JPWO2017085840A1 - Component mounting related apparatus and installation method thereof - Google Patents

Abstract

The component mounting apparatus 1 includes an apparatus main body 10 and support legs 60. The apparatus main body 10 performs positioning control of the head 50 in association with mounting components on the substrate S. The support legs 60 are for installing the apparatus main body 10 on the floor surface F. The support leg 60 includes a leveling bolt 62, a leveling sheet 64, and a rubber magnet sheet 66. The leveling bolt 62 has a convex curved lower surface. The leveling sheet 64 has a concave curved upper surface and receives the convex curved surface of the leveling bolt 62 on the concave curved surface. The rubber magnet sheet 66 is a disk-shaped sheet in which magnetic powder is dispersed in a rubber matrix, and is disposed on the lower surface of the leveling sheet 64.

Description

  The present invention relates to a component mounting related apparatus and an installation method thereof.

  Conventionally, a component supplied from a component supply apparatus is adsorbed to a nozzle provided in a moving body (for example, an XY robot), and the component adsorbed by the nozzle is moved to a predetermined position on the substrate by moving the moving body. A component mounting apparatus for mounting a component at the predetermined position is known. Such a component mounting apparatus has a leveling bolt, and the lower end of the leveling bolt is placed on a steel leveling sheet laid on the floor where the component mounting apparatus is installed. In the component mounting apparatus, the component mounting apparatus vibrates due to the movement of the moving body during the component mounting operation. At this time, since the component mounting apparatus is integrally connected via the leveling bolt and the leveling sheet, the vibration of the apparatus is transmitted to the floor. Patent Document 1 describes that if a rubber sheet is laid between the leveling sheet and the floor, vibration energy transmitted to the floor is reduced by elastic deformation of the rubber sheet.

Japanese Patent Laid-Open No. 11-214887 (paragraphs 0002 and 0003)

  However, although the configuration in which the rubber sheet is laid between the leveling sheet and the floor can be realized easily and inexpensively, as pointed out in Patent Document 1, the natural frequency is close to the excitation frequency in some cases. A resonance state may occur and the amplitude may increase.

  The present invention has been made to solve the above-described problems, and a main object of the present invention is to easily and inexpensively suppress vibration of the component mounting related device itself.

The component mounting related apparatus of the present invention is
An apparatus main body for performing positioning control of the moving body in relation to mounting the component on the board;
A leveling bolt provided in the apparatus main body and having a convex curved bottom surface;
The upper surface is a concave curved surface, and the leveling sheet that receives the convex curved surface of the leveling bolt with the concave curved surface,
With
The leveling sheet has a rubber magnet sheet in which magnetic powder is dispersed in a rubber matrix in at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet.
Is.

  This component mounting related apparatus has a rubber magnet sheet (also referred to as a magnet sheet) in which magnetic powder is dispersed in a rubber matrix at at least one place between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet. Due to the presence of the rubber magnet sheet, the intensity of the vibration frequency of the apparatus main body becomes very small, and vibration can be suppressed very effectively. In particular, it is epoch-making in that not only vibration transmitted from the apparatus main body to the floor but also vibration of the apparatus main body itself can be suppressed. This is an effect obtained by combining a rubber magnet sheet with a structure of a leveling bolt having a convex curved surface on the lower surface and a leveling sheet having a concave curved surface that receives the convex curved surface of the leveling bolt. Thus, according to the component mounting related apparatus of the present invention, vibration of the component mounting related apparatus itself can be easily and inexpensively suppressed.

  When a rubber sheet is used instead of the rubber magnet sheet, the vibration frequency of the device main body generated with the movement of the moving body is reduced, but the strength is increased, and the vibration of the device main body itself cannot be suppressed. .

  Here, examples of the apparatus main body that performs the positioning control of the moving body in connection with mounting the component on the substrate include a component mounting apparatus, an adhesive application apparatus, and a flux application apparatus.

  In the component mounting related apparatus of the present invention, the apparatus main body may be capable of executing positioning control without executing machine base vibration compensation. As described above, according to the present invention, the vibration of the apparatus main body itself can be suppressed. Therefore, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. it can. Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.

  In the component mounting related apparatus of the present invention, the device main body collects a component from the component supply unit on the movable body, moves the movable body to carry the component to a predetermined position on the substrate, and moves the component to the predetermined position. It is good also as what is mounted in the said predetermined position. Since this type of component mounting apparatus requires high accuracy in positioning control of the moving body, it is highly meaningful to apply the present invention.

