JPWO2016208615A1 - Continuous heat treatment furnace and method for manufacturing ceramic electronic components using the same - Google Patents

Abstract

In the continuous heat treatment furnace (HF1), a heat treatment region for heat treating the workpiece is provided along the transfer direction (b). The workpiece is heat-treated while being conveyed through the heat treatment region (H). A workpiece transfer mechanism (100) for transferring a workpiece includes a box-shaped base frame (1) having an opening on the upper side, a porous plate (2), and a porous plate (2). The air chamber (3) formed by covering the opening of the gas chamber (3) and the gas chamber (3) communicated with the air chamber (3), and the gas (g) flowing through the porous plate (2) and flowing out is supplied to the air chamber (3). Gas supply means (4). The porous plate (2) is disposed such that the upper surface (2a) is inclined downward toward the workpiece conveying direction, and the upper plate (2a) has a groove (2t) along the workpiece (W) conveying direction. ₁ to 2t ₁₀ ) are formed.

Description

  The present invention relates to a continuous heat treatment furnace provided with a workpiece transfer mechanism for transferring a large number of minute workpieces (objects to be processed), and a method of manufacturing a ceramic electronic component using the same.

  The continuous processing equipment includes a workpiece transfer mechanism for transferring workpieces continuously. As such a workpiece conveyance mechanism, a belt conveyor, a roller conveyor, or the like is widely used. However, the above-described work transport mechanism requires a drive mechanism for driving a belt or a roller, which complicates and enlarges the work transport mechanism and increases the cost for manufacturing the work transport mechanism.

  Therefore, it is necessary to make the workpiece transfer mechanism simple. JP 2008-273727 A (Patent Document 1) proposes an example of such a workpiece transfer mechanism.

  FIG. 11 is a schematic diagram of a workpiece transfer mechanism 400 described in Patent Document 1. The workpiece transfer mechanism 400 includes a box-shaped base frame 401 whose upper side is open, a porous plate 402, an air chamber 403, a gas supply unit 404, and a pipe 405. Here, the air chamber 403 is formed by the porous plate 402 covering the opening of the base frame 401. Further, the porous plate 402 is disposed so as to be inclined downward in the transport direction. Further, a partial pressure loss adjusting mechanism 402a for applying a propulsive force to the supplied workpiece W is formed on the back surface of the porous plate 402 at the workpiece supply position P1.

  A gas supply port 406 that communicates with the air chamber 403 is formed in the base frame 401. The gas supply unit 404 is connected to the gas supply port 406 via the pipe 405 and supplies gas to the air chamber 403. The gas supplied to the air chamber 403 permeates through the pores in the porous plate 402 and flows out to the outside.

  When the workpiece W is supplied to the workpiece supply position P1 on the porous plate 402, the partial pressure loss adjusting mechanism 402a blows the gas that has permeated through the porous plate 402 to the rear portion (left side in the figure) of the lower surface of the workpiece W. Hit. Then, the workpiece W floats obliquely forward and a propulsive force in the transport direction is added. Thereafter, the workpiece W moves in the conveying direction along the downwardly inclined porous plate 402 in a state where it floats obliquely forward and downward.

  In the work transport mechanism 400 described in Patent Document 1, the work W can be transported along the transport direction with a simple structure by the above configuration, so that the manufacturing cost of the work transport mechanism can be reduced. It is supposed to be possible.

JP 2008-273727 A

  It is considered that the workpiece transfer mechanism 400 can be effectively applied to a case where a large workpiece W having a side of several tens of centimeters, such as a glass substrate, is transferred and heat-treated one by one. On the other hand, it is considered to apply the workpiece transport mechanism 400 when a large number of minute workpieces W such as a capacitor body of a multilayer ceramic capacitor are transported and degreased. When a large number of minute workpieces W are moved on the porous plate 402 in a state of being piled up, the manner in which the gas that has permeated through the porous plate 402 strikes each workpiece W is not uniform. Become. As a result, the method of degreasing becomes non-uniform and the quality of the workpiece W may vary.

