JPWO2016103791A1 - Cap mounting method and cap mounting apparatus for semiconductor device package - Google Patents

Abstract

The present invention relates to a cap mounting method and a cap mounting apparatus for a semiconductor device package. In mounting the cap on the semiconductor element package, the plurality of caps (6) are arranged along the x direction at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages (3), and the plurality of arranged caps (6) At the same time, the plurality of absorbed caps (6) are simultaneously sucked into the cap mounting recess (31) of the corresponding semiconductor element package (3) while being inclined. To do.

Description

  The present invention relates to a cap mounting method and a cap mounting device for a semiconductor device package, and more particularly to a method for mounting a cap in a cap mounting recess provided in a semiconductor device package and a device for realizing the method.

  Conventional semiconductor element packages (hereinafter also simply referred to as “packages”) generally have a large portion for mounting a cap (hereinafter referred to as a cap mounting portion), and the cap itself is accordingly large. For this reason, when mounting the cap on the semiconductor element package, a method has been used so far in which the cap is mechanically sandwiched between guides for positioning. As for positioning of the semiconductor element package, a method has been adopted in which the position is determined by mechanically sandwiching the package between the reference surfaces.

  However, with the recent thinning of semiconductor device packages, cap mounting portions and caps in semiconductor device packages are also made thin and thin. Since the package before mounting the cap is arranged and mounted on a thin metal frame, the package is likely to rotate and the position between the packages is often different. In such a situation, if you attempt to perform positioning by mechanically clamping a thin cap, the positioning of the cap with respect to the front / rear / left / right / rotation direction of the package will not be stable, and the accuracy of cap mounting will be poor. There was a problem of stability and dispersion. Further, since the positioning of the cap is not stable, there is a problem that the cap is hooked on the semiconductor element package when the cap is mounted or the cap is damaged. In addition, since the cap is small, there is also a problem that it is difficult to clamp the cap itself.

  Incidentally, it is known that a plurality of semiconductor element packages are attached with caps after recognizing cap attachment portions one by one using a recognition system such as a position recognition processing camera (see Patent Document 1). ). If this technique is used, the above-mentioned problem concerning the positional accuracy when the cap is mounted can be solved. However, the method of attaching caps after recognizing the cap attaching portions one by one has a problem that the cap attaching time is prolonged as a whole of the plurality of semiconductor element packages.

  As far as the inventors have investigated, the prior art disclosed a method for accurately mounting a cap on a cap mounting portion of a semiconductor element package mounted on a metal frame by a simple method without using a recognition system such as a position recognition processing camera. No literature was found.

Japanese Patent Laid-Open No. 9-252011

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cap mounting method for a semiconductor device package capable of improving cap mounting accuracy, stable assembly quality, and speeding up the mounting operation, and a cap mounting apparatus that realizes the method. Is to provide.

A cap mounting method for a semiconductor device package according to one aspect of the present invention includes:
A cap mounting method for mounting caps to cap mounting recesses of a plurality of semiconductor element packages arranged in the x direction at a predetermined arrangement pitch,
Arranging a plurality of caps along the x direction at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages;
A step of simultaneously adsorbing a plurality of arranged caps by inclining with respect to the horizontal direction;
Inserting the adsorbed caps into a cap mounting recess of a corresponding semiconductor element package at the same time in an inclined state; and
It is provided with.

  In the adsorbing step, the plurality of caps may be placed on an inclined surface, and an adsorbing collet having an inclined tip surface corresponding to the inclined surface may be lowered in the vertical direction to adsorb the cap to the inclined tip surface. Or, after placing the plurality of caps on a horizontal plane, lowering the suction collet having a horizontal tip surface in the vertical direction, adsorbing the cap to the horizontal line end surface, and lifting the cap from the horizontal plane, The adsorption collet may be inclined.

  In one embodiment, in the step of sucking, the plurality of caps are sucked after roughly adjusting the positions of the arranged caps in the x direction.

  In the step of sucking, the positions in the x direction of the plurality of caps after the suction may be finely adjusted.

  In one embodiment, in the inserting step, the plurality of caps with respect to the actual positions of the cap mounting recesses of the plurality of semiconductor device packages are moved by moving the absorbed caps within a minute range along the x direction. After tweaking the position of the x direction, insert these caps.

  Here, the “small range” refers to a range of about 120% to 400% of the dimensional tolerance in the x direction of the cap mounting recess. For example, if the dimensional tolerance in the x direction of the cap mounting recess is ± 25 μm, ± It is in the range of 30 μm to ± 100 μm. Here, the symbol + represents the front in the x direction, and the symbol-represents the rear in the x direction.

  In one embodiment, in the inserting step, each cap with respect to the corresponding cap mounting recess is moved by moving these caps in a state where the tips of the plurality of adsorbed caps are in contact with the inner wall surface of the corresponding cap mounting recess. The angular position of the cap can also be adjusted.

In one embodiment, when the direction perpendicular to the x direction is the y direction,
In the inserting step, the tips of the absorbed caps are inserted into the corresponding cap mounting recesses, and the caps are advanced in the y direction until the tips hit the inner wall surface of the corresponding cap mounting recess. In this way, the plurality of caps are aligned in the y direction.

  In one embodiment, the cap mounting method further includes a step of press-fitting a plurality of caps, the tips of which are inserted into the cap mounting recesses of the semiconductor element package, into the corresponding cap mounting recesses at a two-stage speed. The speed of the stage is slower than the first stage.

  The cap mounting method according to the present invention can be realized by the cap mounting apparatus according to the present invention.

The cap mounting device is a cap mounting device for mounting caps to cap mounting recesses of a plurality of semiconductor element packages arranged in the x direction at a predetermined arrangement pitch,
a cap transport arrangement unit that is movable in the x direction and that arranges a plurality of caps at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages and conveys the cap in the x direction;
A cap suction unit having a suction mechanism and movable in the x direction and the y direction perpendicular to the x direction,
The cap adsorbing unit adsorbs the plurality of caps arranged by the cap transport arrangement unit at the same time in the direction inclined with respect to the cap mounting recess of the semiconductor element package by the adsorbing mechanism. At the same time, the cap is inclined and inserted into the cap mounting recess of the corresponding semiconductor element package.

  The cap transport arrangement unit includes a stage having an inclined mounting surface for mounting the plurality of caps at an inclination, and the suction mechanism has an inclined front end surface corresponding to the inclined mounting surface of the stage. A plurality of suction collets may be provided, and the suction mechanism may be configured such that the plurality of suction collets descend in the vertical direction and suck caps on the respective inclined tip surfaces.

  Further, the cap transport arrangement unit includes a stage having a horizontal mounting surface for mounting the plurality of caps in a horizontal direction, and the suction mechanism includes a plurality of suction collets having a horizontal tip surface, and the suction mechanism The plurality of suction collets may be configured to incline the adsorbed caps by descending in the vertical direction, adsorbing the caps to the respective horizontal tip surfaces, and inclining after the caps are adsorbed.