The method of installing the component mounting related apparatus of the present invention is as follows.
An apparatus main body that performs positioning control of a moving body in association with mounting a component on a board, a leveling bolt that is provided on the apparatus main body and that has a lower surface that is a convex curved surface, and an upper surface that is a concave curved surface, and the leveling bolt A leveling sheet that receives the convex curved surface of the concave curved surface, and a component mounting related device installation method that installs a component mounting related device provided on a floor surface,
After placing a rubber magnet sheet in at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet, the leveling bolt of the apparatus body is placed on the leveling sheet;
Is.

  In this component mounting related apparatus installation method, a rubber magnet sheet is disposed at least at one position between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet, and then the leveling bolt of the apparatus body is placed on the leveling sheet. Due to the presence of the rubber magnet sheet, the intensity of the vibration frequency of the apparatus main body becomes very small, and vibration can be suppressed very effectively. In particular, it is epoch-making in that not only vibration transmitted from the apparatus main body to the floor but also vibration of the apparatus main body itself can be suppressed. Thus, according to the installation method of the component mounting related apparatus of the present invention, the vibration of the component mounting related apparatus itself can be easily and inexpensively suppressed.

  In the component mounting related apparatus installation method of the present invention, the apparatus main body may be capable of executing positioning control without executing machine base vibration compensation. As described above, according to the present invention, the vibration of the apparatus main body itself can be suppressed. Therefore, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. it can. Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.

  In the method for setting a component mounting related device of the present invention, the device main body collects a component from a component supply unit on the movable body, and moves the movable body to carry the component to a predetermined position on the substrate. It is good also as a component mounting apparatus which mounts the said component in the said predetermined position. Since this type of component mounting apparatus requires high accuracy in positioning control of the moving body, it is highly meaningful to apply the present invention.

1 is a configuration diagram of a component mounting apparatus 1. FIG. FIG. The graph which shows a modal test result. The graph which shows a positioning waveform. The fragmentary sectional view of the support leg of other embodiments. The fragmentary sectional view of the support leg of other embodiments.

  Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a configuration diagram of the component mounting apparatus 1, FIG. 2 is a partial sectional view of a support leg 60, FIG. 3 is a graph showing a modal test result, and FIG. 4 is a graph showing a positioning waveform. 1 is the X-axis direction, the front (front) and rear (back) directions are the Y-axis directions, and the vertical direction is the Z-axis directions.

  The component mounting apparatus 1 includes an apparatus main body 10 and support legs 60.

  As shown in FIG. 1, the apparatus main body 10 includes a machine base 11 and a frame 12 supported by the machine base 11. A support base 14 is provided at the lower part of the frame 12. Further, the apparatus main body 10 includes a component supply apparatus 20, a substrate transfer apparatus 30, a head 40, an XY robot 50, and a control apparatus 58 that controls the entire apparatus.

  A plurality of component supply devices 20 are arranged and arranged on the support base 14 so as to be aligned in the left-right direction (X-axis direction). The component supply device 20 is a tape feeder that sends out a carrier tape containing components at a predetermined pitch to a component supply position where the head 40 (nozzle 42) can pick up. The carrier tape includes a bottom tape in which cavities (recesses) are formed at a predetermined pitch in the longitudinal direction, and a top film attached to the upper surface of the bottom tape in a state where components are accommodated in the respective cavities. Become.

  As shown in FIG. 1, the substrate transfer device 30 is configured as a dual lane transfer device provided with two substrate transfer paths in the present embodiment, and is a front-rear direction (Y-axis direction) of the support base 14. It is installed in the center. The substrate transport device 30 includes a belt conveyor device 32, and transports the substrate S from the left to the right (substrate transport direction) in FIG. Further, a backup plate 34 that can be moved up and down by a lifting device (not shown) is provided at the center of the substrate transporting device 30 in the substrate transporting direction (X-axis direction). A plurality of pins 36 are provided on the upper surface of the backup plate 34. When the substrate S is transported above the backup plate 34 by the substrate transport device 30, the substrate S is backed up by the pins 36 from the back side by raising the backup plate 34.

  The head 40 is a moving body that can be moved to an arbitrary position on the XY plane by the XY robot 50. The head 40 causes the component supplied by the component supply device 20 to be adsorbed by the nozzle 42 and mounted on the substrate S transferred by the substrate transfer device 30.

