JPWO2015046376A1 - Thin section sample preparation device and thin section sample preparation method - Google Patents

Abstract

The thin-section sample preparation device 100 starts from the cutting of the transport unit 1 that transports the sample block 20, the cutting unit 4 including the cutter 41, and the cutting of the sample block 20 until the cutting of the sample block 20 is completed. 1 includes an abnormality detection unit 3 that detects cutting abnormality and a control unit 10 that controls at least the conveyance unit 1. The control unit 10 starts cutting the sample block 20 by relatively moving the cutter 41 and the sample block 20 by the transport unit 1, and stops the transport operation of the transport unit 1 when a cutting abnormality is detected. Then, the cutting of the sample block 20 by the cutter 41 is stopped.

Description

  The present invention relates to a thin-section sample preparation apparatus and a thin-section sample preparation method for preparing a thin-section sample used for physicochemical sample analysis, microscopic observation of a biological sample and the like.

  2. Description of the Related Art Conventionally, a microtome is widely known as an apparatus for producing a thin slice sample used for physicochemical sample analysis or microscopic observation of a biological sample. A microtome is an apparatus for producing a thin slice by slicing a surface layer portion of a sample block in which a sample such as a biological sample of an animal is embedded (embedded) in an embedding agent such as paraffin by a cutter (for example, Patent Documents 1 to 5).

JP2012-229993A JP2012-229994A JP 2012-229995 A JP2012-229996A JP 2012-229997 A

  Here, among the samples embedded in the embedding agent, there is a sample related to a very small biopsy tissue. For example, the tissue collected by needle biopsy may have a diameter of about 0.5 mm to 5 mm. A sample related to such a biopsy tissue is very fine and a small amount is ingested, so that it is an extremely valuable subject in a pathological diagnosis site or the like. Therefore, such a sample should not be lost at the site.

  However, when starting to slice a sample block that embeds such a small biopsy sample as described above, the depth of the cutter that cuts the sample block becomes larger than the set depth for some reason. That is, there is a case where deep cutting is performed. When deep cutting occurs, the cutter passes a position deeper than the position where the biopsy sample or the like is embedded, or cuts the sample at a position lower than the original cutting position. However, conventionally, it has been impossible to detect cutting abnormalities such as abnormal cutting depths during cutting. For this reason, the cutting operation is completed while cutting abnormality such as deep cutting occurs.

  Here, in the thin cutting, in addition to the main cutting that cuts out the thin slice sample necessary for preparing the sample, the rough cutting for chamfering the sample or the thickness of the thin slice sample obtained by the main cutting before the main cutting is performed. There is a cut-off to make uniform. The sample sliced by the main cutting is affixed to the slide glass, but the sample sliced by rough cutting or discarding is peeled off from the sample block and discarded as it is. When cutting abnormality occurs, there is a possibility that the specimen is included in the discarded sample, and as a result, there is a problem that the biopsy specimen which is a very valuable specimen may be lost. Moreover, even if not discarded, the biopsy sample is damaged by being cut at the wrong position, and it is not easy to restore it.

  Accordingly, an object of the present invention is to provide a thin-section sample preparation device and a thin slice sample preparation device that detect cutting abnormalities such as abnormal cutting depths between the start of cutting of a sample block and the completion of cutting of the sample block. The object is to provide a method for preparing a section sample.

  In order to achieve the above object, a thin-section sample preparation device according to one embodiment of the present invention is a thin-section sample in which a sample block in which a sample is embedded in an embedding agent is sliced with a cutter to prepare a thin-section sample. A manufacturing apparatus, a conveyance unit that conveys the sample block, a cutting unit that includes the cutter, and a cutting abnormality between the start of the cutting of the sample block and the completion of the cutting of the sample block An abnormality detection unit for detecting the at least one conveyance unit, and a control unit for controlling at least the conveyance unit, wherein the control unit controls the conveyance unit to relatively move the cutter and the sample block. When the cutting of the sample block is started and cutting abnormality is detected by the abnormality detecting unit, cutting of the sample block is stopped.

  The thin-section sample preparation method according to one embodiment of the present invention is a thin-section sample preparation method in which a sample block in which a sample is embedded in an embedding agent is sliced with a cutter to prepare a thin-section sample. A first step of starting cutting of the sample block by relatively moving the cutter and the sample block; and from the start of cutting of the sample block to completion of cutting of the sample block A second step of determining whether or not a cutting abnormality of the sample block occurs, and a third step of stopping the cutting of the sample block when it is determined in the second step that a cutting abnormality has occurred. Are provided.

  According to the thin-section sample preparation device and the thin-section sample preparation method according to the present invention, a cutting abnormality is detected between the start of the cutting of the sample block and the completion of the cutting of the sample block. By stopping the cutting of the sample, loss and damage of the sample can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS Schematic which shows the whole structure of the thin section sample preparation apparatus which concerns on Embodiment 1 of this invention. The top view of the sample block in FIG. The longitudinal cross-sectional view seen from the direction of II in FIG. FIG. 3 is a perspective view for explaining the abnormality detection unit according to the first embodiment. 3 is a flowchart showing a thin-section sample preparation process of the thin-section sample preparation apparatus according to the first embodiment. The flowchart which shows the abnormality detection process in FIG. The figure which shows table TA showing the relationship between the cutting force input from the force sensor in an abnormality detection part, and the depth from the surface of a sample block, and a threshold value. The figure which shows the relationship between the position of the cutter on the surface of a sample block, and the cutting force in each depth from the surface of a sample block. It is a longitudinal cross-sectional view for demonstrating each stop position of the cutter in the sample block in cutting operation, (a) is a longitudinal cross-sectional view which shows the cutting start position of a cutter, (b) is before the embedding position of a sample. The longitudinal cross-sectional view which shows the cutting stop position of a cutter, (c) is the longitudinal cross-sectional view which shows the cutting stop position of the cutter before a thin slice part peels, (d) is the cutting stop position of the cutter from which a thin slice part peels from a sample block. FIG. Schematic which shows the whole structure of the thin slice sample preparation apparatus provided with the cutting force detection part which concerns on another example.

