JPWO2016152990A1 - Electronic components - Google Patents

Abstract

A ceramic dielectric plate 2, a main body 4 having at least a pair of conductor layers 3 a and 3 b disposed on the surface of the ceramic dielectric plate 2, and at least a pair of external electrodes 5 a and 5 b provided on the main body 4 are provided. The conductor layers 3a and 3b are electrically connected to the pair of external electrodes 5a and 5b, respectively, and electrically connected to the conductor layer 3a and the external electrode 5b not electrically connected to the conductor layer 3b. An insulating material 8 made of resin or glass is interposed between the external electrode 5a not connected to the electrode 5a. [Selection] Figure 2

Description

  The present invention relates to an electronic component.

  Electronic parts such as capacitors, piezoelectric elements, heaters, and batteries are used in various electronic devices, many of which have a laminated structure in which a dielectric layer such as ceramics and a metal internal electrode (conductor) layer are laminated. have. In such electronic components, for example, a conductive paste film that becomes an internal electrode layer is formed by applying a conductive paste on a ceramic green sheet that becomes a dielectric layer, and the conductive paste film is combined with the ceramic green sheet. In general, it is produced by firing.

  Patent Document 1 discloses a multilayer ceramic capacitor in which a conductive layer is provided on a ceramic thin plate having a thickness of 20 to 200 μm that is individually fired and bonded with a glass material paste.

Japanese Patent Laid-Open No. 01-086510

  An electronic component of the present disclosure includes a ceramic dielectric plate, a main body having at least a pair of conductor layers disposed on a surface of the ceramic dielectric plate, and at least a pair of external electrodes provided on the main body, The conductor layer is electrically connected to any one of the pair of external electrodes, and is insulated with resin or glass between the conductor electrode and the external electrode not electrically connected. The material is interposed.

It is sectional drawing which showed typically 1st Embodiment of the electronic component. 1 schematically shows a multilayer electronic component, (a) is a sectional view of the entire multilayer electronic component, and (b) is an enlarged sectional view of a portion surrounded by a broken line of (a) in the second embodiment. (C) is sectional drawing to which the part enclosed with the broken line of (a) in 3rd Embodiment was expanded. 2A and 2B show a multilayer electronic component having a resin or glass coating layer, in which FIG. 2A is a cross-sectional view corresponding to FIG. 2A, and FIG. FIG. 3B shows a portion surrounded by a broken line in FIG. 3B, where FIG. 3A is an enlarged cross-sectional view showing an example when the coating layer is not provided, and FIG. 3B shows an example when the coating layer is provided. It is an expanded sectional view. (A) is sectional drawing to which the part enclosed with the broken line of FIG. 1 was expanded, (b) is sectional drawing to which the part enclosed with the broken line of FIG.2 (b) was expanded.

  Specific embodiments of the electronic component will be described in detail with reference to the drawings.

<First Embodiment>
As shown in FIG. 1, the electronic component 1 of the first embodiment includes a ceramic dielectric plate 2, a main body 4 having a pair of conductor layers 3a and 3b, and a pair of external electrodes 5a and 5b. . The main body 4 has a pair of opposing surfaces 6 and a side surface 7 connecting the pair of surfaces 6.

  The pair of conductor layers 3 a and 3 b are disposed on the surface of the ceramic dielectric plate 2 and constitute a pair of opposed surfaces 6 of the main body 4. The pair of external electrodes 5 a and 5 b are disposed on the side surface 7 of the main body 4. The conductor layer 3a is electrically connected to the external electrode 5a, and the conductor layer 3b is electrically connected to the external electrode 5b.

  In the present embodiment, the insulating material 8 made of resin or glass is interposed between the conductor layer 3a and the external electrode 5b and between the conductor layer 3b and the external electrode 5a.

Second Embodiment
As shown in FIG. 2A, the electronic component 1 of this embodiment includes a main body 4 in which a plurality of ceramic dielectric plates 2 and a plurality of conductor layers 3a and 3b are alternately stacked (hereinafter referred to as a stacked body 4). And a pair of external electrodes 5 a and 5 b provided on the outer surface of the main body 4. The stacked body 4 has a pair of surfaces 6 positioned in the stacking direction and a side surface 7 connecting the pair of surfaces 6. The conductor layer 3a is electrically connected to the external electrode 5a, and the conductor layer 3b is electrically connected to the external electrode 5b.

  In the present embodiment, as shown in FIG. 2B, an insulating material 8 made of resin or glass is provided between the conductor layer 3a and the external electrode 5b and between the conductor layer 3b and the external electrode 5a. Is intervening.

  The ceramic dielectric plate 2 is in contact with both the external electrodes 5a and 5b. The insulating material 8 maintains good insulation between the conductor layer 3a and the external electrode 5b and insulation between the conductive layer 3b and the external electrode 5a, and bonds the ceramic dielectric plates 2 sandwiching the insulating material 8 together. The shape of the laminate 4 is maintained.

