JP2019160857A - Component mounting device - Google Patents

Abstract

To provide a component mounting device capable of sufficiently securing necessary rigidity and preventing large vibrations of the entire device and a floor on which device is installed due to generated vibration.SOLUTION: A component mounting device 1 that manufactures a component mounting board in which a component PT is mounted on a substrate KB by working in a working unit 24 includes an upper mount 11 provided with a moving mechanism 23 for moving the working unit 24, and a lower mount 12 that supports the upper mount 11 via a coupling portion 13. The coupling portion 13 includes a rigid joint 41 that rigidly joins the upper mount 11 and the lower mount 12, and a damping unit 42 that reduces transmission of vibration between the upper mount 11 and the lower mount 12.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus for manufacturing a mounting substrate by mounting electronic components on a substrate.

  A component mounting device that picks up the component supplied from the component supply device to the component supply position with the mounting head, moves the mounting head that picked up the component from the component supply position to the component mounting position on the board, and mounts the component on the board is known. It has been. The component mounting apparatus has a configuration in which an upper base having a moving mechanism for moving the mounting head and a lower base supporting the upper base are combined.

  In the component mounting apparatus, the mounting head is moved at a high speed by the moving mechanism. For this reason, the component mounting apparatus generates vibration with the upper base side as the excitation source. If the vibration generated on the upper frame side is transmitted to the lower frame and the entire component mounting apparatus vibrates with a large amplitude, the mounting accuracy may be deteriorated. Further, vibration is transmitted to the floor (floor) where the equipment is installed, and the worker on the floor is affected by the vibration during the operation of the equipment, which may adversely affect the health of the worker. For this reason, conventionally, various configurations have been devised for preventing the entire apparatus from vibrating greatly due to the vibration generated on the upper base side. For example, Patent Document 1 below describes a component mounting apparatus including a vibration isolation mechanism between an upper base with a mounting head and a lower base that supports the upper base.

JP 2012-54497 A

  However, the above-described Patent Document 1 has a problem in that the entire upper base is supported by the lower base by the vibration isolation mechanism, so that the rigidity is lowered and the necessary mounting accuracy may not be maintained.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting apparatus that can sufficiently secure necessary rigidity and prevent the entire apparatus and a floor on which equipment is installed from vibrating greatly due to the generated vibration.

  A component mounting apparatus according to the present invention is a component mounting apparatus for manufacturing a component mounting board in which a component is mounted on a substrate by working in a working unit, and an upper base provided with a moving mechanism for moving the working unit; A lower base that supports the upper base; and a coupling portion that is disposed between the upper base and the lower base; and the joint is a rigid joint that rigidly joins the upper base and the lower base And a damping unit that reduces transmission of vibration between the upper frame and the lower frame.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that the floor in which the whole apparatus and an installation are installed is largely vibrated by the generated vibration, ensuring sufficient rigidity required for the component mounting apparatus.

The perspective view of the component mounting apparatus in 1st Embodiment of this invention. The perspective view of the mount frame with which the component mounting apparatus in 1st Embodiment of this invention is provided. The partial exploded perspective view of the component mounting apparatus in 1st Embodiment of this invention The partial exploded perspective view of the component mounting apparatus in 1st Embodiment of this invention The top view of the undercarriage which shows arrangement | positioning of the coupling | bond part of the component mounting apparatus in 1st Embodiment of this invention The top view of the undercarriage which shows arrangement | positioning of the coupling | bond part of the component mounting apparatus in the modification of 1st Embodiment of this invention The perspective view of the component mounting apparatus in 2nd Embodiment of this invention. The partially exploded perspective view of the component mounting apparatus in 2nd Embodiment of this invention The top view of the undercarriage which shows arrangement | positioning of the coupling | bond part of the component mounting apparatus in 2nd Embodiment of this invention (A) (b) (c) The top view of a part of base frame which shows the modification of the coupling | bond part of the component mounting apparatus

(First embodiment)
FIG. 1 shows a component mounting apparatus 1 according to a first embodiment of the present invention. The component mounting apparatus 1 is a device that mounts a component PT on a substrate KB. The component mounting apparatus 1 includes an upper frame 11 and a lower frame 12 that supports the upper frame 11. A coupling portion 13 is arranged between the upper platform 11 and the lower platform 12, and the lower platform 12 supports the upper platform 11 via the coupling portion 13. In FIG. 1 and some drawings described later, the left-right direction of the component mounting apparatus 1 viewed from the operator OP is defined as the X-axis direction, and the front-rear direction is defined as the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  In FIG. 1, the undercarriage 12 has a center portion 12A and two side portions 12B located on the left and right sides (both ends in the X-axis direction) of the center portion 12A. A substrate transport mechanism 21 is provided on the lower platform 12. The substrate transport mechanism 21 includes a pair of front and rear belt conveyors 21a extending in the X-axis direction, and extends on the upper surface side of the gantry 12 in the X-axis direction. The board transport mechanism 21 transports the board KB supplied from the outside of the component mounting apparatus 1 in the X-axis direction.