  The thin-section sample preparation apparatus according to the first aspect of the present invention is a thin-section sample preparation apparatus that prepares a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter. A conveyance unit that conveys the sample block; a cutting unit that includes the cutter; and an abnormality detection unit that detects a cutting abnormality between the start of the cutting of the sample block and the completion of the cutting of the sample block; A control unit that controls at least the transport unit, and the control unit starts cutting the sample block by controlling the transport unit and relatively moving the cutter and the sample block. When the cutting abnormality is detected by the abnormality detecting unit, the cutting of the sample block is stopped.

  In the thin-section sample preparation device according to the second aspect of the present invention, in the first aspect, when the abnormality detection unit detects a cutting abnormality, the sliced portion of the sample block sliced by the cutter is separated from the sample block. Before peeling, the cutting of the sample block is stopped.

  In the thin-section sample preparation device according to the third aspect of the present invention, in the first aspect, when the abnormality detection unit detects a cutting abnormality, the tip position of the cutting edge of the cutter in the conveyance direction of the cutter starts cutting. Before reaching the position where the sample of the sample block is embedded from the position, cutting of the sample block is stopped.

  In the thin-section sample preparation device according to the fourth aspect of the present invention, in any one of the first to third aspects, the abnormality detection unit is configured such that a depth at which the cutter cuts the sample block is a preset cutting depth. An abnormality is detected when the value is higher than this.

  In the thin-section sample preparation device according to the fifth aspect of the present invention, in the fourth aspect, the abnormality detection unit is a cutting force detection unit that detects a cutting force generated when the sample block is cut by the cutter. .

  In the thin-section sample preparation device according to the sixth aspect of the present invention, in the fifth aspect, the control unit is detected by the cutting force detection unit when monitoring whether a cutting abnormality is detected by the abnormality detection unit. It is determined whether or not the cutting force is equal to or greater than a predetermined threshold value.

  The thin-section sample preparation method according to the seventh aspect of the present invention is a thin-section sample preparation method for preparing a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter, A first step of starting cutting of the sample block by relatively moving the cutter and the sample block, and from the start of cutting of the sample block to completion of cutting of the sample block A second step of determining whether or not a cutting abnormality of the sample block occurs, and a third step of stopping the cutting of the sample block when it is determined in the second step that a cutting abnormality has occurred. Are provided.

  In the thin-section sample preparation method according to the eighth aspect of the present invention, in the seventh aspect, when it is determined that a cutting abnormality has occurred in the second step, a sliced portion of the sample block sliced by the cutter is Before peeling from the sample block, the cutting of the sample block is stopped in the third step.

  In the thin-section sample preparation method according to the ninth aspect of the present invention, in the seventh aspect, when it is determined that a cutting abnormality has occurred in the second step, the tip position of the cutting edge of the cutter in the conveyance direction of the cutter is Before reaching the position where the sample of the sample block is embedded from the cutting start position, the cutting of the sample block is stopped in the third step.

  In the thin-section sample preparation method according to the tenth aspect of the present invention, in the seventh to ninth aspects, the second step is such that the depth at which the cutter cuts the sample block is equal to or greater than a preset cutting depth. Sometimes it is an abnormality detection step for detecting an abnormality.

In the thin-section sample preparation method according to the eleventh aspect of the present invention, in the tenth aspect, in the abnormality detection step, the cutting force generated when the sample block is cut by the cutter is a predetermined threshold value or more. This is a step of determining whether or not.

  Hereinafter, embodiments will be described with reference to the drawings. In addition, in this description, detailed description of the substantially overlapping part is omitted.

(Embodiment 1)
<1. About configuration>
1-1. First, the overall configuration of the thin-section sample preparation apparatus according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram showing an overall configuration of a thin-section sample preparation apparatus 100 according to Embodiment 1.
Here, the thin-section sample preparation device 100 according to Embodiment 1 slices the sample block 20 with the cutter 41 to produce a thin-section sample 24 and attaches the prepared thin-section sample 24 to the slide glass 22. Is a device that performs automatically and continuously. The sample block 20 is placed on the sample table 19 and a sample 20a as a subject is embedded in an embedding material 20b such as paraffin. Examples of the sample 20a include biological samples such as human and animal tissues, samples related to biopsy tissues, and the like. Details of the sample block 20 will be described later.

  As shown in FIG. 1, the thin-section sample preparation device 100 includes a sample block storage unit 30, a transport unit 1, a height detection unit 2, an abnormality detection unit 3, a cutting unit 4, a supply reel 5, A take-up reel 6, a thin section pasting unit 7, a slide glass transport unit 8, an extension unit 9, and a control unit 10 are provided.

  The sample block storage unit 30 stores a plurality of sample blocks 20 in an organized state.

  The transport unit 1 is configured to sequentially take out the sample blocks 20 to be sliced from the sample block storage unit 30 and transport them onto the position A, and then to reciprocate the sample block 20 between the positions A and B. . The positions A to B are linearly aligned in the transport direction (± X direction). Moreover, the conveyance part 1 is comprised so that adjustment of the height direction (+/- Z direction) of the sample block 20 is carried out so that the surface layer part of the sample block 20 may be located in the height which can be sliced with the cutter 41. FIG. Further, the transport unit 1 is provided with a biaxial tilt stage so that the tilt of the sample block 20 with respect to the XY plane can be adjusted.

  The height detector 2 detects the height in the height direction (± Z direction) of the sample block 20 conveyed to the position A. Specifically, the height detection unit 2 obtains the inclination of the surface of the sample block by detecting three height positions on the surface of the sample block 20 conveyed to the position A. Next, after the conveyance unit 1 corrects the inclination so that the surface of the sample block is horizontal, the height is detected.