<Third Embodiment>
The electronic component 1 of the present embodiment differs from the second embodiment in that an insulating material 8 is interposed between the ceramic dielectric layer 2 and one of the external electrodes 5a or 5b as shown in FIG. 2 (c). It is to be. That is, the ceramic dielectric plate 2a is in contact with the external electrode 5a, and the insulating material 8 is interposed between the ceramic dielectric plate 2a and the ceramic dielectric layer 2b is in contact with the external electrode 5b and between the external electrode 5a. Insulating material 8 is interposed. In this embodiment, the insulating material 8 adheres the ceramic dielectric plate 2a and the conductor layer 3a sandwiching the insulating material 8 or the ceramic dielectric plate 2b and the conductor layer 3b, and maintains the shape of the multilayer body 4. .

<Other configurations>
Other configurations in the first to third embodiments will be described. The ceramic dielectric plate 2 may have a bending strength of 150 MPa or more. The ceramic dielectric plate 2 having a bending strength of 150 MPa or more is self-supporting even as a thin plate having a thickness of 3 μm, for example, and can be easily handled. The ceramic dielectric plate 2 may have a relative dielectric constant of 1000 or more. By using a thin plate having a thickness of 3 to 20 μm as the ceramic dielectric plate 2, a practical electronic component 1 can be formed. A specific example of the ceramic dielectric plate 2 having such high strength and high relative dielectric constant will be described later.

  The bending strength of the ceramic dielectric plate 2 is confirmed by, for example, processing the ceramic dielectric plate 2 into a 5 × 10 mm shape, measuring the three-point bending strength, and converting it to the three-point bending strength of JIS R 1601. it can.

  As the conductor layer 3, for example, a metal foil such as copper, silver, palladium, gold, platinum, nickel, aluminum, tantalum or the like, or any two or more alloy foils, vapor-deposited films, and sputtered films are used. Can do. By using a metal foil, a vapor-deposited film or a sputtered film formed on the ceramic dielectric plate 2 as the conductor layer 3, the manufacturing process is simplified and efficient compared to an electrode forming method in which a normal conductive paste is printed and fired. Can be manufactured automatically.

  When different materials such as ceramics and metal are fired at the same time, as in the conventional electrode forming method of printing and baking conductive paste, defects such as cracks and delamination (delamination) occur due to differences in thermal expansion and contraction behavior. Or residual stress was generated. In some cases, desired characteristics cannot be obtained due to reaction between different materials or element diffusion near the interface. Further, in the invention disclosed in Patent Document 1, since a glass layer having a low relative dielectric constant is present in an effective portion that expresses capacitance sandwiched between internal electrode layers having different polarities, the dielectric characteristics of the multilayer ceramic capacitor There was a problem that decreased.

  In the present embodiment, since a metal foil, a vapor deposition film, or a sputtered film is used as the conductor layer 3 for the fired ceramic dielectric plate 2, defects such as cracks and delamination as described above, and the occurrence of residual stress are suppressed. Is done.

  Further, for example, the ceramic dielectric plate 2 and the conductor layer 3 can be bonded and the laminated body 4 can be formed without performing a heat treatment at a high temperature such as firing a ceramic, and therefore, different materials resulting from the heat treatment at a high temperature. Reactions between them and element diffusion near the interface are unlikely to occur, and desired characteristics are easily realized.

  The thickness of the conductor layer 3 may be 0.1 to 3.0 μm from the viewpoint of downsizing the electronic component 1. In particular, when a metal foil is used, the thickness may be 0.5 to 3.0 μm.

  In the first to third embodiments, as shown in FIGS. 3A and 3B, the surface 6 and the side surface 7 which are the outer surfaces of the main body 4 are covered with a coating layer 9 made of an insulating resin or glass. May be. However, the surface 6 or the side surface 7 (hereinafter also referred to as a lead-out surface) of the main body 4 from which any one of the conductor layers 3a and 3b is exposed may not be covered with the covering layer 9.

  In the second and third embodiments, the conductor layers 3a and 3b are not normally exposed on the side surface 7 other than the lead-out surface, and the gap between the side surface 7 and the conductor layers 3a and 3b is as shown in FIG. As shown in FIG. On the other hand, when the outer surface of the laminate 4 is covered with a coating layer 9 made of resin or glass, the conductor layers 3a and 3b are exposed on the side surface 7 other than the lead-out surface as shown in FIG. You may do it. This is because, on the outer surface other than the lead-out surface, the conductor layers 3a and 3b can be electrically insulated by the insulating coating layer 9 covering the laminated body 4. Such a structure is obtained by, for example, forming the coating layer 9 on the entire outer surface of the laminate 4 where the conductor layers 3a and 3b are exposed on the lead-out surface and the other side surface 7, and then removing the coating layer 9 covering the lead-out surface Then, the external electrodes 5a and 5b may be formed on the lead-out surface from which the covering layer 9 has been removed.