  In FIG. 1, a plurality of component supply devices 22 are attached to a region in front of the central portion 12 </ b> A of the undercarriage 12 (on the side of the operator OP). The component supply device 22 is, for example, a tape feeder, and supplies the component PT to the component supply position 22K at the end on the substrate transport mechanism 21 side.

  1 and 2, the upper base 11 includes a moving mechanism 23. The moving mechanism 23 is a mechanism for moving the working unit 24 which is a mounting head. The moving mechanism 23 extends in the Y-axis direction and is arranged in parallel with two Y-axis beams 31 (first beam) and 2 in the X-axis direction. An X-axis beam 32 (second beam) supported at both ends by one Y-axis beam 31 and a moving plate 33 provided on the X-axis beam 32 are provided. Each of the two Y-axis beams 31 has two support columns 31P extending downward from both ends in the Y-axis direction, and is positioned above each of the two side portions 12B.

  The X-axis beam 32 is moved in the Y-axis direction by a beam driving mechanism (not shown) while maintaining an orthogonal posture with respect to the two Y-axis beams 31. The moving plate 33 is moved in the X-axis direction along the X-axis beam 32 by a plate moving mechanism (not shown).

  1 and 2, the working unit 24 is attached to a moving plate 33 of the moving mechanism 23. The working unit 24 includes a plurality of suction nozzles 24a extending downward (FIG. 2). The working unit 24 raises and lowers the plurality of suction nozzles 24a individually and rotates them around the Z axis. Further, the working unit 24 controls the vacuum pressure fed from the outside of the component mounting apparatus 1 to generate a suction force at the lower end of each suction nozzle 24a.

  2, 3, and 4, the lower ends of two support columns 31 </ b> P included in each Y-axis beam 31 are connected by a plate-like connecting member 34 that extends in the Y-axis direction, and the coupling portion 13 is connected to the connecting member 34. And the gantry 12. The coupling portion 13 has a plurality of rigid joint portions 41 and a plurality of vibration damping portions 42. The rigid joint portion 41 is a portion of the joint portion 13 that rigidly joins the upper base 11 and the lower base 12, and the vibration damping portion 42 is a vibration between the upper base 11 and the lower base 12 of the joint portion 13. This is the part that reduces the transmission. The rigid joint portions 41 and the vibration damping portions 42 are alternately arranged in the extending direction of the Y-axis beam 31 (that is, the Y-axis direction).

  In FIG. 4, the rigid joint portion 41 is made of a steel material having a rectangular parallelepiped shape as a whole, and has a through hole 41H that penetrates the upper and lower surfaces. The upper base 11 (the connecting member 34) is fastened to the side 12B of the lower base 12 through the through hole 41H of the rigid joint 41 by a bolt BT from the upper surface side. The upper base 11 and the lower base 12 are coupled (rigidly joined) by the bolt BT through the through hole 41H of the rigid joint 41. Each damping portion 42 is made of an elastic material (for example, a synthetic material including rubber or an elastic material or a member having a vibration suppressing mechanism such as an air cushion or a damper), and has a rectangular parallelepiped shape as a whole. Yes. Each vibration damping part 42 is sandwiched between the upper base 11 and the lower base 12 by being sandwiched between the upper base 11 and the lower base 12 coupled by the rigid joint portion 41. .

  2, 3, and 4, the vibration damping portion 42 is provided between two rigid joint portions 41 that are adjacent in the horizontal direction. A gap KG (FIG. 5) having an appropriate dimension is provided between the damping unit 42 and the rigid joint portion 41 in consideration of the amount of lateral deformation caused by elastic deformation of the damping unit 42. The gap KG can be used as a mounting hole or the like for attaching a sensor necessary for operation to the component mounting apparatus 1 and wiring (not shown) used for the sensor.