  The abnormality detection unit 3 detects a cutting abnormality in an operation (hereinafter referred to as “thin cutting operation”) from when the cutting of the sample block 20 is started until the cutting of the sample block 20 is completed. The abnormality detection unit 3 is installed at the end of the conveyance unit 1 so as to face the cutter 41 on the upstream side (−X direction side) of the conveyance path. Therefore, the abnormality detection unit 3 moves along with the transport unit 1. Details of the abnormality detection unit 3 will be described later.

  The cutting unit 4 includes a cutter 41 and is installed at a cutting position B. The cutting unit 4 is configured by the cutter 41 so that the sample block 20 can be sliced. Specifically, first, the cutter 41 is set at a predetermined height position. Therefore, the cutter block 41 and the sample block 20 are moved relative to each other along the transport direction (+ X direction) by the transport unit 1 to cut the sample block 20 and perform a thin cutting operation.

  The supply reel 5 includes a feeding motor 51. When the feeding motor 51 is driven, the carrier tape 21 is fed from the supply reel 5. The fed carrier tape 21 is guided by the guide rollers 81 and 82 and is supplied above the cutting position B. The carrier tape 21 supplied above the cutting position B holds a thin slice sample 24 obtained by slicing the surface layer portion of the sample block 20 by the cutting unit 4. The carrier tape 21 holding the thin section sample 24 is guided by the guide roller 83 and sent out to the thin section pasting section 7.

  The thin-section pasting portion 7 is disposed on the upstream side (−X direction side) of the traveling path of the carrier tape 21 and on the downstream side (+ X direction side) of the traveling path of the carrier tape 21. And a pair of guide rollers 72. In the above configuration, the thin section pasting unit 7 pastes the thin section sample 24 held on the carrier tape 21 onto the slide glass 22. More specifically, the thin section pasting part 7 is bent downward with the carrier tape 21 between the pair of guide rollers 71 and the pair of guide rollers 72, and is held by the carrier tape 21. The section sample 24 is brought into contact with the slide glass 22 supplied with an adhesive liquid 23 such as water. Thereby, the thin slice sample 24 is stuck on the slide glass 22. Thereafter, the carrier tape 21 to which the thin slice sample 24 is affixed is guided by the guide roller 84 and taken up on the take-up reel 6.

  The take-up reel 6 includes a take-up motor 61. When the winding motor 61 is always driven, a constant torque is always applied to the winding reel 6. Thereby, the carrier tape 21 fed out from the supply reel 5 by the driving of the feeding motor 51 is taken up on the take-up reel 6 simultaneously with the feeding out.

  The slide glass transport unit 8 transports the slide glass 22 with a thin section, which is the slide glass 22 to which the thin section sample 24 is attached, to the extension unit 9. Further, the slide glass transport unit 8 takes out the slide glass 22 on which the thin section sample 24 is not pasted from the slide glass storage section (not shown) and transports it below the thin section pasting section 7.

  The extension unit 9 includes a heating plate (not shown), extends the eyelids of the thin slice sample 24 conveyed by the slide glass conveyance unit 8, and evaporates moisture on the slide glass 22 to evaporate the thin slice sample. 24 is firmly fixed on the slide glass 22.

  The control unit 10 controls at least the transport unit 1. Normally, not only the transport unit 1 but also the above-described components such as the height detection unit 2, the abnormality detection unit 3, and the cutting unit 4 are controlled, and the overall operation of the thin-section sample preparation apparatus 100 is controlled. The control unit 10 controls the operation of each configuration based on information from each configuration input from an input unit (not shown). The input unit is configured to be able to input, for example, the number of manufactured slide glasses 22 with thin sections, the number of thin slice samples attached per slide glass, and the like. The control unit 10 also includes a table TA (first table) that represents a relationship between the cutting force detected by the force sensor in the abnormality detection unit 3 and the depth from the surface of the sample block 20 and a predetermined threshold value. Details of the table TA will be described later. 1 is an example of the overall configuration of the thin-section sample preparation device 100 according to Embodiment 1, and the present invention is not limited to this. For example, it is not limited to the above-described structure or method, such as a method of placing a thin slice cut by a cutting unit on a slide glass or a method of extending a thin slice, and any other structure or method may cause any problem. There is no.

1-2. Sample Block Here, the sample block 20 according to the first embodiment will be described in detail with reference to FIGS. 2 and 3.

1-2-1. Structure of Sample Block First, the structure of the sample block 20 according to Embodiment 1 will be described with reference to FIG. FIG. 2 is a plan view of the sample block 20 in FIG.

  As shown in FIG. 2, the sample block 20 according to Embodiment 1 is obtained by embedding (embedding) a sample 20a, which is a subject, in an embedding agent 20b. Here, the sample 20a is a very small shape having a thickness of about 0.5 mm to 5 mm or a diameter L1 of about 0.5 mm to 5 mm, and is an example of a biopsy sample used when performing a biopsy. To Here, “biopsy” is for the purpose of detecting a lesion or diagnosing a lesion, and means performing a pathological diagnosis using a biopsy tissue obtained by sampling a part of the tissue from the body. . Thus, since the sample 20a is very fine and the amount taken is small, it is a very valuable subject in the pathological diagnosis site. Therefore, the sample 20a should not be lost at the site.

  The sample block 20 has a length LX in the longitudinal direction (± X direction) of 30 mm and a length LY in the short direction (± Y direction) of 24 mm. The embedding agent 20b is, for example, relatively widely used in Japan, and is a paraffin having a melting point of 56 ° C to 58 ° C.

1-2-2. Next, the cross-sectional structure of the sample block 20 according to the first embodiment will be described with reference to FIG. FIG. 3 is a longitudinal sectional view as seen from the direction I-I in FIG.

  As shown in FIG. 3, the sample block 20 is placed on the sample table 19. As illustrated, the sample 20a is embedded in the embedding agent 20b at the position at the depth D1 in the depth direction (−Z direction) from the surface of the sample block 20.