Examples of the insulating resin include an epoxy resin, a phenol resin, an unsaturated polyester resin, and a polyimide resin. Examples of the insulating glass include borosilicate glass, phosphate glass, and vanadium glass. The material used for the insulating material 8 and the covering layer 9 may have an electrical resistivity of 1 × 10 ¹⁰ Ωcm or more. Moreover, the material which has moisture resistance may be sufficient.

<Intervening layer>
In these embodiments, for the purpose of ensuring the adhesion between the ceramic dielectric plate 2 and the conductor layers 3a and 3b, a resin or glass is interposed at the interface between the ceramic dielectric plate 2 and the conductor layers 3a and 3b. May be. When resin or glass having a low dielectric constant is present at the interface between the ceramic dielectric plate 2 and the conductor layers 3a and 3b, particularly at the interface of the effective portion, there is a concern that the dielectric characteristics may be deteriorated. By mixing high ceramic particles, it is possible to suppress a decrease in dielectric characteristics. Note that a material having a low dielectric constant such as resin or glass may not be substantially included between the ceramic dielectric plate 2 and the conductor layers 3a and 3b.

  In particular, when a metal foil is used as the conductor layer 3, an intervening layer containing ceramic particles having a high relative dielectric constant is provided between the ceramic dielectric plate 2 and the conductor layers 3a and 3b (interface). Is good.

  5A is an enlarged cross-sectional view of a portion surrounded by a broken line in FIG. 1, and FIG. 5B is an enlarged cross-sectional view of a portion surrounded by a broken line in FIG. 2B. In this case, the electronic component 1 of the first embodiment and the second embodiment is made of an inorganic compound between the ceramic dielectric plate 2 and the conductor layer 3a as shown in FIGS. 5 (a) and 5 (b), for example. And the intervening layer 10 including the dielectric particles 10a and the organic resin 10b.

  Although not shown, between the ceramic dielectric plate 2 and the conductor layer 3b, there is similarly provided an intervening layer 10 including dielectric particles 10a made of an inorganic compound and an organic resin 10b. Although not shown, also in the third embodiment shown in FIG. 2 (c), the dielectric particles 10a made of an inorganic compound and the organic material are interposed between the ceramic dielectric plates 2a and 2b and the conductor layers 3a and 3b. You may have the intervening layer 10 containing resin 10b. Hereinafter, the ceramic dielectric plates 2a and 2b may be collectively referred to as the ceramic dielectric plate 2, and the conductor layers 3a and 3b may be collectively referred to as the conductor layer 3.

  In this case, the ceramic dielectric plate 2 and the conductor layer 3 are bonded by the organic resin 10 b included in the intervening layer 10. When the organic resin 10b is present at the interface between the ceramic dielectric plate 2 and the conductor layer 3, there is a concern that the dielectric characteristics may be deteriorated, but the intervening layer 10 has an inorganic compound having a relatively higher relative dielectric constant than the organic resin 10b. Since the dielectric particle 10a made of is present, it is possible to suppress a decrease in dielectric characteristics due to the organic resin 10b. From the viewpoint of suppressing a decrease in dielectric characteristics, the thickness of the intervening layer 10 may be 3 μm or less. In addition, the average particle diameter of the dielectric particles 10 a included in the intervening layer 10 may be ½ or less of the thickness of the intervening layer 10 from the viewpoint that the intervening layer 10 has a predetermined thickness.

  The organic resin 10b included in the intervening layer 10 may have a volume ratio in the intervening layer 10 of 0.4 or less from the viewpoint of suppressing a decrease in dielectric characteristics. That is, the volume ratio of the organic resin 10b to the total volume of the dielectric particles 10a and the organic resin 10b, where Va is the volume of the dielectric particles 10a included in the intervening layer 10 and Vb is the volume of the organic resin 10b. Vb / (Vb + Va) may be 0.4 or less. Further, Vb / (Vb + Va) may be set to 0.2 or more from the viewpoint of bonding the ceramic dielectric plate 2 and the conductor layer 3.

  Similarly, at least one dielectric particle 10a may be present in the thickness direction of the intervening layer 10. In other words, in the thickness direction of the intervening layer 10, there should be no portion where only the organic resin 10 b exists between the ceramic dielectric plate 2 and the conductor layer 3. That is, at least one dielectric particle 10a exists in the thickness direction between the ceramic dielectric plate 2 and the conductor layer 3, and the organic resin 10b is not continuous in this direction. A decrease in dielectric characteristics can be effectively suppressed.

