JPWO2015099088A1 - Magnetic sensor, magnetic encoder using the same, lens barrel, camera, and method of manufacturing magnetic sensor - Google Patents

Abstract

Provided is a magnetic sensor with extremely high reliability in which peeling between a connection member and a wiring member does not easily occur.
The magnetic sensor 1 according to the present invention includes a support member 3 having an elastic portion that elastically supports the magnetic sensor element mounting portion 21;
A magnetic sensor element 5 provided on the magnetic sensor element mounting portion 21 for detecting and electrically outputting a magnetic field;
A flexible wiring member 7 electrically connected to the magnetic sensor element 5;
A connection member 9 for connecting the support member 3 and the wiring member 7;
And a cap member 11 provided at a position corresponding to the connection member 9 on at least the upper surface of the wiring member 7.

Description

  The present invention relates to a magnetic sensor for detecting a magnetic change, a magnetic encoder, a lens barrel, and a camera for detecting a moving direction or moving amount of a moving body or a rotation angle of a rotating body by a magnetic change, and manufacture of the magnetic sensor. Regarding the method.

  An encoder is used in a device or apparatus that needs to detect a movement direction, a movement amount, a rotation angle, or the like with high accuracy.

  For example, in a lens barrel of a camera, a lens group attached to a first lens barrel and a lens group attached to a second lens barrel are moved back and forth according to the relative rotation of the lens barrels. Moving. An encoder is used to detect the amount of movement. In particular, in a lens barrel for a single lens reflex camera, a magnetic encoder is attached to the peripheral surface of the lens barrel in order to detect a relative movement amount in the rotation direction of the lens barrel. By detecting the relative movement amount of the lens barrel in the rotation direction with the magnetic encoder, the relative movement amount of the lens barrel in the front-rear direction can be calculated, and focusing can be performed very accurately.

  The magnetic encoder is, for example, a magnetic scale (magnetic medium) in which different magnetization directions are magnetized at a constant pitch along the rotation direction on a magnetic material arranged on a sheet, and a magnetic sensor that relatively slides on the magnetic scale. And comprising. The lens barrel is provided with a magnetic scale along the rotation direction of the lens barrel, and the magnetic sensor relatively slides on the magnetic scale by rotating the lens barrel. At that time, the rotational movement amount of the lens barrel can be detected by detecting the change in the leakage magnetic field from the magnetic scale by the magnetic sensor.

  As such a magnetic encoder, a supporting member such as a leaf spring, a magnetic sensor element provided on the supporting member, a flexible wiring member connected to the magnetic sensor element, and the support For example, Patent Document 1 discloses a member including a member and a connecting member that connects the wiring member. As in Patent Document 1, in a conventional magnetic encoder, a supporting member such as a leaf spring and a wiring member are connected by a connecting member to fix the position of the magnetic sensor element.

JP 2006-317255 A

However, when the magnetic sensor is assembled to a lens barrel or the like, there is little space in the lens barrel, and it is often attempted to attach the wiring member to the lens barrel by forcibly bending or bending it. At this time, the wiring member is pulled, and a force is applied to peel off the wiring member from the connection member. As a result, the wiring member is peeled off from the connecting member, and the position of the magnetic sensor element at the tip may be displaced or the leaf spring may be bent. As a result, there is a problem that the position accuracy detected by the magnetic encoder is remarkably lowered or, in the worst case, the support member is deformed and the magnetic encoder fails and cannot be used.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable magnetic sensor in which peeling between a connecting member and a wiring member hardly occurs and a manufacturing method thereof. There is. The present invention also provides a magnetic encoder, a lens barrel, and a camera using the magnetic sensor.

In order to solve the above problems, one aspect of the present invention provides a support member having an elastic portion that elastically supports the magnetic sensor element mounting portion;
A magnetic sensor element provided in the magnetic sensor element mounting portion for detecting and electrically outputting a magnetic field;
A flexible wiring member electrically connected to the magnetic sensor element;
A connection member for connecting the support member and the wiring member;
And a cap member provided at a position corresponding to the connection member on at least the upper surface of the wiring member.

  In the magnetic sensor, in one aspect, the connection member and / or the cap member is a resin.

  In still another aspect, the resin constituting the connection member and / or the cap member is a photocurable resin.

  The photocurable resin is preferably an ultraviolet curable resin.

  In the magnetic sensor, the height of the cap member is preferably 0.1 mm or more.

  The magnetic sensor further includes a substrate having a wiring portion or a substrate having no wiring portion between the magnetic sensor element mounting portion and the magnetic sensor element, and the magnetic sensor element is provided on the substrate. May be.

  Preferably, the height of the connection member is 0.85 to 1.15 times the thickness of the substrate.

  In the magnetic sensor, a conductive resin layer is interposed between the magnetic sensor element and the substrate, and between the substrate and the support member, and a portion other than an electrical output terminal of the magnetic sensor element And the substrate may be fixed by the conductive resin layer, and the substrate and the support member may be fixed by the conductive resin layer.

  Another aspect of the present invention is a magnetic encoder including a magnetic scale and the above-described magnetic sensor capable of sliding relatively on the magnetic scale.

  Another aspect of the present invention is a lens barrel including the above-described magnetic encoder.

  Yet another aspect of the present invention is a camera including the lens barrel described above.

According to still another aspect of the present invention, a support member having an elastic portion that elastically supports the magnetic sensor element mounting portion, and a magnetic field provided in the magnetic sensor element mounting portion are detected and electrically output. A magnetic sensor element; a flexible wiring member electrically connected to the magnetic sensor element; a connection member connecting the support member and the wiring member; and at least an upper surface of the wiring member, A cap member provided at a position corresponding to the connection member, and a magnetic sensor comprising:
Fixing the magnetic sensor element and the support member;
Electrically connecting the magnetic sensor element and the wiring member;
Forming a connection member between the wiring member and the support member;
Forming a cap member at a position corresponding to the connection member.

The magnetic sensor further includes a substrate having a wiring portion between the support member and the magnetic sensor element,
In the method of manufacturing the magnetic sensor, the step of fixing the magnetic sensor element and the support member is a step of fixing the support member and the substrate, and further fixing the substrate and the magnetic sensor element. Yes,
The step of electrically connecting the magnetic sensor element and the wiring portion of the wiring member is a step of electrically connecting the magnetic sensor element and the wiring portion of the wiring member via the wiring portion of the substrate.

  In the method for manufacturing a magnetic sensor according to the present invention, the step of forming the connection member and the step of forming the cap member may be performed simultaneously.

  In the method of manufacturing a magnetic sensor according to the present invention, the step of forming the connection member and / or the step of forming the cap member includes a step of curing the liquid resin to form the connection member and / or the cap member. It may be.

  In the method of manufacturing a magnetic sensor according to the present invention, the resin preferably has a viscosity of 35,000 (mPa · s) or more.

  In the method for manufacturing a magnetic sensor according to the present invention, the step of forming the connection member and / or the step of forming the cap member may be performed by irradiating the ultraviolet curable resin with ultraviolet rays using an ultraviolet curable resin. It may be a step of curing and forming the ultraviolet curable resin.

  Furthermore, in the method for manufacturing a magnetic sensor according to the present invention, the step of forming the connection member and / or the step of forming the cap member includes a step of irradiating ultraviolet rays from both sides of the connection member and / or the cap member. It may be.

  In the method for manufacturing a magnetic sensor according to the present invention, a portion of the magnetic sensor element other than the electrical output terminal and the substrate are fixed with a conductive resin, and the substrate and the support member are connected with the conductive resin. It may be fixed by.

  According to the present invention, it is possible to provide a highly reliable magnetic sensor and a method for manufacturing the same, in which peeling between the connecting member and the wiring member hardly occurs. In addition, a magnetic encoder, a lens barrel, and a camera using this magnetic sensor can be provided.

