JPWO2016027336A1 - Solder printer - Google Patents

Abstract

The solder printing apparatus of the present invention includes a squeegee for scraping and moving paste solder on a screen having an opening, a squeegee head for mounting the squeegee, and a head movement for moving the squeegee and the squeegee head in a direction parallel to the screen. And a squeegee head or device case, and a solder photographic camera that captures solder image data of a still image or a movie by photographing paste solder in conjunction with the movement of the squeegee, under the screen The paste solder is printed on the arranged substrate. According to this, the solder photographing camera can perform photographing at a timing when the paste-like solder moves to a position suitable for photographing on the screen and is in a state suitable for photographing. Therefore, the paste-like solder spreading on the screen can be easily and accurately confirmed based on the acquired solder image data.

Description

  The present invention relates to a solder printing apparatus that prints paste solder on a substrate disposed under the screen by moving the paste solder supplied onto the screen by scraping with a squeegee.

  As a device for producing a substrate on which a large number of electronic components are mounted, there are a solder printing device, a component mounting device, a reflow device, a substrate inspection device, and the like. In many cases, these devices are connected to construct a substrate production line. The solder printing apparatus prepares for printing by kneading the paste-like solder supplied on the screen with a squeegee and reciprocating the solder. Next, the solder printing apparatus holds the substrate in close contact with the lower side of the screen having the opening, and scrapes and moves the paste solder with a squeegee. By this printing operation, paste-like solder corresponding to the shape of the opening is printed on the surface of the substrate.

  Although there is a single squeegee type that includes only one squeegee, a solder squeegee type that includes two squeegees has become common. The double squeegee type solder printing apparatus is equipped with two squeegees that can move up and down on the squeegee head, and the squeegee is used in the forward and backward directions. The double squeegee type has advantages over the single squeegee type in that the movement stroke of the squeegee head can be reduced and the contact angle of the squeegee with the screen can be set separately in the reciprocating direction.

  The paste solder is generally stored in a plastic container, and is supplied by an operator scooping out with a spatula and placing it on a screen. Also, a solder printing apparatus having an automatic solder supply unit that automatically supplies paste solder has been put into practical use. In both cases of manual supply and automatic supply, if paste-like solder is supplied linearly in the length direction of the squeegee, the kneading operation becomes efficient. The supply of paste solder is generally performed periodically, such as “after printing on a certain number of substrates”. Furthermore, an operator visually checks the state of the paste solder on the screen and responds as needed.

  In the solder printing apparatus, appropriately managing paste-like solder spreading on the screen is an important matter in terms of print quality, and technical examples relating to this are disclosed in Patent Document 1 and Patent Document 2. The solder material deterioration degree determination device disclosed in Patent Literature 1 determines the deterioration degree of the solder material based on the illumination unit that irradiates the surface of the solder material with the inspection light, the imaging unit that images the surface of the solder material, and the captured image. Degradation degree judging means. According to this, it is said that an increase in the unevenness of the surface of the solder material formed with the deterioration of the solder material can be detected, and the degree of deterioration of the solder material can be judged in real time in parallel with the solder printing process. .

  Further, claim 11 of Patent Document 2 discloses a solder supply device that supplies solder to be printed on a substrate onto a mask sheet (screen). This solder supply device measures the width of the solder remaining on the mask sheet after the printing process at a plurality of points in the length direction of the squeegee, and calculates the amount of solder supplied at the plurality of points in the length direction based on the width of the solder. Calculating means for calculating, and means for changing the solder supply amount at a plurality of points in the length direction based on the calculation result. Furthermore, in the embodiment, a reflective optical sensor is disclosed as an example of a measurement unit. According to this, it is possible to improve the adjustment accuracy of the amount of solder, and to reduce the number of rolling operations (the number of kneading operations).

JP 2006-242719 A JP 2014-91222 A

  By the way, in order to visually confirm the state of paste solder and the operation status of the apparatus, a viewing window is provided in the apparatus case of the solder printing apparatus. However, even if the operator visually observes the inside of the apparatus from the viewing window, sufficient confirmation cannot be made if the squeegee and the solder paste are far from the viewing window. In addition, the paste-like solder may be hidden by the squeegee, and the timing at which visual confirmation can be made is limited, causing a waiting time for the operator. Furthermore, visual observation from the viewing window is limited to a single direction, and confirmation from the reverse direction cannot be performed. Patent Document 1 and Patent Document 2 do not describe a method or means for performing high-accuracy confirmation by eliminating the above-described paste solder position restriction, confirmation timing restriction, and confirmation direction restriction.

  Further, as described above, the paste-like solder is supplied periodically, but the actual consumption of the paste-like solder depends on the area of the opening that varies depending on the type of the screen. Therefore, “shortage of solder” and “excessive solder” tend to occur in the prior art, and it is difficult to set the supply time appropriately. Moreover, the method for the operator to visually confirm the paste-like solder is complicated and time-consuming. Furthermore, since the paste solder supply operation is a non-production time, it is preferable that the supply time interval is long. However, if the interval of the supply timing is too long, “insufficient solder” occurs, causing problems such as faint printing on the board. On the other hand, if the interval of supply timing is too dense, the paste-like solder is excessively supplied onto the screen, resulting in “excess solder”. As a result, the paste-like solder leaks from the side surface of the squeegee and the amount of waste increases. In addition, a large amount of paste-like solder remains at the end of production, resulting in a decrease in yield.

  In this regard, the technique of Patent Document 2 measures the solder width at a plurality of points in the length direction of the squeegee, so that a certain effect is expected in the determination of the supply timing. However, the consumption amount of paste solder can be considered separately in the length direction of the squeegee, and the consumption amount can change depending on the position in the length direction. For example, when the squeegee moves on the screen, the number and size of openings that pass through may vary depending on the position in the length direction. In this case, the paste-like solder is remarkably consumed in a specific region passing through many or large openings in the length direction of the squeegee. At this time, it is preferable that the paste-like solder is supplied only to the specific region, or the paste-like solder is moved from both sides to the specific region by performing a sufficient kneading operation to equalize.

  In addition, for example, when the squeegee moves on the screen, the number and size of the openings may be generally uniform regardless of the position in the length direction. In this case, the paste-like solder is consumed substantially uniformly in each region in the length direction of the squeegee. At this time, there is no specific area, and the paste solder is supplied to the entire length of the squeegee. Thus, the consumption of paste solder depends on the length direction of the squeegee and also on the type of screen. For this reason, the technique of Patent Document 2 in which measurement is performed at a plurality of points in the length direction has a limit in improving the adjustment accuracy of the solder amount because the width of the solder is unknown at other points than the measurement point.

  In addition, it is difficult to determine whether the supply of paste solder is necessary or only the kneading operation is performed. In addition, it is difficult to optimize the number of times of the kneading operation regardless of whether or not the paste solder is supplied. The number of paste soldering operations to be performed should be the minimum necessary in consideration of non-production time. The determination method regarding the implementation of this kind of kneading operation is not disclosed in Patent Document 1 and Patent Document 2.

  The present invention has been made in view of the above-mentioned problems of the background art, and can easily and accurately confirm the paste-like solder spreading on the screen. Further, the supply timing and the supply area range of the paste-like solder can be appropriately set. It is an object to be solved to provide a solder printing apparatus that appropriately performs kneading and kneading operations to manage paste solder in a good state and contributes to labor saving.

  The invention of the solder printing apparatus according to claim 1, which solves the above problem, includes a squeegee for scraping and moving paste solder on a screen having an opening, a squeegee head on which the squeegee is mounted, the squeegee and the squeegee. A head moving unit that moves the ledge head in a direction parallel to the screen, and a squeegee head or an apparatus case. And a solder photographing camera for printing the paste solder on a substrate disposed under the screen.