  Whether or not the intervening layer 10 containing the dielectric particles 10a made of an inorganic compound and the organic resin 10b exists between the ceramic dielectric plate 2 and the conductor layer 3 is determined between the ceramic dielectric plate 2 and the conductor layer 3. The interface portion may be confirmed by local elemental analysis such as energy dispersive X-ray spectroscopy (EDS). Further, Vb / (Vb + Va) in the intervening layer 10 is determined by specifying the intervening layer 10 at the interface portion between the ceramic dielectric plate 2 and the conductor layer 3 by a scanning electron microscope (SEM), and an SEM photograph of the intervening layer 10 is an image. What is necessary is just to calculate by analyzing. The number of dielectric particles 10a existing in the thickness direction of the intervening layer 10 and whether or not the organic resin 10b is continuous in the thickness direction of the intervening layer 10 are SEM of a cross section along the thickness direction of the intervening layer 10. For example, a plurality of, for example, 10 arbitrary lines may be drawn in the thickness direction using a photograph, and the number of dielectric particles 10a existing on the line may be confirmed.

  The dielectric particles 10 a may have a composition different from that of the ceramic dielectric plate 2, but may have the same composition as that of the ceramic dielectric plate 2. Since the dielectric particles 10a have the same composition as the ceramic dielectric plate 2, the electronic component 1 having stable dielectric characteristics can be obtained.

  Here, the composition of the dielectric particles 10a and the composition of the ceramic dielectric plate 2 are the same, for example, when both are made of an oxide material, the composition of the metal element of the oxide constituting the dielectric particles 10a. And the composition of the metal element of the oxide constituting the ceramic dielectric plate 2 are within the range of measurement error in elemental analysis such as energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). It means to match.

  When a material having a composition different from that of the ceramic dielectric plate 2 is used as the material of the dielectric particles 10a, for example, for high frequency applications, the material of the dielectric particles 10a is more than the material of the ceramic dielectric plate 2. A material having a large relative dielectric constant and a small dielectric loss may be selected on the high frequency band side. For high-temperature applications, a material having a temperature characteristic at a high temperature superior to that of the ceramic dielectric plate 2 may be selected as the material of the dielectric particles 10a. Thus, by selecting the material of the dielectric particles 10a, the electronic component 1 having characteristics suitable for the purpose can be obtained.

  The material of the organic resin 10b may be a so-called binder such as polyvinyl alcohol, polyvinyl butyral, or acrylic because the ceramic dielectric plate 2 and the conductor layer 3 are bonded. The intervening layer 10 functions as the insulating material 8 when the organic resin 10b has insulating properties and is located between the conductor layer 3a and the external electrode 5b or between the conductor layer 3b and the external electrode 5a. To do.

<Ceramic dielectric plate>
In these embodiments, the material of the ceramic dielectric plate 2 is preferably a paraelectric material mainly composed of titanium oxide and having a rutile crystal structure. Note that the metal element other than Ti may include at least one of a divalent element, a trivalent element, a tetravalent element, and a pentavalent element. A material having such a composition has a high relative dielectric constant and a high bending strength, and can be easily handled even with a thin plate. In addition, since the dielectric property is a paraelectric material whose frequency dependence is small, it is possible to form a practical electronic component 1, such as a multilayer ceramic capacitor, particularly for high frequencies.

  In particular, it contains M1 which is at least one of Mg and Ni and M2 which is at least one of Nb and Ta, and the molar ratio of M1 to the total amount of Ti, M1 and M2 is 0.8. A material having a molar ratio of 005 to 0.025 and M2 of 0.01 to 0.050 is preferably used. A material having such a composition exhibits a very high dielectric constant. The composition of the ceramic dielectric plate 2 may be confirmed by elemental analysis such as energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The crystal structure may be confirmed by X-ray diffraction (XRD) measurement.

  The ceramic dielectric plate 2 may be a dense ceramic having a porosity of 5% or less. By setting the porosity to 5% or less, the bending strength is 150 MPa or more particularly in the above-described material mainly composed of titanium oxide. Such a ceramic dielectric 2 is self-supporting even with a thin plate of about 3 μm and can be easily handled. The porosity of the ceramic dielectric plate 2 may be confirmed by image analysis of a scanning electron microscope (SEM) photograph of the cross section. The magnification of the SEM photograph may be 1000 to 5000 times, for example.

  The ceramic dielectric plate 2 may have a Young's modulus in the range of 200 to 300 GPa. The Young's modulus of the ceramic dielectric plate 2 is in such a range, and the ceramic dielectric plate 2 is not easily broken even if it is a thin plate, and is not cracked even if it is a thin plate of about 3 μm. Can be handled easily. The Young's modulus of the ceramic dielectric plate 2 may be measured by a nanoindentation method.

  The ceramic dielectric plate 2 of each of the above-described embodiments may be manufactured as follows, for example, when using the above-described material mainly composed of titanium oxide.