  Here, when the thin cutting operation is started in the sample block 20 having such a cross-sectional configuration, when the set depth of the cutter 41 is set to a predetermined depth shallower than the depth D1, the cutter 41 To cut the sample 20a. And about the predetermined | prescribed sample 20a, the thin slice sample 24 is sliced from the surface layer part of the sample block 20 with the embedding agent 20b. Therefore, the predetermined thin slice sample 24 can be produced in a state where the thin slice of the sample 20a is included in the embedding agent 20b.

  On the other hand, when starting the thin cutting operation of the sample block 20, the depth D2 of the cutter 41 that is actually cut may be deeper (larger) than the depth D1 (D2> D1). In this case, when no cutting abnormality is detected and a cutting operation is started at the depth D2, the cutter 41 envelops at a depth D2 deeper than the depth D1 where the sample 20a is embedded. It passes through the filling 20b (cuts deeply). Therefore, the cutting operation is completed without cutting the sample 20a. In this case, the sample 20a is peeled off from the sample block 20 while being included in the embedding agent 20b. The sample 20a may be discarded as it is without being affixed on the slide glass 22 in a cutting operation in a preparation stage called rough cutting or discarding. As a result, there is a risk that the sample 20a, which is an extremely valuable subject, may be lost.

  However, according to the thin-section sample preparation device 100 according to the first embodiment, an abnormality detection unit that detects a cutting abnormality between the start of the cutting of the sample block 20 and the completion of the cutting of the sample block 20. 3 is provided. Therefore, when the depth D2 of the cutter 41 that is actually cut as described above becomes deeper (larger) than the preset depth of the cutter 41 as described above, the abnormality detection unit 3 performs a deep cut that cuts too deeply as a cutting abnormality. Detect cutting abnormalities. And the loss of the sample 20a can be prevented by stopping the cutting of the sample block 20 by the cutter 41.

Next, the abnormality detection unit 3 according to Embodiment 1 will be described in detail.
1-3. Abnormality Detection Unit The abnormality detection unit 3 according to the first embodiment will be described with reference to FIG. FIG. 4 is a perspective view for explaining the abnormality detection unit 3 according to the first embodiment. Here, the abnormality detection unit 3 is a cutting force detection unit that detects a cutting force generated when the sample block 20 is cut by the cutter 41.
As shown in FIG. 4, the cutting force detection unit 3 is installed in contact with the end of the holder fixing unit 12 so as to face the cutter 41 on the upstream side (−X direction side) of the conveyance path. It is a sensor. The force sensor is fixed to a base plate (not shown) of the conveyance unit 1 via a connecting part, and the base plate is fixed to the holder fixing unit 12 via a linear motion guide (not shown) coaxial with the conveyance direction. It is connected with. Therefore, the force sensor moves along with the transport unit 1 along the transport path.

1-3-1. About Force Sensor The force sensor detects a cutting force N generated when the cutter 41 cuts the sample block 20, converts it to a predetermined voltage, and outputs a cutting force data signal FD (hereinafter simply referred to as “cutting force FD”). To the control unit 10. More specifically, during the cutting operation, the sample block 20 is cut by relatively moving the cutter 41 and the sample block 20 by the transport unit 1 along the transport direction (+ X direction). Here, the sample block 20 is fixed to the holder fixing portion 12 by holding the sample stage 19 between the pair of holders 11 in the width direction (± Y direction) orthogonal to the transport direction. Therefore, the cutting force N generated during the cutting operation is applied to the cutting force detection unit 3 via the holder fixing unit 12 in the direction from the downstream side to the upstream side of the conveyance path (−X direction), and is applied by the force sensor. Detected.

1-3-2. About Drive Torque Detection Unit Here, the configuration including a force sensor as the cutting force detection unit 3 has been described as an example. However, the cutting force detection part 3 is not restricted to the said structure. Therefore, another example of the cutting force detection unit 3 will be described with reference to FIG. FIG. 10 is a schematic diagram illustrating an overall configuration of a thin-section sample preparation device including a cutting force detection unit 3 according to another example.

  As shown in FIG. 10, the cutting force detection unit 3 according to another example includes a drive torque detection unit 3 </ b> B and detects a cutting force generated when the sample block 20 is cut by the cutter 41.

  The drive torque detection unit 3B detects the drive torque of a drive motor (for example, a servo motor or a pulse motor with a torque control function) provided in the transfer unit 1 for transferring the sample block 20 in the transfer direction (+ X direction). To detect. Specifically, torque monitoring is performed by a motor driver, and the detected driving torque is output from the driver to the control unit 10 as a driving torque signal.

  Here, the driving torque detected by the driving torque detector 3B shows a predetermined value proportional to each depth from the surface of the sample block 20, like the cutting force FD. That is, the drive torque and each depth from the surface of the sample block 20 are the ranges in which the cutter 41 and the sample block 20 interfere in the transport direction (+ X direction), from the cutting start position to the cutting completion position. Proportional relationship. As described above, the cutting force detection unit 3 according to another example detects a cutting force generated when the sample block 20 is cut by the cutter 41 by detecting the driving torque by the driving torque detection unit 3B.

  As shown in FIG. 10, in the thin-section sample preparation device 100B according to another example, the control unit 10 includes a table TB (second table). Similarly to the table TA, the table TB represents the relationship between the driving torque detected by the driving torque detector 3B and the depth from the surface of the sample block 20, and a predetermined threshold value of the driving torque.

<2. Thin section sample preparation process>
Next, the thin-section sample preparation process of the thin-section sample preparation apparatus 100 according to Embodiment 1 will be described with reference to FIG. FIG. 5 is a flowchart showing a thin-section sample preparation process of the thin-section sample preparation apparatus 100 according to the first embodiment.
As shown in the drawing, the thin-section sample preparation process of the thin-section sample preparation apparatus 100 according to Embodiment 1 includes a cutting preparation process S01 and an abnormality detection process S02 that detects a cutting abnormality from the start of cutting to the completion of cutting. , And broadly divided into thin-section-attached slide glass production processing S03. In addition, the following operation | movement is performed when the control part 10 controls said each structure.