  Accordingly, an object of the present invention is to provide a continuous heat treatment furnace capable of uniformly performing a process such as degreasing during conveyance even for a large number of minute workpieces, and a method of manufacturing a ceramic electronic component using the same. Is to provide.

  In the present invention, the shape of the porous plate is improved in order to improve the uniformity of processing for a large number of minute workpieces in the continuous heat treatment furnace.

The present invention is first directed to a continuous heat treatment furnace.
In the continuous heat treatment furnace according to the present invention, at least one heat treatment region for heat treating the workpiece is provided along the workpiece conveyance direction. The workpiece is heat-treated while being transported through the heat-treatment region.

  A work transport mechanism for transporting a work includes a base frame, a porous plate, at least one air chamber, and a gas supply means. The base frame has a box shape having at least one opening on the upper side. At least one air chamber is formed by the porous plate covering at least one opening of the base frame. The gas supply means communicates with at least one air chamber, and supplies the gas flowing through the porous plate and flowing out to the at least one air chamber. The porous plate is disposed such that the upper surface is inclined downward toward the workpiece conveyance direction, and a groove is formed on the upper surface along the workpiece conveyance direction.

  In the above-described continuous heat treatment furnace, a groove is formed on the upper surface of the porous plate along the workpiece conveyance direction. In this case, even a large number of minute workpieces can be kept aligned by entering the groove. Accordingly, the workpieces are not stacked on the porous plate, and gas (atmosphere gas) is supplied to each workpiece from the bottom and side surfaces of the groove, so that uniform heat treatment can be performed.

  The continuous heat treatment furnace according to the present invention preferably has the following features. That is, the workpiece transfer mechanism further includes an alignment mechanism that aligns the workpiece and inserts the workpiece into the groove.

  In the above-described continuous heat treatment furnace, the work transfer mechanism further includes an alignment mechanism for aligning the work and inserting the work into the groove. In this case, even if a large number of minute workpieces are supplied in piles to the workpiece conveyance mechanism, the workpieces are inserted in an aligned state into the grooves of the porous plate by the alignment mechanism. Therefore, since gas is reliably supplied to each of the workpieces from the bottom and side surfaces of the groove, uniform heat treatment can be reliably performed.

The present invention is also directed to a method for manufacturing a ceramic electronic component.
The method for manufacturing a ceramic electronic component according to the present invention is a ceramic electronic component element body in which the workpiece is not degreased, and includes a workpiece preparation step for producing the workpiece, a degreasing step, and a firing step for firing the workpiece after degreasing. . In the degreasing process, the continuous heat treatment furnace according to the present invention is used to degrease the work while adjusting the amount of gas that permeates and flows out of the porous plate by the gas supply means.

  In the production of ceramic electronic components, a polymer organic material called a binder is used to bind ceramic material powder and form a ceramic electronic component body. This binder must be removed by combustion before firing the ceramic electronic component body. This removal of the binder by burning is called degreasing.

  In the above-described method for manufacturing a ceramic electronic component, the workpiece, which is an undegreasing ceramic electronic component body, is degreased using the continuous heat treatment furnace according to the present invention. In this case, as described above, the work is not piled up on the porous plate, and gas (atmospheric gas having an adjusted oxygen concentration) is supplied to each work from the bottom and side surfaces of the groove.

  Further, when degreasing is performed in a state where the workpieces are piled up, the heat generated by the degreasing is not dissipated inside the workpiece pile, and the temperature inside the workpiece pile becomes higher than that of the surface. On the other hand, in the above-described method for degreasing a work, since the work is not piled up, it is possible to suppress variations in the temperature of each work. Therefore, even a large number of minute workpieces such as ceramic electronic component bodies can be uniformly degreased. That is, it is possible to suppress variations in the quality of the ceramic electronic component after firing.

  In the continuous heat treatment furnace according to the present invention, a groove is formed on the upper surface of the porous plate along the workpiece conveyance direction. In this case, even a large number of minute workpieces can be kept aligned by entering the groove. Accordingly, the workpieces are not stacked on the porous plate, and gas (atmosphere gas) is supplied to each workpiece from the bottom and side surfaces of the groove, so that uniform heat treatment can be performed.