To the titanium oxide powder, at least one oxide or carbonate of Mg and Ni (for example, MgO, MgCO ₃ , NiO, NiCO ₃ ), and at least one oxide of Nb and Ta ( Nb ₂ O ₅ , Ta ₂ O ₅ ) powder is mixed and pulverized together with a solvent and a dispersant using a ball mill for a predetermined time. As the solvent, for example, alcohols such as ethanol and isopropyl alcohol (IPA) and organic solvents such as toluene may be used.

  Next, a binder is added and further mixed for a predetermined time to obtain a mixed solution for molding. The obtained mixed solution is formed into a sheet shape by a known sheet forming method such as a doctor blade or a coater to obtain a formed body. As the binder, for example, an organic resin such as polyvinyl alcohol, polyvinyl butyral, or acrylic may be used.

  The obtained molded body is placed on a setter such as zirconia and is subjected to a binder removal process and a calcination process in a state of being stored in a mortar. The treatment conditions may be 3 to 10 hours at 800 to 1000 ° C. in an air atmosphere. Subsequently, the ceramic dielectric board 2 which has a titanium oxide as a main component is obtained by baking at 1200-1400 degreeC in air | atmosphere for 4 to 10 hours. For example, alumina, magnesia, mullite or the like may be used as the material of the mortar.

  In order to obtain a flat ceramic dielectric plate 2, a low-reactivity substrate such as a zirconia substrate may be baked on the formed body after the binder removal process during firing.

  The ceramic dielectric plate 2 may be used without being subjected to grinding / polishing because of handling restrictions and characteristics. That is, the ceramic dielectric plate 2 may have a burnt surface. The thickness of the ceramic dielectric plate 2 may be 3 to 15 μm.

<Method for manufacturing electronic parts>
What is necessary is just to produce the electronic component 1 of these embodiment as follows. When using metal foil as the conductor layers 3a and 3b, the main body 4 of the first embodiment is manufactured by superposing a pair of metal foils on the surface 6 which is the surface having the largest area of the ceramic dielectric plate 2.

  After an insulating resin or glass is applied to a predetermined portion of the main body 4 to form an insulating material 8, external electrodes 5a and 5b are further formed. At this time, the conductor layer 3a is electrically connected to the external electrode 5a, and the insulating material 8 is interposed between the conductor electrode 3b and the conductor layer 3b is electrically connected to the external electrode 5b. External electrodes 5a and 5b are arranged so that insulating material 8 is interposed between electrodes 5a.

  The main body (laminated body) 4 of the second embodiment is produced by alternately laminating a plurality of ceramic dielectric plates 2 and a plurality of metal foils. When laminating, the metal foil to be the conductor layer 3a and the metal foil to be the conductor layer 3b are laminated in a state shifted from each other in one direction of the lamination surface. That is, by laminating the conductor layers 3a and 3b while shifting the left and right positions shown in FIG. 2A, the conductor layer 3a becomes the right side surface 7 of the laminate 4 as shown in FIG. The conductor layer 3b is exposed on the left side surface 7 of the multilayer body 4.

  Thus, after laminating | stacking a desired number of ceramic dielectric plates 2 and metal foil (conductor layer 3a, 3b) alternately, the laminated body 4 which concerns on 2nd Embodiment is obtained by pressing in a lamination direction. . In addition, the adhesiveness of the ceramic dielectric board 2 and metal foil (conductor layer 3a, 3b) can be improved by performing a pressurization in a vacuum.

  The ceramic dielectric plate 2 and the metal foil may be laminated after being processed into a predetermined shape, or the ceramic dielectric plate 2 and a metal foil forming a pattern of the plurality of conductor layers 3a and 3b may be laminated. After producing the laminated base material, the laminated body 4 may be formed by processing into a predetermined shape using a laser cutter or the like.

  The main body (laminated body) 4 according to the third embodiment is produced as follows. A ceramic dielectric plate 2 with a metal foil, in which a metal foil having the same size as that of the ceramic dielectric plate 2 is overlapped and adhered to one surface of the ceramic dielectric plate 2, is produced. The laminated body 4 of 3rd Embodiment is obtained by processing the ceramic dielectric board 2 with metal foil into a predetermined shape, and laminating | stacking in the state shifted for every layer in one direction of the lamination | stacking surface.

  By applying an insulating resin or glass to the side surface 7 that is the lead-out surface of the laminated body 4 of the second and third embodiments obtained in this way, the resin or glass becomes conductive layers 3a, 3b (first layers). In the second embodiment, the insulating material 8 is formed by further entering a gap without the ceramic dielectric plates 2a and 2b).

  Thereafter, excess resin or glass on the lead-out surface of the laminate 4 is removed to expose the conductor layers 3a and 3b, and external electrodes 5a and 5b are respectively formed on the side surfaces 7 where the conductor layers 3a and 3b are exposed. Good.