  According to the invention of the solder printer according to claim 1, the solder photographing camera photographs the paste solder in conjunction with the movement of the squeegee and acquires the solder image data. For this reason, the camera for solder photography takes a picture at a timing when the paste-like solder moves to a position suitable for photography on the screen and is in a state suitable for photography, and provides solder image data suitable for checking the paste-like solder. You can get it. Therefore, based on this solder image data, the paste-like solder spreading on the screen can be easily confirmed with high accuracy.

It is a perspective view explaining notionally the composition of the solder printer of a 1st embodiment. It is a side view in the apparatus case which shows the detailed structure of the solder printing apparatus of 1st Embodiment. It is a block diagram which shows the structure of control of the solder printing apparatus of 1st Embodiment. It is a figure which illustrates typically printing operation of a solder printer, and shows the state where paste-like solder was supplied on the screen. FIG. 5 is a diagram illustrating an operation of moving the front squeegee downward at the start point in the forward movement direction following FIG. 4. FIG. 6 is a diagram illustrating a state in which a printing operation in the forward movement direction is started following FIG. 5. FIG. 7 is a diagram illustrating a state during the printing operation in the forward movement direction following FIG. 6. FIG. 8 is a diagram illustrating an operation of switching the front squeegee to the rear squeegee at the end point in the forward movement direction (start point in the backward movement direction) following FIG. 7. FIG. 9 is a diagram illustrating a state in which the printing operation in the backward movement direction is started following FIG. 8. FIG. 10 is a diagram illustrating an operation of switching the rear squeegee to the front squeegee at the end point in the backward movement direction following FIG. 9. FIG. 11 is a diagram illustrating a state in which the next substrate is carried in and the printing operation in the forward movement direction is started following FIG. 10. It is a figure explaining the imaging | photography method with which the camera for solder imaging | photography images the paste-like solder, and acquires the solder image data of a still image. It is a perspective view explaining notionally the composition of the solder printer of the example of application of a 1st embodiment. It is a figure explaining the plate for calibration used as a photographic subject when acquiring image data for calibration. It is a figure explaining the condition which image | photographs the plate for a calibration with the camera for solder imaging | photography, and acquires the image data for calibration. FIG. 4 is a diagram illustrating an example of solder roll shape data included in solder image data. FIG. FIG. 17 is a diagram showing a result of performing a conversion process on the shape data of the solder roll in FIG. 16 and showing an actual shape of the solder roll. It is a top view which illustrates and explains a printing range and a solder required area. It is another top view which illustrates and demonstrates a printing range and a solder required area | region. It is the figure which showed the favorable maximum shape of the solder roll. It is the figure which showed the favorable minimum shape of the solder roll. It is the figure which showed the solder short shape of the solder roll. It is the figure which showed the breadth insufficient shape of a solder roll. FIG. 24 is a diagram showing a solder roll incomplete spread elimination shape that has been improved by issuing kneading command information to the under spread shape in FIG. 23. It is the figure which showed the part solder short shape of the solder roll. It is the figure which showed the condition after issuing partial supply command information with respect to the partial solder short shape of FIG.

  A solder printing apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view conceptually illustrating the configuration of the solder printing apparatus 1 of the first embodiment. The solder printing apparatus 1 according to the first embodiment is incorporated in a board production line, loads a board, prints paste solder, and carries it out to a subsequent process. The solder printing apparatus 1 of the first embodiment includes two squeegees 21 and 22, a squeegee head 3, a head moving unit 4 (shown in FIG. 2), a solder photographing camera 5, a monitor device 6 (shown in FIG. 3), and a control unit. 7 (shown in FIG. 3), an apparatus case 8, and the like.

  The device case 8 is a box-shaped housing. Although the device case 8 is depicted as being seen through in FIG. 1, the device case 8 is actually made of six plates and partitions the inside of the device 1. The left back side is the front of the device case 8, the right front side is the back surface of the device case 8, the right back side is the substrate carry-in side, and the left front side is the substrate carry-out side. The direction in which the substrate is carried in / out is the X-axis direction, the front-rear direction of the device case 8 orthogonal to the X-axis direction is the Y-axis direction, and the vertical direction is the Z-axis direction. A substantially rectangular viewing window 81 is provided in front of the device case 8. The viewing window 81 is formed of a transparent resin, transparent glass, or the like, and also serves as a door that can be opened and closed. The operator can visually check the state of the inside of the device case 8 from the viewing window 81, and can perform various operations such as supplying solder inside the device case 8 by opening the viewing window 81.

  A rectangular thin plate-like screen Sc is supported horizontally in a replaceable manner near the lower part in the device case 8. A rectangular solder discharge port Sd elongated in the X-axis direction is formed inward of one side of the rear side of the screen Sc. The excessive paste-like solder on the screen Sc is discharged from the solder discharge port Sd. The front squeegee 21 and the rear squeegee 22 are moved by scraping the solder paste on the screen Sc. The front squeegee 21 and the rear squeegee 22 are mounted on the squeegee head 3 so as to be movable up and down. The head moving unit 4 omitted in FIG. 1 reciprocates the squeegee head 3 on which the front squeegee 21 and the rear squeegee 22 are mounted in the Y-axis direction in the horizontal direction parallel to the screen Sc.

  The solder photographing camera 5 is disposed in the vicinity of the upper corner on the back side in the apparatus case 8. The solder photographing camera 5 faces obliquely downward, and images the paste solder on the screen Sc. The solder photographing camera 5 acquires still image or moving image solder image data in a digital manner. The still image or moving image may be either a color image or a black and white image, but it is necessary to be able to distinguish the solder paste in the solder image data from the others. The solder photographing camera 5 preferably has an automatic illumination function, an automatic photographing function, and the like.

  FIG. 2 is a side view inside the device case 8 showing the detailed configuration of the solder printing device 1 of the first embodiment. As shown in the figure, screen support tables 82 and 82 are disposed on the front side and the rear side closer to the lower part than the intermediate height in the apparatus case 8, respectively. The screen Sc is supported across the two screen support tables 82 and 82. The screen Sc has a cross-sectional shape, and has an opening Sp corresponding to the position of a large number of pads (parts for soldering electronic components) formed in the circuit pattern of the substrate Kb. A substrate transfer unit 83 and a substrate holding unit 84 are provided at the bottom in the apparatus case 8. The substrate transport unit 83 loads the substrate Kb from the back side of the sheet of FIG. The substrate holding unit 84 holds the substrate Kb in close contact with a predetermined position on the lower surface of the screen Sc, and releases the substrate Kb when printing is completed. The substrate transport unit 83 transports the printed substrate Kb to the front side of the sheet of FIG.

  The front squeegee 21 and the rear squeegee 22 are thin plate-like members extending long in the X-axis direction (the front and back direction in FIG. 2). The front squeegee 21 and the rear squeegee 22 are mounted in parallel while being spaced apart from each other on the lower side of the squeegee head 3. As shown in FIG. 2, the front squeegee 21 and the rear squeegee 22 are arranged in an “eight” shape in a side view. The front squeegee 21 and the rear squeegee 22 preferably have a surface color that can be easily distinguished from paste solder. As will be described in detail later, one of the front squeegee 21 and the rear squeegee 22 moves up and the other moves down depending on the direction in which the squeegee head 3 reciprocates. The lowered squeegee comes into contact with the screen Sc at an adjusted inclination angle, and scrapes and moves the paste solder by sliding on the upper surface of the screen Sc.

  The squeegee head 3 includes a head main body 31, a front elevation drive unit 32, a front angle adjustment unit 33, a rear elevation drive unit 34, and a rear angle adjustment unit 35. The front angle adjustment unit 33 mounts the front squeegee 21 so that the inclination angle can be adjusted. A front raising / lowering drive unit 32 provided on the lower front side of the head main body 31 moves the front squeegee 21 up and down together with the front angle adjustment unit 33. The rear side angle adjustment unit 35 mounts the rear squeegee 22 so that the inclination angle can be adjusted. A rear raising / lowering drive unit 34 provided on the lower rear side of the head main body 31 moves the rear squeegee 22 up and down together with the rear side angle adjustment unit 35. Air pressure can be exemplified as a drive source of the front raising / lowering drive unit 32 and the rear raising / lowering drive unit 34, but is not limited thereto.