  In one embodiment, the cap mounting device of the present invention includes a transport mechanism that moves the cap suction unit, and the cap suction unit is disposed immediately after suction by the cap suction unit and / or before insertion into the cap mounting recess. The position of the plurality of caps in the x direction is finely adjusted by moving within the minute range along the x direction by the transport mechanism.

  Before the suction by the cap suction unit, the positions of the caps in the x direction of the plurality of caps may be roughly adjusted by adjusting the position of the cap transport arrangement unit with respect to the cap suction unit with respect to the x direction.

  The cap mounting apparatus may include a positioning member for positioning a plurality of caps sucked by the suction mechanism in the y direction.

  In one embodiment, the cap mounting apparatus further includes a press-fitting unit that press-fits a cap having a tip inserted into the cap mounting recess of the semiconductor element package into the cap mounting recess by a two-step lowering operation. The lowering movement speed is slower than the first stage.

  The press-fit unit may be configured by a unit different from the cap suction unit, or the cap suction unit may also serve as the press-fit unit.

  The press-fitting unit may have an overload sensor that detects an overload to the cap.

  The cap mounting device may include a suction sensor that detects whether the cap is sucked by the cap suction unit.

  According to the present invention, when mounting a cap on a semiconductor element package, it is possible to improve cap mounting accuracy, achieve stable assembly quality, and speed up mounting operation.

It is a schematic block diagram of the cap mounting apparatus which concerns on one Embodiment of this invention, Comprising: The state in the cap arrangement | sequence process is shown. It is an operation | movement diagram of the cap mounting apparatus of FIG. 1, Comprising: The state just before a cap adsorption | suction process is shown. It is an operation | movement diagram of the cap mounting apparatus of FIG. 1, Comprising: The state immediately after a cap adsorption | suction process is shown. It is an operation | movement diagram of the cap mounting apparatus of FIG. 1, Comprising: The state just before a cap insertion process is shown. It is an operation | movement diagram of the cap mounting apparatus of FIG. 1, Comprising: The state immediately after a cap insertion process is shown. It is a figure explaining the adsorption | suction positioning and the pick-up method of the cap in one Embodiment of this invention, Comprising: The stage in a conveyance arrangement | sequence unit and the shape of the adsorption collet in an adsorption | suction unit are shown. It is a figure explaining fine adjustment of the adsorption position of the x direction after cap adsorption in one embodiment of the present invention, (A) is a schematic plan view of a cap on a stage, (B) is an adsorption collet just after adsorption Schematic sectional view of the cap and the stage, (C) is a diagram showing the range of fine adjustment. It is a figure explaining the flow of operation | movement of the adsorption collet at the time of the cap insertion process in the cap mounting apparatus of FIG. It is a figure which shows the flow of operation | movement of the press injection process in one Embodiment of this invention. It is a figure which shows the cap front-end | tip insertion process in a semiconductor element package, Comprising: The fine adjustment method of the x direction position of a cap, and the positional relationship of a semiconductor element package and a cap are shown. It is a figure which shows the cap front end positioning process following the process shown in FIG. 10, Comprising: The cap front end shows the state which is contact | abutting to the inner wall surface (reference surface) of the cap mounting | wearing recessed part of a semiconductor element package. It is a figure which shows the cap press-fit process following the process shown in FIG. 11, Comprising: It shows the 2 step | paragraph downward operation | movement of a press-fit unit. FIG. 13 is a diagram showing a state of the semiconductor element package after completion of the cap attachment following the step shown in FIG. 12. It is a figure explaining the adsorption | suction positioning and the pick-up method of the cap in one Embodiment of this invention, Comprising: The stage in the conveyance arrangement unit different from what was shown in FIG. 6 and the shape of the adsorption collet in an adsorption | suction unit are shown. It is a figure explaining the flow of operation | movement at the time of the cap insertion process of the adsorption collet shown in FIG. It is a figure which shows the flow of operation | movement of the press injection process using the adsorption collet of FIG.

  Hereinafter, a cap mounting apparatus and a cap mounting method for a semiconductor device package according to the present invention will be described with reference to the illustrated embodiments.

(First embodiment)
The schematic block diagram of the cap mounting apparatus 1 which concerns on 1st Embodiment of this invention is shown in FIG. As shown in FIG. 1, the cap mounting apparatus 1 simultaneously attaches a plurality of caps 6 supplied from a parts feeder 5 to a plurality of semiconductor element packages 3 arranged in two rows on a mounting stage 2 (that is, collectively). It is configured to be worn.

  Specifically, the cap mounting apparatus 1 is aligned with two cap transport arrangement units 7 that arrange the caps 6 supplied from the parts feeder 5 at the arrangement pitch of the semiconductor element packages 3 (hereinafter, package pitch). Two cap suction units 8 for picking up a plurality (20 in the illustrated example) of caps from each of the cap transport arrangement units 7 (see FIG. 2), and a cap mounting recess 31 of the semiconductor element package 3. And a press-fitting unit 9 for press-fitting into (see FIG. 8). In addition, the cap mounting device includes a transport mechanism that transports the cap transport array unit 7 and a transport mechanism that transports the cap suction unit 8, although not illustrated. Furthermore, the cap mounting apparatus has a positioning guide 10 for positioning the cap picked up by suction below the cap suction unit 8 (see FIG. 6).

  In the non-limiting example shown in FIG. 1, a plurality of semiconductor element packages 3 are mounted with a semiconductor element (not shown) on a thin metal frame that constitutes the terminal portion 4 (see FIG. 10), which is resin-molded. It will be.

  The two cap transport arrangement units 7 are arranged symmetrically with respect to the arrangement direction of the semiconductor element packages 3 (hereinafter referred to as the x direction). Each cap transport arrangement unit 7 includes a stage 71 extending in the x direction for placing the cap, a partition 72 provided with the stage 71 at a pitch corresponding to the package pitch, and one of the stages 71 in the longitudinal direction (x direction). And positioning protrusions 73 (see FIG. 6) provided along the edge. The positioning protrusion 73 is for positioning the cap 6 in the y direction orthogonal to the x direction. The other edge portion extending in the longitudinal direction (x direction) of the stage 71 is opened to receive the cap 6 from the parts feeder 5 (see FIGS. 6 and 7). As shown in FIG. 6, the upper surface of the stage 71 forms an inclined mounting surface 74 that descends from the opening-side edge toward the edge where the positioning protrusion 73 is provided.

  The reason for adopting such an inclined mounting surface 74 is that a plurality of caps can be mounted stably and collectively even if the positions of the cap mounting recesses vary among the plurality of semiconductor element packages 3. It is to make it. In other words, since the semiconductor element package 3 is mounted on the thin frame, the semiconductor element package 3 is easily rotated in a certain direction due to the bending of the thin frame, and the position of the cap mounting recess becomes unstable. Moreover, since the gap between the cap mounting recesses 31 also occurs, it is extremely difficult to insert the cap into the cap mounting recess while keeping the cap in the horizontal direction. However, when the cap 6 is disposed to be inclined with respect to the horizontal direction, when the cap is sucked and picked up while keeping the oblique direction, and mounted in the cap mounting recess, the margin on the cap mounting recess side However, this difficulty can be solved.