FIG. 1 is a diagram illustrating the structure of a magnetic sensor according to an embodiment of the present invention. FIG. 1A is a top view of the magnetic sensor according to the embodiment, and FIG. 1B is a perspective view thereof. FIG. 2 is a schematic cross-sectional view taken along the line Y-Y ′ around the cap member used in the magnetic sensor according to the embodiment of the present invention shown in FIG. 1. FIG. 3 is a diagram for explaining a peeling phenomenon of a connection member in a conventional magnetic sensor. FIG. 4 is a diagram for explaining a phenomenon of suppressing peeling by a cap member in the magnetic sensor according to the present invention. FIG. 5 is a Z-Z ′ sectional view of the magnetic sensor according to the embodiment of the present invention shown in FIG. 1. FIG. 5A shows a state before the magnetic sensor according to the embodiment is attached to the lens barrel of the camera, and FIG. 5B shows the state after the magnetic sensor is attached to the lens barrel. Indicates the state. FIG. 6 is a perspective view of the lens barrel according to Embodiment 1 of the present invention. FIG. 7 is a perspective view showing another aspect of the magnetic sensor according to the first embodiment. FIG. 8 is a perspective view showing still another aspect of the magnetic sensor according to the first embodiment. FIG. 9 is a perspective view showing still another aspect of the magnetic sensor according to the first embodiment. FIG. 10 is a cross-sectional view showing a state where the magnetic sensor of FIG. 9 is attached to a lens barrel. FIG. 11 is a flowchart showing the entire manufacturing process of the magnetic sensor according to the first embodiment of the present invention. FIG. 12 is a schematic diagram illustrating a form of spot irradiation. FIG. 13 is a graph showing the relationship between the height of the cap member and the bonding strength (peel strength). FIG. 14 is a graph illustrating the height of the connecting member and the followability to the magnetic scale. FIG. 15 is a graph for explaining the relationship between the B-A dimension and the maximum pushing amount. FIG. 16 is a graph illustrating the relationship between the resin viscosity and the height of the cap member. FIG. 17 is a graph for explaining a method of determining a preferable lower limit value of ultraviolet irradiation. FIG. 17A shows the relationship between the radiation intensity and the adhesive strength, and FIG. 17B shows the relationship between the accumulated radiation amount and the adhesive strength. FIG. 18 is a graph for explaining how to determine a preferable upper limit value of ultraviolet irradiation. FIG. 19 is a graph showing the relationship between the applied voltage and the resistance change rate. FIG. 20 is a top view of the support member of the sensor according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. The same reference numerals appearing in a plurality of drawings indicate the same parts or members unless otherwise specified.
Hereinafter, a magnetic sensor according to an embodiment of the present invention, a magnetic encoder using the magnetic sensor, a lens barrel and a camera, and a method for manufacturing the magnetic sensor will be described in detail.

(1) Magnetic Sensor FIG. 1A is a top view of the magnetic sensor 1 according to Embodiment 1 of the present invention, and FIG. 1B is a perspective view thereof. The magnetic sensor 1 according to the first embodiment of the present invention includes a magnetic sensor element attachment portion 21 and a support member attachment main body portion 23, and the relative position between the magnetic sensor element attachment portion 21 and the support member attachment main body portion 23. The support member 3 is elastically deformed so as to change, the magnetic sensor element 5 provided on the support member 3 detects a magnetic field, and has flexibility (ie, flexibility) connected to the magnetic sensor element 5. The wiring member 7, the connection member 9 which connects the support member 3 and the wiring member 7, and the cap member 11 provided in the position corresponding to the connection member 9 on the upper surface of the wiring member 7 are provided. And In this case, the magnetic sensor element 5 and the magnetic sensor 1 are different members. The magnetic sensor 1 means the entire sensor device including the magnetic sensor element 5. On the other hand, the magnetic sensor element 5 is an element included in the magnetic sensor 1 and means, for example, an element that detects a leakage magnetic field from the magnetic scale. Further, the illustrated substrate 13 is not necessarily required, and an example in which the substrate 13 is not provided will be described later. Hereinafter, each component will be described in detail.

1. Cap Member and Connection Member The cap member 11 according to Embodiment 1 of the present invention is provided on the upper surface of the wiring member 7, and peels off the wiring member 7 from the connection member 9 provided below the wiring member 7. It is for preventing. In the first embodiment, the cap member 11 is provided on the upper surface of the wiring member 7. However, in the present invention, the cap member 11 prevents the wiring member 7 from being peeled off from the connection member 9. The cap member 11 may be provided in any position as long as it is in a possible position (that is, “position corresponding to the connection member 9” described later).

  2 to 4 are drawings for explaining the principle that the cap member 11 suppresses the peeling between the connection member 9 and the wiring member 7. The consideration about how the cap member 11 is suppressing peeling with the connection member 9 and the wiring member 7 is demonstrated in detail, using FIGS.

  FIG. 2 is a schematic cross-sectional view around the cap member 11 according to Embodiment 1 of the present invention. As shown in FIG. 2, a connection member 9 is provided so as to provide a gap between the wiring member 7 and the support member 3, and the wiring member 7 and the support member 3 are connected by the connection member 9. A cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. The cap member 11 is preferably in the shape of a cap that covers the connecting member on the wiring member as shown in the figure, but is not limited to this as will be described later.

  As a result of intensive studies on peeling between the wiring member 7 and the connection member 9, the present inventors have obtained the following knowledge. That is, as shown in FIGS. 3A to 3C, when the cap member 11 does not exist on the wiring member 7, the flexible wiring member 7 (free end side not fixed) is connected. When bending in the direction opposite to the side on which the member 9 is provided (that is, upward in FIGS. 3A to 3C), stress is applied to the outermost N of the joint portion between the connecting member 9 and the wiring member 7. Concentrate. Here, although the case where the wiring member 7 is bent upward with respect to the connection member 9 will be described, a force for peeling the wiring member 7 from the connection member 9 is applied to the wiring member 7 and / or the connection member 9. The wiring member 7 may be in any condition as long as the wiring member 7 is pulled by a force that pulls the wiring member 7 when connecting the terminals of the wiring member 7 or a force that the magnetic sensor 1 pulls the wiring member 7 during the encoder operation. This includes all situations where the wiring member 7 is deformed or tension is applied. When the stress exceeds the adhesive force between the connecting member 9 and the wiring member 7, as shown in FIG. 3B, the wiring member 7 starts to peel from the connecting member 9, and the wiring member 7 is further curved. As shown in 3 (c), the wiring member 7 moves away from the connection member 9. That is, when the cap member 11 is not provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9, the downward force (the main force of the cap member 11 pushing back the connection member 9 through the wiring member 7 is In the specification, there is no such force) (the reaction force by the cap member 11 or simply referred to as reaction force). Therefore, as shown in FIGS. 3B and 3C, a force that causes the wiring member 7 to be separated from the connection member 9 by bending the connection member 9 (in this specification, such a force is The stress caused by bending the wiring member 7 or simply stress is referred to as a stressed state.) The adhesive force between the connecting member 9 and the wiring member 7 (in the present specification, this is the case). The force is sometimes simply referred to as adhesive force), and force is applied in the direction away from the connection member 9 at the outermost portion N of the connection member 9 to cause separation between the connection member 9 and the wiring member 7. It's easy to do.