  The head moving unit 4 includes a screw shaft 41, a ball screw nut 42, a head drive motor 43 (shown in FIG. 3), a position sensor 44 (shown in FIG. 3), and the like. The screw shaft 41 extends in the Y-axis direction at the upper part in the device case 8. Further, a guide shaft (not shown) is provided in parallel with the screw shaft 41 at the same height position on the back side of the sheet of FIG. The ball screw nut 42 is fixed to the head body 31 of the squeegee head 3 and is screwed to the screw shaft 41. The head body 31 is movably mounted on the screw shaft 41 and the guide shaft, and the horizontal posture is maintained. The head drive motor 43 drives the screw shaft 41 to rotate. The head drive motor 43 is a servo motor, and can switch between forward rotation and reverse rotation and control the amount of rotation. As the position sensor 44, a combination of a linear scale provided on the guide shaft and an encoder provided on the head main body 31 and reading the linear scale can be exemplified, and the position sensor 44 is not limited to this.

  When the head drive motor 43 rotates forward or backward to rotate the screw shaft 41, the ball screw nut 42 advances or retracts with respect to the screw shaft 41. As a result, the entire squeegee head 3 reciprocates in the Y-axis direction together with the front squeegee 21 and the rear squeegee 22. Since the position of the squeegee head 3 in the Y-axis direction is detected by the position sensor 44, the positions of the front squeegee 21 and the rear squeegee 22 in the Y-axis direction are also found.

  An automatic solder supply unit 85 is provided above the front screen support 82 in the apparatus case 8. The automatic solder supply unit 85 includes a tubular container, a supply nozzle, a pressure supply mechanism, a moving mechanism, and the like. The tube-shaped container stores paste solder. The supply nozzle is provided downward at the lower end of the tubular container. The press supply mechanism presses the tube-shaped container and discharges paste solder from the supply nozzle. The moving mechanism moves the tube-shaped container, the supply nozzle, and the pressure supply mechanism in the X-axis direction when the supply nozzle is discharging paste-like solder. As a result, the automatic solder supply unit 85 supplies paste solder in a line along the X-axis direction at a predetermined Y-axis coordinate position on the upper surface of the screen Sc. The automatic solder supply unit 85 operates according to a command from the control unit 7 or operates for each preset number of substrates Kb. Note that in an apparatus configuration that does not include the automatic solder supply unit 85, the operator takes charge of solder supply work instead.

  The monitor device 6 (shown in FIG. 3) is communicatively connected to the control unit 7 using a communication cable. The location of the monitor device 6 is not particularly limited, and examples include the vicinity of the device case 8 and a monitoring location where an operator resides. The monitor device 6 may be a dedicated device for displaying solder image data. Alternatively, an operation screen for an operator to input an operation of the solder printing apparatus 1 may be used as the monitor device 6. The monitor device 6 is a general display device such as a liquid crystal display device.

  The control unit 7 controls each unit of the solder printing apparatus 1. FIG. 3 is a block diagram illustrating a control configuration of the solder printing apparatus 1 according to the first embodiment. As shown in the figure, the control unit 7 is configured by using a microprocessor having a central processing unit (CPU) 71 and operating by software. The control unit 7 further includes a volatile random access memory (RAM) 72, a nonvolatile read only memory (ROM) 73, a hard disk drive (HDD) 74, and an input / output interface 75. The control unit 7 controls each unit through the input / output interface 75 as described below.

  The control unit 7 issues a command to the substrate transport unit 83 and the substrate holding unit 84 to control the loading / unloading of the substrate Kb and the close contact holding on the lower surface of the screen Sc. The control unit 7 issues a command to the front elevation drive unit 32, the rear elevation drive unit 34, and the head drive motor 43, receives a detection signal from the position sensor 44, and controls the printing operation and the kneading operation. The control unit 7 issues a command to the automatic solder supply unit 85 to control the supply of paste solder onto the screen Sc.

  Further, the control unit 7 issues a photographing command to the solder photographing camera 5 in conjunction with the movement of the front squeegee 21 and the rear squeegee 22. When receiving the photographing instruction, the solder photographing camera 5 photographs the solder paste on the screen Sc and acquires solder image data. Next, the solder photographing camera 5 transfers the solder image data to the control unit 7. The control unit 7 temporarily stores the received solder image data in the random access memory 72 and stores it in the hard disk drive 74 for a long time.

  Then, the control unit 7 transfers the solder image data to the monitor device 6 for display. When the solder image data is a still image, the monitor device 6 may always display the solder image data acquired immediately before (automatic update display). Alternatively, when the operator selects and inputs a display request, the previous solder image data, the stored past solder image data, and other screens (for example, operation input screens) may be switched and displayed. On the other hand, when the solder image data is a moving image, it is displayed on the monitor device 6 in real time. In addition to the display of the solder image data, the model number and bar code of the paste solder Ps used, the outer shape image of the solder container, and the like may be displayed on the monitor device 6. Thereby, the convenience of an operator's solder replenishment work is achieved.

  Next, the printing operation of the solder printing apparatus 1 according to the first embodiment will be described using schematic diagrams. 4 to 11 are diagrams schematically illustrating a printing operation of the solder printing apparatus 1 and show a time-series flow. FIG. 4 shows a state in which the paste solder Ps is supplied on the screen Sc, and FIG. 5 shows an operation of moving the front squeegee 21 downward at the start point in the forward movement direction. 6 shows a state in which the printing operation in the forward direction is started, FIG. 7 shows a state in the middle of the printing operation in the forward direction, and FIG. 8 shows an end point in the forward direction (start point in the backward direction). ) Shows the operation of switching the front squeegee 21 to the rear squeegee 22. FIG. 9 shows a state where the printing operation in the backward movement direction is started, and FIG. 10 shows an operation of switching the rear squeegee 22 to the front squeegee 21 at the end point in the backward movement direction. FIG. 11 shows a state in which the next substrate Kb2 is carried in and the printing operation in the forward movement direction is started.

  In FIG. 4, the range in the front-rear direction (Y-axis direction) where the opening Sp of the screen Sc is located is the printing range R1. Further, the substrate Kb has already been tightly held at a predetermined position on the lower surface of the screen Sc by the substrate holding portion 84. Both the front squeegee 21 and the rear squeegee 22 are moving upward. Then, the automatic solder supply unit 85 supplies the paste solder Ps to the predetermined Y-axis coordinate position in front of the printing range R1 of the screen Sc. Then, as indicated by an arrow A1 in the drawing, the squeegee head 3 is driven further forward than the predetermined Y-axis coordinate position.

  As shown in FIG. 5, when the front squeegee 21 is positioned further forward than the paste solder Ps, the squeegee head 3 stops. The position shown in FIG. 5 is the starting point in the forward movement direction. The direction of movement of the screen Sc from the front side to the rear side is the forward movement direction, and the reverse direction is the backward movement direction. After the squeegee head 3 is stopped, the front squeegee 21 located behind the forward movement direction is moved downward (shown by an arrow A2), and the preparation for the printing operation is completed.

  As shown in FIG. 6, when the squeegee head 3 is driven toward the rear side (shown by an arrow A3), the front squeegee 21 moves while collecting the solder paste Ps. Then, the solder paste Ps that has reached the printing range R1 enters the opening Sp of the screen Sc. Thereby, the printing operation in the forward direction is performed. As shown in FIG. 7, during the printing operation in which the squeegee head 3 moves (indicated by arrow A4), the paste solder Ps extends in the length direction (X-axis direction) of the squeegees 21 and 22, and the squeegee. The width of the direction orthogonal to 21 and 22 becomes the solder roll Pr with substantially constant. Thereafter, the solder roll Pr is scratched by the squeegees 21 and 22 and moves on the screen Sc. The solder roll Pr is consumed little by little as it passes through the opening Sp and gradually thins.