  The inclination angle of the inclined mounting surface 74 is set within a range of 5 degrees to 15 degrees. If the inclination angle is within the range of 5 to 15 degrees, the margin at the time of insertion can be increased.

  Similarly, the two cap suction units 8 are also arranged symmetrically with respect to the x direction, which is the arrangement direction of the semiconductor element packages 3. These two cap suction units 8 are arranged in a state in which the edges on the opposite sides are in contact with each other, that is, in a back-to-back state. Each cap suction unit 8 includes a plurality of suction collets 81 arranged in the x direction at a pitch corresponding to the package pitch, a holding plate 82 that holds the plurality of suction collets 81, and a plurality of holding plates 82 that are held by the holding plate 82. An operating mechanism for moving the suction collet 81 simultaneously is provided. Each suction collet 81 is connected to a vacuum device (not shown), and has a channel 82 for evacuation at the center. The front end surface 83 of each suction collet 81 is an inclined front end surface that is inclined at an angle corresponding to the inclined mounting surface 74 of the stage 71, that is, an angle within a range of 5 degrees to 15 degrees.

  The press-fitting unit 9 includes a substantially rectangular parallelepiped press-fitting member 91 (shown in cross section in FIGS. 8 and 9) extending in the x direction, and an operating unit (not shown) that operates the press-fitting member 91. Further, as shown in FIG. 9, an overload sensor 13 that detects an overload on the cap 6 when the press-fitting member 91 is lowered by the compression of the spring 12 is attached to the press-fitting unit 9. The output signal of the overload sensor 13 is input to the operating portion, and thereby, it is possible to perform the press-fitting operation while confirming whether or not the cap 6 is overloaded. As a result, damage to the package due to overload on the cap 6 can be avoided as much as possible. As will be described later, the operating portion of the press-fitting unit 9 causes the press-fitting member 91 to perform a two-step lowering operation.

  Next, a basic operation flow of the cap mounting apparatus 1 will be described with reference to FIGS. 1 to 5, and details of a cap mounting process by the cap mounting apparatus 1 will be described with reference to FIGS. 6 to 13. .

(Cap arrangement process)
First, as shown in FIG. 1, the caps 6 are filled in the parts feeder 5, and the caps 6 are transferred one by one from the parts feeder 5 to the cap transport array unit 7 while shifting the cap transport array unit 7 in the x direction.

  More specifically, when the two cap transport arrangement units 7 are synchronously moved by a distance corresponding to the package pitch in the x direction indicated by the arrow in the figure, the cap 6 is separated from the corresponding parts feeder 5 by the partition 72. Is placed on the inclined slope 74 of the stage 71. That is, the cap 6 is placed on the stage 71 in an inclined state with respect to the horizontal direction. At this time, the cap abuts against the positioning projection 73 provided on the stage 71 (see (I) in FIG. 6), thereby positioning the cap 6 in the y direction (direction perpendicular to the x direction). In this way, the cap transport arrangement unit 7 advances to the delivery position to the cap suction unit 8 while receiving the caps 6 one by one.

  When the transfer of the cap 6 to all (20) sections of the stage 71 is completed, the cap transport arrangement unit 7 further advances beyond the delivery position to the cap suction unit 8 and then returns to the delivery position. In this way, with respect to the x direction, the cap 6 in the cap transport arrangement unit 7 is aligned with the suction collet 81 of the cap suction unit 8 (see FIG. 2), and rough adjustment of the position in the x direction is performed.

(Cap adsorption process)
Next, as shown in FIG. 2, one of the two cap suction units 8 (for example, the left cap suction unit 8 in FIG. 2) is moved by the transport mechanism toward the corresponding transport array unit 7 in the y direction. (For example, move leftward in FIG. 2). Then, the plurality of suction collets 81 are simultaneously lowered in the vertical direction (see (II) in FIG. 6), and the plurality of caps 6 whose positions in the x direction are roughly adjusted are simultaneously sucked by the suction collet 81 in an inclined state. (See (III) in FIG. 6). In this suction state, as shown in FIG. 7, by moving the cap suction unit 8 in the x direction in a minute range, in this example, within a range of ± 30 μm to ± 100 μm (see (C) of FIG. 7), The position of the cap 6 in the x direction is finely adjusted with respect to the set position of the cap mounting recess 31 of the semiconductor element package 3 in the x direction. In FIG. 7B, only the upper part of the stage 71 of the cap transport arrangement unit 7 is shown. After fine adjustment of the position of the cap 6 in the x direction, as shown in FIG. 6 (IV), the suction collet 81 is raised in the vertical direction, and the cap 6 is picked up and transferred from the cap transport arrangement unit 7 to the cap suction unit 8. To do. Then, as shown in FIG. 6 (V), the cap 6 after suction is applied to the positioning guide 10 to position the cap 6 with respect to the set position in the y direction of the cap mounting recess 31 of the semiconductor element package 3. I do. Thereafter, the cap suction unit 8 is returned to the original position shown in FIG. Next, the other cap suction unit 8 (for example, the right cap suction unit 8 in FIG. 2) is moved in the y direction (for example, the right direction in FIG. 2) opposite to the previous one, and thereafter The same operation is repeated.

  In the first embodiment, the two cap suction units 8 are provided with a common transport mechanism and an operating mechanism. First, the cap 6 is transferred from one cap transport array unit 7 to the corresponding one cap suction unit 8. Then, the cap 6 is transferred from the other cap transport arrangement unit 7 to the remaining cap suction unit 8. However, instead of this, as will be described in a third embodiment to be described later, a transport mechanism and an operating mechanism dedicated to each cap suction unit 8 are provided to move the two cap suction units 8 simultaneously in different directions. The caps may be picked up and transferred from the corresponding cap transport arrangement unit 7.

  In the illustrated example, since the semiconductor element packages 3 are arranged in two rows, two parts feeders 5, a cap transport arrangement unit 7, and a cap suction unit 8 are prepared, but the semiconductor element packages 3 are arranged in one row. In this case, the number of parts feeder 5, cap transport arrangement unit 7, and cap adsorption unit 8 may be one.

  Next, as shown in FIG. 3, the two cap suction units 8 that suck the cap 6 positioned in the x direction and the y direction are moved to the mounting stage 2 along the x direction.

(Cap insertion process)
Subsequently, as shown in FIG. 4, the cap 6 is inserted and mounted from the cap suction unit 8 into the cap mounting recess 31 of the semiconductor element package 3 of the mounting stage 2.

  Specifically, as shown in FIG. 8 (V1), a plurality of suction collets 81 each having a cap 6 attached thereto obliquely are moved onto the aligned semiconductor element package 3, and then these suction collets 81 are moved. At the same time, as shown in FIG. 8 (V1I), the tip end of the cap 6 is inserted into the cap mounting recess 31 by being lowered in the vertical direction. Before the insertion, the positions of the plurality of caps 6 in the x direction are finely adjusted with respect to the actual positions of the corresponding cap mounting recesses 31.

  Since the semiconductor element package 3 is mounted on a thin metal frame, the actual position of the cap mounting recess 31 often deviates somewhat from the installation position due to rotation of the semiconductor element package 3 or the like. Before the cap is inserted, in order to absorb the deviation of the actual position of the cap mounting recess 31 from the set position as described above, the positions of the plurality of caps 6 in the x direction are finely adjusted before the cap is inserted as described above. It is.