  When the component mounting apparatus 1 performs a component mounting operation for mounting the component PT on the substrate KB, first, the substrate transport mechanism 21 operates to receive the substrate KB input from the outside and position it at the operation position. When the substrate transport mechanism 21 positions the substrate KB at the work position, the working unit 24 is moved by the operation of the moving mechanism 23, and the component PT supplied by the component supply device 22 is sucked and mounted at the component mounting position on the substrate KB. . When all the components PT to be mounted on the substrate KB are mounted on the substrate KB by the work unit 24 repeating the reciprocating movement between the component supply device 22 and the substrate KB, the substrate transport mechanism 21 mounts the component on the substrate KB. This is carried out to the outside of the apparatus 1 and the component mounting work per board KB is completed.

  In the component mounting operation described above, the working unit 24 reciprocates between the component supply device 22 and the board KB at a high speed. Therefore, vibration using the moving mechanism 23 as an excitation source is generated on the upper frame 11 side, and the generated vibration is transmitted to the lower frame 12 through the coupling portion 13. At this time, the vibration damping portion 42 of the coupling portion 13 reduces (absorbs) the vibration generated on the upper frame 11 side and transmits it to the lower frame 12, thereby preventing the entire component mounting apparatus 1 from vibrating with a large amplitude. Is done. On the other hand, since the upper platform 11 is coupled to the lower platform 12 by the rigid joint portion 41 of the coupling portion 13, the rigidity necessary for the component mounting apparatus 1 is sufficiently ensured. As described above, the component mounting apparatus 1 is configured to prevent the entire apparatus and the floor on which the facility is installed from vibrating greatly due to the generated vibration while sufficiently securing necessary rigidity.

  The Y-axis beam 31 forms a frame structure by connecting the lower ends of the two support pillars 31P by the connecting member 34, and the rigidity is enhanced. For this reason, the upper frame 11 itself has a configuration that is difficult to vibrate with a large amplitude. In addition, since the connecting member 34 is provided, the coupling portion 13 can be disposed over the entire area between the upper frame 11 and the lower frame 12. For this reason, many rigid joint parts 41 and damping parts 42 can be provided, and the effect of maintaining rigidity and damping can be exhibited sufficiently.

  In the component mounting apparatus 1 described above, the rigid joint portion 41 and the vibration damping portion 42 are alternately arranged in the extending direction (Y-axis direction) of the Y-axis beam 31 (first beam). The direction in which the rigid joint portions 41 and the vibration damping portions 42 are alternately arranged is not particularly limited. Therefore, for example, as shown in the modification of FIG. 6, the rigid joint portions 41 and the vibration damping portions 42 may be alternately arranged in the extending direction of the X-axis beam 32 (that is, the X-axis direction). .

(Second Embodiment)
FIG. 7 shows a component mounting apparatus 1A according to the second embodiment. The component mounting apparatus 1 </ b> A according to the second embodiment has a configuration in which the coupling portion 13 is disposed between the two support pillars 31 </ b> P and the undercarriage 12, similarly to the component mounting apparatus 1 according to the first embodiment. However, the lower ends of the two support columns 31P extending downward from the Y-axis beam 31 are not connected to each other (FIG. 8). For this reason, in the second embodiment, the two support columns 31P are directly coupled to the coupling portion 13 (without using the coupling member 34 as in the first embodiment).

  In the component mounting apparatus 1A according to the second embodiment, as shown in FIGS. 8 and 9, the rigid joint portions 41 and the vibration damping portions 42 are alternately arranged in the extending direction of the Y-axis beam 31 (Y-axis direction). Yes. However, this is only an example, and as in the modification of the first embodiment, the rigid joint portions 41 and the vibration damping portions 42 are alternately arranged in the extending direction of the X-axis beam 32 (that is, the X-axis direction). It does not matter if it is.

  Also in the component mounting apparatus 1 </ b> A according to the second embodiment, the vibration generated on the upper mount 11 side is reduced (absorbed) by the vibration damping portion 42 constituting the coupling portion 13 and then transmitted to the lower mount 12. At this time, the vibration damping part 42 of the coupling part 13 reduces (absorbs) the vibration generated on the upper frame 11 side and transmits it to the lower frame 12, thereby preventing the entire component mounting apparatus 1 </ b> A from vibrating with a large amplitude. Is done. On the other hand, since the upper platform 11 is coupled to the lower platform 12 by the rigid joint portion 41 of the coupling portion 13, the rigidity necessary for the component mounting apparatus 1A is sufficiently ensured. As described above, the component mounting apparatus 1A according to the second embodiment, like the component mounting apparatus 1 according to the first embodiment, is installed with the entire apparatus and facilities due to the generated vibration while sufficiently securing necessary rigidity. The floor can be prevented from greatly vibrating.