  As shown in FIG. 1, the XY robot 50 includes a pair of left and right Y-axis guide rails 51 provided on the upper portion of the frame 12 along the front-rear direction (Y-axis direction) and a pair of left and right Y-axis guide rails 51. A long Y-axis slider 52 that can be moved along the Y-axis guide rail 51 in a bridged state, and an X-axis provided on the lower surface of the Y-axis slider 52 along the left-right direction (X-axis direction) A guide rail 53 and an X-axis slider 54 that can move along the X-axis guide rail 53 are provided. A head 40 is attached to the X-axis slider 54. The XY robot 50 can move the head 40 to an arbitrary position on the XY plane by being controlled by the control device 58.

  The control device 58 is configured as a microprocessor including a CPU, a ROM, a RAM, and the like, and executes positioning control of the XY robot 50 in association with mounting the component supplied from the component supply device 20 on the substrate S. .

  The support leg 60 is for installing the apparatus main body 10 on the floor F obtained by applying a resin coat to the surface of the concrete floor. The support leg 60 includes a leveling bolt 62, a leveling sheet 64, and a rubber magnet sheet 66.

  The leveling bolts 62 are made of metal (for example, made of stainless steel) and are provided so as to protrude downward from the four corners of the lower surface of the machine base 11 of the apparatus body 10. The leveling bolt 62 is a stepped bolt as shown in FIG. 2. The lower step is thicker than the upper step, and the lower surface of the lower step is a convex curved surface 62a. The leveling bolt 62 is screwed to the bottom plate of the machine base 11, and the height of the device body 10 from the floor surface is adjusted by adjusting the screwing amount (screwing amount) or the device body 10 is supported horizontally. You can do it.

  The leveling sheet 64 is a disk-shaped member made of metal (for example, stainless steel), and the upper surface is a concave curved surface 64a, and the convex curved surface 62a of the leveling bolt 62 is received by the concave curved surface 64a. Therefore, the convex curved surface 62 a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64 a of the leveling sheet 64.

  The rubber magnet sheet 66 is a disk-shaped sheet in which magnetic powder is dispersed in a rubber matrix, and is disposed between the lower surface of the leveling sheet 64, that is, between the leveling sheet 64 and the floor surface F. In this embodiment, “A4 MAGNET SHETET magnet sheet” sold by Daiso Japan (Daso Japan, Daiso Sangyo Co., Ltd.) was used as the rubber magnet sheet 66. The thickness of the rubber magnet sheet 66 is about 1-2 mm.

  Next, a method for installing the component mounting apparatus 1 on the floor surface F will be described. First, the leveling sheet 64 with the rubber magnet sheet 66 attached to the lower surface is arranged at predetermined four locations on the floor surface F. Alternatively, the rubber magnet sheets 66 are disposed at four predetermined locations, and the leveling sheet 64 is placed on the rubber magnet sheets 66. Thereafter, the convex curved surface 62 a of the leveling bolt 62 of the apparatus main body 10 is placed on the concave curved surface 64 a of the leveling sheet 64. Thereby, installation to the floor surface F of the component mounting apparatus 1 is completed.

  Next, an operation in which the control device 58 of the apparatus main body 10 mounts components on the board S based on a production job provided from a management computer (not shown) will be described. First, the control device 58 causes the nozzle 42 of the head 40 to collect the components supplied from the component supply device 20. Specifically, the control device 58 controls the XY robot 50 to move the nozzle 42 directly above the component supply position of the desired component. Next, the control device 58 controls a Z-axis motor and a pressure adjusting device for the nozzle 42 (not shown) so as to lower the nozzle 42 and supply negative pressure to the nozzle 42. Thereby, a desired part is adsorbed to the tip of the nozzle 42. Thereafter, the control device 58 raises the nozzle 42 and controls the XY robot 50 to carry the component adsorbed on the tip of the nozzle 42 to above the predetermined position of the substrate S (positioning control). Then, at the predetermined position, the control device 58 controls the lowering of the nozzle 42 so that the atmospheric pressure is supplied to the nozzle 42. Thereby, the components adsorbed by the nozzle 42 are separated and mounted at a predetermined position on the substrate S. Other components to be mounted on the substrate S are similarly mounted on the substrate S. The control device 58 can switch between valid / invalid of machine base compensation control by a switch operation by an operator. In this embodiment, the machine compensation control is control that uses the filter K (s) of Example 1 of Japanese Patent No. 4840987, and realizes reduction of residual vibration and reduction of movement time during execution of positioning control. Can do.