  As the external electrodes 5a and 5b, for example, a base electrode made of Cu, which is used as an external electrode of many multilayer ceramic capacitors, with Ni and Sn plating may be used. Alternatively, the external electrodes 5a and 5b may be formed using a conductive resin containing a conductive filler such as Ag or Cu.

  When using a metal vapor-deposited film or a sputtered film as the conductor layers 3a and 3b, a mask for forming a pattern of the conductor layers 3a and 3b is superimposed on the surface of the ceramic dielectric plate 2, and vapor deposition or sputtering is performed thereon. Conductive layers 3a and 3b having a predetermined pattern are formed to obtain a ceramic dielectric plate 2 with a conductive layer. The obtained ceramic dielectric plate with a conductor layer 2 is laminated so that the conductor layers 3a and 3b are displaced in one direction of the laminated surface, and then pressed in the laminating direction, whereby the first dielectric layer as shown in FIG. The laminate 4 according to the second embodiment is obtained. In addition, the adhesiveness of the ceramic dielectric plates 2 with a conductor layer can be improved by performing pressurization in a vacuum.

  The ceramic dielectric plate 2 with a conductor layer by metal deposition or sputtering may be laminated after being processed into a predetermined shape, or the ceramic dielectric plate with a conductor layer having a pattern of a plurality of conductor layers 3a and 3b. After laminating 2 to produce a laminated mother body, the laminated body 4 may be formed by processing into a predetermined shape using a laser cutter or the like.

  The laminated body 4 according to the third embodiment is obtained by processing a ceramic dielectric plate 2 with a conductor layer in which a metal vapor-deposited film or a sputtered film is formed on the entire surface of one surface of the ceramic dielectric plate 2 into a predetermined shape. The layers may be stacked in a shifted state in one direction.

  For the obtained laminate 4, the insulating material 8 and the external electrodes 5a and 5b may be formed by the same method as in the case of using the above-described metal foil.

  It should be noted that the conductor dielectric layer-attached ceramic dielectric plate having a pattern of a plurality of conductor layers 3a and 3b, both when a metal foil is used as the conductor layers 3a and 3b, and when a metal vapor-deposited film and a sputtered film are used. After the insulating material 8 is formed on the laminated base body in which the two layers are laminated, it may be processed into a predetermined shape.

  When the side surface 7 other than the surface 6 and the lead-out surface of the laminate 4 is covered with a coating layer 9 made of an insulating resin or glass, for example, the following may be performed. After covering the entire outer surface of the laminate 4 with the coating layer 9, the lead-out surface is polished so that the conductor layers 3a and 3b are exposed. A base electrode may be formed on the lead-out surface, and Ni and Sn plating may be further performed.

  Thus, in this embodiment, for example, the ceramic dielectric plate 2 and the conductor layer 3 can be bonded and the laminated body 4 can be formed without performing a heat treatment at a high temperature such as firing the ceramic. It is difficult for reactions between different materials due to the heat treatment, element diffusion near the interface, etc. to occur, and it is easy to realize desired characteristics.

  Hereinafter, the electronic component of the present disclosure will be described in detail based on examples.

  As raw materials for the ceramic dielectric plate, powders of titanium oxide, magnesium carbonate, and tantalum pentoxide were prepared. These powders were blended such that Mg was 0.01, Ta was 0.02, and the balance was Ti with a molar ratio to the total amount of metal elements (Ti, Mg, Ta).

  To 100% by mass of the blended raw material powder, 15% by mass of toluene, 15% by mass of ethanol, and 3.2% by mass of an allyl ether copolymer dispersant are added, and wet mixing is performed for about 48 hours with a ball mill to produce a slurry. did.

  Further, a binder solution in which a butyral resin binder was dissolved in a mixed solution of toluene and ethanol was prepared. This binder solution was added to the prepared slurry and mixed to prepare a mixed solution. The mixed solution contained 12% by mass of the binder with respect to 100% by mass of the raw material powder.

  The prepared mixed solution was formed into a sheet by a multi coater to obtain a green sheet having a thickness of 18 μm. The obtained green sheet was cut into a rectangle, then placed on a zirconia substrate, subjected to binder removal treatment and calcining at 900 ° C. in an air atmosphere to obtain a calcined sheet. After that, by placing a zirconia substrate on the calcined sheet, the substrate is sandwiched between zirconia substrates, fired at 1300 ° C. for 6 hours in an air atmosphere, and have a thickness of 14 μm, 18 × 20 mm, and 10 × 20 mm. A rectangular ceramic plate was obtained.

  The porosity of the obtained ceramic plate was confirmed by image analysis of a scanning electron microscope (SEM) photograph of a cross section. The magnification of the SEM photograph was 2000 times. As a result of the measurement, the porosity was 2%.

