JPWO2015046057A1 - Light emitting element mounting package and light emitting device - Google Patents

Light emitting element mounting package and light emitting device Download PDF

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JPWO2015046057A1
JPWO2015046057A1 JP2015539165A JP2015539165A JPWO2015046057A1 JP WO2015046057 A1 JPWO2015046057 A1 JP WO2015046057A1 JP 2015539165 A JP2015539165 A JP 2015539165A JP 2015539165 A JP2015539165 A JP 2015539165A JP WO2015046057 A1 JPWO2015046057 A1 JP WO2015046057A1
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light emitting
mounting portion
emitting element
mounting
recess
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JP6140831B2 (en
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茂義 福薗
茂義 福薗
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

発光素子搭載用パッケージ（１）は、凹部（13）を有し、凹部（13）内に発光素子（２）を搭載するための第１搭載部（11ａ）と部品（４）を搭載するための第２搭載部（11ｂ）とを有する絶縁基体（11）を備えており、第１搭載部（11ａ）側の凹部（13）の側壁は傾斜面を有しており、平面視で第１搭載部（11ａ）と第２搭載部（11ｂ）との対向部分における対向方向に対して垂直方向において、第１搭載部（11ａ）側の凹部（13）の開口の幅（Ｗ１）が第２搭載部（11ｂ）側の凹部（13）の開口の幅（Ｗ２）よりも小さい。The light emitting element mounting package (1) has a recess (13), and is used to mount the first mounting portion (11a) and the component (4) for mounting the light emitting element (2) in the recess (13). And an insulating base (11) having a second mounting portion (11b), and the side wall of the recess (13) on the first mounting portion (11a) side has an inclined surface, which is the first in plan view. The width (W1) of the opening of the recess (13) on the first mounting portion (11a) side is the second in the direction perpendicular to the facing direction at the facing portion between the mounting portion (11a) and the second mounting portion (11b). It is smaller than the width (W2) of the opening of the recess (13) on the mounting portion (11b) side.

Description

本発明は、例えば発光ダイオード等の発光素子が搭載される発光素子搭載用パッケージおよび発光装置に関するものである。   The present invention relates to a light emitting element mounting package and a light emitting device on which a light emitting element such as a light emitting diode is mounted.

従来、発光素子および部品を搭載するための凹部を有する発光素子搭載用パッケージが知られている。（例えば、特許文献１を参照。）。   Conventionally, a light emitting element mounting package having a recess for mounting a light emitting element and a component is known. (For example, see Patent Document 1).

特開2008−041917号公報JP 2008-041917 A

しかしながら、凹部内にサイズが大きい部品または複数の部品を搭載するために凹部のサイズを大きいものとすると、発光素子と凹部の側壁との間隔が大きくなり、発光素子から放射された光の反射の効率が悪くなって、発光装置の輝度が低下してしまう可能性があった。   However, if the size of the recess is increased in order to mount a large part or a plurality of components in the recess, the distance between the light emitting element and the side wall of the recess is increased, and reflection of light emitted from the light emitting element is reduced. There is a possibility that the efficiency is deteriorated and the luminance of the light emitting device is lowered.

本発明の一つの態様によれば、発光素子搭載用パッケージは、凹部を有し、該凹部内に発光素子を搭載するための第１搭載部と部品を搭載するための第２搭載部とを有する絶縁基体を備えており、前記第１搭載部側の前記凹部の側壁は傾斜面を有しており、平面視で前記第１搭載部と前記第２搭載部との対向部分における対向方向に対して垂直方向において、前記第１搭載部側の前記凹部の開口の幅が前記第２搭載部側の前記凹部の開口の幅よりも小さい。   According to one aspect of the present invention, the light emitting element mounting package has a recess, and the first mounting portion for mounting the light emitting element in the recess and the second mounting portion for mounting the component. And a side wall of the concave portion on the first mounting portion side has an inclined surface in a facing direction in a facing portion between the first mounting portion and the second mounting portion in a plan view. On the other hand, in the vertical direction, the width of the opening of the concave portion on the first mounting portion side is smaller than the width of the opening of the concave portion on the second mounting portion side.

本発明の他の態様によれば、発光装置は、上記構成の発光素子搭載用パッケージと、前記第１搭載部に搭載された前記発光素子と、前記第２搭載部に搭載された前記部品とを有している。   According to another aspect of the present invention, a light emitting device includes a light emitting element mounting package configured as described above, the light emitting element mounted on the first mounting portion, and the component mounted on the second mounting portion. have.

本発明の一つの態様による発光素子搭載用パッケージは、平面視で第１搭載部と第２搭載部との対向部分における対向方向に対して垂直方向において、第１搭載部側の凹部の開口の幅が第２搭載部側の凹部の開口の幅よりも小さいことから、第２搭載部にサイズが大きい部品または複数の部品を搭載したとしても、発光素子と凹部の側壁との間隔が大きいものとならず、発光素子が放射した光は凹部の側壁に効果的に反射されるものとなり、発光装置として輝度が低下しにくいものとすることができる。   A light emitting element mounting package according to an aspect of the present invention includes an opening of a recess on a first mounting portion side in a direction perpendicular to a facing direction in a facing portion between a first mounting portion and a second mounting portion in a plan view. Since the width is smaller than the width of the opening of the concave portion on the second mounting portion side, even if a large size component or a plurality of components are mounted on the second mounting portion, the distance between the light emitting element and the side wall of the concave portion is large. In other words, the light emitted from the light-emitting element is effectively reflected on the side wall of the recess, and the luminance of the light-emitting device can hardly be reduced.

本発明の他の態様による発光装置は、上記構成の発光素子搭載用パッケージと、第１搭載部に搭載された発光素子と、第２搭載部に搭載された部品とを有していることから、高輝度の発光装置とすることができる。   A light emitting device according to another aspect of the present invention includes the light emitting element mounting package having the above configuration, the light emitting element mounted on the first mounting portion, and the components mounted on the second mounting portion. A light emitting device with high brightness can be obtained.