  Next, a modal test that is a test for investigating the natural vibration of the apparatus will be described. As a test object, the component mounting apparatus 1 of the present embodiment, the one in which the rubber magnet sheet 66 of the support leg 60 of the component mounting apparatus 1 is omitted (Comparative Form 1), and the rubber magnet sheet of the support leg 60 of the component mounting apparatus 1 are used. Instead of 66, a high-attenuation rubber sheet not containing magnetic powder (a vibration-proof rubber sheet manufactured by Modal Test Kurashiki Processing Co., Ltd.) (Comparative Form 2) was prepared. The result of the modal test is shown in FIG. In FIG. 3, black circles are points representing machine vibration. Machine vibration is a phenomenon that causes the device itself to vibrate from the foot due to the drive reaction force of this type of component mounting device, and is the lowest frequency vibration among the natural vibrations of the device, impeding high-speed performance. As a factor to account for, the ratio is large. As can be seen from FIG. 3, the frequency of the machine vibration is lower in the comparative example 2 using the high attenuation rubber sheet than in the comparative example 1 in which the rubber magnet sheet or the high attenuation rubber sheet is not used. Increased (decrease in attenuation). On the other hand, in the present embodiment using the rubber magnet sheet 66, the attenuation increased so that the frequency of the machine base vibration could not be clearly identified.

  Next, measurement of the positioning waveform will be described. As a measurement target, the component mounting apparatus 1 of the present embodiment and the one in which the rubber magnet sheet 66 of the support leg 60 of the component mounting apparatus 1 is omitted (Comparative Form 1) were prepared. In this embodiment, positioning waveform was measured by executing positioning control in a state in which machine compensation control was disabled. For Comparative Example 1, in addition to measuring positioning waveforms by executing positioning control with machine compensation control disabled (Comparative Example 1-1), measuring positioning waveforms even with machine compensation control enabled (Comparative Form 1-2). The result is shown in FIG. FIG. 4 shows a waveform at the positioning end (zero deviation). As can be seen from FIG. 4, in the comparative example 1-1 in which the machine base compensation control is disabled without the rubber magnet sheet, the machine base compensation control is enabled without the rubber magnet sheet. In Comparative Example 1-2, vibration was attenuated at the positioning end. On the other hand, in this embodiment in which the machine magnet compensation control is disabled and the machine base compensation control is disabled, vibration attenuation similar to that in Comparative Example 1-2 was observed. Furthermore, when the target deviation is 20 [pulses], it has been found that the time to reach the target can be shortened by about 50 [sample count] in this embodiment as compared with the comparative example 1-2. For this reason, according to the present embodiment, it can be said that the tact of the apparatus can be improved without sacrificing the component mounting accuracy as compared with the comparative embodiment 1-2.

  According to the component mounting apparatus 1 described above, due to the presence of the rubber magnet sheet 66, the intensity of the vibration frequency of the apparatus main body 10 becomes very small, and vibration can be suppressed very effectively. In particular, not only vibration transmitted from the apparatus main body 10 to the floor but also vibration of the apparatus main body 10 itself can be suppressed. This is an effect obtained by combining the rubber magnet sheet 66 with the configuration of the leveling bolt 62 having the convex curved surface 62a on the lower surface and the leveling sheet 64 having the concave curved surface 64a for receiving the convex curved surface 62a. Thus, according to the component mounting apparatus 1 of the present embodiment, the vibration of the apparatus main body 10 itself can be easily and inexpensively suppressed.

  Conventionally, there are many products and technologies that do not transmit external vibration to the structure on the vibration isolation table, such as the vibration isolation table, or do not transmit the vibration of the vibration source on the vibration isolation table to the outside. (For example, JP 2006-199814 A). On the other hand, this embodiment is epoch-making in that the vibration of the apparatus main body 10 (vibration source) itself can be suppressed.

  Moreover, according to this embodiment, since vibration of the apparatus main body 10 itself can be suppressed, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. . Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.

  Furthermore, since this type of component mounting apparatus 1 requires high accuracy in positioning control of the head 40 on which the nozzle 42 is mounted, the significance of applying the present invention is high.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the embodiment described above, the rubber magnet sheet 66 is disposed on the lower surface of the leveling sheet 64, but the rubber magnet sheet 166 may be disposed on the concave curved surface 64a of the leveling sheet 64 as shown in FIG. In this case, the rubber magnet sheet 166 is sandwiched between the leveling bolt 62 and the leveling sheet 64. Further, as shown in FIG. 6, a rubber magnet sheet 266 may be disposed between the upper and lower surfaces of the leveling sheet 264. In the case of FIG. 5 and FIG. 6, the same effect as the above-described embodiment can be obtained.