  However, as shown in FIG. 4A, the cap member 11 is provided on the upper surface of the wiring member 7 so as to match the end of the interface between the connecting member 9 and the wiring member 7. The effect that peeling with the member 7 does not occur easily is obtained. This will be described with reference to FIGS. First, as shown in FIG. 4A, the cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. Thereby, as shown in FIGS. 4B to 4C, even if the wiring member 7 is curved as described above, the reaction force due to the rigidity of the cap member 11 (the reaction force is indicated by M in FIG. 4). Therefore, the outermost part of the joint between the connection member 9 and the wiring member 7 (the magnetic sensor element 5 or the substrate 13 connected to the wiring member 7 out of the joint between the connection member 9 and the wiring member 7 is When used, the stress applied to N (the portion farthest from the substrate 13 provided with the magnetic sensor element 5) N (stress is indicated by P in FIG. 4) is the reaction force M by the cap member 11, the adhesive member, and the wiring member. 7 is less likely to exceed the combined force with the adhesive force 7 (the adhesive force is indicated by O in FIG. 4), and the connection member 9 and the wiring member 7 are less likely to be peeled off. Since the effect is that the reaction force M is applied in the direction in which the force is applied, when the force is applied upward as shown in FIGS. 4B to 4C, the end portion of the connecting member 9 and the cap member It is preferable that the end portions of 11 are at the same position or the end portion of the cap member 11 is outside the end portion of the connection member 9. Considering the force in the opposite direction, it is preferable that the end of the connection member 9 and the end of the cap member 11 are in the same position. In addition, in order to obtain an effect that makes it difficult to peel even with respect to the movement on the sensor side, it is preferable that not only the right end but also the left end be in the same position.

  Based on the above considerations, the present inventors have obtained the knowledge that peeling between the connecting member 9 and the wiring member 7 is reduced by providing the cap member 11 at a position corresponding to the connecting member 9. It has come to be completed.

  Therefore, the cap member 11 according to the first embodiment of the present invention is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. Here, the “position corresponding to the connection member 9 on the upper surface of the wiring member 7” means a projection view of the cap member 11 when the cap member 11 and the wiring member 7 are viewed from the upper surface of the wiring member 7. Means a position where at least a part of the projection of the connection member 9 overlaps. As described above, if the cap member 11 is located on the upper surface of the wiring member 7 and corresponds to the connection member 9, peeling between the wiring member 7 and the connection member 9 can be suppressed as described above. More preferably, the projected view of the cap member 11 curves in the outermost part of the joint portion between the wiring member 7 and the connecting member 9 (that is, the wiring member 7 is curved in the direction opposite to the connecting member 9 (ie, upward in FIG. 3)). In this case, the portion N that is most stressed is overlapped with the portion N so as to include the portion N. As described above, the projection view of the cap member 11 and the projection view of the connection member 9 are overlapped so as to include the portion N that receives the most stress as described above. The force works, and the separation between the wiring member 7 and the connection member 9 can be most effectively suppressed. However, if the outermost peripheral portion of the cap member 11 protrudes outside the outermost end R of the support member 3, the wiring member 7 should be routed and assembled, which should be avoided.

  Hereinafter, the details of the cap member 11 according to the first embodiment of the present invention will be described.

  If the cap member 11 and the connection member 9 according to Embodiment 1 of the present invention have sufficient rigidity on the bonding surface with the wiring member 7 so that a reaction force can be exerted on the connection member 9. Any material or connection form may be used. Moreover, each may be the same material or different materials. For example, at least one metal, alloy, ceramics, resin, rubber or the like can be used. For solids such as metals, alloys, and ceramics, an adhesive such as an epoxy resin or an adhesive tape may be used, or a resin mixed with metal or ceramics may be used. When the cap member 11 or the connecting member 9 is made of resin, it is preferable because it has rigidity, that is, has a large reaction force, is inexpensive, and can be easily formed at an arbitrary position. Further, when the cap member 11 and the connection member 9 are made of resin, the step of forming the cap member 11 and the step of forming the connection member 9 can be performed at the same time. Therefore, the cap member 11 and the connection member 9 can be efficiently formed. It is preferable because it can be formed. As metals, alloys, ceramics, resins, rubbers, and the like that can be used as the cap member 11 and the connection member 9, all of the currently known materials can be used. The resin will be described in detail in the next paragraph, and as an example of other materials, examples of the metal (metal includes an alloy) include stainless steel (SUS), aluminum, and phosphor bronze. Examples of the ceramic include silicon oxides such as alumina and silicon dioxide, mixed sintered bodies such as AlTiC, polycrystalline sintered bodies containing them, and glassy sintered bodies. These materials are preferable because they have a large reaction force particularly when used as the cap member 11 and / or the connection member 9.

  Moreover, when the cap member 11 and the connection member 9 are produced using resin, it is preferably used because it is inexpensive and can be easily formed at an arbitrary position. In addition, it is preferable to use a resin that has an appropriate strength and is elastically deformed as the connecting member because the connecting member made of the resin can relieve the tension applied to the wiring member. In addition, the cap member 11 and the connecting member 9 are made of different materials, or a process of assembling these members after making them in different processes is not necessary, and labor and cost can be reduced. It is preferable because the cap member 11 and the connection member 9 having sufficient rigidity on the bonding surface can be easily manufactured. As the resin, an acrylate resin, an epoxy resin, a phenol resin, a polyimide resin, or the like can be suitably used. Among them, an epoxy resin is preferable because of high rigidity after curing and small dimensional change due to temperature or the like. As a curing method, a thermosetting type, a photocuring type, or the like can be used. In particular, the photo-curing type is preferable because the curing time is short and it is not affected by the decrease in viscosity due to heat or the outflow of resin, and thus the above-described dimensions such as the height and diameter of the cap member can be easily maintained. Furthermore, since the curing time is short and the entire magnetic sensor can be manufactured in a short time, the manufacturing cost of the magnetic sensor can be reduced.

  The cap member 11 according to Embodiment 1 of the present invention may have any height as long as it has the above-described peeling suppression effect. Suitably, the lower limit of the height of the cap member 11 is 0.1 mm or more, more preferably 0.15 mm or more, and further preferably 0.20 mm or more. If the height of the cap member 11 is within such a range, the cap member 11 can apply a reaction force to the connection member 9. Further, the upper limit value of the height of the cap member 11 is not particularly limited, but if the height of the cap member 11 is too large, useless space is increased, so the upper limit value of the height of the cap member 11 is It is 0.40 mm or less, More preferably, it is 0.35 mm or less, More preferably, it is 0.30 mm or less. Here, the height of the cap member 11 means the maximum height of the cap member 11, that is, the height of the cap member 11 at a position where the height of the cap member 11 is maximum. The height of the cap member 11 is calculated by observing the cap member 11 from the side with a length measuring microscope and measuring the distance from the apex portion of the cap member 11 to the interface between the cap member 11 and the wiring member 7. .

  The cap member 11 according to Embodiment 1 of the present invention may have any diameter as long as it has the above-described peeling suppression effect. Here, the diameter of the cap member 11 means the diameter of an inscribed circle when the cap member 11 is viewed from above. Therefore, when the shape of the cap member 11 when viewed from the top is a substantially circular shape, the diameter of the cap member 11 corresponds to the diameter. Moreover, when the shape when the cap member 11 is viewed from above is a rectangular shape (including a square shape), it is the distance between the sides facing the rectangular shape.

  The diameter of the cap member 11 according to Embodiment 1 of the present invention and the diameter of the connection member 9 (the diameter of the connection member 9 in the portion where the connection member 9 and the wiring member 7 are in contact with each other). The ratio may be any value as long as it has the above-described peeling suppression effect, but preferably the ratio is 3: 1 to 1: 3, more preferably 2: 1 to 1: 2. Yes, and more preferably 1.5: 1 to 1: 1.5. If it exists in such a range, peeling with the connection member 9 and the wiring member 7 can be suppressed favorably. However, if the diameter of the cap member 11 is too larger than the diameter of the connection member 9, the cap member 11 may protrude from the outermost end R of the support member 3 as described above. Further, the wiring member 7 is difficult to bend, and the height of the cap member 11 is increased, so that a useless space is increased. If the diameter of the cap member 11 is too smaller than the diameter of the connecting member 9, the outermost portion of the joint portion between the connecting member 9 and the wiring member 7 (that is, the portion that receives the greatest stress when the wiring member 7 is curved). ), It is considered that the reaction force from the cap member 11 becomes difficult to work, and the wiring member 7 is easily peeled off from the connection member 9. In consideration of the force applied in accordance with the movement of the sensor element and the force applied in assembling the wiring member, it is preferable that the end surfaces of the cap member and the connecting member on both sides coincide, that is, the ratio is close to approximately 1: 1. Is preferred.