2-1. Cutting preparation process S01
First, the cutting preparation process S01 shown in FIG. 5 will be described.
First, the transport unit 1 sequentially takes out the sample blocks 20 to be sliced from the sample block storage unit 30 and transports them onto the position A. Then, the control part 10 controls the conveyance part 1 so that the said sample block 20 may be reciprocated between position AB as needed.

  Subsequently, at the position A, the height detection unit 2 detects the height of the sample block 20 in the height direction (± Z direction) and the inclination of the sample block surface in the XY plane. At this time, the height detector 2 detects the inclination of the sample block 20 by detecting three height positions on the surface of the sample block 20. Subsequently, the control unit 10 adjusts the inclination of the sample block 20 based on the information detected by the height detection unit 2, and then the height of the surface layer portion of the sample block 20 can be sliced by the cutter 41. The conveying unit 1 is controlled so as to be positioned at the position. Subsequently, the control unit 10 controls the transport unit 1 so that the sample block 20 adjusted to a predetermined height is transported to the cutting position B. As described above, the cutting preparation process S01 according to the first embodiment is performed.

2-2. Abnormality detection process S02
Next, an abnormality detection process S02 for detecting a cutting abnormality from the start of cutting to the completion of cutting will be described with reference to FIG. FIG. 6 is a flowchart showing the abnormality detection process S02 in FIG. As shown in the figure, after the cutting preparation process S01, first, in step S21, a threshold value for detecting a cutting abnormality is determined based on various parameters such as the cutting depth. Here, the “threshold value” refers to a value at which cutting of the sample block 20 by the cutter 41 is stopped when the depth of the cutter 41 is equal to or greater than the limit depth DTH from the surface of the sample block 20. Further, the determined threshold value is stored in a table TA such as a storage unit (not shown) provided in the control unit 10. As will be described later, the control unit 10 refers to the threshold value in the table TA, and determines whether or not the cutting abnormality (deep cutting cutting abnormality) is based on whether the cutting force FD detected by the force sensor exceeds the threshold value. ).

  Here, as an example, a case where the cutting force FDTH corresponding to the limit depth DTH (about 80 μm) from the surface of the sample block 20 is set as the threshold value will be described. In this case, first, a sample block for determining a threshold value, which is formed of the same kind of paraffin material as that of the sample block 20 used for thin section sample preparation, is prepared. Then, the thin slice sample preparation apparatus 100 performs a thin slice operation on the prepared threshold determination sample block. As a result, a table TA representing the relationship between the cutting force FD input from the force sensor and the depth from the surface of the sample block and the threshold value FDTH is acquired. Therefore, the table TA according to the first embodiment will be described in detail next with reference to FIG.

2-2-1. Table TA
Next, the table TA according to the first embodiment will be described with reference to FIG.
As described above, the table TA shown in FIG. 7 is obtained as a result of performing the thinning operation on the sample block for determining the threshold by the thin-section sample preparation device 100. A table TA shown in FIG. 7 represents the relationship between the cutting force FD input from the force sensor and the depth from the surface of the sample block 20 and the threshold value FDTH. More specifically, the table TA shown in FIG. 7 includes a cutting force (..., FDA, ..., FDG, ...) input from the force sensor and a depth (..., DA, ..., ...) from the surface of the sample block. DG,...) And a threshold value FDTH and a corresponding limit depth DTH. The acquired table TA is stored in a storage unit (not shown) of the control unit 10 or the like.

  Here, the case where the table TA represents the relationship between the cutting force FD and the depth from the surface of the sample block 20 in a table format has been described as an example. However, it is not limited to such a table (table) format. For example, the controller 10 may store a parameter representing a relational expression between the cutting force FD and the depth from the surface of the sample block 20.

  Further, here, the threshold value FDTH for detecting a cutting abnormality based on two parameters of the depth (cut amount) DT from the surface of the sample block 20 and the type of paraffin similar to the sample block 20 is used. Explained the case of determining. However, the parameters for determining the threshold value are not limited to these. For example, the threshold value can be similarly determined based on other various parameters such as the size of the sample block 20, the type of the cutter 41, or the cutting speed due to the movement of the transport unit 1. Further, the step S21 for determining the threshold does not necessarily have to be performed at the timing described here. For example, it is also possible to determine the threshold value in the same manner before starting the slicing operation and store it in the previously acquired table TA.

  Subsequently, returning to FIG. 6, in step S <b> 22, the control unit 10 starts the cutting operation of the sample block 20. Specifically, the control unit 10 controls the transport unit 1 so that the cutter 41 and the sample block 20 relatively move along the transport direction (+ X direction). Thus, the cutting operation is started by the cutter 41 moving on the surface layer portion of the sample block 20. The conveyance speed (hereinafter referred to as “cutting speed”) in the conveyance direction (X direction) in the conveyance unit 1 during the cutting operation is usually about 5 mm / sec to 100 mm / sec.

  Subsequently, in step S23, the control unit 10 monitors the cutting force FD during the cutting operation, and determines whether or not the cutting force is greater than or equal to a threshold value. Specifically, the control unit 10 refers to the table TA and compares the cutting force FD detected by the force sensor in real time with the threshold value FDTH of the cutting force in the table TA. Therefore, the control unit 10 determines whether or not the cutting force FD detected by the force sensor is equal to or greater than the cutting force threshold FDTH in the table TA. In step S23, when the control unit 10 determines that the detected cutting force FD is less than the threshold value FDTH (NO), the process proceeds to step S24.

  Subsequently, in step S24, the control unit 10 cuts out the thin slice sample and ends the cutting operation (end).