  Moreover, in the method for manufacturing a ceramic electronic component according to the present invention, the degreasing of the workpiece which is an undegritted ceramic electronic component body is performed using the continuous heat treatment furnace according to the present invention. In this case, as described above, the workpieces are not stacked on the porous plate, and gas (atmospheric gas with an adjusted oxygen concentration) is supplied to each workpiece from the bottom and side surfaces of the groove, and Each temperature variation can be suppressed. Therefore, even a large number of minute workpieces such as ceramic electronic component bodies can be uniformly degreased. That is, it is possible to suppress variations in the quality of the ceramic electronic component after firing.

It is sectional drawing which showed typically the continuous heat processing furnace HF1 which is 1st Embodiment of the continuous heat processing furnace which concerns on this invention. In the continuous heat treatment furnace HF1 shown in FIG. 1, a top view (FIG. 2 (A)) of the porous plate 2 provided in the workpiece transfer mechanism 100 and a cross-sectional view taken along the line AA in the top view ( FIG. 2 (B)). 2 is a graph showing a relationship between a set temperature and a gas flow rate in each region in the furnace and a lapse of time in the continuous heat treatment furnace HF1 shown in FIG. It is sectional drawing equivalent to the arrow sectional view shown to FIG. 2 (B) of porous plate 2A which is the 1st modification of the porous plate 2 shown in FIG. It is sectional drawing equivalent to the arrow sectional view shown to FIG. 2 (B) of the porous plate 2B which is the 2nd modification of the porous plate 2 shown in FIG. It is sectional drawing equivalent to the arrow sectional view shown to FIG. 2 (B) of the porous plate 2C which is the 3rd modification of the porous plate 2 shown in FIG. It is sectional drawing which showed typically the continuous heat processing furnace HF2 which is 2nd Embodiment of the continuous heat processing furnace which concerns on this invention. It is a graph showing the relationship between the set temperature and gas flow rate in each area | region in a furnace, and time passage in the continuous heat processing furnace HF2 shown in FIG. It is sectional drawing which showed typically the continuous heat processing furnace HF3 which is 3rd Embodiment of the continuous heat processing furnace which concerns on this invention. 10 is a graph showing the relationship between the set temperature and gas flow rate in each region in the furnace and the passage of time in the continuous heat treatment furnace HF3 shown in FIG. It is sectional drawing which showed typically the workpiece conveyance mechanism 400 of background art.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

-First embodiment of continuous heat treatment furnace-
A continuous heat treatment furnace HF1 which is a first embodiment of a continuous heat treatment furnace according to the present invention will be described with reference to FIGS. The continuous heat treatment furnace HF1 is a degreasing furnace used for degreasing the non-degreasing ceramic electronic component body. Hereinafter, the embodiment of the continuous heat treatment furnace according to the present invention will be described by taking a degreasing furnace as a specific example according to the above.

<Construction of continuous heat treatment furnace>
FIG. 1 is a cross-sectional view schematically showing a continuous heat treatment furnace HF1. The continuous heat treatment furnace HF1 is provided with a heat treatment region H in which a heat treatment of the workpiece is performed along the conveyance direction b of the workpiece (not shown). The workpiece is heat-treated while being conveyed through the heat-treatment region H. The workpiece is a non-degreasing ceramic electronic component body as described above, and is manufactured by a known method. In addition, in the method for manufacturing a ceramic electronic component, the ceramic electronic component body after degreasing and the external electrode may be co-fired. In such a case, the ceramic electronic component element body includes those to which an external electrode paste has been applied in advance.

  A workpiece conveyance mechanism 100 for conveying workpieces includes a base frame 1 that is also a lower furnace body of a continuous heat treatment furnace HF1, a porous plate 2, an air chamber 3, and a gas supply means 4.

  The base frame 1 has a box shape having an opening on the upper side. The porous plate 2 is disposed such that the upper surface 2a is inclined downward toward the workpiece conveyance direction b, and a groove (not shown) is formed on the upper surface 2a along the workpiece conveyance direction b. Yes. The air chamber 3 is formed by the porous plate 2 covering the opening of the base frame 1. The gas supply means 4 communicates with the air chamber 3 through the pipe 5 and the gas supply port 6, and supplies the gas g that flows through the porous plate 2 and flows out to the air chamber 3.