  In the embodiment described above, the A4 magnet sheet sold by Daiso Japan is exemplified as the rubber magnet sheet 66, but other rubber sheets may be used. For example, using a rubber magnet sheet disclosed in Japanese Patent Application Laid-Open No. 2006-199814, specifically, a rubber magnet sheet obtained by dispersing ferrite magnetic powder or rare earth magnetic powder in a matrix composed of rubber components. Also good.

  In the embodiment described above, the apparatus main body 10 collects a part from the part supply apparatus 20 onto the head 40 that is a moving body, and moves the part 40 to a predetermined position on the substrate S to move the part to a predetermined position. Although it is assumed that it is mounted at the position, it may be anything as long as it performs positioning control of the moving body in connection with mounting the component on the board S. For example, a component fixing adhesive (or flux) mounted on the moving body may be applied to a predetermined position of the substrate S.

  In the above-described embodiment, the control device 58 that can execute the machine base compensation control is used. However, a control device that cannot execute the machine base compensation control may be used. This is because the vibration of the apparatus main body 10 itself can be suppressed without executing the machine base compensation control.

  In the embodiment described above, the convex curved surface 62a of the leveling bolt 62 is brought into contact with the concave curved surface 64a of the leveling sheet 64. However, a universal joint or a ball joint may be configured based on this structure.

  In the above-described embodiment, the leveling bolt 62 and the leveling sheet 64 are not integrated, but the convex curved surface 62a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64a of the leveling sheet 64. If they can be maintained, both may be integrated.

  In the above-described embodiment, only one rubber magnet sheet 66 is provided, but two or more layers may be provided. Further, the rubber magnet sheet 66 may be used in combination with an anti-slip sheet.

  The present invention can be used in, for example, a component mounting apparatus, an adhesive application apparatus, a flux application apparatus, and the like.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus, 10 apparatus main body, 11 machine stand, 12 frame, 14 support stand, 20 component supply apparatus, 30 board conveyance apparatus, 32 belt conveyor apparatus, 34 backup plate, 36 pins, 40 heads, 42 nozzles, 50 XY Robot, 51 Y-axis guide rail, 52 Y-axis slider, 53 X-axis guide rail, 54 X-axis slider, 58 Control device, 60 Support leg, 62 Leveling bolt, 62a Convex curved surface, 64,264 Leveling sheet, 64a Concave curved surface, 66,166,266 Rubber magnet sheet.

Claims (6)

An apparatus main body for performing positioning control of the moving body in relation to mounting the component on the board;
A leveling bolt provided in the apparatus main body and having a convex curved bottom surface;
The upper surface is a concave curved surface, and the leveling sheet that receives the convex curved surface of the leveling bolt with the concave curved surface,
With
The leveling sheet has a rubber magnet sheet in which magnetic powder is dispersed in a rubber matrix in at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet.
Component mounting related equipment. The apparatus body is capable of performing positioning control without performing machine vibration compensation.
The component mounting related apparatus according to claim 1. The apparatus main body collects a component from a component supply unit on the moving body, moves the moving body to move the component to a predetermined position on the substrate, and mounts the component at the predetermined position. ,
The component mounting related apparatus according to claim 1. An apparatus main body that performs positioning control of a moving body in association with mounting a component on a board, a leveling bolt that is provided on the apparatus main body and that has a lower surface that is a convex curved surface, and an upper surface that is a concave curved surface, and the leveling bolt A leveling sheet that receives the convex curved surface of the concave curved surface, and a component mounting related device installation method that installs a component mounting related device provided on a floor surface,
After placing a rubber magnet sheet in at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet, the leveling bolt of the apparatus body is placed on the leveling sheet;
How to install component mounting related equipment. The apparatus body is capable of performing positioning control without performing machine vibration compensation.
The installation method of the component mounting related apparatus of Claim 4. The apparatus main body collects a component from a component supply unit on the movable body, moves the movable body to move the component to a predetermined position on the substrate, and mounts the component at the predetermined position. Is,
The installation method of the component mounting related apparatus of Claim 4 or 5.

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