  The above-described first embodiment (including the modified example) and the vibration damping portion 42 shown in the second embodiment are each composed of a rectangular parallelepiped member, but the size, the positional relationship with respect to the rigid joint portion 41, and the like. There are no particular restrictions. Therefore, for example, as shown in FIGS. 10A, 10 </ b> B, and 10 </ b> C, a plurality of vibration damping portions 42 may be disposed between two adjacent rigid joint portions 41. Further, the shape of the damping unit 42 is not limited. Therefore, for example, it may have a cylindrical shape as shown in FIGS. 10A is an example corresponding to the first embodiment, FIG. 10B is an example corresponding to a modification of the first embodiment, and FIG. 10C is an example corresponding to the second embodiment. is there. Note that the rigid joint portion 41 and the vibration damping portion 42 are configured at an optimum ratio by experiments or the like based on the size of the vibration source.

  When each size of the vibration control unit 42 is small, a large number of vibration control units 42 are arranged in places where the vibration control units 42 should be arranged. Accordingly, it becomes possible to respond flexibly. For this reason, it is not necessary to manufacture the dedicated vibration control part 42 corresponding to the shape of the place where the vibration control part 42 should be arranged, and the manufacturing cost of the component mounting apparatuses 1 and 1A can be reduced.

  As described above, in the component mounting apparatus 1 in the first embodiment (including the modified example) and the component mounting apparatus 1A in the second embodiment, the necessary rigidity between the upper mount base 11 and the lower mount base 12 is While being maintained at the rigid joint 41 of the connecting portion 13, vibration generated on the upper mount 11 side is reduced by the vibration control portion 42 of the connecting portion 13 and then transmitted to the lower mount 12. For this reason, it is possible to prevent the entire apparatus and the floor on which the equipment is installed from vibrating greatly due to the generated vibration while sufficiently securing the rigidity required for the component mounting apparatuses 1 and 1A.

  The component mounting apparatus may be used in a component mounting apparatus and a printing apparatus that perform a component mounting operation. In addition to the component mounting operation, an inspection machine that inspects a component mounting board and a semiconductor manufacturing apparatus that manufactures a semiconductor component. It may be. Further, the working unit takes a corresponding form according to the use of various component mounting apparatuses, and works directly or indirectly on the substrate. That is, in the above description, the working unit 24 is described as a mounting head for mounting components on a substrate. However, the working unit 24 is deposited on a squeegee head that deposits solder on the substrate, an application head that applies solder to the substrate, and the substrate. An inspection head for inspecting components mounted on solder or a substrate may be used.

  Provided is a component mounting apparatus capable of sufficiently securing necessary rigidity and preventing large vibrations of the entire apparatus and a floor on which equipment is installed due to generated vibration.

DESCRIPTION OF SYMBOLS 1,1A Component mounting apparatus 11 Upper stand 12 Lower stand 13 Coupling part 23 Moving mechanism 24 Working part 31 Y-axis beam (1st beam)
31P Support pillar 32 X-axis beam (second beam)
34 Connecting member 41 Rigid joint 42 Damping part KG Gap PT Part KB Substrate

Claims (8)

A component mounting apparatus for manufacturing a component mounting board in which a component is mounted on a board by working in a working unit,
An gantry provided with a moving mechanism for moving the working unit;
A lower frame supporting the upper frame;
A coupling portion disposed between the upper frame and the lower frame;
The coupling part includes a rigid joint that rigidly joins the upper frame and the lower frame, and a component mounting device that includes a vibration control unit that reduces transmission of vibration between the upper frame and the lower frame.   The component mounting apparatus according to claim 1, wherein the vibration damping portion is a member made of an elastic member.   The component mounting apparatus according to claim 1, wherein the vibration suppression unit is positioned between two rigid joints adjacent in the horizontal direction.   The component mounting apparatus according to claim 3, wherein a gap is provided between the vibration damping portion and the rigid joint portion.   The moving mechanism includes a first beam having two support pillars extending in the horizontal direction and extending downward, and extending in the horizontal direction perpendicular to the direction in which the first beam extends to extend the first beam. 5. The component mounting apparatus according to claim 1, further comprising: a second beam that moves in a direction, wherein the coupling portion is disposed between the two support columns and the lower base.   The component mounting apparatus according to claim 5, wherein lower ends of the two support pillars are connected by a connecting member, and the coupling portion is disposed between the connecting member and the undercarriage.   The component mounting apparatus according to claim 5 or 6, wherein the rigid joint portion and the vibration damping portion are alternately arranged in a direction in which the first beam extends.   The component mounting apparatus according to claim 5 or 6, wherein the rigid joint portion and the vibration damping portion are alternately arranged in a direction in which the second beam extends.

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