本発明の第１の実施形態における発光装置を示す上面図である。It is a top view which shows the light-emitting device in the 1st Embodiment of this invention. （ａ）は、図１のＡ−Ａ線における断面図、（ｂ）は、図１のＢ−Ｂ線における断面図、（ｃ）は図１のＣ−Ｃ線における断面図である。(A) is sectional drawing in the AA line of FIG. 1, (b) is sectional drawing in the BB line of FIG. 1, (c) is sectional drawing in the CC line of FIG. （ａ）は、第１の実施形態における発光素子搭載用パッケージの製造方法の一工程を示す上面図であり、（ｂ）は、図３（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows 1 process of the manufacturing method of the light emitting element mounting package in 1st Embodiment, (b) is sectional drawing in the AA of FIG. 3 (a). （ａ）は、第１の実施形態における発光素子搭載用パッケージの製造方法の一工程を示す上面図であり、（ｂ）は、図４（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows 1 process of the manufacturing method of the light emitting element mounting package in 1st Embodiment, (b) is sectional drawing in the AA of FIG. 4 (a). （ａ）は、第１の実施形態における発光素子搭載用パッケージの製造方法の一工程を示す上面図であり、（ｂ）は、図５（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows 1 process of the manufacturing method of the light emitting element mounting package in 1st Embodiment, (b) is sectional drawing in the AA of FIG. 5 (a). 本発明の第２の実施形態における発光装置を示す上面図である。It is a top view which shows the light-emitting device in the 2nd Embodiment of this invention. （ａ）は、図６のＡ−Ａ線における断面図、（ｂ）は、図６のＢ−Ｂ線における断面図、（ｃ）は図６のＣ−Ｃ線における断面図である。(A) is sectional drawing in the AA line of FIG. 6, (b) is sectional drawing in the BB line of FIG. 6, (c) is sectional drawing in the CC line of FIG. （ａ）は、本発明の第３の実施形態における発光装置を示す上面図であり、（ｂ）は図８（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows the light-emitting device in the 3rd Embodiment of this invention, (b) is sectional drawing in the AA of FIG. 8 (a). （ａ）は、本発明の第３の実施形態の他の例における発光装置を示す上面図であり、（ｂ）は図９（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows the light-emitting device in the other example of the 3rd Embodiment of this invention, (b) is sectional drawing in the AA of FIG. 9 (a). （ａ）は、本発明の第４の実施形態における発光装置を示す上面図であり、（ｂ）は図10（ａ）のＡ−Ａ線における断面図、（ｃ）は図11（ａ）のＢ−Ｂ線における断面図である。(A) is a top view which shows the light-emitting device in the 4th Embodiment of this invention, (b) is sectional drawing in the AA of FIG. 10 (a), (c) is FIG. 11 (a). It is sectional drawing in the BB line. （ａ）は、本発明の第４の実施形態の他の例における発光装置を示す上面図であり、（ｂ）は図11（ａ）のＡ−Ａ線における断面図、（ｃ）は図11（ａ）のＢ−Ｂ線における断面図である。(A) is a top view which shows the light-emitting device in the other example of the 4th Embodiment of this invention, (b) is sectional drawing in the AA of FIG. 11 (a), (c) is a figure. It is sectional drawing in the BB line of 11 (a).

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における発光装置は、図１および図２に示すように、発光素子搭載用パッケージ１と、発光素子搭載用パッケージ１に形成された凹部13内に搭載された、発光素子２と部品４とを含んでいる。発光装置は、例えば照明装置を構成する回路基板上に実装される。(First embodiment)
As shown in FIGS. 1 and 2, the light emitting device according to the first embodiment of the present invention is a light emitting device mounting package 1 and a light emitting device mounted in a recess 13 formed in the light emitting device mounting package 1. The element 2 and the component 4 are included. The light emitting device is mounted on, for example, a circuit board constituting the lighting device.

発光素子搭載用パッケージ１は、上面に凹部13を有する絶縁基体11と、絶縁基体11の表面および内部に設けられた配線導体12とを有している。凹部13は、発光素子２を搭載するための第１搭載部11ａと、部品４とを搭載するための第２搭載部11ｂとを有している。第１搭載部11ａ側の凹部13の側壁は傾斜面を有しており、平面視で第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向に対して垂直方向において、第１搭載部11ａ側の凹部13の開口の幅Ｗ１が第２搭載部11ｂ側の凹部13の開口の幅Ｗ２よりも小さくなっている。なお、図１および後述する図５（ａ）、図６、図８（ａ）、図９（ａ）、図10（ａ）、図11（ａ）において、第１搭載部11ａは細かい網掛けで、第２搭載部11ｂは粗い網掛けで示している。図１および図２において、発光装置は仮想のｘｙｚ空間におけるｘｙ平面に実装されている。図１および図２において、上方向とは仮想のｚ軸の正方向のことをいう。   The light emitting element mounting package 1 includes an insulating base 11 having a recess 13 on the upper surface, and a wiring conductor 12 provided on the surface and inside of the insulating base 11. The recess 13 has a first mounting portion 11a for mounting the light emitting element 2 and a second mounting portion 11b for mounting the component 4. The side wall of the recess 13 on the first mounting portion 11a side has an inclined surface, and the first mounting portion 11a and the second mounting portion 11b have a first surface in a direction perpendicular to the facing direction in the facing portion of the first mounting portion 11a and the second mounting portion 11b. The width W1 of the opening of the recess 13 on the mounting portion 11a side is smaller than the width W2 of the opening of the recess 13 on the second mounting portion 11b side. In FIG. 1 and FIGS. 5 (a), 6, 8 (a), 9 (a), 10 (a), and 11 (a), which will be described later, the first mounting portion 11a has a fine mesh. The second mounting portion 11b is shown by rough shading. 1 and 2, the light emitting device is mounted on the xy plane in a virtual xyz space. 1 and 2, the upward direction means the positive direction of the virtual z axis.

絶縁基体11は、上面に凹部13を有しており、平面視において矩形状の形状を有しており、板状となっている。絶縁基体11は、発光素子２を支持するための支持体として機能し、凹部13の底面に設けられた配線導体12上に発光素子２が半田等の接合材を介して接着されて固定される。   The insulating base 11 has a recess 13 on the upper surface, has a rectangular shape in plan view, and has a plate shape. The insulating base 11 functions as a support for supporting the light emitting element 2, and the light emitting element 2 is bonded and fixed to the wiring conductor 12 provided on the bottom surface of the recess 13 through a bonding material such as solder. .

絶縁基体11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体またはガラスセラミック焼結体等のセラミックスを用いることができる。   As the insulating substrate 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used.

絶縁基体11が、樹脂材料を用いて作製される場合は、例えば、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂，フェノール樹脂もしくはポリエステル樹脂、または四フッ化エチレン樹脂を始めとするフッ素系樹脂等を用いることができる。   When the insulating substrate 11 is made of a resin material, for example, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin or a polyester resin, or a fluorine-based resin such as a tetrafluoroethylene resin is used. Can do.

絶縁基体11が、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム，酸化珪素，酸化マグネシウムおよび酸化カルシウム等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿状とし、これをドクターブレード法やカレンダーロール法等によってシート状に成形してセラミックグリーンシートを得て、しかる後、セラミックグリーンシートに適当な打ち抜き加工を施すとともにこれを複数枚積層し、高温（約1600℃）で焼成することによって製作される。   If the insulating substrate 11 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to form a slurry. Then, this is formed into a sheet shape by the doctor blade method or the calender roll method to obtain a ceramic green sheet. After that, the ceramic green sheet is subjected to appropriate punching processing, and a plurality of these are laminated to obtain a high temperature (about 1600 Manufactured by baking at a temperature of ° C.

凹部13は、発光素子２の搭載領域となる第１搭載部11ａと、部品４の搭載領域となる第２搭載部11ｂとを有している。第１搭載部11ａ側の凹部13の側壁は傾斜面を有しており、平面視で第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向に対して垂直方向において、第１搭載部11ａ側の凹部13の開口の幅Ｗ１が第２搭載部11ｂ側の凹部13の開口の幅Ｗ２よりも小さくなっている。図１および図２に示す例においては、第１搭載部11ａ側の凹部13の側壁は傾斜面を有しており、第２搭載部11ｂ側の凹部13の側壁は底面に対して垂直な面を有しているとともに、第１搭載部11ａに１つの発光素子２が搭載され、第２搭載部11ｂに１つの部品４が搭載されている。なお、図１、図２および後述する図６〜図11に示す例においては、第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向とはｙ軸方向であり、対向方向に対して垂直方向とはｘ軸方向である。   The concave portion 13 includes a first mounting portion 11 a that is a mounting region for the light emitting element 2 and a second mounting portion 11 b that is a mounting region for the component 4. The side wall of the recess 13 on the first mounting portion 11a side has an inclined surface, and the first mounting portion 11a and the second mounting portion 11b have a first surface in a direction perpendicular to the facing direction in the facing portion of the first mounting portion 11a and the second mounting portion 11b. The width W1 of the opening of the recess 13 on the mounting portion 11a side is smaller than the width W2 of the opening of the recess 13 on the second mounting portion 11b side. In the example shown in FIGS. 1 and 2, the side wall of the recess 13 on the first mounting portion 11a side has an inclined surface, and the side wall of the recess 13 on the second mounting portion 11b side is a surface perpendicular to the bottom surface. In addition, one light emitting element 2 is mounted on the first mounting portion 11a, and one component 4 is mounted on the second mounting portion 11b. In the examples shown in FIGS. 1 and 2 and FIGS. 6 to 11 to be described later, the facing direction in the facing portion between the first mounting portion 11a and the second mounting portion 11b is the y-axis direction. On the other hand, the vertical direction is the x-axis direction.