  The work transport mechanism 100 includes an alignment mechanism 10 above the upper surface 2a of the porous plate 2. The operation of the alignment mechanism 10 will be described later.

  The continuous heat treatment furnace HF1 includes an upper furnace body 7 that constitutes a furnace body together with a lower furnace body, and a heater 9 that heats a workpiece. The upper furnace body 7 is provided with a gas discharge port 8 through which the gas g flowing through the porous plate 2 and flowing out is discharged. In FIG. 1, the gas discharge ports 8 are provided on the inlet side and the outlet side of the continuous heat treatment furnace HF1, respectively, but the number and locations are not limited thereto. Further, the upper furnace body is provided with a heat insulating material (not shown), and heat dissipation to the outside of the continuous heat treatment furnace HF1 is suppressed.

FIG. 2 (A) is a top view of the porous plate 2 in the continuous heat treatment furnace HF1 shown in FIG. 1, for example, a large number of cuboid shaped workpieces W such as a capacitor body of a multilayer ceramic capacitor. It is also illustrated. FIG. 2B is a cross-sectional view taken along the line AA of the top view. In FIG. 2, grooves 2t ₁ to 2t ₁₀ are formed on the upper surface 2a along the conveyance direction b of the workpiece W.

The cross section of the grooves 2t ₁ to 2t ₁₀ perpendicular to the conveyance direction b of the workpiece W is rectangular. The workpiece W moves in a state in which the longest side of the rectangular parallelepiped workpiece W enters the grooves 2t ₁ to 2t ₁₀ so that the longest side is along the conveyance direction b. The state in which the longest side of the rectangular parallelepiped workpiece W is along the transport direction b includes a state in which the longest side and the transport direction b are somewhat inclined.

The width of each groove when the grooves 2t ₁ to 2t ₁₀ are viewed from above is set to be somewhat longer than the length of the second longest side of the rectangular parallelepiped workpiece W. That is, the gas g can be supplied to each workpiece W not only from the bottom surface of the groove but also from the side surface. Specifically, the width of each groove is preferably about 20% longer than the length of the second longest side of the rectangular parallelepiped workpiece W.

Further, an alignment mechanism 10 which is a plate-like member installed so as to be orthogonal to the conveyance direction b of the workpiece W is installed above the upper surface 2a. Spacing between the upper surface 2a of the lower end and the porous plate 2 of the alignment mechanism 10, only the work W that enters the to no groove 2t ₁ 2t ₁₀ is set to an interval that can pass under the alignment mechanism 10 Yes.

In FIG. 2A, the workpiece W is supplied in a piled state to a workpiece supply position (not shown) on the porous plate 2. A part of the supplied piled work W enters the grooves 2t ₁ to 2t ₁₀ , another part is on the upper surface 2a, and another part overlaps another work W. Among these workpieces W, the gas g that has permeated through the porous plate 2 is blown onto the workpieces that have entered the grooves 2t ₁ to 2t ₁₀ in particular. Then, the workpieces W are in a state where the frictional force between the side surfaces and the bottom surface of the grooves 2t ₁ to 2t ₁₀ is reduced.

Then, the workpiece W entering the grooves 2t ₁ to 2t ₁₀ moves in the conveying direction b in a slanting forward downward state along the downwardly inclined porous plate 2 by its own weight. Workpiece W to no groove 2t ₁ does not enter into 2t ₁₀ also, as the transport of the workpiece W has entered into to 2t ₁₀ without a groove 2t _1, it moves likewise in the conveying direction b.