  The bending strength of the obtained ceramic plate was measured. A ceramic plate was processed to a size of 5 × 15 mm to obtain a test piece. The measuring device was a universal testing machine Autograph AG-IS (manufactured by Shimadzu Corporation), and the three-point bending strength at a span of 10 mm was measured. When the result was converted into the three-point bending strength of JIS R 1601, the bending strength was 209 MPa.

  The Young's modulus of the obtained ceramic plate was confirmed by a nanoindentation method. The Young's modulus was 275 GPa.

<Example 1>
Gold was sputtered on one surface of the obtained 18 × 20 mm ceramic plate using a mask having a 7 × 9 mm rectangular opening to form a rectangular shape having a thickness of 0.2 μm and 7 × 9 mm. A ceramic plate (A) and (B) with a conductor layer was obtained. The sputtered films (A) and (B) were formed so that their positions were shifted from each other by 1 mm only in the direction of the long side of the sputtered film.

  (A) and (B) are laminated so that one surface (deposition surface) of (A) and the other surface (surface where the ceramic is exposed) of (B) face each other so that the entire surface of the ceramic plate overlaps. Further, a ceramic plate having no conductor layer was laminated on one surface of (B).

  The obtained laminate matrix was pressurized in the lamination direction in a vacuum, then immersed in a vanadium-based low melting point glass paste, and left under a vacuum of 0.01 MPa for 5 minutes. The laminated matrix is taken out of the glass paste, and the glass is melted and solidified by heat treatment at a maximum temperature of 350 to 400 ° C. for 10 to 60 minutes. The voids in the laminated matrix are filled with glass to form an insulating material, and the outer surface of the laminated matrix A glass coating layer was formed on the substrate. This laminated matrix was cut into a size of 9 × 10 mm so that the conductor layer was arranged in the center with a laser cutter, and the laminated body according to the first embodiment was obtained. The obtained laminated body has (B) as a ceramic dielectric plate having a thickness of 14 μm and an effective portion of 7 × 8 mm.

  After removing the glass which covered the side surface where the conductor layer of the obtained laminated body was exposed, the silver paste was apply | coated and baked on the said side surface, the external electrode was formed, and it was set as the sample.

  The impedance characteristics of the obtained sample were evaluated using an impedance measuring instrument (S1 1260 manufactured by Solartron) at DC bias 0 V, AC 0.5 V, and measurement frequency 1 Hz to 1 MHz. As a result, the capacitance Cp at 10 kHz was 0.19 μF, the dielectric loss tangent (tan δ) was 0.06, and the relative dielectric constant (εr) was 5340.

<Example 2>
A rectangular copper foil having a thickness of 2 μm was placed on one surface of the obtained ceramic plate, and a ceramic plate with a conductor layer having a size of 8 × 10 mm was produced using a laser cutter. In addition, this ceramic plate with a conductor layer is obtained by overlapping a copper foil on the entire surface of one surface of the ceramic plate.

  Four ceramic plates with conductor layers (C), (D), (E), and (F) were laminated in this order to produce a laminate. (C), (D), and (E) are laminated so that one of the surfaces (the surface having the copper foil) and the other surface (the surface on which the ceramic is exposed) face each other, and (F) is One surface thereof was made to face one surface of (E). That is, the other surface of (C) and the other surface of (F) were made the outer surface in the stacking direction of the laminate. Only (D) was arranged so as to be shifted by 2 mm in the long side direction from the other ceramic plate with the conductor layer.

  The obtained laminate was pressurized in the lamination direction in a vacuum, then immersed in a vanadium-based low-melting glass paste, and left under a vacuum of 0.01 MPa for 5 minutes. The laminated body is taken out from the glass paste, and the glass is melted and solidified by a heat treatment at a maximum temperature of 350 to 400 ° C. for 10 to 60 minutes. The voids of the laminated body are filled with glass to form an insulating material, and the outer surface of the laminated body A glass coating layer was formed on the substrate to obtain a laminate according to the second embodiment.

The obtained laminate has (D) and (E) as ceramic dielectric plates each having a thickness of 14 μm, and has an effective portion of 8 × 8 mm (effective area 128 mm ² ).

  After removing the glass covering the side surface where the conductor layer of the obtained laminate was exposed, a silver paste was applied to the side surface and baked to form an external electrode as a sample.

  The impedance characteristics of the obtained samples were evaluated in the same manner as in Example 1. As a result, the capacitance Cp at 10 kHz was 0.43 μF, the dielectric loss tangent (tan δ) was 0.06, and the relative dielectric constant (εr) was 5340.