  When the front squeegee 21 passes the printing range R1, the squeegee head 3 is stopped at the end point in the forward movement direction shown in FIG. Next, the front squeegee 21 is moved upward (indicated by arrow A5), and the rear squeegee 22 is moved downward to the rear side of the solder roll Pr (indicated by arrow A6). The end point in the forward movement direction is the starting point in the backward movement direction. Next, as shown in FIG. 9, the squeegee head 3 is driven toward the front side (shown by an arrow A7). Thereby, printing in the backward direction using the rear squeegee 22 is performed.

  When the rear squeegee 22 passes the printing range R1, the squeegee head 3 is stopped at the end point in the backward movement direction shown in FIG. Thus, the printing operation on the substrate Kb is completed, the substrate Kb is unloaded, and the next substrate Kb2 is loaded. The rear squeegee 22 is moved upward at the end point in the backward movement direction (indicated by arrow A8), and instead, the front squeegee 21 is moved downward to the front side of the solder roll Pr (indicated by arrow A9). The end point in the backward movement direction is the starting point in the second forward movement direction, and as shown in FIG. 11, the squeegee head 3 is driven toward the rear side (indicated by arrow A10), and the next printing operation on the substrate Kb2 is performed. Done.

  The start point in the second forward direction shown in FIG. 11 is closer to the printing range R1 than the start point in the first forward direction shown in FIG. That is, the range of movement of the squeegee head 3 is expanded when the supplied paste-like solder Ps is scraped, and the range of reciprocal movement of the squeegee head 3 is controlled in accordance with the printing range R1 during the printing operation. In the above description, the printing operation on the substrate Kb is completed by one reciprocation of the squeegee head 3, but the invention is not limited to this. That is, the printing operation may be terminated by one-way movement of the squeegee head 3, or the printing operation may be terminated by performing two reciprocations of the squeegee head 3.

  Actually, however, the printing operation does not proceed immediately after the paste solder Ps is supplied. This is because the paste solder Ps immediately after being supplied is not necessarily in a state or spread suitable for the printing operation. Therefore, the control unit 7 performs a kneading operation when the paste solder Ps is supplied. In the kneading operation, the same operation as the printing operation described in FIGS. 4 to 11 is repeated a plurality of times. However, the squeegee head 3 is reciprocated over a wide range of the screen Sc without being restricted by the printing range R1. At this time, the substrate Kb may be held in close contact with the lower surface of the screen Sc, and a dummy plate may be held in close contact instead of the substrate Kb if there is a concern about the adverse effects of overprinting. By the kneading operation, the softness of the paste solder Ps is secured, and the paste solder Ps is stretched in the length direction (X-axis direction) of the squeegees 21 and 22 to form a good solder roll Pr. Thereafter, the control unit 7 starts a regular printing operation.

  Next, a method of photographing the paste solder Ps (solder roll Pr) using the solder photographing camera 5 will be described. FIG. 12 is a view for explaining a photographing method in which the solder photographing camera 5 photographs the paste solder Ps to acquire still image solder image data. FIG. 12 actualizes the state of FIG. 8 and clarifies the positional relationship with the solder photographing camera 5. When in the state of FIG. 12, the control unit 7 issues a shooting command to the solder shooting camera 5. At this time, irregular control for moving up and down the squeegees 21 and 22 for photographing is not performed.

  In FIG. 12, the front squeegee 21, the rear squeegee 22, and the squeegee head 3 are located at the end points in the forward movement direction, and the rear squeegee 22 on the side facing the solder photographing camera 5 is moved upward. At this timing, the solder photographing camera 5 photographs the paste solder Ps (solder roll Pr) that spreads below the squeegee 22 after moving upward. Thereby, the solder photographing camera 5 is capable of photographing at the best timing when the paste solder Ps is closest and is temporarily stopped, and in addition, the rear squeegee 22 does not disturb the photographing field of view. Therefore, the solder image data in which the entire image of the paste-like solder Ps is large and clear can be obtained. The solder image data includes not only the whole image of the paste solder Ps but also the screen Sc, the squeegees 21 and 22 and a part of the squeegee head 3 in the field of view.

  The solder image data acquired by the photographing camera 5 is automatically updated and displayed on the monitor device 6 as described above. Therefore, the operator can easily confirm with high accuracy by looking at the still image of the paste solder Ps displayed on the monitor device 6. Further, the operator can check the latest state of the paste solder Ps at any time regardless of the current position of the squeegee head 3. Furthermore, the operator can confirm the paste-like solder Ps viewed from the back side, which cannot be obtained by visual inspection from the viewing window 81. Based on these confirmation results, the operator can manage the paste solder Ps in a good state by taking an appropriate action at an appropriate time. For example, in an apparatus configuration that does not include the automatic solder supply unit 85, the operator can check the paste-like solder Ps and determine whether “I will supply solder soon” or “I can print several boards yet”.

  In addition, the operator can check the situation on the back side that cannot be seen from the squeegee 21, 22 or the sight window 81 of the squeegee head 3 by looking at the display on the monitor device 6. For example, the operator can check the situation where the paste solder Ps hangs down from the squeegee 22 after moving up, or the situation where a part of the paste solder Ps is scattered and solidified on the squeegee head 3. These conditions can be accurately grasped by checking from both directions of the viewing window 81 and the photographing camera 5. Thereby, the possibility that a part of the paste solder Ps adheres to the back surface of the screen Sc, the substrate transport unit 83, the substrate holding unit 84, and the like can be reduced, and further, the quality deterioration of the paste solder Ps can be suppressed.

  When the solder photographing camera 5 acquires moving solder image data, it is preferable to perform photographing in the time zone of FIGS. 5 to 8 in which the rear squeegee 22 is moving upward. Alternatively, it is preferable to preferentially display the time zone of FIGS. 5 to 8 on the monitor device 6 even if the video is taken over the entire time zone. Thereby, the convenience of the operator who confirms the paste solder Ps can be aimed at. Even in the case of moving image solder image data, the state of the paste solder Ps and the back side can be confirmed in the same manner as in the case of a still image, and the same effect is produced.

  The solder printing apparatus 1 according to the first embodiment includes squeegees 21 and 22 for scraping and moving the paste solder Ps on a screen Sc having an opening Sp, a squeegee head 3 on which the squeegees 21 and 22 are mounted, and a squeegee 21. , 22 and the squeegee head 3 are provided on the squeegee head 3 or the apparatus case 8 for moving the squeegee head 3 in a direction parallel to the screen Sc, and the paste solder Ps is photographed in conjunction with the movement of the squeegees 21 and 22. A solder photographing camera 5 that acquires solder image data of a still image or a moving image, and paste-like solder Ps is printed on a substrate Kb disposed under the screen Sc.

  According to this, the solder photographing camera 5 photographs the solder paste Ps in conjunction with the movement of the squeegees 21 and 22, and acquires solder image data. For this reason, the solder photographing camera 5 performs photographing at a timing when the paste solder Ps moves to a position suitable for photographing on the screen Sc and is in a state suitable for photographing, and is suitable for checking the paste solder Ps. Solder image data can be acquired. Therefore, the paste solder Ps spreading on the screen Sc can be easily and accurately confirmed based on the solder image data.

  Furthermore, in the solder printing apparatus 1 according to the first embodiment, the head moving unit 4 reciprocates the squeegees 21 and 22 and the squeegee head 3 on the screen Sc, and the squeegees 21 and 22 and the squeegee head 3 reciprocate. At the timing at which the movement is located at the start point or the end point, the solder photographing camera 5 photographs the paste solder Ps and obtains still image solder image data.

  According to this, the solder photographing camera 5 can perform photographing at the timing when the paste solder Ps comes closest and temporarily stops. Therefore, the solder image data in which the paste-like solder Ps is large and clear can be obtained, and the paste-like solder Ps can be more accurately and easily confirmed.