When the piled workpieces W that have moved reach the alignment mechanism 10, the workpieces W that have entered the grooves 2t ₁ to 2t ₁₀ move in the transport direction b as they are. On the other hand, the workpiece W that has not entered the grooves 2t ₁ to 2t ₁₀ is blocked by the alignment mechanism 10. Then, after the workpiece W entering the grooves 2t ₁ to 2t ₁₀ has passed through the alignment mechanism 10, or when there is a gap between the workpieces W entering the grooves 2t ₁ to 2t ₁₀ , the grooves It falls to 2t ₁ to 2t ₁₀ and moves in the transport direction b. That is, the alignment mechanism 10 moves the workpiece W on the porous plate 2 in a state where the workpiece W enters the grooves 2t ₁ to 2t ₁₀ and is aligned. In this case, the work W can be aligned and conveyed with a very simple configuration.

The alignment mechanism 10 is not limited to the simple plate member described above, and is designed so that the workpiece W enters the grooves 2t ₁ to 2t ₁₀ when the workpiece W is supplied onto the porous plate 2. It may be a transfer jig. Also, a vibration device such as a vibration device that gives a weak vibration to the porous plate 2 and breaks the pile of the workpiece W supplied in a piled state at the workpiece supply position and enters the grooves 2t ₁ to 2t _10. Good.

  FIG. 3 is a graph showing the relationship between the set temperature and gas flow rate in each region in the furnace and the passage of time in the continuous heat treatment furnace HF1 shown in FIG. The inside of the continuous heat treatment furnace HF1 is roughly degreasing progress region where the binder contained in the work W is burned when the temperature is increased and the maximum temperature is maintained, and degreasing proceeds, and the degreasing is approximately performed when the maximum temperature is maintained and the temperature is decreased. It can be roughly divided into completed degreasing completed areas. In the case of FIG. 3, the supplied gas flow rate is constant.

As described above, as described above, the workpieces W that are aligned and transported without being stacked on the porous plate 2 are separated from the bottom and side surfaces of the grooves 2t ₁ to 2t _{10 by} the gas g. Is supplied. Further, in the degreasing progress region, the heat generated by the degreasing is uniformly dissipated, and the temperature variation of each workpiece W is suppressed. Therefore, even a large number of minute workpieces W such as ceramic electronic component bodies can be uniformly degreased.

  A ceramic electronic component element body is obtained by firing the workpiece W degreased as described above. A ceramic electronic component can be obtained by forming an external electrode or the like on the obtained ceramic electronic component body as necessary.

<Modified example of porous plate>
Modification examples of the porous plate 2 provided in the workpiece transfer mechanism 100 in the continuous heat treatment furnace HF1 according to the present invention will be described with reference to FIGS.

<First Modification of Porous Plate>
FIG. 4 is a cross-sectional view corresponding to the cross-sectional view of the porous plate 2 </ b> A that is a first modification of the porous plate 2 provided in the workpiece transfer mechanism 100, as viewed in the direction of the arrow shown in FIG. In the porous plate 2A, the cross section of the grooves 2t ₁ to 2t ₁₀ formed in the upper surface 2Aa and perpendicular to the conveyance direction b of the workpiece W is U-shaped.

In this case, a gap is formed between the workpiece W and the bottom of the grooves 2t ₁ to 2t ₁₀ , the gas g is easily supplied from the bottom, and the supplied gas g easily flows. Therefore, the binder contained in the work W can be burned effectively, and the heat generated by the burning of the binder can be effectively dissipated. Moreover, since there is no corner | angular part in the bottom part and it is the rounded shape, mechanical strength can be improved.

<Second Modification of Porous Plate>
FIG. 5 is a cross-sectional view of a porous plate 2B, which is a second modification of the porous plate 2 provided in the workpiece transfer mechanism 100, corresponding to the cross-sectional view taken along the arrow shown in FIG. In the porous plate 2B, the cross section of the grooves 2t ₁ to 2t ₁₀ formed in the upper surface 2Ba perpendicular to the conveyance direction b of the workpiece W is V-shaped.

In this case, like the porous plate 2A, a gap is formed between the workpiece W and the bottom of the grooves 2t ₁ to 2t ₁₀ , and the gas g is easily supplied from the bottom. Moreover, since the area of the opening part in upper surface 2Ba becomes large, the supplied gas g becomes easy to flow. Therefore, the binder contained in the workpiece | work W can be burned more effectively, and the heat which generate | occur | produces by combustion of a binder can be dissipated more effectively.