  On the other hand, when the control unit 10 determines in step S23 that the detected cutting force FD is greater than or equal to the threshold value FDTH (YES), the process proceeds to step S25. In step S <b> 25, the control unit 10 determines that the sample block 20 has a deep cutting abnormality based on the relationship between the cutting force FD represented on the table TA and the depth from the surface of the sample block 20. Therefore, the control unit 10 stops the conveying operation of the conveying unit 1 and stops the cutting operation of the sample block 20 by the cutter 41. Here, the detection of cutting abnormality (deep cutting cutting abnormality) will be described in more detail with reference to FIG.

2-2-2. Detection of Cutting Abnormality (Deep Cutting Abnormality) FIG. 8 is a diagram showing the relationship between the position of the cutter 41 on the surface of the sample block 20 and the cutting force FD at each depth DA to DG from the surface of the sample block 20. It is. Here, as the depth from the surface of the sample block 20, a depth DA to DG (DA: 5 μm, DB: 10 μm, DC: 30 μm, DD: 50 μm, DE: 100 μm, DF: 200 μm, DG: 300 μm) is an example. To In the first embodiment, the voltage output from the force sensor is amplified using an amplifier. Here, the relationship between the cutting force N detected by the force sensor and the voltage V for converting the cutting force N is 0.95 N / V, but this relationship varies depending on the type of amplifier. Regarding the sample block 20, the length LY in the short direction (± Y direction) of the sample block 20 is 24 mm. The sample 20a of the sample block 20 is a biopsy tissue. The embedding agent 20b of the sample block 20 is paraffin having a melting point of 56 ° C to 58 ° C. Furthermore, the cutting speed is 40 mm / sec.

  Under the above conditions, as shown in FIG. 8, each cutting force FD detected by the force sensor at each depth DA to DG from the surface of the sample block 20 is an area where the cutter 41 and the sample block 20 do not interfere with each other. In this case, it is not detected and indicates approximately 0.

  On the other hand, in the region where the cutter 41 and the sample block 20 interfere with each other in the transport direction (+ X direction), the cutting forces FD at the depths DA to DG are measured from the position P1 where the cutter 41 contacts the sample block 20. Between the block 20 and the position P2 where the cutter 41 is detached, a substantially constant value proportional to each depth is shown. This is because the volume and weight of the sample 20a and the embedding agent 20b to be cut by the cutter 41 increase as the depth from the surface of the sample block 20 increases (thickness increases), and thus the cutting force necessary for cutting also increases. Because. As described above, the depths DA to DG from the surface of the sample block 20 and the cutting forces FD detected by the force sensor are in a proportional relationship between P1 and P2.

  Therefore, when the detected cutting force FD is equal to or greater than the set threshold value FDTH, the control unit 10 determines that a deep cut cutting abnormality has occurred and transmits an abnormal stop control signal to the transport unit 1. The transport unit 1 that has received the abnormal stop control signal immediately stops the transport operation. As a result, the control unit 10 stops the cutting operation (S25). For example, in the case shown in FIG. 8, the threshold value is set to the cutting force FDTH corresponding to the limit depth DTH (about 80 μm) from the surface of the sample block 20. Therefore, the control unit 10 determines that the cutting force FD detected by the force sensor is greater than or equal to the threshold value FDTH for the depths DE, DF, and DG. Therefore, the control unit 10 determines that a deep cutting abnormality has occurred for these depths DE, DF, and DG, stops the conveying operation of the conveying unit 1, and stops the cutting operation (S25). As described above, in the first embodiment, the control unit 10 determines that a deep cutting abnormality has occurred at depths DE, DF, and DG having a depth of 100 μm or more, and stops the cutting operation. As a result, the loss of the sample 20a such as a minute biopsy sample, which is a very valuable subject, can be prevented.

2-2-3. Each stop position of the cutter in the sample block in the cutting operation Next, with reference to FIG. 9, each stop position of the cutter 41 when a deep cut abnormality occurs will be described in more detail.

2-23-1. About the cutting start position of a cutter First, the cutting start position of the cutter 41 is demonstrated using Fig.9 (a). In FIG. 9A, the cutter 41 is in the cutting start position PS. From here, when the sample block 20 moves in the transport direction (+ X direction), cutting of the sample block 20 is started.

2-2-3-2. Cutting Stop Position of Cutter Before Sample Embedding Position Next, the cutting stop position of the cutter 41 will be described with reference to FIG. Here, when a deep cut cutting abnormality is detected, before the tip position PB of the cutting edge of the cutter 41 in the sample block 20 reaches the position PC in the sample block 20 in which the sample 20a is embedded from the cutting start position. A case where the cutting operation stops will be described.
Here, in the sample block 20, the position of the end of the sample block 20 on the cutter 41 side is set as PA, the tip position of the cutting edge of the cutter 41 that detects and stops the deep cutting abnormality is set as PB, and on the cutter 41 side. The position where the sample 20a is embedded is defined as PC. Further, a distance between the position PA and the position PB is set as a stop distance X0, and a distance between the position PA and the position PC is set as an embedding distance X1.

  As shown in FIG. 9B, when the cutting operation is started at an abnormal depth, the control unit 10 detects a deep cutting abnormality and stops the cutting operation. Here, in order for the cutting operation to stop before the tip position PB of the cutting edge of the cutter 41 reaches the position PC where the sample 20a is embedded from the cutting start position, the stop distance X0 is larger than the embedding distance X1. It must be small (X0 <X1). Therefore, the control part 10 controls the conveyance part 1 so that the stop distance X0 becomes smaller than the embedding distance X1. Thus, the valuable sample 20a such as a biopsy sample is not damaged by the cutter 41 by controlling the stop distance X0 to be smaller than the embedding distance X1. As a result, it is possible to prevent the sample 20a from being damaged by the cutting operation.