  Specifically, for example, as shown in FIG. 10, the caps 6 are adsorbed while the tips of a plurality of caps 6 (only one is shown in FIG. 10) are pushed into the cap mounting recesses only slightly. The gap C in the x direction between the cap 6 and the semiconductor element package 3 becomes substantially equal on both sides by swinging the cap suction unit 8 along the x direction in a minute range (for example, a range of ± 30 μm to ± 100 μm). It is adjusted as follows. By such a simple method, it is possible to absorb the deviation of the actual positions of the plurality of cap mounting recesses 31 from the set position. As a result, the tips of the plurality of caps 6 can be further pushed in and inserted into the respective cap mounting recesses 31 at the same time while being accurately positioned with respect to the cap mounting recess 31 with respect to the position in the x direction. In the example shown in FIG. 10, the tip of the cap 6 is inserted with an inclination of about 5 to 15 degrees. In the state after insertion, the positioning convex portion 62 at the tip of the cap is normally not in contact with the complementary concave portion 32 provided on the inner wall surface on the front end side of the cap mounting concave portion 31.

  Next, as shown in FIG. 8 (VIII), with the tip of the cap 6 inserted into the cap mounting recess 31, the cap is adsorbed until the tip of the cap 6 contacts the inner wall surface on the tip side of the cap mounting recess 31. The cap 6 is moved forward in the y direction while the unit 8 is attracted, and the cap 6 is positioned in the y direction with respect to the actual y position of the cap mounting recess 31.

  Specifically, as shown in FIG. 11, the cap 6 is moved to the front end side of the semiconductor element package 3 until the positioning convex portion 62 at the front end of the cap fits tightly into the concave portion 32 of the cap mounting recess 31. At this time, the cap 6 is also aligned with the rotation direction of the cap mounting recess 31 caused by the rotation of the semiconductor element package 3.

  In the present embodiment, the cap insertion process including the alignment in the x direction, the y direction, and the rotation direction is performed by using a transport mechanism and an operation mechanism common to the two cap suction units 8. 8 are sequentially operated one by one, and the two rows of semiconductor element packages 3 mounted on the mounting stage 2 are sequentially executed one by one. Since the direction of the semiconductor element packages 3 in one row is opposite to the direction of the semiconductor element packages 3 in the other row, the movement of the two cap suction units 8 is opposite to the y direction. It is.

  However, as described in the third embodiment to be described later, the cap insertion process is mounted on the mounting stage 2 by providing a transport mechanism and an operating mechanism for each of the two cap suction units 8 individually. You may make it perform simultaneously with respect to the semiconductor element package 3 of 2 rows. Of course, when the semiconductor element packages 3 are only in one row, only one cap suction unit 8 needs to be operated.

  After positioning the cap tip, as shown in FIG. 8 (IX), the suction collet 81 is raised to release the cap from the suction state, and then the two cap suction units 8 are moved to the locations shown in FIGS. Return to (supply stage).

  The cap mounting device 1 has a suction sensor (not shown), and when the suction collet 81 is raised, the cap sensor 6 detects the presence or absence of the cap 6 on the front end surface of the suction collet 81 by using this suction sensor. Are simultaneously mounted on the two or one row of the semiconductor element packages 3. In other words, the adsorption sensor can simultaneously detect the presence or absence of a cap attachment error for these semiconductor element packages.

(Cap press-fitting process)
Finally, after the press-fitting unit 9 is moved onto the mounting stage 2 as shown in FIG. 9 (X), the two steps of the press-fitting member 91 are carried out as shown in FIG. 9 (XI) and FIGS. The cap 6 is pushed into the corresponding cap mounting recess 31 by the lowering operation.

  The two-stage lowering operation of the press-fitting member 91 is performed at a high speed in the first stage and at a low speed in the second stage. Switching between the first stage and the second stage of the downward movement does not damage the internal components of the package as much as possible. Thus, it is good to carry out at the timing when the cap 6 does not elastically contact the package internal components (wires or the like). In addition, since the lowering operation is performed while checking the output of the overload sensor 13 so that a large impact is not applied to the inside of the package or the package exterior, damage inside the package or the package exterior can be prevented.

  By the two-stage press-fitting operation, the cap 6 inserted in an inclined state is fitted in the cap mounting recess 31 in the horizontal direction, and the cap mounting operation is completed.

  After completion of the press-fitting, as shown in FIG. 9 (XII), the press-fitting unit 9, that is, the press-fitting member 91 is raised and returned to the original position.

  As a result of the above process, a high-quality assembly of the semiconductor element package 3 and the cap 6 as shown in FIG. 13 is obtained.

  As can be seen from the above description, according to the configuration of the cap mounting device according to the first embodiment and the cap mounting method implemented by the cap mounting device, even if the actual cap mounting recesses are between the plurality of semiconductor element packages. Even if there is a variation in position, the cap can be mounted accurately by stably inserting it into the cap mounting recess of the corresponding semiconductor element package without recognizing the position of the cap mounting recess using a recognition system. It becomes possible. As a result, stable assembly quality can be obtained.

  In addition, according to the first embodiment, since a plurality of caps 6 are simultaneously processed, it is possible to realize a marked speedup of the mounting operation as compared with individual cap processing.

(Second Embodiment)
A second embodiment of the present invention will be described. The schematic configuration diagram of the cap mounting device according to the second embodiment is substantially equivalent to the cap mounting device 1 shown in FIG. 1 excluding the press-fitting unit 9. Therefore, in the following description, the reference numbers shown in FIGS. 1 to 13 are appropriately used for the cap mounting device of the second embodiment except for some reference numbers.

  In the second embodiment, the configurations of the cap delivery array unit 7 and the cap suction unit 8 are different from those of the first embodiment. Moreover, it differs from the first embodiment in that the cap suction unit 8 also serves as a press-fit unit. The other configuration is basically the same as that of the first embodiment, and a description thereof will be omitted. Hereinafter, differences from the first embodiment will be described with reference to FIGS. FIG. 14 is a view for explaining the cap suction positioning and pick-up method in the second embodiment. The cross-sectional shape of the cap transport arrangement unit 7 in the second embodiment and the shape of the suction collet 81 in the cap suction unit 8 are shown in FIG. Is shown. FIG. 15 is a diagram for explaining the flow of operation during the cap insertion step of the suction collet shown in FIG. FIG. 16 is a diagram showing a flow of the operation of the press-fitting process using the adsorption collet of FIG.

  As shown in FIG. 14, in the second embodiment, the stage 71 includes a horizontal placement surface 75. The stage 71 does not include the positioning projection 73 of the first embodiment, and instead, the positioning clamp mechanism 11 is provided between the stage 71 and the suction collet 81. Further, unlike the first embodiment, the tip of the suction collet 81 is not cut obliquely but has a horizontal tip surface 84. Instead, a mechanism for tilting the suction collet 81 itself is provided. In the second embodiment, the angle at which the suction collet 81 is inclined corresponds to the inclination angle of the inclined tip surface 83 of the suction collet 81 in the first embodiment, and is an angle within a range of 5 to 15 degrees.