凹部13の傾斜面は、第１搭載部11ａの側壁について第１搭載部11ａを取り囲むように形成されていると、発光素子２から横方向に放射された光を、第１搭載部11ａの周囲でより広い面積となった凹部13の側壁によって良好に反射させて、発光装置の輝度を高めることができる。   When the inclined surface of the recess 13 is formed so as to surround the first mounting portion 11a on the side wall of the first mounting portion 11a, the light emitted from the light emitting element 2 in the lateral direction is transmitted around the first mounting portion 11a. Thus, it is possible to improve the brightness of the light emitting device by favorably reflecting by the side wall of the recess 13 having a larger area.

このような凹部13は、絶縁基体11用のセラミックグリーンシートにレーザー加工や金型による打ち抜き加工等によって、凹部13となる貫通孔を複数のセラミックグリーンシートに形成し、これらのセラミックグリーンシートを、貫通孔を形成していないセラミックグリーンシートに積層することで形成できる。また、絶縁基体11の厚みが薄い場合には、凹部13となる貫通孔は、セラミックグリーンシートを積層した後、レーザー加工や金型による打ち抜き加工等によって形成すると精度よく加工できるので好ましい。   Such a recess 13 is formed through a plurality of ceramic green sheets through holes to become the recesses 13 by laser processing or punching with a mold on the ceramic green sheet for the insulating substrate 11, and these ceramic green sheets are It can be formed by laminating on a ceramic green sheet in which no through hole is formed. In addition, when the insulating substrate 11 is thin, it is preferable that the through-hole serving as the recess 13 be formed by laser processing or punching with a mold after laminating ceramic green sheets, because it can be processed with high accuracy.

配線導体12は、絶縁基体11の表面および内部に設けられている。配線導体12の一端部は、例えば凹部13の底面に導出しており、配線導体12の他端部は、絶縁基体11の下面に導出している。配線導体12は、発光素子搭載用パッケージ１に搭載された発光素子２と外部の回路基板とを電気的に接続するためのものである。配線導体12は、絶縁基体11の表面または内部に設けられた配線導体と、絶縁基体11を構成する絶縁層を貫通して上下に位置する配線導体同士を電気的に接続する貫通導体とを含んでいる。   The wiring conductor 12 is provided on the surface and inside of the insulating base 11. One end portion of the wiring conductor 12 is led out to the bottom surface of the recess 13, for example, and the other end portion of the wiring conductor 12 is led out to the lower surface of the insulating base 11. The wiring conductor 12 is for electrically connecting the light emitting element 2 mounted on the light emitting element mounting package 1 and an external circuit board. The wiring conductor 12 includes a wiring conductor provided on the surface of or inside the insulating base 11, and a penetrating conductor that penetrates the insulating layer constituting the insulating base 11 and electrically connects the wiring conductors positioned above and below. It is out.

配線導体12は、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等の金属材料を用いることができる。例えば、絶縁基体11が酸化アルミニウム質焼結体から成る場合であれば、Ｗ，ＭｏまたはＭｎ等の高融点金属粉末に適当な有機バインダーおよび溶媒等を添加混合して得た配線導体12用の導体ペーストを、絶縁基体11となるセラミックグリーンシートに予めスクリーン印刷法によって所定のパターンに印刷塗布して、絶縁基体11となるセラミックグリーンシートと同時に焼成することによって、絶縁基体11の所定位置に被着形成される。配線導体12が貫通導体である場合は、金型やパンチングによる打ち抜き加工やレーザー加工によってグリーンシートに貫通孔を形成して、この貫通孔に印刷法によって配線導体12用の導体ペーストを充填しておくことによって形成される。   The wiring conductor 12 can be made of a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu). For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, the wiring conductor 12 is obtained by adding and mixing an appropriate organic binder and solvent to a refractory metal powder such as W, Mo or Mn. The conductor paste is printed and applied in a predetermined pattern to the ceramic green sheet to be the insulating base 11 in advance by a screen printing method, and is fired at the same time as the ceramic green sheet to be the insulating base 11 to cover a predetermined position of the insulating base 11. It is formed. When the wiring conductor 12 is a through conductor, a through hole is formed in the green sheet by punching by a die or punching or laser processing, and the through hole is filled with a conductor paste for the wiring conductor 12 by a printing method. It is formed by placing.

配線導体12の露出する表面には、さらに電気めっき法または無電解めっき法によってめっき層が被着されている。めっき層は、ニッケル，銅，金または銀等の耐食性や接続部材との接続性に優れる金属から成るものであり、例えば、厚さ0.5〜５μｍ程度のニッケルめっき層と0.1〜３μｍ程度の金めっき層とが、あるいは厚さ１〜10μｍ程度のニッケルめっき層と0.1〜１μｍ程度の銀めっき層とが、順次被着される。これによって、配線導体12が腐食することを効果的に抑制できるとともに、配線導体12と発光素子２との接合材による接合や配線導体12とボンディングワイヤ等の接続部材３との接合や、配線導体12と外部の回路基板の配線との接合を強固にできる。   The exposed surface of the wiring conductor 12 is further coated with a plating layer by electroplating or electroless plating. The plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, gold, or silver, and connectivity with a connection member. For example, a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold plating having a thickness of about 0.1 to 3 μm. A nickel plating layer having a thickness of about 1 to 10 μm and a silver plating layer having a thickness of about 0.1 to 1 μm are sequentially deposited. As a result, the corrosion of the wiring conductor 12 can be effectively suppressed, the bonding between the wiring conductor 12 and the light emitting element 2, the bonding between the wiring conductor 12 and the connection member 3 such as a bonding wire, the wiring conductor, and the like. The connection between the wiring 12 and the wiring of the external circuit board can be strengthened.

また、発光素子２が搭載される配線導体12上では、厚さ10〜80μｍ程度の銅めっき層を被着させておくことにより、発光素子２の熱を良好に放熱させやすくしてもよいし、下面の配線導体12上では、厚さ10〜80μｍ程度の銅めっき層を被着させておくことにより、発光素子搭載用パッケージ１から外部の回路基板に放熱させやすくしてもよい。   In addition, on the wiring conductor 12 on which the light emitting element 2 is mounted, a copper plating layer having a thickness of about 10 to 80 μm may be deposited to facilitate heat dissipation of the light emitting element 2 satisfactorily. On the wiring conductor 12 on the lower surface, a copper plating layer having a thickness of about 10 to 80 μm may be deposited to facilitate heat dissipation from the light emitting element mounting package 1 to the external circuit board.

また、上記以外の金属からなるめっき層、例えばパラジウムめっき層等を介在させていても構わない。   Moreover, you may interpose the plating layer which consists of metals other than the above, for example, a palladium plating layer.