  Furthermore, the solder printing apparatus 1 according to the first embodiment is mounted on the squeegee head 3 so as to be movable up and down, and one of the squeegee heads 3 moves up and down depending on the direction in which the squeegee head 3 reciprocates. A front squeegee 21 and a rear squeegee 22 for scraping and moving the paste solder Ps are provided. The rear squeegee 22 is located at the start or end point of the reciprocating movement and the side facing the solder photographing camera 5 is provided. At the timing of the upward movement, the solder photographing camera 5 photographs the paste solder Ps that spreads below the squeegee 22 after the upward movement.

  According to this, the solder photographing camera 5 can perform photographing at a timing at which the rear squeegee 22 does not disturb the photographing visual field. Therefore, solder image data in which the entire image of the paste-like solder Ps is shown is obtained, and the entire image of the paste-like solder Ps can be easily confirmed with high accuracy. Further, since irregular control for moving up and down the squeegees 21 and 22 for photographing is not performed, no time loss occurs.

  The solder printing apparatus 1 according to the first embodiment further includes a monitor device 6 that displays solder image data.

  According to this, the operator can easily perform high-accuracy confirmation by looking at the entire image of the large and clear paste-like solder Ps displayed on the monitor device 6. Further, the operator can check the latest state of the paste solder Ps at any time regardless of the current position of the squeegee head 3, and no waiting time occurs. Furthermore, the operator can confirm the state of the paste-like solder Ps viewed from the back side, which cannot be obtained by visual inspection from the viewing window 81. Based on these confirmation results, the operator can manage the paste solder Ps in a good state by taking an appropriate action at an appropriate time.

  In addition, the operator can check the situation on the back side that cannot be seen from the squeegee 21, 22 or the sight window 81 of the squeegee head 3 by looking at the display on the monitor device 6. These situations are accurately grasped from both directions of the viewing window 81 and the photographing camera 5, and are useful for improving the reliability of the printing operation and improving the printing quality.

  In the first embodiment, the solder photographing camera 5 may be disposed at another position in the apparatus case 8 or at a position shown in FIG. FIG. 13 is a perspective view conceptually illustrating the configuration of a solder printing apparatus 1A as an application example of the first embodiment. In the application example, the solder photographing camera 5A is provided in the squeegee head 3A. Although it is difficult for the solder photographing camera 5A to photograph the entire image of the paste solder Ps, a part of the paste solder Ps can be photographed largely.

  The monitor device 6 may be shared by a plurality of solder printing devices 1. In this case, the monitor device 6 displays a plurality of solder image data at the same time by the multi-window function, or sequentially switches and displays them by the automatic switching function. Alternatively, the monitor device 6 displays solder image data of a specific solder printing device 1 in accordance with an operator's selection operation. Conversely, the solder image data of one solder printing device 1 may be displayed on a plurality of monitor devices 6. In this case, for example, the control unit 7 and the plurality of monitor devices 6 are communicatively connected via a network.

  Furthermore, the control unit 7 of one or a plurality of solder printing apparatuses 1 can be connected to a higher management apparatus. According to this configuration, one or a plurality of solder printing apparatuses 1 can be controlled from the management apparatus. For example, by remote control from the management device, the shooting conditions of the solder shooting camera 5 are changed, the automatic solder supply unit 85 is started, or the monitor device 6 is manually guided to supply paste-like solder, A command to clean the screen Sc can be issued, or the solder printing apparatus 1 can be stopped.

  Next, a solder printing apparatus according to a second embodiment will be described with reference to FIGS. The solder printing apparatus of the second embodiment has the same apparatus configuration as that of the first embodiment, and the control content of the control unit 7 is different from that of the first embodiment. In 2nd Embodiment, the control part 7 emits the command information regarding management of the paste solder Ps based on the solder image data which image | photographed the whole image of the paste solder Ps. Further, the control unit 7 performs image processing on the solder image data, and the length L in a direction parallel to the squeegees 21 and 22 of the solder roll Pr formed so that the paste solder Ps is movably spread on the screen Sc. At least one of the width W, the surface area, and the volume in the direction orthogonal to the squeegees 21 and 22 is obtained, and command information is issued when at least one is less than a predetermined value. That is, in 2nd Embodiment, the control part 7 plays the role of the solder control part of this invention.

  In the second embodiment, the control unit 7 determines a shape data conversion processing method to be performed by image processing prior to a printing operation, and further sets a printing range R1 and a solder required region R2.

  Regarding determination of the shape data conversion processing method, the control unit 7 acquires calibration image data in advance. FIG. 14 is a diagram illustrating a calibration plate 9 used as a subject when acquiring calibration image data. The calibration plate 9 is a rectangular thin plate member having approximately the same size as the screen Sc. On the upper surface of the calibration plate 9, at least one of lines and symbols is drawn at regular intervals. In the example of FIG. 14, a large number of black circles 91 are drawn in a two-dimensional lattice pattern. Further, instead of the large number of black circles 91, lattice lines 92, only a part of which are shown in FIG. 14, may be drawn. The lattice line 92 is drawn by orthogonally intersecting two groups of parallel lines parallel at equal intervals.

  The calibration plate 9 is used by being placed on the screen Sc. Alternatively, the calibration plate 9 may be replaced with the screen Sc. FIG. 15 is a diagram for explaining a situation in which the calibration plate 9 (black circle 91 is not shown) is photographed by the solder photographing camera 5 to acquire calibration image data. As shown in the figure, most of the calibration plate 9 enters the imaging field 51 of the solder imaging camera 5. Therefore, when the calibration plate 9 is photographed by the solder photographing camera 5, most of the calibration plate 9 is shown in the acquired calibration image data.

  The control unit 7 calculates the resolution of each pixel of the solder photographing camera 5 and the resolution ratio in the X-axis direction and the Y-axis direction based on the calibration image data. The resolution is a measure representing how much area each pixel corresponds to on the calibration plate 9. The resolution ratio is a scale representing how much the length and width of each pixel are inclined with respect to the X-axis direction and the Y-axis direction, and how much the length corresponds.

  For example, in the field of view 51 shown in FIG. 15, the calibration plate 9 is inclined with respect to the solder photographing camera 5. Therefore, the calibration plate 9 is shown relatively large at the lower side of the imaging field 51, and the calibration plate 9 is shown at a lower level near the upper side of the imaging field 51. Such a change in the size of each part of the calibration plate 9 depending on the difference in the position of the imaging field of view 51 is taken as a change in the size of the black circle 91 or a change in the interval of the grid lines 92 and is represented by the resolution and the resolution ratio. Is done. The calculated resolution and resolution ratio can be applied to image processing performed on solder image data photographed in the same field of view 51.

  The control unit 7 determines a conversion processing method for image processing to be applied to the solder image data based on the resolution and the resolution ratio. Qualitatively, a conversion processing method is employed in which a relatively large portion is converted to a smaller size and a relatively small portion is converted to a larger size. Thereby, the control unit 7 performs a conversion process on the shape data of the solder roll Pr included in the solder image data, and calculates the actual shape of the solder roll Pr.

  FIG. 16 illustrates an example of the shape data of the solder roll Pr included in the solder image data. The apparent width WV of the solder roll Pr shown in the shape data is a width WV1 on the near side in the length direction, a width WV2 near the middle, and a width WV3 on the far side. In appearance, width WV1> width WV2> width WV3. Further, it is the apparent length LV of the solder roll Pr. The control unit 7 performs a conversion process on the shape data to obtain a conversion process result shown in FIG.

  FIG. 17 is a result of the conversion process performed on the shape data of the solder roll Pr shown in FIG. 16, and is a diagram showing the actual shape of the solder roll Pr. The control unit 7 performs the conversion process on the width WV1 on the near side in FIG. 16 to obtain the width W1 in FIG. Similarly, the control unit 7 performs conversion processing on the width WV2, the width WV3, and the length LV in FIG. 16 to obtain the width W2, the width W3, and the length L. The actual width W of the solder roll Pr is substantially constant as width W1≈width W2≈width W3. As in this example, the actual shape of the solder roll Pr can be calculated with high accuracy by the conversion processing method based on the resolution and the resolution ratio. The above-described conversion processing method is a specific example of a method for performing image processing on solder image data with reference to calibration image data.