  Furthermore, the embedding position PC of the sample 20a is not necessarily near the center of the embedding agent 20b. For example, there may be a case where the embedding position PC of the sample 20a is located closer to the position PA side of the end portion of the sample block 20 on the cutter 41 side. Therefore, considering such an embedding state of the sample 20a, the stop distance X0 is preferably 3 mm or less. The stop distance X0 is more preferably 2 mm or less. Furthermore, the stop distance X0 is more preferably 1 mm or less. Furthermore, the stop distance X0 is most preferably 0.5 mm or less.

2-2-3-3. Next, the cutting stop position of the cutter 41 before the thin cut portion 22 is peeled will be described with reference to FIG. 9C. Here, a case where the cutting operation is stopped before the thin cut portion 22 cut by the cutter 41 is peeled off from the sample block 20 when a deep cut cutting abnormality is detected will be described.
Here, in the sample block 20, the limit position where the sliced portion 22 does not peel is PD, and the end position of the sample block 20 on the side facing the cutter 41 is PE. Further, the distance between the position PA and the position PD is defined as a separation limit distance X2.

  As shown in FIG. 9C, the stop distance X0 is smaller than the separation limit distance X2 in order to stop the cutting operation before the sliced portion 22 sliced by the cutter 41 is peeled from the sample block 20. (X0 <X2) is necessary. Therefore, the control unit 10 controls the transport unit 1 so that the stop distance X0 is smaller than the separation limit distance X2. More specifically, when the control unit 10 detects a deep cutting abnormality, the tip position PB of the cutting edge of the cutter 41 exceeds the embedding position PC of the sample 20a from the cutting start position, and the sliced portion 22 is at the latest. The cutting operation is stopped before reaching the limit position PD where separation does not occur. Thus, by controlling, the valuable sample 20 a such as the biopsy sample in the sliced portion 22 is not peeled off from the sample block 20. As a result, loss of the sample 20a due to the cutting operation can be prevented.

2-2-3-4. Next, the cutting stop position of the cutter 41 where the thin cut portion 22 peels from the sample block 20 will be described with reference to FIG. Here, a case where the stop distance X0 is larger than the separation limit distance X2 (X0> X2) will be described.

  As shown in FIG. 9 (d), when the tip position PB of the cutting edge of the cutter 41 exceeds the limit position PD at which the thin-cut portion 22 does not peel and the cutting operation is continued, the thin-cut portion 22 peels from the sample block 20. There is a high risk of For example, the thin sliced portion 22 in the state shown in FIG. 9D can be easily broken by suction by dust suction or blown away by scraps, or by being cut from the cutting port when the cutter 41 is reversed, etc. There is a high risk of peeling from.

  However, in the first embodiment, the distance that the cutter 41 cuts the sample block 20 after the cutting force FD is detected by the force sensor and before the conveyance unit 1 is stopped (hereinafter referred to as “response stop distance”). For example) is about 0.26 mm. Therefore, it is possible to prevent the sample 20a from being peeled off from the sample block 20 as shown in FIG.

  In addition, it is preferable that the said response stop distance is 0.3 mm or less. As described above, in the first embodiment, the response stop distance is about 0.26 mm. Furthermore, the response stop distance can be shortened as necessary by optimizing control software (not shown) provided in the control unit 10.

  Subsequently, returning to FIG. 6, after the cutting is stopped (S25), in step S26, the control unit 10 performs a predetermined process at the time of abnormal termination, and terminates the abnormality detection process S02 (END). For example, the control unit 10 controls the transport unit 1 to reverse the upstream side (−X direction side) of the transport path for the sample block 20 whose cutting operation has been stopped as a predetermined process at the time of abnormal termination, The cutter 41 is extracted from the cutting opening of the sample block 20. And the sample 20a can be collect | recovered by losing the sample block 20 from which the cutting was stopped from a conveyance line, without losing the sample 20a.

  The abnormality detection process S02 is not limited to the operation (main cutting) in which the sample block 20 is sliced by the cutter 41 and the thin section sample 24 is cut out. For example, in order to observe the useful sample 20a when obtaining the thin slice sample 24 by performing the above-described main cutting, it is necessary that the portion of the sample 20a is sufficiently present on the surface of the sample block 20 It is. Therefore, in order to obtain an observation surface for the sample 20a, the surface of the sample block 20 is cut to a predetermined thickness (rough cutting), and then the main cutting is performed. Further, immediately before the main cutting, a cutting operation (discarding) may be performed several times in order to improve the thin cutting accuracy. Therefore, the abnormality detection process S02 can be performed in the same manner when performing such rough cutting or discarding.

2-3. Thin-section pasted slide glass production process S03
Next, returning to FIG. 5, the thin-section pasted slide glass production process S03 will be described.
First, after the abnormality detection process S02, as shown in FIG. 1, the sliced thin section sample 24 is attached to the carrier tape 21 supplied above the cutting position B and held.

  Subsequently, the thin slice sample 24 held on the carrier tape 21 is transported onto the slide glass 22 and pasted by the thin slice pasting unit 7. More specifically, the thin section pasting part 7 is bent downward with the carrier tape 21 between the pair of guide rollers 71 and the pair of guide rollers 72, and is held by the carrier tape 21. The section sample 24 is brought into contact with the slide glass 22 supplied with an adhesive liquid 23 such as water. Thereby, the thin slice sample 24 is stuck on the slide glass 22.

  Subsequently, the slide glass 22 to which the thin section is attached is conveyed to the extension unit 9 by the slide glass conveyance unit 8. Subsequently, the thin slice sample 24 conveyed to the extension unit 9 is stretched by the heating plate of the extension unit 9, the moisture on the slide glass 22 evaporates, and is firmly fixed on the slide glass 22. As described above, the thin-section pasted slide glass manufacturing process S03 according to Embodiment 1 is performed.