  Hereinafter, with reference to FIGS. 1 to 5 and FIGS. 14 to 16, the operation flow of the cap arrangement process, the cap adsorption process, the cap insertion process, and the cap press-fitting process in the second embodiment different from the first embodiment will be described. explain.

(Cap arrangement process)
First, as shown in FIG. 1, the caps 6 are filled in the parts feeder 5, and the caps 6 are transferred one by one from the parts feeder 5 to the cap transport array unit 7 while shifting the cap transport array unit 7 in the x direction.

  More specifically, when the two cap transport arrangement units 7 move synchronously in the x direction indicated by the arrow in the drawing by a distance corresponding to the package pitch, as shown in FIG. From the feeder 5, the cap 6 is placed on the horizontal placement surface 75 of the stage 71 partitioned by the partition 72. Then, as shown in (II) of FIG. 14, the cap 6 is positioned in the y direction by the clamp mechanism 11. In this way, the cap transport arrangement unit 7 advances to the delivery position to the cap suction unit 8 while receiving the caps 6 one by one.

  In the second embodiment, instead of providing the positioning protrusion clamp mechanism 11, the stage 71 may include a positioning protrusion 73 for positioning in the y direction, as in the first embodiment. In this case, positioning in the y direction can be performed by applying the cap 6 to the positioning protrusion 73.

  When the transfer of the cap 6 to all (20) sections of the stage 71 is completed, the cap transport arrangement unit 7 further advances beyond the delivery position to the cap suction unit 8 and then returns to the delivery position. In this way, with respect to the x direction, the cap 6 in the cap transport arrangement unit 7 is aligned with the suction collet 81 of the cap suction unit 8 (see FIG. 2), and rough adjustment of the position in the x direction is performed.

(Cap adsorption process)
Next, as shown in FIG. 2, one of the two cap suction units 8 (for example, the left cap suction unit 8 in FIG. 2) is moved by the transport mechanism toward the corresponding transport array unit 7 in the y direction. (For example, move leftward in FIG. 2). Then, the plurality of suction collets 81 are simultaneously lowered in the vertical direction, and a plurality (20 in the illustrated example) of caps 6 whose positions in the x direction are roughly adjusted are simultaneously sucked by the suction collet 81 (FIG. 14). (See (III)). In this suction state, the cap suction unit 8 is moved in a small range in the x direction, in this example, within a range of ± 30 μm to ± 100 μm (see FIG. 7C), thereby mounting the cap of the semiconductor element package 3 The position of the cap 6 in the x direction is finely adjusted with respect to the set position of the recess 31 in the x direction. After fine adjustment of the position of the cap 6 in the x direction, as shown in FIG. 14 (IV), the suction collet 81 is raised in the vertical direction, and the cap 6 is picked up from the cap transport arrangement unit 7 to the cap suction unit 8. Subsequently, as shown in FIG. 14 (V), the suction collet 81 is inclined in the y direction, and the cap 6 after suction is applied to the positioning guide 10, so that the y of the cap mounting recess 31 of the semiconductor element package 3 is obtained. The cap 6 is positioned with respect to the set position of the direction. Thereafter, the cap suction unit 8 is returned to the original position shown in FIG. Subsequently, the other cap suction unit 8 (for example, the right cap suction unit 8 in FIG. 2) is moved in the opposite y direction (for example, the right direction in FIG. 2), and thereafter Repeats the same operation as described above.

  In the second embodiment, the two cap suction units 8 are provided with a common transport mechanism and an operating mechanism. First, the cap 6 is transferred from one cap transport array unit 7 to the corresponding one cap suction unit 8. Then, the cap 6 is transferred from the other cap transport arrangement unit 7 to the remaining cap suction unit 8. However, instead of this, as will be described in a third embodiment to be described later, a transport mechanism and an operating mechanism dedicated to each cap suction unit 8 are provided to move the two cap suction units 8 simultaneously in different directions. The caps may be picked up and transferred from the corresponding cap transport arrangement unit 7.

  In the illustrated example, since the semiconductor element packages 3 are arranged in two rows, two parts feeders 5, a cap transport arrangement unit 7, and a cap suction unit 8 are prepared, but the semiconductor element packages 3 are arranged in one row. In this case, the number of parts feeder 5, cap transport arrangement unit 7, and cap adsorption unit 8 may be one.

  Next, as shown in FIG. 3, the two cap suction units 8 that suck the cap 6 positioned in the x direction and the y direction are moved to the mounting stage 2 along the x direction.

(Cap insertion process)
Subsequently, as shown in FIG. 4, the cap 6 is inserted and mounted from the cap suction unit 8 into the cap mounting recess 31 of the semiconductor element package 3 of the mounting stage 2.

  Specifically, as shown in FIG. 15 (V1), a plurality of suction collets 81 each having a cap 6 sucked diagonally are moved onto the aligned semiconductor element package 3, and then these suction collets 81 are moved. At the same time, as shown in FIG. 15 (V1I), the tip of the cap 6 is lowered while being inclined, and the tip of the cap 6 is inserted into the cap mounting recess 31. Before the insertion, the positions of the plurality of caps 6 in the x direction are finely adjusted with respect to the actual positions of the corresponding cap mounting recesses 31.

  Specifically, for example, as shown in FIG. 15 (VII), the caps 6 are moved in a state where the tips of a plurality of caps 6 (only one is shown in FIG. 15) are pushed into the cap mounting recesses only slightly. The cap 6 is aligned with the cap mounting recess 31 by swinging the adsorbing cap adsorbing unit 8 along the x direction in a minute range (for example, a range of ± 30 μm to ± 100 μm). By such a simple method, it is possible to absorb the deviation of the actual positions of the plurality of cap mounting recesses 31 from the set position. As a result, the tips of the plurality of caps 6 can be further pushed in and inserted into the respective cap mounting recesses 31 at the same time while being accurately positioned with respect to the cap mounting recess 31 with respect to the position in the x direction. In the example shown in FIG. 15, the tip of the cap 6 is inserted with an inclination of about 5 to 15 degrees. The state of the cap after insertion is the same as that shown in FIG.

  Next, as shown in FIG. 15 (VIII), the cap is adsorbed until the tip of the cap 6 comes into contact with the inner wall surface on the tip side of the cap mounting recess 31 while the tip of the cap 6 is inserted into the cap mounting recess 31. The cap 6 is moved forward in the y direction while the unit 8 is attracted, and the cap 6 is positioned in the y direction with respect to the actual y position of the cap mounting recess 31.

  Specifically, as in the first embodiment, as shown in FIG. 11, the cap 6 is inserted into the semiconductor element package 3 until the positioning protrusion 62 at the tip of the cap fits tightly into the recess 32 of the cap mounting recess 31. Move to the tip side. At this time, the cap 6 is also aligned with the rotation direction of the cap mounting recess 31 caused by the rotation of the semiconductor element package 3.