  On the other hand, regarding the setting of the printing range R1 and the solder required region R2, the control unit 7 acquires screen image data in advance. The controller 7 causes the solder photographing camera 5 to photograph the screen Sc and obtains screen image data. The control unit 7 performs the above-described conversion process on the screen image data, and grasps the arrangement of the openings Sp of the screen Sc. Then, a range in which the opening Sp exists in the Y-axis direction orthogonal to the squeegees 21 and 22 is set as the printing range R1. Further, a range where the opening Sp exists in the length direction (X-axis direction) of the squeegees 21 and 22 is set as the solder required region R2.

  FIG. 18 is a plan view illustrating the printing range R1 and the necessary soldering area R2. In FIG. 18, the substrate Kb3 is held in close contact with the lower surface of the screen Sc3. Further, the rear squeegee 22 located at the start point in the backward movement direction and the solder roll Pr3 at that time are indicated by solid lines, and the front squeegee 21 located at the start point in the forward movement direction and the solder roll Pr4 at that time are indicated by broken lines. Yes. As shown in the figure, the screen Sc3 has 16 openings Sp in total. Among these, the printing range R13 is set by the opening Sp31 and the opening Sp32 that are farthest in the Y-axis direction. Furthermore, the solder required region R23 is set by the opening Sp33 and the opening Sp34 that are farthest in the length direction (X-axis direction) of the squeegees 21 and 22.

  FIG. 19 is another plan view illustrating the printing range R1 and the solder required region R2. In FIG. 19, the substrate Kb5 is held in close contact with the lower surface of the screen Sc5. Further, the rear squeegee 22 located at the start point in the backward movement direction and the solder roll Pr5 at that time are indicated by solid lines, and the front squeegee 21 located at the start point in the forward movement direction and the solder roll Pr6 at that time are indicated by broken lines. Yes. As shown in the drawing, the screen Sc5 has seven openings Sp in total. Among these, the printing range R15 is set by the opening Sp51 and the opening Sp52 that are farthest in the Y-axis direction. Furthermore, the solder required region R25 is set by the opening Sp52 and the opening Sp53 that are farthest in the length direction (X-axis direction) of the squeegees 21 and 22. As shown in the figure, the required solder region R25 is not necessarily located at the center of the screen Sc5 or the substrate Kb5.

  As another method for setting the printing range R1 and the solder required region R2, the control unit 7 may acquire information regarding the existence range of the opening Sp from CAD data or the like designed for the screen Sc. Further, instead of the printing range R1 and the solder required area R2, the entire area where the boards Kb3 and Kb5 exist, that is, the ranges of the Y-axis direction dimensions R13T and R15T of the boards Kb3 and Kb5, and the X-axis direction dimensions R23T and R25T. May be set (shown in FIGS. 18 and 19).

  After determining the shape data conversion processing method and setting the printing range R1 and the solder required region R2, the control unit 7 starts the printing operation. In the middle of the printing operation, the control unit 7 obtains the solder image data sequentially and calculates the shape of the solder roll Pr. The control unit 7 issues command information when at least one of the length L, width W, surface area, and volume of the solder roll is less than a predetermined value. In the second embodiment, the control unit 7 compares the two quantities of the length L and the width W of the solder roll with predetermined values.

  Without being limited thereto, the control unit 7 can obtain the surface area by adding (integrating) the width W of the solder roll Pr over the length direction of the squeegees 21 and 22 and compare it with a predetermined value. Further, if the width W of the solder roll Pr increases, the rising height of the solder roll Pr also increases, so there is a correlation between the width W and the volume. Using this, the control unit 7 can estimate the volume from the width W of the solder roll Pr and compare it with a predetermined value. Further, a plurality of solder photographing cameras 5 may be provided to acquire a plurality of solder image data, and the volume of the solder roll Pr may be estimated by an estimation calculation process and compared with a predetermined value.

  The predetermined value L0 related to the length L adds a margin to the X-axis direction dimensions R23T and R25 of the solder required area R2 (R23 and R25) and the boards Kb3 and Kb5 that change according to the types of the screen Sc and the board Kb, Set to variable. Moreover, the predetermined value regarding a surface area or a volume is also set variably. On the other hand, the predetermined value W0 relating to the width W is normally set to a constant value, and may be set and changed in response to changes in the inclination angles of the squeegees 21 and 22.

Next, a method for determining whether or not the control unit 7 issues command information based on the shape of the solder roll Pr will be described. There are the following three types of command information.
1) Necessary area supply command information: Command information for supplying the paste solder Ps to the entire required solder area R2 (R23, R25).
2) Partial supply command information: Command information for supplying paste solder Ps to a part of the squeegees 21 and 22 in the length direction (X-axis direction).
3) Kneading command information: Command information for kneading paste solder Ps by moving squeegees 21 and 22 a plurality of times.

In addition, when not setting solder required area | region R2 (R23, R25), it replaces with required area | region supply command information, and the control part 7 uses the following whole supply command information.
4) Whole supply command information: Command information for supplying the paste solder Ps to the entire area (R23T, R25T) where the substrates Kb3, Kb5 exist in the length direction (X-axis direction) of the squeegees 21, 22.

  The control unit 7 issues necessary area supply command information, partial supply command information, and overall supply command information to the automatic solder supply unit 85. According to the command information, the automatic solder supply unit 85 supplies the paste solder Ps on the screen Sc. In the case of an apparatus configuration that does not include the automatic solder supply unit 85, the control unit 7 displays necessary area supply command information, partial supply command information, and overall supply command information on the monitor device 6 to perform solder supply work to the operator. Prompt. After the paste solder Ps is supplied by automatic supply or manual supply, the control unit 7 issues kneading command information. In accordance with the kneading command information, the front elevating drive unit 32, the rear elevating drive unit 34, and the head drive motor 43 perform a kneading operation. The control unit 7 may issue kneading command information without supplying the paste solder Ps.

  20 to 26 are diagrams illustrating various shapes of the solder roll Pr. FIG. 20 shows a good maximum shape of the solder roll Pr11, and FIG. 21 shows a good minimum shape of the solder roll Pr12. Further, FIG. 22 shows a solder insufficient shape of the solder roll Pr13, and FIG. 23 shows an insufficiently expanded shape of the solder roll Pr14. FIG. 24 shows a shape of the solder roll Pr15 which is improved by issuing kneading command information with respect to the shape of the insufficiently spread shape of FIG. FIG. 25 shows a partial solder shortage shape of the solder roll Pr16, and FIG. 26 shows a situation after partial supply command information is issued for the partial solder shortage shape of FIG. The good maximum shape shown in FIG. 20 is indicated by a broken line in FIGS. 21 to 26 for reference.

  In FIG. 20, the length L11 of the solder roll Pr11 is equal to or greater than a predetermined value L0, and the width W11 is a good maximum width that is considerably larger than the predetermined value W0. The shape of the solder roll Pr11 is suitable for the printing operation, and the control unit 7 does not issue command information. The good maximum width substantially corresponds to the separation distance between the front squeegee 21 and the rear squeegee 22 on the screen Sc. Therefore, even if the paste-like solder Ps is supplied beyond the good maximum width, the surplus is discharged.

  In FIG. 21, the length L12 of the solder roll Pr12 is equal to or greater than a predetermined value L0, and the width W12 is equal to the predetermined value W0. The shape of the solder roll Pr12 is suitable for the printing operation, and the control unit 7 does not issue command information. Actually, the width W of the solder roll Pr often varies little by little along the X-axis direction. If the length L of the solder roll Pr is not less than the predetermined value L0 and the width W of each portion that varies along the X-axis direction is between the width W11 and the width W12, the shape of the solder roll Pr is printed. It is suitable for operation, and the control unit 7 does not issue command information.

  In FIG. 22, the length L13 of the solder roll Pr13 is not less than a predetermined value L0, but the width W13 is less than the predetermined value W0. The shape of the solder roll Pr13 is not suitable for the printing operation, and the total amount of paste solder Ps that forms the solder roll Pr13 is insufficient. Therefore, the control unit 7 issues necessary area supply command information or overall supply command information. Thereafter, when the paste solder Ps is supplied, the controller 7 issues kneading command information. By supplying and kneading the paste solder Ps, the solder roll Pr13 has a width W13 larger than the predetermined value W0 and is improved to a good shape suitable for the printing operation.

  In FIG. 23, the length L14 of the solder roll Pr14 is less than a predetermined value L0, and the width W14 is generally a good maximum width. The shape of the solder roll Pr14 is not suitable for the printing operation. Here, it can be estimated that the width W14 is considerably larger than the predetermined value W0, and the total amount of the paste solder Ps forming the solder roll Pr14 is not insufficient. Therefore, the control unit 7 issues kneading command information. When the kneading operation is performed according to the kneading command information, the shape of the solder roll Pr14 in FIG. 23 is improved to the shape of the solder roll Pr15 in FIG. The improved length L15 of the solder roll Pr15 is equal to or greater than the predetermined value L0 to eliminate the shortage of spread, and the width W15 is also ensured to be equal to or greater than the predetermined value W0.

  If the length L of the solder roll Pr is less than the predetermined value L0 and the width W is slightly larger than the predetermined value W0, the total amount of the paste solder Ps forming the solder roll Pr is insufficient. Can be estimated. In this case, the control unit 7 issues necessary area supply command information (or entire supply instruction information) or partial supply instruction information for supplying the paste solder Ps to the areas on both sides where the paste solder Ps is not present. Thereafter, when the paste solder Ps is supplied, the controller 7 issues kneading command information.

  In FIG. 25, the length L16 of the solder roll Pr16 is equal to or greater than the predetermined value L0, and the width W16 is also equal to or greater than the predetermined value W0 in most regions, but the width W16S is less than the predetermined value W0 in some regions. Yes. Therefore, the shape of the solder roll Pr16 is not suitable for the printing operation. Such a situation occurs when, for example, as shown in FIG. 18, the number and size of the openings Sp through which the squeegees 21 and 22 pass depend on the position in the X-axis direction. Here, when the kneading operation is performed, it is unclear whether or not the width W16 can be improved more than the predetermined value W0 in the entire region. Therefore, the control unit 7 issues partial supply command information.

  In accordance with the partial supply command information, the automatic solder supply unit 85 supplies the paste solder Ps16 to a partial region where the width W16S is less than the predetermined value W0. Then, the situation shown in FIG. 26 is reached, and the control unit 7 issues kneading command information. When the kneading operation is performed, the solder roll Pr16 has a width W16 that is equal to or greater than the predetermined value W0 in all regions and is uniformed, and is improved into a good shape suitable for the printing operation.

  If the width W16 is considerably larger than the predetermined value W0 in most of the areas and the kneading operation is performed, it may be estimated that the width W16 can be larger than the predetermined value W0 in all areas. In this case, the control unit 7 issues kneading command information without supplying the paste solder Ps16.

  In FIG. 25, the shape of the solder roll Pr16 can be improved even if the control unit 7 issues the necessary area supply command information and then issues the kneading command information. However, this method is not advantageous as compared with a method of issuing partial supply command information because it takes time to supply the paste solder Ps and further increases the number of reciprocating operations of the squeegees 21 and 22 for kneading.

  Further, the control unit 7 acquires the solder image data sequentially and calculates the shape of the solder roll Pr even during the kneading operation. The control unit 7 continues the kneading operation if any one of the length L and the width W of the solder roll Pr is less than the predetermined values L0 and W0. Then, the control unit 7 ends the kneading operation when both the length L and the width W of the solder roll Pr are recovered to the predetermined values L0 and W0 or more. The determination of continuation and termination of the kneading operation is not limited to the middle of the printing operation, and is also performed in the first kneading operation when starting to use the screen Sc.

  The solder printing apparatus according to the second embodiment further includes a control unit 7 (solder control unit) that issues command information related to the management of the paste solder Ps based on the solder image data.

  According to this, since the paste-like solder Ps is managed based on the command information issued by the control unit 7, it becomes easy to maintain the solder roll Pr in a good state. In addition, since the determination depending on the operator is unnecessary, the accuracy of management is improved and the labor saving is also achieved.

  Furthermore, in the solder printing apparatus according to the second embodiment, the control unit 7 performs image processing on the solder image data, and the squeegee 21 of the solder roll Pr formed so that the paste solder Ps is movably spread on the screen Sc. The length L in the direction parallel to 22, the width L in the direction perpendicular to the squeegees 21, 22, the surface area, and the volume of the length L and the width W are obtained, and either one of the two quantities is a predetermined value Command information is issued when L0 or less than W0.

  According to this, since the command information is issued based on the shape of the solder roll Pr, it becomes easy to maintain the solder roll Pr in a good shape suitable for the printing operation.

  Furthermore, in the solder printing apparatus according to the second embodiment, the calibration plate 9 on which lines or symbols are drawn at regular intervals is placed on the screen Sc, or is replaced with the screen Sc, and the solder photographing camera is placed. 5, the calibration plate 9 is photographed to obtain calibration image data in advance, and the control unit 7 performs image processing on the solder image data with reference to the calibration image data.

  According to this, since the actual shape of the solder roll Pr can be calculated with high accuracy based on the resolution and resolution ratio calculated from the calibration image data, the accuracy of the shape management of the solder roll Pr is remarkably improved.

  Furthermore, in the solder printing apparatus according to the second embodiment, the control unit 7 sets the solder required region R2 in the length direction of the squeegees 21 and 22 corresponding to the arrangement of the openings Sp, and according to the solder required region R2. The predetermined value L0 regarding the length is set variably.

  According to this, the solder required region R2 and the predetermined value L0 are variably set corresponding to the arrangement of the opening Sp where the paste solder Ps is consumed. For this reason, the paste solder Ps is not supplied to a useless position on the screen Sc. Therefore, there is no possibility that the paste-like solder Ps stays on the screen Sc for a long time to deteriorate the quality. In addition, the yield of the paste solder Ps is improved.

  In the solder printing apparatus of the second embodiment, when at least the width W13 is less than the predetermined value W0 among the length L13, the width W13, the surface area, and the volume of the solder roll Pr13, the control unit 7 Necessary area supply command information for supplying paste solder to the entire R2 is issued.

  In addition, in the solder printing apparatus according to the second embodiment, when at least one of the length L, the width W, the surface area, and the volume of the solder roll Pr is less than a predetermined value, the control unit 7 controls the substrate Kb3, The entire supply command information for supplying the paste solder Ps to the entire region (R23T, R25T) where Kb5 exists in the length direction of the squeegees 21, 22 may be issued.

  In addition, in the solder printing apparatus of the second embodiment, when the width W16S of the solder roll Pr16 is a part of the length direction of the squeegees 21 and 22 and is less than the predetermined value W0, the control unit 7 controls the squeegees 21 and 22. The partial supply command information for supplying the paste-like solder Ps16 to a part in the length direction is issued.

  According to these, the supply timing and supply area range of the paste solder Ps can be optimized, and determination depending on the operator is unnecessary. Therefore, errors due to visual confirmation by the operator and subjective influences can be eliminated, and the shape management accuracy of the solder rolls Pr13 and Pr16 is improved. As a result, “solder shortage” and “excessive solder” that occur in the prior art that regularly supplies paste-like solder do not occur in the second embodiment. In addition, the labor of the operator can be reduced, contributing to labor saving.

  Furthermore, in the solder printing apparatus of the second embodiment, when the width W of the solder roll Pr is less than a predetermined value W0 in a part of the length direction of the squeegees 21 and 22, and the length L14 of the solder roll Pr14 is predetermined. When at least one of the values is less than the value L0, the control unit 7 issues kneading command information for kneading the paste solder Ps by moving the squeegees 21 and 22 a plurality of times.