また、発光素子２が搭載される配線導体12の最表面には銀めっき層を被着させ、他の配線導体12の最表面には金めっき層を被着させることが好ましい。金めっき層は、銀めっき層と比較して接続部材３との、あるいは外部の回路基板の配線との接合性に優れており、銀めっき層は、金めっき層と比較して光に対する反射率が高いためである。また、配線導体12の最表面を銀と金との合金めっき層として、例えば銀と金との全率固溶の合金めっき層としてもよい。   Moreover, it is preferable to apply a silver plating layer to the outermost surface of the wiring conductor 12 on which the light emitting element 2 is mounted, and to apply a gold plating layer to the outermost surface of the other wiring conductor 12. The gold plating layer is superior in bondability with the connection member 3 or the wiring of the external circuit board as compared with the silver plating layer, and the silver plating layer has a light reflectance compared with the gold plating layer. Is high. Further, the outermost surface of the wiring conductor 12 may be an alloy plating layer of silver and gold, for example, an alloy plating layer of a complete solid solution of silver and gold.

第１搭載部11ａと第２搭載部11ｂとを有し、部分的に側壁の傾斜角度が異なる凹部13の形成は、例えば以下の製造方法によって製作できる。   Formation of the concave portion 13 having the first mounting portion 11a and the second mounting portion 11b and having partially different side wall inclination angles can be manufactured by, for example, the following manufacturing method.

まず、図３に示された例のように、第１セラミックグリーンシート111を準備し、第１セラミックグリーンシート111に、金型による打ち抜き加工により、第１貫通孔114を形成する。このとき、第１貫通孔114は、全周にわたって側壁が、例えば開口径の小さい側の第１貫通孔114の開口面とのなす角度が110度〜145度に傾斜した貫通孔として形成される。角度をこのような範囲とすると、凹部13となる貫通孔の側壁を打ち抜き加工で安定かつ効率よく形成することが容易であり、この発光素子搭載用パッケージ１を用いた発光装置を小型化しやすい。また、発光素子が発した光を外部に向かって良好に放射できる。このような角度の側壁を有する凹部13は、パンチの径とダイスの穴の径とのクリアランスを大きく設定した打ち抜き金型を用いて第１セラミックグリーンシート111を打ち抜くことによって形成される。すなわち、打ち抜き金型のパンチの径に対してダイスの穴の径のクリアランスを大きく設定しておくことで、第１セラミックグリーンシート111を主面側から他方主面側に向けて打ち抜く際にグリーンシートがパンチとの接触面の縁からダイスの穴との接触面の縁に向けて剪断されて、貫通孔の径が主面側から他方主面側に広がるように形成される。このとき、第１セラミックグリーンシート111の厚み等に応じてパンチの径とダイスの穴の径とのクリアランスを設定することで、第１セラミックグリーンシート111に形成される第１貫通孔114の側壁の角度を調節できる。このような打ち抜き方法は、打ち抜き加工のみで、凹部13の側壁と凹部13の底面とのなす角度を所望の角度にできることから、生産性が高い。   First, as in the example shown in FIG. 3, a first ceramic green sheet 111 is prepared, and first through holes 114 are formed in the first ceramic green sheet 111 by punching using a mold. At this time, the first through hole 114 is formed as a through hole whose side wall is inclined at an angle of 110 to 145 degrees with the opening surface of the first through hole 114 on the side having a smaller opening diameter, for example. . When the angle is in such a range, it is easy to stably and efficiently form the side wall of the through hole that becomes the recess 13 by punching, and the light emitting device using the light emitting element mounting package 1 can be easily downsized. In addition, the light emitted from the light emitting element can be emitted well toward the outside. The concave portion 13 having such a side wall is formed by punching the first ceramic green sheet 111 using a punching die in which the clearance between the punch diameter and the die hole diameter is set large. That is, by setting the clearance of the diameter of the die hole larger than the diameter of the punch of the punching die, when the first ceramic green sheet 111 is punched from the main surface side toward the other main surface side, the green The sheet is sheared from the edge of the contact surface with the punch toward the edge of the contact surface with the die hole, and the diameter of the through hole is formed to expand from the main surface side to the other main surface side. At this time, the side wall of the first through hole 114 formed in the first ceramic green sheet 111 is set by setting a clearance between the diameter of the punch and the diameter of the die hole according to the thickness of the first ceramic green sheet 111 and the like. You can adjust the angle. Such a punching method is high in productivity because the angle formed between the side wall of the recess 13 and the bottom surface of the recess 13 can be set to a desired angle only by punching.

また、パンチの径とダイスの穴の径とのクリアランスが小さい打ち抜き金型による加工によって角度が約90度の貫通孔を形成した後に、貫通孔の側壁に円錐台形状または角錐台形状の型を押し当てることでも、上述のような一方の主面側から他方の主面側に広がる角度を有する第１貫通孔114を形成してもよい。このような場合には、凹部13の側壁と凹部13の底面とのなす角度をより精度よく調整できる。   In addition, after forming a through hole with an angle of about 90 degrees by processing with a punching die with a small clearance between the diameter of the punch and the diameter of the die hole, a die having a truncated cone shape or a truncated pyramid shape is formed on the side wall of the through hole. Alternatively, the first through-hole 114 having an angle extending from one main surface side to the other main surface side as described above may be formed. In such a case, the angle formed between the side wall of the recess 13 and the bottom surface of the recess 13 can be adjusted with higher accuracy.

次に、図４に示された例のように、第１セラミックグリーンシート111に、金型による打ち抜き加工により、平面視において第１貫通孔114の一部を切り欠くように第２貫通孔115を形成し、第１貫通孔114と第２貫通孔115とが連結した大貫通孔116を形成する。大貫通孔116は、例えば、第１貫通孔114の側壁は傾斜し、第２貫通孔115の側壁は垂直に形成される。このとき、第２貫通孔115は、金型により、第１貫通孔114の開口の大きい面側から開口の小さい面側に向けて第１セラミックグリーンシート111を打ち抜いて形成される。   Next, as in the example shown in FIG. 4, the second through hole 115 is formed in the first ceramic green sheet 111 so as to cut out a part of the first through hole 114 in plan view by punching with a mold. And a large through hole 116 in which the first through hole 114 and the second through hole 115 are connected to each other is formed. In the large through hole 116, for example, the side wall of the first through hole 114 is inclined, and the side wall of the second through hole 115 is formed vertically. At this time, the second through-hole 115 is formed by punching out the first ceramic green sheet 111 from the large opening side of the first through-hole 114 toward the small opening side by a mold.

そして、図５に示された例のように、第１セラミックグリーンシート111と、他の第２セラミックグリーンシート112とを積層して、セラミックグリーンシート積層体113を準備する。なお、第２のセラミックグリーンシート112には、予め配線導体用のメタライズペースト212が形成されている。そして、このセラミックグリーンシート積層体113を焼成することにより、第１搭載部11ａと第２搭載部11ｂとを有する凹部13を有する絶縁基体11を形成する。なお、第１のセラミックグリーンシート111および第２のセラミックグリーンシート112は、それぞれ単層での説明を行なっているが、２層以上であっても構わない。   Then, as in the example shown in FIG. 5, the first ceramic green sheet 111 and another second ceramic green sheet 112 are laminated to prepare a ceramic green sheet laminate 113. The second ceramic green sheet 112 is preliminarily formed with a metallized paste 212 for wiring conductor. Then, by firing the ceramic green sheet laminate 113, the insulating base 11 having the recess 13 having the first mounting portion 11a and the second mounting portion 11b is formed. The first ceramic green sheet 111 and the second ceramic green sheet 112 are each described as a single layer, but may be two or more layers.