<Third Modification of Porous Plate>
FIG. 6 is a cross-sectional view corresponding to the cross-sectional view taken in the direction of the arrow shown in FIG. 2B of a porous plate 2 </ b> C that is a third modification of the porous plate 2 provided in the workpiece transfer mechanism 100. In the porous plate 2C, the cross section of the grooves 2t ₁ to 2t ₁₀ formed in the upper surface 2Ca perpendicular to the conveyance direction b of the workpiece W has a V shape with a round bottom.

In this case, like the porous plate 2B, a gap is formed between the workpiece W and the bottom of the grooves 2t ₁ to 2t ₁₀ , and the gas g is easily supplied from the bottom. Moreover, since the area of the opening part in upper surface 2Ca becomes large, the supplied gas g becomes easier to flow. Further, like the porous plate 2A, the bottom has no corners and has a rounded shape. Therefore, the binder contained in the workpiece | work W can be burned more effectively, and the heat which generate | occur | produces by combustion of a binder can be dissipated more effectively. Further, the mechanical strength can be improved.

-Second embodiment of continuous heat treatment furnace-
A continuous heat treatment furnace HF2 which is a second embodiment of the continuous heat treatment furnace according to the present invention will be described with reference to FIGS. Similar to the continuous heat treatment furnace HF1, the continuous heat treatment furnace HF2 is a degreasing furnace used for degreasing the electronic component body constituting the ceramic electronic component.

  FIG. 7 is a cross-sectional view schematically showing the continuous heat treatment furnace HF2. In the continuous heat treatment furnace HF2, the air chamber is divided into a first air chamber 3a and a second air chamber 3b. The gas supply means 4 communicates with the first air chamber 3a through the first pipe 5a and the first gas supply port 6a, and the second through the second pipe 5b and the second gas supply port 6b. The gas g is supplied to each air chamber in communication with the air chamber 3b. The other parts are the same as those of the above-described continuous heat treatment furnace HF1, and thus the description thereof is omitted.

  In the continuous heat treatment furnace HF2, with the above-described configuration, the first heat treatment region H1 and the second heat treatment region H2 for heat treating the workpiece are provided along the conveyance direction b of the workpiece (not shown). The workpiece is heat-treated while being transported through the first heat-treatment region H1 and the second heat-treatment region H2.

  FIG. 8 is a graph showing the relationship between the set temperature and the flow rate of gas g in each region in the furnace and the passage of time in the continuous heat treatment furnace HF2 shown in FIG. Similar to the continuous heat treatment furnace HF1, the interior of the continuous heat treatment furnace HF2 can be roughly divided into a degreasing progress region and a degreasing completion region. In the case of FIG. 8, the amount of gas (atmospheric gas with adjusted oxygen concentration) g supplied to each air chamber is adjusted by the gas supply means 4 and is large in the degreasing progress region and small in the degreasing completion region. The gas g component supplied to each region is the same.

  In the degreasing method described above, efficient degreasing is achieved by increasing the amount of gas g in the degreasing progress region to promote degreasing, and decreasing the flow rate of gas g in the degreasing completed region to reduce the gas g flowing wastefully. Can be done.

-Third embodiment of continuous heat treatment furnace-
A continuous heat treatment furnace HF3, which is a third embodiment of the continuous heat treatment furnace according to the present invention, will be described with reference to FIGS. Similar to the continuous heat treatment furnaces HF1 and HF2, the continuous heat treatment furnace HF3 is a degreasing furnace used for degreasing the electronic component body constituting the ceramic electronic component.

  FIG. 9 is a cross-sectional view schematically showing the continuous heat treatment furnace HF3. In the continuous heat treatment furnace HF3, the air chamber is divided into a first air chamber 3a, a second air chamber 3b, and a third air chamber 3c. The gas supply means 4 communicates with the first air chamber 3a through the first pipe 5a and the first gas supply port 6a, and the second through the second pipe 5b and the second gas supply port 6b. The air chamber 3b communicates with the third air chamber 3c via the third pipe 5c and the third gas supply port 6c, and the gas g is supplied to each air chamber. The other parts are the same as those of the above-described continuous heat treatment furnaces HF1 and HF2, and thus the description thereof is omitted.