  When the cap member 11 is produced using a curable resin, preferably, the curable resin has a viscosity of 35,000 (mPa · s) or more in a liquid state immediately before curing, and more preferably 40, 000 (mPa · s) or more, and more preferably 45,000 (mPa · s) or more. If the viscosity of the liquid state of the curable resin is in such a range immediately before curing, it is preferable because the cap member 11 can be easily formed to have the above-described sufficient height. On the other hand, the upper limit of the viscosity of the liquid state of the curable resin immediately before curing is not particularly limited, but if the viscosity when applied with the liquid is too high, the application of the syringe or the like of the apparatus for applying the resin The productivity of the magnetic sensor 1 decreases, for example, it takes time to discharge from the mouth. Therefore, the viscosity of the liquid state of the curable resin when applied as a liquid is preferably 60,000 (mPa · s) or less, more preferably 55,000 (mPa · s) or less, and still more preferably, 53,000 (mPa · s) or less. Here, the curable resin includes a photocurable resin such as an ultraviolet curable resin, a thermosetting resin, and the like. The viscosity of the curable resin means the viscosity of the liquid resin before the curable resin is cured. If the viscosity of the curable resin in the liquid state immediately before curing and the liquid state at the time of application are in the above range, the productivity of the magnetic sensor 1 and thus the productivity of the magnetic encoder can be improved. Since the viscosity of the resin changes depending on the temperature, a photo-curing resin that can be adjusted in temperature at the time of coating or curing is preferred. In particular, ultraviolet rays are preferable because they have high energy in visible light, can be cured in a short time, and can be formed while maintaining a sufficient height.

  The cap member 11 according to the first embodiment of the present invention may be formed integrally with the wiring member 7 in the same process using the same material such as polyimide as the insulating portion of the wiring member 7, or the cap member 11 and the wiring The member 7 may be formed in a separate process, and the cap member 11 and the wiring member 7 formed in the separate process in this way may be bonded together by an adhesive means. Thus, by producing the cap member 11 and the wiring member 7 as separate bodies, the cap member 11 can be accurately arranged at a position corresponding to the connection member 9. As such an adhering means, any member may be used as long as the cap member 11 and the wiring member 7 can be bonded with appropriate strength, and examples thereof include a resin adhesive and a double-sided tape.

  The cap member 11 according to Embodiment 1 of the present invention may have any shape. For example, a mountain shape with a raised central portion as shown in FIG. 2 may be used. Such a shape is preferable because it can be easily formed, for example, by simply dropping and curing a resin or rubber. Examples of the shape of the other cap member 11 include a columnar shape, a polygonal prism shape, a conical shape, and a polygonal pyramid shape. In particular, when the contact surface of the cap member 11 with the wiring member 7 has a shape formed by a rounded curve such as a circle or an ellipse (for example, a columnar shape or a cone shape), the starting point is the corner. It is preferable because the cap member 11 is unlikely to break and the cap member 11 is unlikely to break.

  The cap member 11 according to Embodiment 1 of the present invention extends beyond the wiring member 7 to the connection member 9 provided on the lower side of the wiring member 7 while expanding in the width direction of the wiring member 7, and It may have a portion (hereinafter referred to as an extending portion, which is not shown in the drawing) connected to the member 9. Further, the connecting member 9 side may extend beyond the wiring member 7 and be coupled to the cap member 11. As a result, in addition to the effect of suppressing peeling due to the reaction force of the cap member 11 described above, the wiring member 7 and the connection member 9 are physically firmly connected by the extended portion, and the connection between the wiring member 7 and the connection member 9 Bonding strength can be improved. Such an extended portion may be made of the same material as the material of the cap member 11 and / or the connection member 9. The material of the extending portion, the material of the cap member 11, and the material of the connecting portion may be different. However, since the material and man-hours for forming the extended portion are required, it is preferable to form the cap member 11 and the connecting member 9 only without providing the extended portion, considering the manufacturing cost.

  As described above in detail, even if the wiring member 7 is curved as described above by providing the cap member 11 at a position corresponding to the connecting member 9 on the upper surface of the wiring member 7, the cap member When the reaction force of 11 acts, peeling between the connection member 9 and the wiring member 7 can be prevented. Therefore, it is possible to provide a magnetic sensor with extremely high reliability. If such a magnetic sensor is used in a magnetic encoder, the tension applied to the wiring member 7 due to peeling causes the support member 3 to be deformed. Since the distance between 1 and the magnetic scale does not change and the output of the magnetic sensor element does not change, it is possible to provide a magnetic encoder having a good position accuracy of the magnetic scale with respect to the magnetic sensor 1.

2. Support Member The support member 3 according to Embodiment 1 of the present invention is configured such that the magnetic sensor 1 is relative to a magnetic scale (hereinafter also referred to as a magnetic medium. The magnetic scale 32 is illustrated in FIG. 6 as will be described later). When the magnetic sensor element 1 and the magnetic scale are slid (that is, the magnetic sensor 1 may be slid with respect to the magnetic scale, or the magnetic scale may be slid with respect to the magnetic sensor 1). It is used so that the distance of 32 does not change. For example, in the situation where the magnetic sensor 1 is installed in the second lens barrel 37 so that the magnetic scale 32 is installed in the first lens barrel 35 and slides relative to the magnetic scale 32. As shown in FIG. 20, the support member 3 includes a magnetic sensor element attachment portion 21 to which the magnetic sensor element 5 is attached, a support member attachment main body portion 23 for attaching the support member 3 to the second lens barrel, Have Furthermore, you may have the elastic part 25 which connects the magnetic sensor element attachment part 21 and the support member attachment main-body part 23 elastically. Due to the action of the elastic portion 25, the support member 3 changes its relative position between the magnetic sensor element attachment portion 21 and the support member attachment main body portion 23, so that the distance between the magnetic sensor 1 and the magnetic scale is kept constant. Deform.

  Here, FIG. 5A shows a state before the magnetic sensor 1 according to the embodiment of the present invention is attached to the lens barrel of the camera, and FIG. 5B shows the magnetic sensor 1 as a lens mirror. The state after attaching to a cylinder is shown. In FIG. 5A, the magnetic sensor element 5 is not pressed by the magnetic scale and is not displaced. On the other hand, in FIG. 5B, the magnetic sensor element 5 is pressed by the magnetic scale 32 and displaced upward. In this state, the wiring member 7 is bent in a substantially S shape in a portion hidden by the fixing member for fixing the support member 3. Thus, the support member 3 can be elastically deformed so that the position of the magnetic sensor element attachment portion 21 changes relative to the position of the support member attachment main body portion 23 so that the magnetic sensor element 5 can be displaced in this manner. . By having such a configuration, the magnetic sensor element 5 can always be kept in contact with the magnetic scale 32 by the urging force of the elastic portion 25, so that the distance can be kept constant. Can be detected well.

  The elastic portion 25 may have any shape. For example, as shown in FIG. 1A, the width gradually decreases from the support member attachment main body portion 23 toward the magnetic sensor element attachment portion 21. The elastic portion preferably has a meandering shape. Since the elastic portion 25 has such a shape, the magnetic sensor 1 is pressed against the magnetic scale 32 while pressing the magnetic sensor 1 against the magnetic scale 32 via the magnetic sensor element mounting portion 21 bonded to the elastic member 25. When sliding, the distance between the magnetic sensor 1 and the magnetic scale 32 can be kept constant. This is preferable because the output is stable and the accuracy of the position detected by the magnetic sensor is high. The elastic portion 25 is a direction in which the magnetic scale 32 slides with respect to the magnetic sensor 1 or a direction in which the magnetic sensor 1 slides with respect to the magnetic scale 32 (hereinafter may be referred to as a sliding direction), that is, magnetic. It is preferable to provide the scale 32 and the magnetic sensor 1 in a direction in which the scale 32 and the magnetic sensor 1 move relative to each other. Holes 27 for fixing the support member mounting main body 23 are provided at both ends of the support member mounting main body 23, and the support member mounting main body 23 is connected to the second lens mirror of FIG. It can be fixed to the cylinder 37 or the like.