発光素子搭載用パッケージ１は、凹部13の第１搭載部11ａに発光素子２が搭載され、凹部13の第２搭載部11ｂに部品４が搭載されることによって発光装置が作製される。発光素子搭載用パッケージ１に搭載される発光素子２がワイヤボンディング型である場合には、発光素子２は、半田等の接合材によって配線導体12上に固定された後、ボンディングワイヤ等の接続部材３を介して発光素子２の電極と配線導体12とが電気的に接続されることによって発光素子搭載用パッケージ１に搭載される。   In the light emitting element mounting package 1, the light emitting element 2 is mounted on the first mounting portion 11 a of the concave portion 13, and the component 4 is mounted on the second mounting portion 11 b of the concave portion 13, whereby a light emitting device is manufactured. When the light emitting element 2 mounted on the light emitting element mounting package 1 is a wire bonding type, the light emitting element 2 is fixed on the wiring conductor 12 with a bonding material such as solder and then connected to a connecting member such as a bonding wire. The electrode of the light emitting element 2 and the wiring conductor 12 are electrically connected via 3 to be mounted on the light emitting element mounting package 1.

発光素子２は、例えば発光ダイオード（Light Emitting Diode）等の半導体発光素子である。なお、発光素子２は必要に応じて、樹脂またはガラス等からなる封止材５により、樹脂、ガラス、セラミックスまたは金属等からなる蓋体等によって封止される。   The light emitting element 2 is a semiconductor light emitting element such as a light emitting diode. In addition, the light emitting element 2 is sealed with a sealing body 5 made of resin, glass, or the like, if necessary, by a lid made of resin, glass, ceramics, metal, or the like.

部品４は、例えば、抵抗素子や容量素子、ツェナーダイオード等の小型の電子部品、または放熱部材、反射部材、外部の回路基板に固定するための固定部材、外部の回路基板に電気的に接続するためのリード部材等である。なお、部品４が搭載される第２搭載部11ｂには、部品４の用途に応じて、部品４用の接合用金属層や配線導体12が形成される。   The component 4 is electrically connected to, for example, a small electronic component such as a resistance element, a capacitance element, or a Zener diode, a heat dissipation member, a reflection member, a fixing member for fixing to an external circuit board, or an external circuit board. For example, a lead member. In addition, in the second mounting portion 11b on which the component 4 is mounted, a joining metal layer for the component 4 and a wiring conductor 12 are formed according to the use of the component 4.

本実施形態の発光素子搭載用パッケージ１によれば、平面視で第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向に対して垂直方向において、第１搭載部11ａ側の凹部13の開口の幅Ｗ１が第２搭載部11ｂ側の凹部13の開口の幅Ｗ２よりも小さいことから、第２搭載部11ｂにサイズが大きい部品４または複数の部品４を搭載したとしても、発光素子２と凹部13の側壁との間隔が大きいものとならず、発光素子２が放射した光は凹部13の側壁に効果的に反射されるものとなり、輝度が低下しにくいものとすることができる。   According to the light emitting element mounting package 1 of the present embodiment, the concave portion on the first mounting portion 11a side in the direction perpendicular to the facing direction of the facing portion of the first mounting portion 11a and the second mounting portion 11b in plan view. Since the width W1 of the opening 13 is smaller than the width W2 of the opening 13 of the recess 13 on the second mounting portion 11b side, even if a large component 4 or a plurality of components 4 are mounted on the second mounting portion 11b The distance between the element 2 and the side wall of the concave portion 13 does not become large, and the light emitted from the light emitting element 2 is effectively reflected on the side wall of the concave portion 13 so that the luminance is hardly lowered. .

また、第１搭載部11ａ側の凹部13を第２搭載部11ｂ側の凹部13よりも小さくしていることから、第１搭載部11ａ側の凹部13の側壁を傾斜面としても、十分な壁厚みを有することとなるので、発光素子搭載用パッケージ１の小型化を図ることができる。   Further, since the concave portion 13 on the first mounting portion 11a side is made smaller than the concave portion 13 on the second mounting portion 11b side, a sufficient wall can be obtained even if the side wall of the concave portion 13 on the first mounting portion 11a side is an inclined surface. Since it has thickness, the light emitting element mounting package 1 can be reduced in size.

本実施形態の発光装置によれば、上記構成の発光素子搭載用パッケージ１と、第１搭載部11ａに搭載された発光素子２と、第２搭載部11ｂに搭載された部品４とを有することによって、高輝度の発光装置とすることができる。   According to the light emitting device of this embodiment, the light emitting element mounting package 1 having the above configuration, the light emitting element 2 mounted on the first mounting portion 11a, and the component 4 mounted on the second mounting portion 11b are provided. Thus, a light emitting device with high luminance can be obtained.

（第２の実施形態）
次に、本発明の第２の実施形態による電子装置について、図６および図７を参照しつつ説明する。(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

本発明の第２の実施形態における発光装置において、上記した第１の実施形態の発光装置と異なる点は、図６および図７に示された例のように、第１搭載部11ａ側の側壁と第２搭載部11ｂ側の側壁とが交わる角部を面取りし、Ｃ面にしている点と、凹部13の側壁に金属層14が形成されている点と、絶縁基体11の下面中央部に中央端子層15が形成されている点である。図６および図７に示す例においては、第１搭載部11ａに３つの発光素子２が搭載され、第２搭載部11ｂに４つの部品４が搭載されている。   The light emitting device according to the second embodiment of the present invention differs from the light emitting device according to the first embodiment described above in that the side wall on the first mounting portion 11a side is the same as the example shown in FIGS. Chamfered at the corner where the side wall on the second mounting portion 11b side is chamfered, a point where the metal layer 14 is formed on the side wall of the recess 13, and a central portion on the lower surface of the insulating base 11. The central terminal layer 15 is formed. In the example shown in FIGS. 6 and 7, three light emitting elements 2 are mounted on the first mounting portion 11a, and four components 4 are mounted on the second mounting portion 11b.

第２の実施形態における発光素子搭載用パッケージ１は、第１搭載部11ａ側の側壁と第２搭載部11ｂ側の側壁とが交わる角部を面取りし、Ｃ面にしていることから、凹部13の底面側において、部品４の搭載領域となる第２搭載部11ｂの領域を広くするとともに、凹部13の開口部において、反射面となる凹部13の側壁に金属層14が形成されるので、小型でかつ高輝度の発光素子搭載用パッケージ１とすることができる。   The light emitting element mounting package 1 according to the second embodiment has a chamfered corner portion where the side wall on the first mounting portion 11a side and the side wall on the second mounting portion 11b side intersect to form a concave portion 13. Since the area of the second mounting portion 11b that becomes the mounting area of the component 4 is widened on the bottom side of the metal layer 14 and the metal layer 14 is formed on the side wall of the concave portion 13 that becomes the reflecting surface in the opening portion of the concave portion 13, In addition, the light emitting element mounting package 1 having high luminance can be obtained.