  In the second embodiment, the cap insertion process including the alignment in the x direction, the y direction, and the rotation direction is similar to the first embodiment in the conveyance mechanism and the operation mechanism common to the two cap suction units 8. These cap suction units 8 are operated one by one in order, and the two rows of semiconductor element packages 3 mounted on the mounting stage 2 are sequentially executed one by one. Since the direction of the semiconductor element packages 3 in one row is opposite to the direction of the semiconductor element packages 3 in the other row as described above, the movement of the two cap suction units 8 is reversed with respect to the y direction. Because it becomes a direction.

  However, as described in the third embodiment to be described later, the cap insertion process is mounted on the mounting stage 2 by providing a transport mechanism and an operating mechanism for each of the two cap suction units 8 individually. You may make it perform simultaneously with respect to the semiconductor element package 3 of 2 rows. Of course, when the semiconductor element packages 3 are only in one row, only one cap suction unit 8 needs to be operated.

  After positioning the tip of the cap, as shown in FIG. 15 (IX), the suction collet 81 is lifted to release the cap from the suction state, and then the suction collet 81 is returned to the original vertical state.

  When the suction collet 81 is raised, the presence or absence of the cap 6 on the front end surface of the suction collet 81 is detected by the suction sensor to determine whether the cap 6 is attached to the semiconductor element package 3 in two or one row. All the semiconductor device packages 3 are checked simultaneously.

(Cap press-fitting process)
Finally, as shown in FIGS. 16 (X) and (XI), the cap 6 mounted obliquely is mounted on the horizontal tip surface 84 of the suction collet 81 by the two-step descending operation of the suction collet 81 returned to the vertical posture. Push into the corresponding cap mounting recess 31. The cap press-fitting step may be performed simultaneously on the two rows of semiconductor element packages 3 after the cap insertion into the two rows of semiconductor element packages 3 is completed, or may be performed on the semiconductor element packages 3 in each row. It may be performed each time the cap insertion is completed.

  The effect of the two-step lowering operation of the suction collet press-fitting member 91 is as described in the first embodiment.

  By the two-stage press-fitting operation, the cap 6 inserted in an inclined state is fitted in the cap mounting recess 31 in the horizontal direction, and the cap mounting operation is completed.

  After completion of press-fitting, the suction collet 81 is raised and the suction unit 8 is returned to the original position (supply stage) shown in FIGS.

  As a result of the above process, a high-quality assembly of the semiconductor element package 3 and the cap 6 is obtained.

  Although not shown in FIG. 14, the spring 12 and the overload sensor 13 as shown in FIG. 9 of the first embodiment may also be provided for the suction collet 81.

  As can be seen from the above description, according to the configuration of the cap mounting device according to the second embodiment and the cap mounting method implemented by the cap mounting device, even if the actual cap mounting recesses are between the plurality of semiconductor element packages. Even if there is a variation in position, the cap can be mounted accurately by stably inserting it into the cap mounting recess of the corresponding semiconductor element package without recognizing the position of the cap mounting recess using a recognition system. It becomes possible. As a result, stable assembly quality can be obtained.

  In addition, according to the second embodiment, since a plurality of caps 6 are simultaneously processed, it is possible to realize a significant speed-up of the mounting operation as compared with individual cap processing.

  Further, according to the second embodiment, the mounting surface 71 of the stage 71 is horizontal, and the tip surface of the suction collet 81 is also horizontal, so that an existing stage or suction collet can be used.

  In addition, according to the second embodiment, the cap suction unit 8 also serves as a press-fitting unit, so the number of parts is reduced accordingly.

  In the first embodiment and the second embodiment, the shape of the cap 6 (including the tip shape), the shape of the semiconductor element package 3, and the shape of the cap mounting recess 31 (including the shape of the inner wall surface) are limited. It is not a thing and is suitably changed according to a use.

  Further, the number of caps to be attached at one time is set as appropriate, and is not limited to the one described and illustrated in the first and second embodiments.

(Third embodiment)
In the third embodiment, a part of the first embodiment or the second embodiment is changed to further speed up the cap mounting operation. The description of the portions that are not changed from the first embodiment and the second embodiment will be omitted because the specification becomes redundant. Further, the changeable items (for example, the shape of the cap) described with respect to the first embodiment and the second embodiment can be similarly applied to the third embodiment. Only the differences from the first and second embodiments will be described below.

  In the first and second embodiments, a common transport mechanism and an operating mechanism are provided for the two cap suction units 8 so that the two cap suction units 8 are sequentially operated in the cap suction step and the cap insertion step. However, in the third embodiment, a dedicated transport mechanism and an operating mechanism are provided for each of the two cap suction units 8, and the two cap suction units 8 are individually operated. Therefore, in the third embodiment, the two cap suction units 8 can be operated simultaneously by simultaneously (synchronously) moving the transport mechanism and the operation mechanism of the two cap suction units 8.

  That is, in the cap adsorption process, in the first and second embodiments, the cap 6 is transferred from one cap conveyance arrangement unit 7 to the corresponding one cap adsorption unit 8 by the common conveyance mechanism and the operation mechanism. Thereafter, the cap 6 was transferred from the other cap transport arrangement unit 7 to the remaining cap suction unit 8. On the other hand, in the example of the third embodiment, two cap suction units 8 are simultaneously moved in different directions (opposite directions) by a transport mechanism and an operation mechanism dedicated to each cap suction unit 8 and corresponding caps. The cap is picked up and transferred from the transport arrangement unit 7. Therefore, the time required for the cap adsorption process of the third embodiment can be shortened to approximately half as compared with the cap adsorption process of the first and second embodiments.

  In the cap insertion process, in the first and second embodiments, two rows mounted on the mounting stage 2 by operating the two cap suction units 8 one by one in order by the common transport mechanism and the operation mechanism. The caps were inserted into the semiconductor element package 3 one by one in order. On the other hand, in the example of the third embodiment, the two cap suction units 8 are mounted on the mounting stage 2 by simultaneously operating the two cap suction units 8 individually by the transport mechanism and the operation mechanism dedicated to each cap suction unit 8. Caps are simultaneously inserted into the semiconductor element packages 3 in the row. Therefore, the time required for the cap insertion process of the third embodiment can be shortened to approximately half compared to the cap insertion process of the first and second embodiments.

  The simultaneous operation of the two cap suction units 8 can be easily realized by a method of synchronizing the respective transport mechanisms and operation mechanisms with a synchronization signal.

  In addition, the operations of the transport mechanism and the operation mechanism of the two cap suction units 8 do not necessarily have to be synchronized, and a slight deviation may occur in the operation timing. Even in this case, the cap mounting time can be shortened compared to the first and second embodiments.

  Finally, the present invention and the embodiment are summarized as follows.

A cap mounting method for a semiconductor device package according to one aspect of the present invention includes:
A cap mounting method for mounting the cap 6 to the cap mounting recesses 31 of the plurality of semiconductor element packages 3 arranged along the x direction at a predetermined arrangement pitch,
Arranging the plurality of caps 6 along the x direction at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages 3;
A step of simultaneously adsorbing the arrayed caps 6 by inclining them with respect to the horizontal direction;
Inserting the adsorbed caps 6 into the cap mounting recesses 31 of the corresponding semiconductor element package 3 in an inclined state at the same time;
It is provided with.