<3. About effect>
As described above, in the thin-section sample preparation device 100 according to Embodiment 1, the control unit 10 determines whether or not a cutting abnormality is detected by the abnormality detection unit 3 (S23), and the abnormality detection unit 3 When the cutting abnormality is detected by the above, the conveying operation of the conveying unit 1 is stopped, and the cutting of the sample block 20 by the cutter 41 is stopped (S25).

  Accordingly, the cutting abnormality is detected between the start of the cutting of the sample block 20 and the completion of the cutting of the sample block 20, and the cutting of the sample block 20 is stopped, so that the sample 20a is lost. Can be prevented.

  For example, in the case of Embodiment 1, the abnormality detection unit 3 is a cutting force detection unit including a force sensor that detects a cutting force FD generated when the sample block 20 is cut by the cutter 41. The control unit 10 refers to the table TA and determines whether or not the cutting force FD detected by the force sensor is equal to or greater than a predetermined threshold value FDTH in the table TA (S23). When the cutting force FD is greater than or equal to a predetermined threshold value FDTH in the table TA, the control unit 10 determines the sample block based on the relationship between the cutting force FD represented by the table TA and the depth from the surface of the sample block 20. It is determined that 20 deep cutting abnormalities have occurred, and an abnormal stop control signal is sent to the transport unit 1. The transport unit 1 that has received the abnormal stop control signal immediately stops the transport operation. As a result, the control unit 10 stops the cutting operation (S25).

  As a result, it is possible to reliably prevent the loss of the sample 20a such as a minute biopsy sample, which is a very valuable subject.

(Other embodiments)
In the first and second embodiments, as an example of the abnormality detection unit 3, a configuration that detects a deep cutting abnormality by including a force sensor that detects the cutting force FD and a drive torque detection unit that detects drive torque is provided. explained. However, the abnormality detection unit 3 is not limited to these configurations.

  For example, as another embodiment, the abnormality detection unit 3 can be applied even if the abnormality detection unit 3 includes an imaging sensor that captures the periphery of the sliced portion of the sample block 20. In this case, image data captured by the imaging sensor is input to the control unit 10. Therefore, based on the input image data, the control unit 10 determines whether or not there is a cutting abnormality after the cutting of the sample block 20 until the cutter 41 contacts the sample block 20. judge. And when it is cutting abnormality, the control part 10 stops the conveyance operation of the conveyance part 1, and stops cutting operation.

  The present invention can be applied to a thin slice sample preparation apparatus or the like for preparing a thin slice sample used for physicochemical sample analysis or microscopic observation of a biological sample or the like.

DESCRIPTION OF SYMBOLS 1 Conveyance part 2 Height detection part 3 Abnormality detection part 4 Cutting part 5 Supply reel 6 Take-up reel 7 Thin section sticking part 8 Slide glass conveyance part 9 Extending part 10 Control part 12 Holder fixing part 20 Sample block 20a Sample 20b Embedding Agent 24 Thin section sample 30 Sample block storage section 41 Cutter TA, TB Table 100, 100B Thin section sample preparation device

Claims (11)

A thin-section sample preparation device for preparing a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter,
A transport unit for transporting the sample block;
A cutting section comprising the cutter;
From the start of cutting of the sample block until the completion of cutting of the sample block, an abnormality detection unit that detects cutting abnormality,
A control unit that controls at least the transport unit;
The control unit starts the cutting of the sample block by controlling the transport unit and relatively moving the cutter and the sample block, and when the abnormal abnormality is detected by the abnormality detection unit, Thin section sample preparation device that stops cutting of sample block.   The cutting of the sample block is stopped before the sliced portion of the sample block sliced by the cutter is peeled off from the sample block when the abnormality detecting unit detects a cutting abnormality. Thin section sample preparation device.   When the abnormality detection unit detects a cutting abnormality, in the transport direction, the tip position of the cutting edge of the cutter reaches the position where the sample of the sample block is embedded from the cutting start position. The thin-section sample preparation apparatus according to claim 1, wherein the cutting is stopped.   The thin section sample preparation device according to any one of claims 1 to 3, wherein the abnormality detection unit detects an abnormality when a depth at which the cutter cuts the sample block is equal to or greater than a preset cutting depth. .   The thin section sample preparation device according to claim 4, wherein the abnormality detection unit is a cutting force detection unit that detects a cutting force generated when the sample block is cut by the cutter.   The control unit determines whether the cutting force detected by the cutting force detection unit is equal to or greater than a predetermined threshold when monitoring whether a cutting abnormality is detected by the abnormality detection unit. The thin-section sample preparation apparatus according to claim 5. A thin-section sample preparation method for preparing a thin-section sample by slicing a sample block in which a sample is embedded in an embedding agent with a cutter,
A first step of starting cutting of the sample block by relatively moving the cutter and the sample block;
A second step of determining whether or not a cutting abnormality of the sample block occurs between the start of cutting of the sample block and the completion of cutting of the sample block;
A thin-section sample preparation method comprising: a third step of stopping cutting of the sample block when it is determined in the second step that a cutting abnormality has occurred. When it is determined that a cutting abnormality has occurred in the second step, the cutting of the sample block is stopped in the third step before the sliced portion of the sample block sliced by the cutter is peeled off from the sample block. The thin-section sample preparation method according to claim 7. When it is determined that a cutting abnormality has occurred in the second step, before the tip position of the cutting edge of the cutter reaches the position where the sample of the sample block is embedded from the cutting start position in the transport direction, The thin-section sample preparation method according to claim 7, wherein the cutting of the sample block is stopped in a third step. The abnormality detection step according to any one of claims 7 to 9, wherein the second step is an abnormality detection step in which an abnormality is detected when a depth at which the cutter cuts the sample block is equal to or greater than a preset cutting depth. The thin-section sample preparation method as described.   The thin-section sample preparation according to claim 10, wherein the abnormality detection step is a step of determining whether or not a cutting force generated when the sample block is cut by the cutter is equal to or greater than a predetermined threshold value. Method.

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