第２の実施形態における発光素子搭載用パッケージは、第１貫通孔が形成された第１セラミックグリーンシートの第１貫通孔の側壁に金属層14用のメタライズペーストを印刷塗布した後、金型による打ち抜き加工により、平面視において第１貫通孔および金属層14用のメタライズペーストの一部を切り欠くように第２貫通孔を形成することで形成される。第２の実施形態における発光素子搭載用パッケージ１は、平面視において第１貫通孔114の一部と重なるように直線的に第２貫通孔を形成する場合と比較して、第１貫通孔と第２貫通孔との境界部の側壁や金属層14用のメタライズペーストに変形やクラックが発生し難く、凹部13の形状および信頼性に優れた発光素子搭載用パッケージ１とすることができる。   In the light emitting element mounting package in the second embodiment, the metallized paste for the metal layer 14 is printed and applied on the side wall of the first through hole of the first ceramic green sheet in which the first through hole is formed, and then the mold is used. By punching, the first through hole and the second through hole are formed so as to cut out part of the metallized paste for the metal layer 14 in plan view. The light emitting element mounting package 1 according to the second embodiment has a first through hole compared to a case where the second through hole is linearly formed so as to overlap a part of the first through hole 114 in plan view. The light-emitting element mounting package 1 is excellent in the shape and reliability of the recess 13 because the side wall at the boundary with the second through hole and the metallized paste for the metal layer 14 are hardly deformed or cracked.

金属層14および中央端子層15は、上述の配線導体12と同様の材料および方法によって製作することができ、露出する表面には、配線導体12と同様のめっき層が被着される。金属層14は、例えば発光素子２の光を反射するための反射層として用いられる。中央端子層15は、例えば、配線導体12と同様に外部の回路基板との接合に用いられる。   The metal layer 14 and the central terminal layer 15 can be manufactured by the same material and method as those of the wiring conductor 12 described above, and a plating layer similar to that of the wiring conductor 12 is deposited on the exposed surface. The metal layer 14 is used as a reflective layer for reflecting the light of the light emitting element 2, for example. The central terminal layer 15 is used, for example, for bonding to an external circuit board in the same manner as the wiring conductor 12.

（第３の実施形態）
次に、本発明の第３の実施形態による発光装置について、図８および図９を参照しつつ説明する。(Third embodiment)
Next, a light emitting device according to a third embodiment of the invention will be described with reference to FIGS.

本発明の第３の実施形態における発光装置において、上記した実施形態の発光装置と異なる点は、図８および図９に示された例のように、凹部13の第１搭載部11ａの側壁のうち第２搭載部11ｂに対向する側壁と対向する第２搭載部11ｂの側壁が設けられていない点である。図８に示す例においては、第１搭載部11ａに３つの発光素子２が搭載され、第２搭載部11ｂに３つの部品４が搭載されており、図９に示す例においては、第１搭載部11ａに３つの発光素子２が搭載され、第２搭載部11ｂに１つの部品４が搭載されている。   The light emitting device according to the third embodiment of the present invention differs from the light emitting device according to the above-described embodiment in that the side wall of the first mounting portion 11a of the recess 13 is different from the example shown in FIGS. Of these, the side wall of the second mounting portion 11b facing the side wall facing the second mounting portion 11b is not provided. In the example shown in FIG. 8, three light emitting elements 2 are mounted on the first mounting portion 11a, and three components 4 are mounted on the second mounting portion 11b. In the example shown in FIG. Three light emitting elements 2 are mounted on the part 11a, and one component 4 is mounted on the second mounting part 11b.

図８に示された例においては、平面視で第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向において、第２搭載部11ｂが絶縁基体11の外縁まで延出して形成されており、部品４が、平面透視において、絶縁基体11から突出するように配置されている。   In the example shown in FIG. 8, the second mounting portion 11 b extends to the outer edge of the insulating base 11 in the facing direction in the facing portion between the first mounting portion 11 a and the second mounting portion 11 b in plan view. The component 4 is arranged so as to protrude from the insulating base 11 in a plan perspective.

図９に示された例においては、第２搭載部11ｂにおいて、凹部13の深さが絶縁基体11の厚み以上であり、凹部13の底面が存在しておらず、部品４が絶縁基体11の側面に搭載されている。   In the example shown in FIG. 9, in the second mounting portion 11 b, the depth of the recess 13 is equal to or greater than the thickness of the insulating base 11, and the bottom surface of the recess 13 does not exist. It is mounted on the side.

第３の実施形態の発光素子搭載用パッケージ１は、凹部13の第１搭載部11ａの側壁のうち第２搭載部11ｂに対向する側壁と対向する第２搭載部11ｂの側壁が設けられていないことから、部品４を凹部13の第２搭載部11ｂに搭載しやすくなるとともに、発光素子搭載用パッケージ１の小型化を図ることができる。また、凹部13の深さが絶縁基体11の厚み以上であり、凹部13の底面が存在していないことから、部品４を絶縁基体11の側面に搭載することが可能となり、よりサイズが大きい部品４またはより多くの複数の部品４を搭載することが可能となる。   In the light emitting element mounting package 1 according to the third embodiment, the side wall of the second mounting portion 11b facing the side wall facing the second mounting portion 11b among the side walls of the first mounting portion 11a of the recess 13 is not provided. Therefore, the component 4 can be easily mounted on the second mounting portion 11b of the concave portion 13, and the light emitting element mounting package 1 can be reduced in size. In addition, since the depth of the recess 13 is equal to or greater than the thickness of the insulating substrate 11 and the bottom surface of the recess 13 does not exist, the component 4 can be mounted on the side surface of the insulating substrate 11 and the component is larger in size. It is possible to mount four or more parts 4.

第３の実施形態における発光素子搭載用パッケージは、第１搭載部11ａと第２搭載部11ｂとを有する凹部13を有するセラミックグリーンシート積層体、あるいは第１搭載部11ａと第２搭載部11ｂとを有する凹部13を有する絶縁基体11に対して、凹部13を分断するように切断することによって製作することができる。   The light emitting element mounting package in the third embodiment includes a ceramic green sheet laminate having a recess 13 having a first mounting portion 11a and a second mounting portion 11b, or a first mounting portion 11a and a second mounting portion 11b. It can manufacture by cut | disconnecting the recessed part 13 with respect to the insulation base | substrate 11 which has the recessed part 13 which has these.

また、上述の例では、第１搭載部11ａの側壁のうち第２搭載部11ｂに対向する側壁と対向する第２搭載部11ｂの側壁が設けられていない構成としているが、第２搭載部11ｂの側壁のうち第１搭載部11ａに対向する側壁と対向する第１搭載部11ａの側壁が設けられていない構成であってもよく、この場合には、発光素子２を凹部13の第１搭載部11ａに搭載しやすくなるとともに、発光素子２の光を上面側および側面側に放出させる発光素子搭載用パッケージ１とすることができる。   In the above-described example, the second mounting portion 11b is not provided with the side wall of the second mounting portion 11b that faces the side wall of the first mounting portion 11a that faces the side of the second mounting portion 11b. The side wall of the first mounting portion 11a facing the first mounting portion 11a may not be provided, and in this case, the light-emitting element 2 is mounted on the first mounting portion of the recess 13. The light emitting element mounting package 1 can be easily mounted on the portion 11a and can emit light of the light emitting element 2 to the upper surface side and the side surface side.

（第４の実施形態）
次に、本発明の第４の実施形態による発光装置について、図10および図11を参照しつつ説明する。(Fourth embodiment)
Next, a light emitting device according to a fourth embodiment of the present invention will be described with reference to FIGS.