  The support member 3 according to Embodiment 1 of the present invention may be made of any material, but when the support member 3 is made of the same material, the material of the support member 3 is suitable. For these, metals or alloys are preferred. The support member 3 using a metal or alloy is formed by punching or etching, and may be further formed into a spring shape. However, in consideration of the cost of molding, it is preferable to form the spring so as to obtain a spring effect. In addition, it is preferable to use a metal or an alloy for the support member 3 because charging of the magnetic sensor element 5 can be suppressed. For example, by electrically connecting the magnetic sensor element and the support member 3 with a conductive resin or the like, the electricity generated in the magnetic sensor element 5 can be discharged through the through electrode and the support member 3. In addition, destruction of the magnetic sensor element 5 due to charging can be suppressed.

3. Magnetic Sensor Element and Substrate The magnetic sensor element 5 is for reading, for example, a magnetic signal from the magnetic scale 32 (for example, the relationship between voltage, time, and displacement is a signal having a waveform close to a sine curve). An actual magnetic signal may not be able to obtain sufficient strength due to an angle shift or a position shift of the magnetic sensor 1. For this reason, it is preferable that the magnetic sensor 1 is configured such that even if the magnetic sensor 1 is slightly shifted by combining a plurality of magnetoresistive films, the shift in signal intensity is reduced. The magnetic sensor element 5 may be any element as long as it can read a magnetic signal from the magnetic scale 32. As the magnetic sensor element 5, a known element such as a magnetic sensor having at least one magnetoresistive effect element described in, for example, Japanese Patent No. 5365744 can be used.

  In addition, the magnetic sensor 1 according to the first embodiment of the present invention may further include the substrate 13, but the substrate 13 is not necessarily required. For example, as described in FIG. 2 of Patent Document 1, it can be designed as appropriate according to the shape of the support member. As an example, as shown in FIG. 1, the substrate 13 is provided on the magnetic sensor element mounting portion 21 of the support member 3, and the magnetic sensor element 5 is provided on the substrate 13. The substrate 13 preferably has a wiring portion on the upper surface of the substrate 13. The magnetic sensor element 5 and the wiring portion of the substrate 13 are connected by wire bonding. In addition, the wiring of the wiring member 7 and the wiring portion of the substrate 13 are electrically connected. Thereby, an electric signal from the magnetic sensor element 5 is electrically output via the wiring portion of the substrate 13 and the wiring member 7.

  The substrate 13 preferably has a through electrode that conducts from the magnetic sensor element 5 to the support member 3. Since the magnetic sensor element 5 slides on the magnetic scale, it is easily charged. Therefore, as described above, the support member 3 is conductive, and the substrate 13 has a through electrode that conducts from the magnetic sensor element 5 to the support member 3, thereby suppressing breakage of the magnetic sensor element 5 due to charging. Can do.

  The magnetic sensor element 5 and the substrate 13 and the substrate 13 and the support member 3 may be fixed by any adhesive means, but are preferably fixed using a conductive resin. If conductive resin is used for fixing the magnetic sensor element 5 and the substrate 13 and fixing the substrate 13 and the support member 3, when the substrate 13 having the through electrode is used as described above, The charged electricity can be discharged through the through electrode, the conductive resin, and the support member 3. Thereby, like the above, destruction of the magnetic sensor element 5 due to charging can be suppressed.

4). Wiring member The wiring member 7 according to Embodiment 1 of the present invention is electrically connected to the magnetic sensor element 5 described above, thereby receiving a magnetic signal from the magnetic sensor element 5 and supplying power to the magnetic sensor element 5. It is also what supplies. The wiring member 7 may be used only for receiving a magnetic signal from the magnetic sensor element 5. Further, the wiring member 7 may be used only for supplying power to the magnetic sensor element 5.

  As described above, the substrate 13 is provided on the magnetic sensor element mounting portion 21 of the support member 3, the magnetic sensor element 5 is further provided on the substrate 13, and the magnetic sensor element 5 is electrically connected to the substrate 13. Yes. By connecting the wiring member 7 to the electrode of the substrate 13, the wiring member 7 is electrically connected to the magnetic sensor element 5. In addition, the wiring member 7 and the magnetic sensor 1 are fixed by physically connecting the wiring member 7 to the substrate 13. Therefore, the thickness of the wiring member 7 should just be the thickness which has the flexibility which does not inhibit the motion of the magnetic sensor element 5. FIG. Usually, the thickness is about 20 μm to 300 μm.

  Furthermore, as described above, the support member 3 and the wiring member 7 are connected by the connection member 9, thereby further fixing the wiring member 7 and the magnetic sensor 1. Thus, the wiring member 7 and the magnetic sensor 1 are fixed at least at two points.

  As long as the wiring member 7 can receive a magnetic signal from the magnetic sensor element 5 and / or supply power to the magnetic sensor element 5, any wiring member 7 can be used. More specifically, a plurality of electrically insulated wires, each using a flexible printed circuit (FPC) provided inside or on the surface of a flexible wiring board, may be used. Is preferred. The cross section of the wiring member 7 is preferably flat so that the cap member 11 can be easily placed.

(2) Magnetic Encoder Next, the magnetic encoder 31 will be described. A magnetic encoder 31 according to Embodiment 1 of the present invention includes a magnetic scale 32 and the above-described magnetic sensor 1 that can slide relatively on the magnetic scale 32. For example, as shown in FIG. 6, the lens group attached to the first lens barrel 35 and the lens group attached to the second lens barrel 37 respond to relative rotation between the lens barrels. As a magnetic encoder 31 for moving back and forth and detecting the amount of movement, the magnetic scale 32 is attached to the first lens barrel 35, the magnetic sensor 1 is attached to the second lens barrel 37, and the magnetic sensor 1 is attached. The one arranged so as to be slidable relative to the magnetic scale 32 is used. The magnetic scale 32 is, for example, the opposite magnetization direction along the direction in which the magnetic scale 32 slides with respect to the magnetic sensor 1 or the direction in which the magnetic sensor 1 slides with respect to the magnetic scale 32 (sliding direction). The two types of magnetized regions having the above are arranged alternately. For example, the magnetic scale 32 is provided in the lens barrel 30 along the rotation direction of the lens barrel 30, and the magnetic sensor 1 slides on the magnetic scale 32 by rotating the lens barrel 30, and the magnetic scale 32. The rotation angle of the lens barrel 30 can be detected by using the magnetic encoder 31 that detects the magnetic change from the magnetic sensor 31 in the lens barrel 30. Further, a camera using the lens barrel 30 is preferable because it can be used as a focal position correction means from the detected rotation angle.

  According to the magnetic encoder 31 according to the first embodiment of the present invention, since the cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9, the reaction force of the cap member 11 is reduced. By acting on the connection member 9 via the wiring member 7, peeling between the connection member 9 and the wiring member 7 can be suppressed. Therefore, a magnetic encoder with good positional accuracy can be provided. In addition, although the example of the rotary encoder formed in the lens barrel was shown, the linear encoder etc. which detect the moving amount | distance of the straight line of one direction are mentioned to others. Among them, a rotary encoder is preferable because the load to be pressed is limited to one point of the rotating body, and is not easily caught during sliding.