  According to the method of the present invention, the cap 6 is sucked and sucked with respect to the horizontal direction, and is inserted into the cap mounting recess 31 of the corresponding semiconductor element package 3 in the tilted state. In comparison with the case where the cap is inserted in parallel, the margin on the cap mounting recess side when the cap is inserted is substantially increased, and therefore the insertion into the cap mounting recess 31 is easy. Also, the cap 6 can be easily adjusted in position relative to the cap mounting recess 31 by inserting the cap 6 into the cap mounting recess 31 in an inclined state and applying the insertion tip of the cap 6 to the inner wall surface of the cap mounting recess 31. it can. Thereby, even if the actual position of the cap mounting recess 31 varies among the plurality of semiconductor element packages 3, the corresponding semiconductor element can be detected without recognizing the position of the cap mounting recess 31 using the recognition system. The cap 6 can be mounted with high accuracy by being stably inserted into the cap mounting recess 31 of the package 3. As a result, stable assembly quality can be obtained.

  In addition, according to the present invention, since it is not necessary to individually recognize the position of the cap mounting recess 31 using the recognition system, a plurality of caps 6 can be processed simultaneously, and the mounting work speed can be increased. it can.

  In the step of sucking, the plurality of caps 6 are placed on the inclined surface 74, and the suction collet 81 having the inclined tip surface 83 corresponding to the inclined surface 74 is lowered in the vertical direction to form the inclined tip surface 83. The cap 6 may be adsorbed, or the plurality of caps 6 may be placed on the horizontal surface 75 and the adsorbing collet 81 having the horizontal front end surface 84 may be lowered in the vertical direction so that the cap 6 is placed on the horizontal front end surface 84. After adsorbing and lifting the cap 6 from the horizontal plane 75, the adsorption collet 81 may be inclined.

  Any of the above methods can realize the suction of the cap 6 in the inclined state. In addition, when the latter method is used, an existing stage for mounting a cap and a suction collet can be used.

  In one embodiment, in the step of sucking, the plurality of caps 6 are sucked after roughly adjusting the positions of the arranged caps 6 in the x direction.

  By roughly adjusting the positions in the x direction of the plurality of caps 6 before sucking the caps, the caps 6 can be easily positioned when the caps are inserted.

  In the step of sucking, the positions in the x direction of the plurality of caps 6 after the suction may be finely adjusted.

  By fine adjustment of the position of the cap 6 in the x direction, the position accuracy of the cap 6 with respect to the set position of the cap mounting recess 31 can be increased.

  In one embodiment, in the inserting step, the plurality of sucked caps 6 are moved within a minute range along the x direction so that the cap mounting recesses 31 of the plurality of semiconductor element packages 3 are actually positioned. After finely adjusting the positions of the plurality of caps 6 in the x direction, these caps 6 are inserted.

  When the semiconductor element package 3 is mounted on a thin metal frame, the position of the cap mounting recess 31 tends to become unstable. That is, the actual position of the cap mounting recess 31 often deviates somewhat from the installation position due to rotation of the semiconductor element package 3 or the like. However, even if the actual position of the cap mounting recess 31 is deviated from the set position in this way, before inserting the cap, for example, the cap 6 is moved with the tip of the cap 6 pushed into the cap mounting recess 31 only slightly. By moving (swinging) in a very small range along the x direction, the actual displacement of the cap mounting recess 31 can be easily absorbed. Therefore, a plurality of caps 6 can be simultaneously inserted into the respective cap mounting recesses 31 while being accurately positioned with respect to the cap mounting recesses 31 with respect to the position in the x direction. It is not necessary to recognize the position of the cap mounting recess 31 by a recognition system such as a position recognition camera.

  In the inserting step, the caps 6 are moved by moving the caps 6 in a state where the tips 62 of the adsorbed caps 6 are in contact with the inner wall surfaces 32 of the corresponding cap mounting recesses 31. The angular position of each cap 6 with respect to 31 can also be adjusted.

In one embodiment, when the direction perpendicular to the x direction is the y direction,
In the step of inserting, the plurality of caps 6 are inserted until the tips of the plurality of caps 6 adsorbed are inserted into the corresponding cap mounting recesses 31 and the tips 32 abut against the inner wall surfaces 62 of the corresponding cap mounting recesses 31. Is moved forward in the y direction, thereby aligning the plurality of caps 6 in the y direction.

  In this method, the alignment of the caps 6 in the y direction with respect to the actual positions of the plurality of cap mounting recesses 31 is performed simply by advancing in the y direction until the tip 32 of the cap hits the inner wall surface 32 of the corresponding cap mounting recess 31. be able to. It is not necessary to recognize the position of the cap mounting recess 31 by a recognition system such as a position recognition camera. As a result, it is possible to easily and quickly align the plurality of caps 6 in the y direction.

  In one embodiment, the cap mounting method further includes a step of press-fitting a plurality of caps 6 having tips inserted into the cap mounting recesses 31 of the semiconductor element package 3 into the corresponding cap mounting recesses at a two-stage speed. The second stage is slower than the first stage.

  In the process of press-fitting the cap, the cap 6 inserted into the cap mounting recess 31 in an inclined state is substantially horizontal in the cap mounting recess 31, and the assembly of the semiconductor element package 3 and the cap 6 is completed. When press-fitting, the press-fitting speed is two steps, the first step speed is high, the second step speed is low, and the speed switching timing is adjusted to greatly increase the time required for press-fitting as a whole. Therefore, it is possible to prevent the cap from elastically contacting and damaging the internal components (wire components and the like) of the semiconductor element package 3.

  The cap mounting method according to the present invention can be realized by the cap mounting apparatus 1 according to the present invention.

The cap mounting apparatus 1 is a cap mounting apparatus for mounting caps to cap mounting recesses 31 of a plurality of semiconductor element packages 3 arranged in the x direction at a predetermined arrangement pitch.
a cap transport arrangement unit 7 which is movable in the x direction and which arranges a plurality of caps 6 at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages 3 and conveys them in the x direction;
A cap suction unit 8 having a suction mechanism 81 and movable in the x direction and the y direction perpendicular to the x direction;
The cap adsorbing unit 8 adsorbs a plurality of caps 6 arranged by the cap transport arrangement unit 7 simultaneously by the adsorbing mechanism 81 in an inclined direction with respect to the cap mounting recess 31 of the semiconductor element package 3. The plurality of adsorbed caps 6 are inserted into the cap mounting recesses 31 of the corresponding semiconductor element package 3 while being inclined at the same time.

  In this cap mounting apparatus 1, a plurality of caps 6 are arranged at an arrangement pitch corresponding to the arrangement pitch of a plurality of semiconductor element packages by a cap transport arrangement unit 7 that is movable in the x direction, and caps are adsorbed in the x direction. It is conveyed to the position of the unit 8. After the plurality of caps 6 are simultaneously sucked by the suction mechanism 81 in a direction inclined with respect to the cap mounting recess 31 of the semiconductor element package and carried to the place 2 where the semiconductor element package 3 is arranged. , And inserted into the cap mounting recess 31 of the corresponding semiconductor element package 3 in an inclined manner. Thus, this cap mounting apparatus 1 can implement the cap mounting method of the present invention by combining the cap transport arrangement unit 7 and the cap suction unit 8, and has the effects described for the cap mounting method. it can.