本発明の第４の実施形態における発光装置において、上記した実施形態の発光装置と異なる点は、図10および図11に示された例のように、第１搭載部11ａまたは第２搭載部11ｂが複数形成されている点である。図10に示す例では、２つの第２搭載部11ｂが第１搭載部11ａを挟んで対向して設けられており、第１搭載部11ａには、３つの発光素子２が搭載され、２つの第２の搭載部11ｂには、それぞれ１つの部品４と４つの部品４とが搭載されている。図11に示す例では、２つの第１搭載部11ａが第２搭載部11ｂを挟んで対向して設けられており、２つの第１搭載部11ａにはそれぞれ４つの発光素子２と６つの発光素子２とが搭載され、第２の搭載部11ｂには４つの部品４とが搭載されている。   The light emitting device according to the fourth embodiment of the present invention differs from the light emitting device according to the above embodiment in that the first mounting portion 11a or the second mounting portion 11b is different from the example shown in FIGS. This is a point where a plurality of are formed. In the example shown in FIG. 10, two second mounting portions 11b are provided to face each other across the first mounting portion 11a, and three light emitting elements 2 are mounted on the first mounting portion 11a. One component 4 and four components 4 are mounted on the second mounting portion 11b, respectively. In the example shown in FIG. 11, two first mounting portions 11a are provided to face each other across the second mounting portion 11b, and the four first light emitting elements 2 and the six light emitting elements are respectively provided in the two first mounting portions 11a. The element 2 is mounted, and the four components 4 are mounted on the second mounting portion 11b.

第４の実施形態の発光素子搭載用パッケージ１は、第１搭載部11ａまたは第２搭載部11ｂが複数形成されていることから、凹部13を必要に応じた大きさとすることができるので、複数の発光素子２または部品４が搭載される発光素子搭載用パッケージ１の高輝度化および小型化を図ることができる。   Since the light emitting element mounting package 1 of the fourth embodiment has a plurality of first mounting portions 11a or second mounting portions 11b, the recesses 13 can be sized as required. The light emitting element mounting package 1 on which the light emitting element 2 or the component 4 is mounted can be increased in luminance and size.

複数の第１搭載部11ａまたは複数の第２搭載部11ｂは、第１搭載部11ａ同士または第２搭載部11ｂ同士の大きさや側壁の傾斜角度が同じであってもよいし、図10および図11に示す例のように、それぞれの搭載部の大きさや側壁の傾斜角度が異なっていても構わない。   The plurality of first mounting portions 11a or the plurality of second mounting portions 11b may have the same size or the inclination angle of the side walls of the first mounting portions 11a or the second mounting portions 11b. As in the example shown in 11, the size of each mounting portion and the inclination angle of the side wall may be different.

このような搭載部は、例えば、複数の第１搭載部11ａのそれぞれの側壁の角度が同じ場合には、第１セラミックグリーンシートの広領域に第１貫通孔を形成し、この第１貫通孔を複数に分断するように、第２貫通孔を形成すればよい。複数の第１搭載部11ａのそれぞれの側壁の角度が異なっている場合には、例えば、第１セラミックグリーンシートに側壁の傾斜角度の異なる２つの第１貫通孔を隣接して形成し、第１セラミックグリーンシートに、この２つの第１貫通孔を同時に分断するように第２貫通孔を形成すればよい。   For example, when the angles of the side walls of the plurality of first mounting portions 11a are the same, the mounting portion forms a first through hole in a wide area of the first ceramic green sheet. What is necessary is just to form a 2nd through-hole so that may be divided into plurality. When the angles of the side walls of the plurality of first mounting portions 11a are different, for example, two first through holes having different inclination angles of the side walls are formed adjacent to the first ceramic green sheet, and the first The second through hole may be formed in the ceramic green sheet so as to simultaneously divide the two first through holes.

なお、第１搭載部11ａと第２搭載部11ｂとが複数形成された凹部13を有するものであっても構わない。   In addition, you may have the recessed part 13 in which the 1st mounting part 11a and the 2nd mounting part 11b were formed in multiple numbers.

本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。例えば、配線導体12の他端部は、絶縁基体11の下面に導出しているが、絶縁基体11の上面や側面に導出しても構わない。例えば、絶縁基体11の側面に溝が設けられており、溝の内面に導体の被着された、いわゆるキャスタレーション導体を有していてもよい。   The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the other end portion of the wiring conductor 12 is led out to the lower surface of the insulating base 11, but may be led to the upper surface and side surfaces of the insulating base 11. For example, a groove may be provided on the side surface of the insulating base 11, and a so-called castellation conductor having a conductor attached to the inner surface of the groove may be provided.

また、平面視で第１搭載部11ａと第２搭載部11ｂとの対向部分における対向方向に対して垂直方向において、第１搭載部11ａ側の凹部13の開口の幅Ｗ１方向の中心と、第２搭載部11ｂ側の凹部13の開口の幅Ｗ２方向の中心とがずれていてもよい。   Further, in a plan view, the center in the width W1 direction of the opening of the recess 13 on the first mounting portion 11a side in the direction perpendicular to the facing direction at the facing portion of the first mounting portion 11a and the second mounting portion 11b, 2 The center of the opening of the recess 13 on the mounting portion 11b side in the width W2 direction may be shifted.

また、配線導体12の他端部を上面側に導出させる場合は、発光素子搭載用パッケージ１の上面側において外部の回路基板に接合してもよい。このような発光素子搭載用パッケージ１は、発光素子搭載用パッケージ１の上面側で外部の回路基板に接合できるので、発光素子搭載用パッケージ１の下面側の全面に絶縁基体11よりも熱伝導率の高い部材を接合して発光素子搭載用パッケージ１の放熱性を向上できる。絶縁基体11よりも熱伝導率の高い材料としては、絶縁基体が11が酸化アルミニウム質焼結体からなる場合は、銅（Ｃｕ）、銅−タングステン（Ｃｕ−Ｗ）またはアルミニウム（Ａｌ）等の金属材料や窒化アルミニウム質焼結体からなる絶縁基体等が挙げられる。   When the other end portion of the wiring conductor 12 is led out to the upper surface side, it may be bonded to an external circuit board on the upper surface side of the light emitting element mounting package 1. Since the light emitting element mounting package 1 can be bonded to an external circuit board on the upper surface side of the light emitting element mounting package 1, the thermal conductivity of the light emitting element mounting package 1 on the entire lower surface side of the light emitting element mounting package 1 is higher than that of the insulating substrate 11. It is possible to improve the heat dissipation of the light emitting element mounting package 1 by bonding a high member. As a material having higher thermal conductivity than the insulating base 11, when the insulating base 11 is made of an aluminum oxide sintered body, copper (Cu), copper-tungsten (Cu-W), aluminum (Al), or the like is used. Examples thereof include an insulating substrate made of a metal material or an aluminum nitride sintered body.

また、発光素子搭載用パッケージ１は、絶縁基体11の第１搭載部11ａを貫通した貫通部を形成し、この貫通部に、発光素子２が搭載される放熱性に優れた放熱部材を嵌合した発光素子搭載用パッケージ１であってもよいし、絶縁基体11の内部に、絶縁基体11よりも放熱性の優れた金属部材を平面視で発光素子２が搭載される領域と重なる領域に埋設させた発光素子搭載用パッケージ１であってもよい。   The light emitting element mounting package 1 is formed with a penetrating portion penetrating the first mounting portion 11a of the insulating base 11, and a heat radiating member with excellent heat dissipation on which the light emitting element 2 is mounted is fitted into the penetrating portion. The light-emitting element mounting package 1 may be used, or a metal member having better heat dissipation than the insulating base 11 is embedded inside the insulating base 11 in a region overlapping the region where the light-emitting element 2 is mounted in plan view. The light emitting element mounting package 1 may be used.

また、発光素子搭載用パッケージ１は多数個取り発光素子搭載用パッケージの形態で製作されていてもよいし、複数の凹部13を有する発光素子搭載用パッケージ１であっても構わない。   Further, the light emitting element mounting package 1 may be manufactured in the form of a multi-piece light emitting element mounting package or may be a light emitting element mounting package 1 having a plurality of recesses 13.

本発明の一つの態様によれば、発光素子搭載用パッケージは、凹部を有し、該凹部内に発光素子を搭載するための第１搭載部と発光素子を除く部品を搭載するための第２搭載部とを有する絶縁基体を有しており、前記第１搭載部側の前記凹部の側壁は傾斜面を有しており、平面視で前記第１搭載部と前記第２搭載部との対向部分における対向方向に対して垂直方向において、前記第１搭載部側の前記凹部の開口の幅が前記第２搭載部側の前記凹部の開口の幅よりも小さい。
According to one aspect of the present invention, the light emitting element mounting package has a recess, a first mounting portion for mounting the light emitting element in the recess, and a second for mounting components excluding the light emitting element . has an insulating base and a mounting portion, opposite of the side wall of the recess of the first mounting portion has an inclined surface, the said first mounting portion in a plan view a second mounting portion In the direction perpendicular to the facing direction of the portion, the width of the opening of the concave portion on the first mounting portion side is smaller than the width of the opening of the concave portion on the second mounting portion side.

本発明の一つの態様による発光素子搭載用パッケージは、凹部を有し、凹部内に発光素子を搭載するための第１搭載部と発光素子を除く部品を搭載するための第２搭載部とを有する絶縁基体を有しており、第１搭載部側の凹部の側壁は傾斜面を有しており、平面視で第１搭載部と第２搭載部との対向部分における対向方向に対して垂直方向において、第１搭載部側の凹部の開口の幅が第２搭載部側の凹部の開口の幅よりも小さいことから、第２搭載部にサイズが大きい部品または複数の部品を搭載したとしても、発光素子と凹部の側壁との間隔が大きいものとならず、発光素子が放射した光は凹部の側壁に効果的に反射されるものとなり、発光装置として輝度が低下しにくいものとすることができる。 A light emitting element mounting package according to one aspect of the present invention has a recess, and includes a first mounting portion for mounting the light emitting element in the recess and a second mounting portion for mounting components other than the light emitting element. And the side wall of the recess on the first mounting portion side has an inclined surface, and is perpendicular to the facing direction at the facing portion between the first mounting portion and the second mounting portion in plan view. In the direction, since the width of the opening of the recess on the first mounting portion side is smaller than the width of the opening of the recess on the second mounting portion side, even if a large component or a plurality of components are mounted on the second mounting portion The distance between the light emitting element and the side wall of the concave portion does not become large, and the light emitted from the light emitting element is effectively reflected on the side wall of the concave portion, so that the luminance of the light emitting device is difficult to decrease. it can.

Claims (8)

凹部を有し、該凹部内に発光素子を搭載するための第１搭載部と部品を搭載するための第２搭載部とを有する絶縁基体を備えており、前記第１搭載部側の前記凹部の側壁は傾斜面を有しており、平面視で前記第１搭載部と前記第２搭載部との対向部分における対向方向に対して垂直方向において、前記第１搭載部側の前記凹部の開口の幅が前記第２搭載部側の前記凹部の開口の幅よりも小さいことを特徴とする発光素子搭載用パッケージ。   An insulating base having a first mounting portion for mounting a light emitting element and a second mounting portion for mounting a component in the concave portion, the concave portion on the first mounting portion side; The side wall of the first mounting portion has an inclined surface, and the opening of the recess on the first mounting portion side is perpendicular to the opposing direction of the opposing portion of the first mounting portion and the second mounting portion in plan view. The light emitting element mounting package is characterized in that the width of the light emitting element is smaller than the width of the opening of the recess on the second mounting portion side. 前記凹部の前記傾斜面に金属層が設けられていることを特徴とする請求項１に記載の発光素子搭載用パッケージ。   The light emitting element mounting package according to claim 1, wherein a metal layer is provided on the inclined surface of the recess. 前記第１搭載部側の側壁と前記第２搭載部側の側壁とが交わる角部が面取りされていることを特徴とする請求項１に記載の発光素子搭載用パッケージ。   2. The light emitting element mounting package according to claim 1, wherein a corner portion where the side wall on the first mounting portion side and the side wall on the second mounting portion side intersect is chamfered. 前記凹部の前記第１搭載部の側壁のうち前記第２搭載部に対向する側壁と対向する前記第２搭載部の側壁が設けられていないことを特徴とする請求項１に記載の発光素子搭載用パッケージ。   2. The light emitting element mounting according to claim 1, wherein a side wall of the second mounting portion facing a side wall facing the second mounting portion is not provided among side walls of the first mounting portion of the recess. For package. 前記第２搭載部において、前記凹部の深さが前記絶縁基体の厚み以上であり、前記凹部の底面が存在していないことを特徴とする請求項１に記載の発光素子搭載用パッケージ。   2. The light emitting element mounting package according to claim 1, wherein in the second mounting portion, the depth of the recess is equal to or greater than the thickness of the insulating base, and the bottom surface of the recess does not exist. 平面視で複数の前記第２搭載部が前記第１搭載部を挟んで対向して設けられていることを特徴とする請求項１に記載の発光素子搭載用パッケージ。   2. The light emitting element mounting package according to claim 1, wherein a plurality of the second mounting portions are provided to face each other with the first mounting portion interposed therebetween in a plan view. 平面視で複数の前記第１搭載部が前記第２搭載部を挟んで対向して設けられていることを特徴とする請求項１に記載の発光素子搭載用パッケージ。   2. The light emitting element mounting package according to claim 1, wherein a plurality of the first mounting portions are provided to face each other with the second mounting portion interposed therebetween in a plan view. 請求項１に記載の発光素子搭載用パッケージと、前記第１搭載部に搭載された前記発光素子と、前記第２搭載部に搭載された前記部品とを有することを特徴とする発光装置。   A light emitting device comprising: the light emitting element mounting package according to claim 1; the light emitting element mounted on the first mounting portion; and the component mounted on the second mounting portion.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196637A (en) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd Light emitting device
JP2007300021A (en) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd Light emitting device
JP2008085296A (en) * 2006-09-01 2008-04-10 Nichia Chem Ind Ltd Light emitting device
JP2010182878A (en) * 2009-02-05 2010-08-19 Sumitomo Metal Electronics Devices Inc Package for mounting light-emitting element
JP2013149866A (en) * 2012-01-20 2013-08-01 Nichia Chem Ind Ltd Package mold for light-emitting device, and light-emitting device using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196637A (en) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd Light emitting device
JP2007300021A (en) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd Light emitting device
JP2008085296A (en) * 2006-09-01 2008-04-10 Nichia Chem Ind Ltd Light emitting device
JP2010182878A (en) * 2009-02-05 2010-08-19 Sumitomo Metal Electronics Devices Inc Package for mounting light-emitting element
JP2013149866A (en) * 2012-01-20 2013-08-01 Nichia Chem Ind Ltd Package mold for light-emitting device, and light-emitting device using the same

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