  In another aspect of the magnetic sensor 1 according to the first embodiment of the present invention, as shown in FIG. 7, the wiring of the wiring member 7 is directly connected to the magnetic sensor element 5 without the substrate 13. Also good. 1 includes the substrate 13 having the wiring portion, and the magnetic sensor element 5 and the wiring of the wiring member 7 are electrically connected via the wiring portion. 7 described with reference to FIG. 7 does not have the substrate 13 having the wiring portion, and the wiring of the wiring member 7 is directly connected to the magnetic sensor element 5. Different. In the aspect of FIG. 7, since the substrate 13 having the wiring portion is not provided, the magnetic sensor element 5 is directly mounted on the magnetic sensor element mounting portion 21, and the wiring member 7 is connected to the magnetic sensor element 5. . When the thickness of the magnetic sensor element mounting portion 21 is small, the magnetic sensor mounting portion 21 may have a structure having a pedestal thickness. Similarly to the above, the support member 3 and the wiring member 7 are connected by the connection member 9, and the cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. In the embodiment of FIG. 7, the substrate 13 having the wiring portion is not included, and the magnetic sensor element 5 is directly mounted on the magnetic sensor element mounting portion 21, so that the number of parts can be reduced and the cost can be reduced. . Further, when a resin substrate is used as the substrate 13 having the wiring portion, the total thickness accuracy of the magnetic sensor element and the resin substrate is only the thickness accuracy of the magnetic sensor element. The positional accuracy of the magnetic sensor element with respect to the support member is improved.

  Further, in still another aspect of the magnetic sensor 1 according to the first embodiment of the present invention, as shown in FIG. 8, the substrate 13 is provided, but the substrate 13 may not have a wiring part. In the aspect of FIG. 1 described above, the substrate 13 has a wiring portion, and the magnetic sensor element 5 and the wiring of the wiring member 7 are connected via the wiring portion, whereas in the aspect of FIG. Although the magnetic sensor 1 has the substrate 13 but the substrate 13 does not have a wiring portion, the magnetic sensor element 5 and the wiring of the wiring member 7 are directly connected by wire bonding 40. Different from the first aspect. In the embodiment of FIG. 8, the substrate 13 is attached on the magnetic sensor element attachment portion 21, and the magnetic sensor element 5 is attached on the substrate 13. A wiring member 7 is attached to the upper surface of the substrate 13 at a position close to the magnetic sensor element 5, and the wiring of the wiring member 7 and the magnetic sensor element 5 are connected by wire bonding 40. Similarly to the above, the support member 3 and the wiring member 7 are connected by the connection member 9, and the cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. In this aspect, since the wiring part is not included in the substrate 13 and the wiring member 7 and the magnetic sensor element 5 are connected by the wire bonding 40, it is not necessary to have the wiring part as the substrate 13. Since various materials can be used, an inexpensive material may be used, and the use of a material that can be processed with high accuracy improves the positional accuracy of the magnetic sensor element with respect to the support member after assembly.

  As shown in FIG. 9, as a support member 3 ′ different from the support member 3 described so far, as shown in FIG. 9, the magnetic sensor element mounting portion 21 is disposed so as to be displaced upward with respect to the support member mounting main body portion 23. The member 3 ′ may be used. At this time, the elastic portion 25 that elastically connects the magnetic sensor element mounting portion 21 and the support member mounting main body portion 23 is combined with the magnetic scale as the magnetic sensor 1 as a magnetic encoder. A force for pressing the magnetic sensor element 5 attached to the magnetic scale is applied. Since the magnetic sensor element mounting portion 21 is disposed so as to be displaced upward with respect to the support member mounting main body portion 23, when the magnetic sensor 1 is slid with respect to the magnetic scale, the support member mounting main body portion. Since the pressing force is applied by the elastic portion 25 without bringing the magnetic scale 23 closer to the magnetic scale than necessary, the contact between the magnetic sensor 1 and the magnetic scale is improved, and a highly reliable magnetic encoder can be obtained.

  When such a magnetic encoder including the magnetic sensor 1 is attached to the lens barrel, the magnetic sensor element 5 is pressed against the magnetic scale 32 as shown in FIG. Can be detected well. In order to increase the resolution, when the magnetization area per one is reduced, the leakage magnetic field is reduced, which is particularly effective in a magnetic encoder having a high resolution.

  The magnetic encoder including the magnetic sensor 1 according to Embodiment 1 of the present invention can be applied to a lens barrel as a rotary encoder as described above (see FIG. 6). In the magnetic sensor 1 according to the first embodiment of the present invention, as described above, the wiring member 7 is hardly peeled off from the connection member 9 by the cap member 11. When the wiring member 7 is easily peeled off from the connection member 9, if the wiring member 7 is sharply bent, the wiring member 7 is peeled off from the connection member 9, so that it is difficult to bend the wiring member 7 sharply. However, since the wiring member 7 is difficult to peel from the connection member 9 as described above, the wiring member 7 can be bent sharply. If the wiring member 7 is bent sharply in this way, dead space can be reduced and space saving can be achieved. Therefore, the lens barrel including the magnetic encoder including the magnetic sensor 1 according to the first embodiment can reduce the dead space included therein and can be made compact. Moreover, since a dead space can be reduced also about a camera provided with such a lens barrel, it can similarly be made compact.

(3) Manufacturing Method of Magnetic Sensor Hereinafter, a manufacturing method of the magnetic sensor according to Embodiment 1 of the present invention will be described. Although it demonstrates for every process using FIG. 11, each process does not have to be performed in the order described below. It will be understood that the steps may be interchanged to the extent possible.

I. Preparation of magnetic sensor element (step (a))
For example, a magnetic film pattern is formed on a silicon substrate, and a wiring pattern is formed. Thereafter, a protective film is formed on the wiring pattern. Thereafter, the silicon substrate on which the magnetic film pattern or the like is formed as described above is diced into individual pieces, and the magnetic sensor element 5 is manufactured. The size of the magnetic sensor element is, for example, 0.6 mm × 3 mm. The contact surface of the diced magnetic sensor element 5 may be chamfered. In this way, the magnetic sensor element 5 is prepared.
Moreover, you may prepare by purchasing such a magnetic sensor element 5. FIG.

II. Mounting of magnetic sensor element (process (b))
A single substrate 13 in which a plurality of through electrodes are formed in alignment is prepared. A plurality of magnetic sensor elements 5 obtained as described above are arranged in alignment on the single substrate 13. At this time, the through electrode and the magnetic sensor element 5 are arranged so as to be conductive and the directions of the magnetic sensor element 5 are aligned. When the magnetic sensor element 5 is fixed on the substrate 13, it is preferable to use a conductive resin (for example, a resin containing silver powder). As described above, charging of the magnetic sensor element 5 can be suppressed and the electrostatic withstand voltage is improved.

III. Wire bonding (process (c))
In order to establish conduction between the electrodes provided on the magnetic sensor element 5 and the electrodes of the substrate 13, these electrodes are electrically connected by wire bonding. Further, not only wire bonding but also bump connection may be used.

IV. Sealing and dicing with sealing resin (individualization) (step (d))
The above-described wire bonding portion is sealed with an insulating resin 15. Thereby, the unexpected contact between wires can be suppressed. Thereafter, the single substrate 13 is diced so as to include at least one magnetic sensor element 5 and is separated into individual pieces. The size of the substrate is, for example, 1.5 mm × 4.5 mm.

V. Mounting the separated substrate on the support member (step (e))
The separated substrate 13 is mounted on the magnetic sensor element mounting portion 21 of the support member 3. When the substrate 13 is fixed on the magnetic sensor element mounting portion 21 of the support member 3, it is preferable to use a conductive resin as described above. As described above, charging of the magnetic sensor element 5 can be suppressed and the electrostatic withstand voltage is improved.

VI. Bonding of flexible wiring board (process (f))
The flexible wiring board is connected to the electrode of the substrate 13 by soldering. Thereafter, an insulating resin 15 is applied to the connection portion to reinforce the terminal portion.