  In the continuous heat treatment furnace HF3, with the above-described configuration, the first heat treatment region H1, the second heat treatment region H2, and the third heat treatment region H3 that heat treat the workpiece along the conveyance direction b of the workpiece (not shown). Will be provided. The workpiece is heat-treated while being conveyed through the first heat treatment region H1, the second heat treatment region H2, and the third heat treatment region H3.

  FIG. 10 is a graph showing the relationship between the set temperature and the flow rate of the gas g in each region in the furnace and the passage of time in the continuous heat treatment furnace HF3 shown in FIG. Similar to the continuous heat treatment furnaces HF1 and HF2, the interior of the continuous heat treatment furnace HF3 can be roughly divided into a degreasing progress region and a degreasing completion region. And according to the arrangement | positioning method of the heater 9, a degreasing progress area | region can be further divided into a low temperature area and a high temperature area. In the case of FIG. 10, the flow rate of the gas g supplied to each air chamber is adjusted by the gas supply means 4, second most in the low temperature region of the degreasing progress region, and most in the high temperature region of the degreasing progress region. It is the least in the area. Note that the components of the gas g supplied to each region are the same.

  In the above degreasing method, the flow rate of the gas g in the low temperature region where the combustion of the binder is difficult to proceed even in the degreasing progress region is smaller than that in the high temperature region, and the degreasing is performed by increasing the flow rate of the gas g in the high temperature region. In the degreasing completion region, further efficient degreasing can be performed by reducing the flow rate of the gas g and reducing the gas g flowing unnecessarily.

  In addition, this invention is not limited to said embodiment, A various application and deformation | transformation can be added within the scope of this invention. For example, the amount of gas g supplied to each air chamber may be adjusted not only by the gas supply means 4 but also by the aperture ratio of the porous plate 2. Further, the type of the gas g supplied by the gas supply means 4 may be different between the air chambers.

  For example, the degreasing and firing may be performed in one continuous heat treatment furnace by making the type and arrangement of the heater 9 and the type of gas g supplied by the gas supply means 4 different between the air chambers. Good. That is, the present invention can be applied to any continuous heat treatment furnace regardless of the content of the heat treatment.

  In addition, it is pointed out that each embodiment described in this specification is an exemplification, and a partial replacement or combination of configurations is possible between different embodiments.

HF1, HF2, HF3 Continuous heat treatment furnace, 100 workpiece transfer mechanism, 1 base frame, 2 porous plate, 2a upper surface, 2t _{1 to} 2t ₁₀ groove, 3 air chamber, 4 gas supply means, W work, H heat treatment region, g Gas, b Transport direction.

Claims (3)

A continuous heat treatment furnace provided with at least one heat treatment region for heat-treating the workpiece along a workpiece conveyance direction, wherein the workpiece is heat-treated while being conveyed through the heat treatment region,
A workpiece transfer mechanism for transferring the workpiece includes a box-shaped base frame having at least one opening on the upper side, a porous plate, and the porous plate covering the at least one opening of the base frame. Comprising at least one air chamber formed by the gas supply means, and a gas supply means that communicates with the at least one air chamber and supplies the gas flowing through the porous plate and flowing out to the at least one air chamber,
The porous plate is arranged such that the upper surface is inclined downward toward the workpiece conveying direction, and a groove is formed on the upper surface along the workpiece conveying direction. , Continuous heat treatment furnace.   The continuous heat treatment furnace according to claim 1, wherein the workpiece transfer mechanism further includes an alignment mechanism that aligns the workpiece and inserts the workpiece into the groove. The workpiece is a non-degreasing ceramic electronic component body,
A workpiece production process for producing the workpiece;
A degreasing step of degreasing the workpiece while adjusting the amount of gas that permeates and flows out of the porous plate by the gas supply means, using the continuous heat treatment furnace according to claim 1 or 2;
A firing step of firing the workpiece after degreasing;
A method for producing a ceramic electronic component, comprising: