is measured according to the drop test 1, and the layer and the coating arranged on the side of the glass element face the pen, according to any one of claims 5 to 8. Device assembly.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662279558P | 2016-01-15 | 2016-01-15 | |
| US62/279,558 | 2016-01-15 | ||
| US201662415088P | 2016-10-31 | 2016-10-31 | |
| US62/415,088 | 2016-10-31 | ||
| PCT/US2017/013374 WO2017123899A1 (en) | 2016-01-15 | 2017-01-13 | Foldable electronic device assemblies and cover elements for the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019504812A JP2019504812A (en) | 2019-02-21 |
| JPWO2017123899A5 true JPWO2017123899A5 (en) | 2022-06-03 |
| JP7121656B2 JP7121656B2 (en) | 2022-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018536800A Active JP7121656B2 (en) | 2016-01-15 | 2017-01-13 | Foldable electronic device assembly and cover element for the foldable electronic device assembly |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10688756B2 (en) |
| EP (1) | EP3402667A1 (en) |
| JP (1) | JP7121656B2 (en) |
| KR (1) | KR102692388B1 (en) |
| CN (3) | CN112976725B (en) |
| TW (1) | TWI795350B (en) |
| WO (1) | WO2017123899A1 (en) |
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