VII. Formation of Connection Member and Formation of Cap Member The connection member 9 is disposed between the wiring member 7 and the support member 3 to connect the wiring member 7 and the support member 3. Further, the cap member 11 is formed in a region corresponding to the connection member 9 on the upper surface of the wiring member 7. Specifically, as shown in FIG. 12, for example, an ultraviolet curable resin before curing, which is a raw material of the connection member 9, is disposed between the support member 3 and the wiring member 7, and further, on the upper surface of the wiring member 7. The same uncured ultraviolet curable resin is disposed in the region directly above the connecting member 9. Then, two or more light (for example, ultraviolet rays) irradiation devices 17 irradiate the raw material to be the cap member 11 and the connection member 9 from both sides. It is preferable that the crossing position of the irradiated light is in a portion to be the connection member 9 or the cap member 11. The irradiation angle is an angle that can be cured by reflection or refraction on the back side of the wiring member 7 when irradiated from an obliquely upward direction as shown in FIG. The emitted light may be parallel to the back surface of the wiring member 7. By setting in this way, the unreachable portion of light can be reduced and uncured resin can be reduced.

  As described above in detail, according to the method for manufacturing the magnetic sensor according to the first embodiment of the present invention, the cap member 11 is provided on the upper surface of the wiring member 7 at a position corresponding to the connection member 9. As a result, even if the wiring member 7 is bent as described above, the reaction force of the cap member 11 acts to suppress the separation between the connection member 9 and the wiring member 7.

  A magnetic sensor and a magnetic encoder were manufactured based on the embodiment of the present invention. Various experiments were performed on the magnetic sensor and the magnetic encoder thus manufactured, and the effect of providing the cap member 11 was confirmed.

(Relationship between cap member height and bonding strength (peel strength))
FIG. 13 is a graph showing the relationship between the height Hs of the cap member (cap height Hs) and the bonding strength (that is, peel strength) between the wiring member 7 and the connection member 9. The horizontal axis is the height Hs of the cap member, and the vertical axis is the peel strength. The unit of height Hs of the cap member on the horizontal axis is millimeter (mm), and the unit of peel strength is gram weight (gf).

  A flexible wiring board covered with polyimide was used as the wiring member 7. Moreover, the support member 3 as shown in FIG. 1 was produced using the copper plate as the support member 3. The support member 3 and the wiring member 7 were fixed by the connecting member 9, and the cap member 11 was formed at a position corresponding to the connecting member 9 on the upper surface of the wiring member 7. As the connection member 9 and the cap member 11, an ultraviolet curable epoxy resin was used.

  As shown in FIG. 13, the peel strength when the height of the cap member 11 was 0 mm, that is, when the cap member 11 was not present was 34 gf (333.2 mN) and 39 gf (382.2 mN). However, the peel strength increased as the height of the cap member 11 increased. Specifically, when the height of the cap member 11 is 0.104 mm, the peel strength is 71 gf (695.8 mN), whereas when the height of the cap member 11 is 0.20 mm, When the peel strength was 130 gf (1274 mN) and the height of the cap member 11 was 0.303 mm, the peel strength was 295 gf (2891 mN).

  From the above, it was confirmed that the peel strength is improved by providing the cap member 11. Further, it was confirmed that the peel strength became extremely high as the height of the cap member 11 was increased. In particular, when the height of the cap member 11 is 0.1 mm or more, the peel strength is at least 70 gf (686 mN) or more, which is about twice the peel strength 34 gf (333.2 mN) when the cap member 11 is not used. It was.

(Relationship between height of connecting member and followability of magnetic sensor element)
FIG. 14 is a graph showing the relationship between the height Ht of the connecting member 9 and the followability of the magnetic sensor element 5 to the magnetic scale 32. The horizontal axis is the height Ht of the connecting member 9, and the vertical axis is the followability of the magnetic sensor element 5 to the magnetic scale 32, that is, whether the magnetic sensor element 5 is in good contact with the magnetic scale 32 (good contact). It is shown that the contact between the magnetic sensor element 5 and the magnetic scale 32 is not good (the case where it is not in good contact is NG). When the magnetic sensor element 5 is in good contact with the magnetic scale 32, the output of the magnetic signal can be read well from the magnetic sensor element 5. On the other hand, when the magnetic sensor element 5 is not in good contact with the magnetic scale 32, the output of the magnetic signal from the magnetic sensor element 5 is remarkably lowered, and the output of the magnetic signal cannot be read.

  FIG. 14 shows the relationship between the height Ht of the connecting member 9 and the followability of the magnetic sensor element 5 to the magnetic scale 32 when the substrate thickness is 0.8 mm.

  As shown in FIG. 14, when the height Ht of the connecting member 9 is 0.71 mm or less, the magnetic sensor element 5 is not in good contact with the magnetic scale 32 and the magnetic signal from the magnetic sensor element 5 cannot be read. On the other hand, when the height Ht of the connecting member 9 is 0.72 mm or more, the magnetic sensor element 5 is in good contact with the magnetic scale 32 and the magnetic signal from the magnetic sensor element 5 can be read well.

Therefore, the height Ht of the connecting member 9 is preferably 0.72 mm or more. Here, since the substrate 13 itself has a variation of about ± 0.05 mm, the height Ht of the connecting member 9 is preferably about 0.67 mm or more. When the height Ht of the connection member 9 is divided by the substrate thickness of 0.8 mm and normalized, the height of the connection member 9 is 0.85 times or more the thickness of the substrate 13.
On the other hand, in order to save space, the height of the connection member 9 is preferably 1.15 times or less with respect to the thickness of the substrate 13.
From the above, it was found that the height of the connection member 9 / the thickness of the substrate 13 is preferably 0.85 to 1.15.
Furthermore, since the variation in the thickness of the substrate 13 described above is reduced by using a material with higher thickness accuracy, which is a substrate that does not have a wiring portion, the wiring portion is made of a material with higher thickness accuracy. It is preferable to use a substrate that does not have any. The height of the connecting member 9 is more preferably 0.9 times or more with respect to the thickness of the substrate 13, and further preferably 0.95 times or more. In another aspect, the height of the connection member 9 / the thickness of the substrate 13 is 0.85 to 1.15, as described above, regardless of whether or not the substrate 13 has a wiring portion. preferable.

(Relation between B-A dimension and maximum push-in amount)
FIG. 15A is a diagram for explaining the B-A dimension, and FIG. 15B is a graph showing the relationship between the B-A dimension and the maximum pushing amount. The maximum pressing amount is the maximum pressing amount when the magnetic sensor element 5 is in good contact with the magnetic scale 32. In FIG. 15B, the horizontal axis is the B-A dimension, and the vertical axis is the maximum pushing amount. The unit of the B-A dimension is millimeter (mm), and the unit of the maximum pushing amount is micrometer (μm).

  In FIG. 15A, the dimension B-A indicates the shortest distance between the connection member 9 and the sealing resin 15. That is, the dimension B-A corresponds to the length of a portion (movable portion) in which the wiring member 7 is not covered with the cap member 11, the support member 3, and the sealing resin 15 and can be bent freely.

  As shown in FIG. 15 (b), the maximum pushing amount increased as the B-A dimension increased. In particular, when the magnetic encoder is used in a lens barrel, the maximum push amount is required to be at least 500 μm. Therefore, it was found that the B-A dimension needs to be 2.5 mm or more in order to make the maximum pushing amount 500 μm or more.

(Relationship between resin viscosity and cap member height)
FIG. 16 is a graph showing the relationship between the resin viscosity and the height Hs. The horizontal axis is the resin viscosity, and the vertical axis is the height. The unit of resin viscosity is millipascal second (mPa · s), and the unit of height is millimeter (mm).

  It was found that the height increases as the resin viscosity increases. In particular, when the resin has a viscosity of 35,000 (mPa · s) or more, the height can be 0.20 mm or more within a diameter range that does not exceed the width of the wiring member. It was found that it was preferable to be 1,000 (mPa · s) or more. Here, the viscosity of the resin means the viscosity of the resin before curing.

(Relationship between radiation intensity or accumulated radiation amount and adhesive strength)
FIG. 17A is a graph showing the relationship between radiation intensity and adhesive strength. The horizontal axis is radiation intensity, and the vertical axis is adhesive strength. The unit of radiant intensity is milliwatt / square centimeter (mW / cm ² ), and the unit of adhesive strength is gram weight (gf).

FIG. 17B is a graph showing the relationship between the integrated radiation amount and the adhesive strength, which is obtained by converting the radiation intensity into an integrated radiation amount. The horizontal axis is the integrated radiation amount, and the vertical axis is the adhesive strength. The unit of the integrated radiation amount is millijoule / square centimeter (mJ / cm ² ), and the unit of the adhesive strength is gram weight (gf).
As the resin, an ultraviolet curable epoxy resin was used as described above.

As shown in FIG. 17 (a), until the radiation intensity 1000 mW / cm ² (rises to about 235gf (2303mN)) adhesive strength according to the radiation intensity is increased is increased and exceeds the radiation intensity 1000 mW / cm ² The bond strength decreased as the radiation intensity increased. Further, as shown in FIG. 17B, the adhesive strength increases as the integrated radiation amount increases up to the integrated radiation amount of 3000 mJ / cm ² (increases to about 235 gf (2303 mN)), and the integrated radiation amount increases. As a result, the adhesive strength decreased.

From FIG. 17 (a), it was found that a radiation intensity of 500 mW / cm ² or more is necessary to obtain sufficient strength (150 to 170 gf (1470 to 1666 mN)) in this ultraviolet curable epoxy resin. . Also, from FIG. 17B, it was found that an integrated radiation amount of 1500 mJ / cm ² or more is necessary.

(Relationship between irradiation time and adhesive strength)
FIG. 18 is a graph showing the relationship between irradiation time and adhesive strength. The horizontal axis is irradiation time, and the vertical axis is adhesive strength. The unit of irradiation time is seconds (s), and the unit of adhesive strength is gram weight (gf). In the region where the irradiation time is 0 to 3 seconds, the adhesive strength increases as the irradiation time becomes longer (from 144 gf (1411.2 mN) to 226 gf (2214.8 mN)). In the region where the irradiation time is 3 to 15 seconds, the adhesive strength is substantially constant and is included in the range of 220 gf (2156 mN) to 250 gf (2450 mN). In the region where the irradiation time is 15 to 20 seconds, the adhesive strength decreases as the irradiation time becomes longer (from 224 gf (2195.2 mN) to 60 gf (588 mN)).

  Accordingly, FIG. 18 indicates that the irradiation time is preferably 3 to 15 seconds in order to ensure high adhesive strength (220 gf (2156 mN) to 250 gf (2450 mN)).

(Relationship between applied voltage and resistance change rate)
FIG. 19 is a graph showing the relationship between the applied voltage and the resistance change rate. The horizontal axis is applied voltage, and the vertical axis is resistance change rate. The unit of applied voltage is kilovolt (kV), and the unit of resistance change rate is percent (%).

  As shown in FIG. 19, a circle indicates the present invention, and a circle indicates a conventional product. Specifically, according to the present invention, a magnetic sensor in which a magnetic sensor element is fixed using a conductive resin through a substrate having a through electrode at a magnetic sensor element mounting portion of the support member, and a conventional product, Comparison was made with a magnetic sensor in which a magnetic sensor element was fixed using an insulating resin through a substrate having no through electrode in the magnetic sensor element mounting portion. For conventional products, the resistance change rate decreases when the applied voltage exceeds 0.6 kV. On the other hand, in the present invention, the rate of change in resistance does not decrease until the applied voltage is 0.9 kV, and is kept constant (about 12.3%). Therefore, it was found that the present invention has high applied voltage tolerance.

(About the material of the cap member)
When SUS304 was used as the cap member, the plate-shaped member was cut out into a circular shape, and aligned with the projection surface of the connecting member and adhered with a resin, the same effect as in the above-described embodiment was obtained.

DESCRIPTION OF SYMBOLS 1 Magnetic sensor 3 Support member 5 Magnetic sensor element 7 Wiring member 9 Connection member 11 Cap member

Claims (19)

A support member having an elastic portion for elastically supporting the magnetic sensor element mounting portion;
A magnetic sensor element provided in the magnetic sensor element mounting portion for detecting and electrically outputting a magnetic field;
A flexible wiring member electrically connected to the magnetic sensor element;
A connection member for connecting the support member and the wiring member;
And a cap member provided at a position corresponding to the connection member on at least the upper surface of the wiring member.   The magnetic sensor according to claim 1, wherein the connection member and / or the cap member is a resin.   The magnetic sensor according to claim 2, wherein the resin constituting the connection member and / or the cap member is a photocurable resin.   The magnetic sensor according to claim 3, wherein the photocurable resin is an ultraviolet curable resin.   The magnetic sensor according to claim 1, wherein a height of the cap member is 0.1 mm or more.   The substrate according to claim 1, further comprising a substrate having a wiring portion or a substrate having no wiring portion between the magnetic sensor element mounting portion and the magnetic sensor element, wherein the magnetic sensor element is provided on the substrate. The magnetic sensor in any one.   The magnetic sensor according to claim 6, wherein a height of the connection member is 0.85 to 1.15 times the thickness of the substrate.   A conductive resin layer is interposed between the magnetic sensor element and the substrate, and between the substrate and the support member, and a portion other than an electrically output terminal of the magnetic sensor element and the substrate are The magnetic sensor according to claim 6, wherein the magnetic sensor is fixed by the conductive resin layer, and the substrate and the support member are fixed by the conductive resin layer.   A magnetic encoder comprising: a magnetic scale; and the magnetic sensor according to any one of claims 1 to 8, which is slidable on the magnetic scale.   A lens barrel comprising the magnetic encoder according to claim 9.   A camera comprising the lens barrel according to claim 10. A support member having an elastic portion that elastically supports the magnetic sensor element mounting portion, a magnetic sensor element provided in the magnetic sensor element mounting portion for detecting and electrically outputting a magnetic field, and electric power to the magnetic sensor element Connected flexible wiring member, connecting member connecting the support member and the wiring member, and a cap provided at a position corresponding to the connecting member on at least the upper surface of the wiring member A magnetic sensor comprising a member,
Fixing the magnetic sensor element and the support member;
Electrically connecting the magnetic sensor element and the wiring member;
Forming a connection member between the wiring member and the support member;
Forming a cap member at a position corresponding to the connection member. The magnetic sensor further includes a substrate having a wiring portion between the support member and the magnetic sensor element,
In the method of manufacturing the magnetic sensor, the step of fixing the magnetic sensor element and the support member is a step of fixing the support member and the substrate, and further fixing the substrate and the magnetic sensor element. Yes,
The step of electrically connecting the magnetic sensor element and the wiring portion of the wiring member is a step of electrically connecting the magnetic sensor element and the wiring portion of the wiring member via the wiring portion of the substrate. Item 13. A method for manufacturing a magnetic sensor according to Item 12.   The method of manufacturing a magnetic sensor according to claim 12 or 13, wherein the step of forming the connection member and the step of forming the cap member are performed simultaneously.   15. The step of forming the connection member and / or the step of forming the cap member is a step of curing the liquid resin to form the connection member and / or the cap member. Manufacturing method of magnetic sensor.   The method of manufacturing a magnetic sensor according to claim 15, wherein the resin has a viscosity of 35,000 (mPa · s) or more.   The step of forming the connecting member and / or the step of forming the cap member is a step of using an ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays to cure the ultraviolet curable resin. The manufacturing method of the magnetic sensor of Claim 15 or 16.   The process of forming the said connection member and / or the process of forming the said cap member are the processes of irradiating an ultraviolet-ray from the both sides of the said connection member and / or the said cap member. Manufacturing method of magnetic sensor.   The part other than the electrical output terminal of the magnetic sensor element and the substrate are fixed with a conductive resin, and the substrate and the support member are fixed with a conductive resin. The manufacturing method of the magnetic sensor as described in 1.

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