  According to this, only the kneading operation can be appropriately performed without performing the urgent supply of the paste solder Ps, and the determination depending on the operator is unnecessary. Therefore, the error and subjective influence due to the visual confirmation of the operator can be eliminated, and the shape management accuracy of the solder roll Pr14 is improved. In addition, the labor of the operator can be reduced, contributing to labor saving.

  Furthermore, in the solder printing apparatus according to the second embodiment, the paste solder Ps is supplied according to any one of the necessary area supply command information, the entire supply command information, and the partial supply command information, and then a plurality of squeegees 21 and 22 are provided. A kneading operation for kneading the paste solder Ps by moving it once, or a kneading operation according to kneading command information, and predetermined values L0, W0 among the length L, width W, surface area, and volume of the solder roll Pr. The kneading operation is terminated when at least one amount that is less than the value has recovered to a predetermined value L0, W0 or more.

  According to this, the number of times of the kneading operation for improving the shape of the solder roll Pr can be minimized, and the printing efficiency can be increased. Conventionally, the kneading operation is set to a certain number of times, and kneading more than necessary is apt to be performed redundantly. According to the second embodiment, the redundancy of the kneading operation can be eliminated.

  In the second embodiment, the surface area of the solder roll Pr has a high correlation with the total amount of the paste solder Ps. Therefore, if the surface area of the solder roll Pr is compared with a predetermined value, it can be accurately determined whether or not the total amount of the paste solder Ps is insufficient. Further, it is difficult to photograph the entire image of the solder roll Pr with the solder photographing camera 5A provided in the squeegee head 3A shown in FIG. In this case, the same processing as in the second embodiment can be performed on the range where the solder roll Pr is shown. For example, the width W of the solder roll Pr at the center in the length direction of the squeegees 21 and 22 can be calculated and compared with a predetermined value to determine whether or not the supply of paste solder is necessary.

  Furthermore, when the operation of the solder printing apparatus 1 is started or when the operation is resumed after the operation is interrupted, the operation reliability can be improved by using the solder photographing camera 5. For example, the direction of the printing operation can be correctly determined by photographing the screen Sc with the solder photographing camera 5 to acquire screen image data and confirming the position of the solder roll Pr. Further, the position of the squeegee head 3 can be correctly controlled corresponding to the position of the solder roll Pr. Normally, the solder printing apparatus 1 stores the state immediately before the stop, and correctly determines the direction of the printing operation and the position of the squeegee head 3 when the operation is started or when the operation is resumed. However, there is no risk of misjudgment when restarting after power is turned off, when switching the type of substrate Kb to be produced, or when manually supplying the paste solder Ps. This fear is surely eliminated by confirming the position of the solder roll Pr based on the screen image data.

  Also, for example, when the operation is started or the operation is resumed, the length L and the width W of the solder roll Pr are confirmed from the screen image data, and a “solder shortage” warning is issued when the value is less than the predetermined values W0 and L0. it can. According to this, it is possible to cope with a change in the shape of the solder roll Pr when the operation is interrupted, and no printing failure occurs. Various other modifications and applications of the present invention are possible.

DESCRIPTION OF SYMBOLS 1, 1A: Solder printer 21: Front squeegee 22: Rear squeegee 3, 3A: Squeegee head 31: Head main body 32: Front side raising / lowering drive part 33: Front side raising / lowering drive part 34: Rear side raising / lowering drive part 35: Rear side angle adjustment Unit 4: head moving unit 41: screw shaft 42: ball screw nut 43: head drive motor 44: position sensor 5, 5A: solder photographing camera 51: photographing field of view 6: monitor device 7: control unit 8: device case 81: Viewing window 83: Board transport section 84: Board holding section 85: Automatic solder supply section 9: Calibration plate 91: Black circle 92: Grid line Sc: Screen Sd: Solder discharge port Sp, Sp31 to Sp34, Sp51 to Sp53: Opening Part Ps, Ps16: Paste solder Pr, Pr3 to Pr6, Pr11 to Pr16: Solder roll Kb, Kb 2, Kb3, Kb5: Substrate R1, R13, R15: Printing range R23, R25: Solder required area W1-W3, W11-W16, W16S: Width of solder roll L, L11-L16: Length of solder roll W0: Solder Predetermined value for roll width L0: Predetermined value for solder roll length

Claims (13)

A squeegee that scrapes and moves paste solder on a screen having an opening;
A squeegee head on which the squeegee is mounted;
A head moving unit that moves the squeegee and the squeegee head in a direction parallel to the screen;
A solder photographing camera provided on the squeegee head or device case, photographing the paste solder in conjunction with the movement of the squeegee, and obtaining solder image data of a still image or a moving image, and under the screen A solder printing apparatus for printing the paste-like solder on a substrate disposed on the board. The head moving unit is configured to reciprocate the squeegee and the squeegee head on the screen,
2. The solder photographing camera captures still image solder image data by photographing the paste solder at a timing when the squeegee and the squeegee head are positioned at a start point or an end point of the reciprocating movement. Solder printing device. Two squeegees mounted on the squeegee head so as to be movable up and down, one of which moves up and down depending on the direction in which the squeegee head reciprocates and the other moves down and scratches the paste solder. With
At the timing when the squeegee head is positioned at the start point or end point of the reciprocating movement and the squeegee on the side facing the solder photographing camera is moved upward, the solder photographing camera moves below the squeegee that has moved upward. The solder printing apparatus according to claim 2, wherein the solder paste spreads in a picture.   The solder printing apparatus according to claim 1, further comprising a monitor device that displays the solder image data.   The solder printing apparatus according to any one of claims 1 to 4, further comprising a solder control unit that issues command information related to the management of the paste solder based on the solder image data.   The solder control unit performs image processing on the solder image data, and the length of the solder roll formed so that the paste-like solder spreads movably on the screen is parallel to the squeegee, orthogonal to the squeegee 6. The solder printing apparatus according to claim 5, wherein at least one amount is obtained from a width, a surface area, and a volume in a direction to perform, and the command information is issued when the at least one amount is less than a predetermined value. A calibration plate on which lines or symbols are drawn at regular intervals is placed on the screen or replaced with the screen, and the calibration plate is photographed with the solder photographing camera for calibration. Image data is acquired in advance,
The solder printing apparatus according to claim 6, wherein the solder control unit performs image processing on the solder image data with reference to the calibration image data.   The solder control unit sets a required solder area in a length direction of the squeegee corresponding to the arrangement of the opening, and variably sets the predetermined value according to the required solder area. The solder printing apparatus as described. When at least one of the length, width, surface area, and volume of the solder roll is less than the predetermined value,
The solder printing apparatus according to claim 8, wherein the solder control unit issues necessary area supply command information for supplying the paste-like solder to the entire solder required area. When at least one of the length, width, surface area, and volume of the solder roll is less than the predetermined value,
The solder printing apparatus according to claim 6 or 7, wherein the solder control unit issues overall supply command information for supplying the paste-like solder to an entire region where the substrate is present in a length direction of the squeegee. When the width of the solder roll is less than the predetermined value in a part of the length direction of the squeegee,
The solder printing apparatus according to any one of claims 6 to 8, wherein the solder control unit issues partial supply command information for supplying the paste-like solder to a part in a length direction of the squeegee. When the width of the solder roll is less than the predetermined value in a part of the length direction of the squeegee, and when at least one of the length of the solder roll is less than the predetermined value,
The solder printing apparatus according to any one of claims 6 to 8, wherein the solder control unit issues kneading command information for kneading the paste solder by moving the squeegee a plurality of times. The paste solder according to any one of claims 9 to 11, wherein paste solder is supplied according to the command information, and then the paste operation is performed by kneading the paste solder by moving the squeegee a plurality of times.
Alternatively, in claim 12, the kneading operation is performed according to the kneading command information,
A solder printing apparatus that terminates the kneading operation when at least one amount that is less than the predetermined value among the length, width, surface area, and volume of the solder roll is recovered to the predetermined value or more.

Images