<Example 3>
A small amount of the mixed solution used in the above molding was applied to one surface of the obtained ceramic plate, and a rectangular copper foil having a thickness of 10 × 20 mm and a thickness of 2 μm was overlaid. These are the first ceramic plate and copper foil. When the copper foil was stacked on the ceramic plate, the ceramic plate and the copper foil were stacked with a shift of 2 mm in the long side direction. A small amount of the mixed solution was further applied to the surface of the stacked copper foils, and another ceramic plate was stacked so that the entire surface of the first ceramic plate overlapped. A small amount of the mixed solution was applied to the surface of the stacked ceramic plates, and the other copper foils were stacked in a direction opposite to the first copper foil. The other ceramic plate and copper foil are used as the second ceramic plate and copper foil. A small amount of the mixed solution was applied to the surface of the second copper foil, and the third ceramic plate was overlapped with the first and second ceramic plates so that the entire surface overlapped.

  The obtained laminated body was heat-treated at 120 ° C. for 1 hour while applying pressure in the laminating direction to cure the binder in the mixed solution. Both ends in the long side direction of the laminate were polished, silver paste was applied to the ends, and solidified by heat treatment at 150 ° C. for 1 hour to form external electrodes.

In this way, a sample having an effective area of 10 × 16 mm ² in which one second ceramic plate was used as a ceramic dielectric plate having a thickness of 14 μm was obtained.

  The thickness of the intervening layer is determined by using the energy dispersive X-ray spectroscopy (EDS) attached to the scanning electron microscope (SEM) at the interface between the ceramic dielectric plate and the copper foil. The presence or absence was confirmed, and the thickness of the layer containing the organic component was measured. The average thickness of the intervening layer was 1.5 μm. Moreover, it was confirmed that the average particle diameter of the dielectric particles was 0.4 μm by image analysis of a cross-sectional photograph taken with a scanning electron microscope (SEM). Vb / (Vb + Va) in the intervening layer was also measured and confirmed to be 35%.

  The impedance characteristics of this electronic component were evaluated in the same manner as in Example 1. As a result, the capacitance Cp at 10 kHz was 0.54 μF, the dielectric loss tangent (tan δ) was 0.06, and the relative dielectric constant (εr) was 5340.

DESCRIPTION OF SYMBOLS 1 Electronic component 2, 2a, 2b Ceramic dielectric board 3, 3a, 3b Conductor layer 4 Main body 5, 5a, 5b External electrode 6 Main body surface 7 Main body side surface 8 Insulating material 9 Covering layer 10 Intervening layer 10a Dielectric particle 10b Organic resin

Claims (16)

A body having a ceramic dielectric plate and at least a pair of conductor layers disposed on a surface of the ceramic dielectric plate;
And at least a pair of external electrodes provided on the main body,
The conductor layer is electrically connected to any one of the pair of external electrodes, and is insulated with resin or glass between the conductor electrode and the external electrode not electrically connected. Electronic components with intervening materials.   The electronic component according to claim 1, wherein the plurality of ceramic dielectric plates and the plurality of conductor layers are alternately laminated. The plurality of ceramic dielectric plates are in contact with either one of the pair of external electrodes, respectively,
The electronic component according to claim 2, wherein the insulating material is interposed between the ceramic dielectric plate and the other external electrode.   The electronic component according to claim 1, wherein the ceramic dielectric plate has a bending strength of 150 MPa or more and a relative dielectric constant of 1000 or more.   The electronic component according to claim 1, wherein a thickness of the ceramic dielectric plate is 3 to 20 μm.   The electronic component according to claim 1, wherein a surface of the main body on which the external electrode is not provided is covered with an insulating resin or glass.   The electronic component according to claim 1, further comprising an intervening layer containing dielectric particles made of an inorganic compound and an organic resin between the ceramic dielectric plate and the conductor layer.   The electronic component according to claim 7, wherein the conductor layer is a metal foil.   The electronic component according to claim 7 or 8, wherein the thickness of the intervening layer is 3 µm or less.   The electronic component according to claim 7, wherein an average particle diameter of the dielectric particles is ½ or less of a thickness of the intervening layer.   The volume ratio Vb / (Vb + Va) of the organic resin is 0.4 or less, where Va is the volume of the dielectric particles in the intervening layer and Vb is the volume of the organic resin. Electronic component in any one.   The electronic component according to claim 7, wherein the composition of the dielectric particles is the same as the composition of the ceramic dielectric plate.   The ceramic dielectric plate is mainly composed of titanium oxide, has a rutile-type crystal structure, and includes at least one of a divalent element, a trivalent element, a tetravalent element, and a pentavalent element. The electronic component according to claim 1. The ceramic dielectric plate is mainly composed of titanium oxide and has a rutile crystal structure,
A metal element M1 that is at least one of Mg and Ni, and a metal element M2 that is at least one of Nb and Ta,
The molar ratio of M1 is 0.005 to 0.025, and the molar ratio of M2 is 0.01 to 0.050, with respect to the total amount of Ti, M1, and M2. Electronic components.   The electronic component according to claim 1, wherein the ceramic dielectric plate has a porosity of 5% or less. The electronic component according to claim 1, wherein a Young's modulus of the ceramic dielectric plate is in a range of 200 to 300 GPa.

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