  Further, since the cap mounting device 1 does not require a position recognition system using a camera or the like, the manufacturing cost of the device can be reduced accordingly.

  The cap transport arrangement unit 7 includes a stage 71 having an inclined mounting surface 74 for mounting the plurality of caps 6 at an inclination, and the suction mechanism corresponds to the inclined mounting surface 74 of the stage 71. A plurality of suction collets 81 having inclined tip surfaces 83, and the suction mechanism is configured such that the plurality of suction collets 81 descend in the vertical direction and suck the cap 6 to each of the inclined tip surfaces 83. May be.

  Further, the cap transport arrangement unit 7 includes a stage 71 having a horizontal placement surface 75 for placing the plurality of caps 6 in the horizontal direction, and the suction mechanism has a plurality of suction collets 81 having a horizontal tip surface 84. The suction mechanism is configured such that the plurality of suction collets 81 descend in the vertical direction to suck the caps 6 to the respective horizontal front end surfaces 85 and tilt after the caps are sucked, thereby tilting the sucked caps 6. It may be configured as follows.

  In one embodiment, the cap mounting apparatus 1 of the present invention includes a transport mechanism that moves the cap suction unit 8, and the cap mounting device 1 immediately after suction by the cap suction unit 8 and / or before insertion into the cap mounting recess. By moving the suction unit within the minute range along the x direction by the transport mechanism, the positions of the plurality of caps in the x direction are finely adjusted.

  The position adjustment of the cap 6 in the x direction immediately after suction by the cap suction unit 8 is performed with respect to the set position of the cap mounting recess 31, and the position adjustment of the cap 6 in the x direction before insertion into the cap mounting recess 31 is performed. This is performed with respect to the actual position of the cap mounting recess 31.

  Further, the position of the plurality of caps 6 in the x direction is roughly adjusted by adjusting the position of the cap transport arrangement unit 7 with respect to the cap suction unit 8 with respect to the x direction before suction by the cap suction unit 8. It may be.

  The cap mounting apparatus 1 may include a positioning member 10 for positioning the plurality of caps 6 sucked by the suction mechanism in the y direction.

  In one embodiment, the cap mounting apparatus 1 includes a press-fitting unit 8 that press-fits a cap 6 having a tip inserted into the cap mounting recess 31 of the semiconductor element package 3 into the cap mounting recess 31 by a two-step lowering operation. 9 is further provided, and the speed of the lowering operation of the second stage is slower than that of the first stage.

  The press-fitting unit 9 may be configured by a unit 9 different from the cap suction unit 8, or the cap suction unit 8 may also serve as the press-fitting unit.

  The press-fitting units 8 and 9 may have an overload sensor 13 that detects an overload to the cap.

  In this case, since the press-fitting operation can be performed while confirming whether or not the overload is applied to the cap 6 by the overload sensor 13, damage to the semiconductor element package 3 due to the overload on the cap 6 can be prevented. It can be avoided as much as possible.

  Further, the cap mounting device 1 may include a suction sensor that detects whether or not the cap 6 is sucked by the cap suction unit 8.

  In this case, after the cap mounting operation to the plurality of semiconductor element packages 3, it is possible to simultaneously detect the presence or absence of a cap mounting error for the plurality of semiconductor element packages by the suction sensor.

  The cap mounting method and the cap mounting apparatus of the present invention are useful when used for mounting caps on a plurality of semiconductor element packages arranged in a state where the position of the cap mounting recess tends to become unstable. However, it can also be used when the position of the cap mounting recess is relatively stable.

DESCRIPTION OF SYMBOLS 1 Cap mounting apparatus 2 Mounting stage 3 Semiconductor element package 4 Terminal part 5 Parts feeder 6 Cap 7 Cap conveyance arrangement unit 8 Cap adsorption unit 9 Press fitting unit 10 Positioning guide 11 Clamp mechanism 12 Spring 13 Overload sensor 31 Cap of semiconductor element package 3 Mounting concave portion 32 Concave portion 62 on the inner wall surface at the front end side of the cap mounting concave portion 31 Positioning convex portion 71 at the tip end of the cap 72 Stage 72 of the cap transporting array unit 7 Partition 73 Positioning projection 74 80 Holding plate 81 of cap adsorption unit 8 Adsorption collet 82 of cap adsorption unit 8 Channel 83 of adsorption collet 81 Inclined tip surface 84 of adsorption collet 81 Horizontal tip surface 91 of adsorption collet 81 Press-fitting part of press-fitting unit 9

Claims (5)

A cap mounting method for mounting caps to cap mounting recesses of a plurality of semiconductor element packages arranged in the x direction at a predetermined arrangement pitch,
Arranging a plurality of caps along the x direction at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages;
A step of simultaneously adsorbing a plurality of arranged caps by inclining with respect to the horizontal direction;
Inserting the adsorbed caps into a cap mounting recess of a corresponding semiconductor element package at the same time in an inclined state; and
A cap mounting method characterized by comprising: The cap mounting method according to claim 1,
In the inserting step, the plurality of caps in the x direction relative to the actual positions of the cap mounting recesses of the plurality of semiconductor element packages are moved by moving the sucked caps within a minute range along the x direction. A cap mounting method comprising inserting these caps after fine-tuning. In the cap mounting method according to claim 1 or 2,
When the direction perpendicular to the x direction is the y direction,
In the inserting step, the tips of the absorbed caps are inserted into the corresponding cap mounting recesses, and the caps are advanced in the y direction until the tips hit the inner wall surface of the corresponding cap mounting recess. Thus, the cap mounting method is characterized in that the plurality of caps are aligned in the y direction. A cap mounting device for mounting caps on cap mounting recesses of a plurality of semiconductor element packages arranged in the x direction at a predetermined arrangement pitch,
a cap transport arrangement unit that is movable in the x direction and that arranges a plurality of caps at an arrangement pitch corresponding to the arrangement pitch of the plurality of semiconductor element packages and conveys the cap in the x direction;
A cap suction unit having a suction mechanism and movable in the x direction and the y direction perpendicular to the x direction,
The cap adsorbing unit adsorbs the plurality of caps arranged by the cap transport arrangement unit at the same time in the direction inclined with respect to the cap mounting recess of the semiconductor element package by the adsorbing mechanism. A cap mounting apparatus, wherein the cap is inserted into the cap mounting recess of the corresponding semiconductor element package at an angle at the same time. In the cap mounting apparatus of Claim 4,
The cap transport arrangement unit includes a stage having a horizontal placement surface for placing the plurality of caps in a horizontal direction,
The suction mechanism includes a plurality of suction collets having a horizontal tip surface;
The suction mechanism is configured such that the plurality of suction collets descend in the vertical direction to suck the caps to the respective horizontal front end surfaces and tilt after the caps are sucked, thereby tilting the sucked caps. Cap mounting device characterized by.

Images