JPWO2014185369A1 - Ink jet head and method of manufacturing ink jet head - Google Patents

Abstract

The yield of the ink jet head is further improved. The ink-jet head 1 is provided so as to abut on the nozzle N from which ink is ejected downward, the pressure chamber 21 in which ink ejected from the nozzle N is stored, and the upper surface of the pressure chamber 21, and the ink in the pressure chamber 21. An actuator 60 that applies pressure to eject ink from the nozzles N, and a head substrate B provided between the head substrate B and a supply unit that supplies ink supplied to the pressure chamber 21. The wiring board 50 having a conduction path 51 communicating with the pressure chamber 21 from the supply unit and the bump 91 formed on the wiring board 50 are provided, and the wiring 52 of the wiring board 50 and the actuator 60 are electrically connected. A connection unit 90.

Description

  The present invention relates to an inkjet head and a method for manufacturing the inkjet head.

  The inkjet head includes a plurality of nozzles that eject ink, a plurality of pressure chambers for applying pressure related to the ejection of ink from each nozzle, a flow path for supplying ink to each pressure chamber, and the like. If these configurations of the inkjet head are arranged along a plane (for example, a horizontal plane) orthogonal to the ink ejection direction (for example, the vertical direction), the interval between the nozzles becomes large, and the density of the ejected ink Cannot be raised. Therefore, an ink jet head is known in which a pressure chamber is provided above each nozzle and a high density is achieved by stacking a common flow path for supplying ink to each pressure chamber further above the pressure chamber (for example, Patent Document 1). In such an ink jet head, an actuator that is in contact with the wall surface of the pressure chamber from the outside operates to apply pressure to the pressure chamber and eject ink from the nozzles.

  Since the wiring board that transmits an electrical signal to the actuator of the inkjet head is provided separately from the actuator, it is necessary to connect the wiring board and the actuator when the inkjet head is assembled. Here, as described above, since the nozzle, the pressure chamber, and the common channel are stacked in the ink jet head, the wiring board is connected to the actuator between the pressure chamber and the common channel.

FIG. 9 is a cross-sectional view showing a configuration in the vicinity of a nozzle of a conventional inkjet head.
As shown in FIG. 9, the actuator 203 that comes into contact with the outside of the vibration plate 202 provided on the upper surface of the pressure chamber 201 and the wiring 204 a of the wiring board 204 disposed above the actuator 203 are electrodes of the actuator 203. The bumps 205 formed on the 203a are electrically connected to each other through solder 206 formed on the wiring board 204 side.

Japanese Patent No. 4929755

  However, the actuator 203 may be damaged by heat or vibration during the formation of the bump 205. For this reason, the yield of the ink jet head is inevitably lowered due to the damage of the actuator 203.

  An object of the present invention is to provide an ink jet head and a method for manufacturing the ink jet head with improved yield.

  An ink jet head according to a first aspect of the invention is in contact with a nozzle that ejects ink in a predetermined direction, a pressure chamber in which the ink is stored, and one surface of the pressure chamber opposite to the predetermined direction. An ink conduction path that is provided between the head substrate and the ink supply unit that is supplied to the pressure chamber and communicates from the supply unit to the pressure chamber. A wiring board formed and a bump having a bump formed on the wiring board, and a connection portion for electrically connecting the wiring of the wiring board and the actuator.

  A second aspect of the present invention is the ink jet head according to the first aspect, wherein the connection portion electrically connects the wiring substrate and the actuator via a conductive material applied to a bump. It is characterized by that.

  A third aspect of the present invention is the ink jet head according to the second aspect, wherein the conductive material is one of a conductive adhesive or solder.

  A fourth aspect of the present invention is the ink jet head according to any one of the first to third aspects, wherein the head substrate includes a pressure chamber substrate on which the pressure chamber is formed, and the ink jet head Is further provided with a spacer substrate stacked on the predetermined direction side of the vibration plate so as to be positioned between the vibration substrate that constitutes the one surface of the pressure chamber and is in contact with the actuator, and the wiring substrate, The pressure chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate each have a difference in thermal expansion coefficient that is a predetermined value or less.

The invention according to claim 5 is the ink jet head according to claim 4, wherein the pressure chamber substrate, the vibration plate, the wiring substrate, and the spacer substrate have a thermal conductivity of 10 [W · m ^{−1. -It} consists of material more than K ^<-1 >], It is characterized by the above-mentioned.

  The invention according to claim 6 is the ink jet head according to claim 4 or 5, wherein the material of the pressure chamber substrate, the diaphragm, and the wiring substrate is silicon, and the material of the spacer substrate is It is 42 alloys.

  The invention according to claim 7 is the ink-jet head according to any one of claims 4 to 6, wherein the spacer substrate has a thickness of 50 [μm] or more and 200 [μm] or less. To do.

  The invention according to claim 8 is the ink jet head according to any one of claims 4 to 7, wherein the spacer substrate is provided with an ink conduction path communicating with the pressure chamber, The ink conduction path is surface-treated.

  The invention according to claim 9 is the ink jet head according to any one of claims 4 to 8, wherein the head substrate further includes a nozzle substrate on which the nozzle is formed, The material is characterized by being silicon.

  A tenth aspect of the present invention is the ink jet head according to the ninth aspect, wherein the nozzle is formed by dry etching with respect to the nozzle substrate.

  An ink jet head manufacturing method according to an eleventh aspect of the present invention is the ink jet head manufacturing method according to any one of the first to tenth aspects, wherein the bumps are formed on the wiring provided on the wiring substrate. And a step of electrically connecting the wiring and the actuator via the bump.

  According to the present invention, the yield of the inkjet head can be further improved.

1 is a perspective view of an inkjet head according to the present invention. It is a figure which shows the example of arrangement | positioning of the some nozzle in XY plane. It is sectional drawing of an inkjet head. It is an enlarged view of the structure which concerns on one nozzle among sectional drawings shown in FIG. It is a figure which shows the wiring board before a bump is formed among the processes of formation of a connection part. It is a figure which shows the wiring board after a bump is formed and before a conductive material is apply | coated among the processes of formation of a connection part. It is a figure which shows the wiring board after the electroconductive material is apply | coated among the processes of formation of a connection part. It is a figure which shows the spacer board | substrate in the joining example of a diaphragm and a spacer board | substrate. It is a figure which shows the head board | substrate in the example of joining of a diaphragm and a spacer board | substrate. It is a figure which shows the joined body of the head board | substrate and spacer board | substrate in the joining example of a diaphragm and a spacer board | substrate. It is a top view at the time of seeing a spacer board | substrate from upper direction, Comprising: It is a figure which shows the spacer board | substrate before joining with a head board | substrate. It is a top view at the time of seeing a spacer board | substrate from upper direction, Comprising: It is a figure which shows the spacer board | substrate after joining with a head board | substrate. It is sectional drawing which shows the modification of the inkjet head by this invention. It is sectional drawing which shows the structure of the nozzle vicinity of the conventional inkjet head.

  Embodiments of the present invention will be described below with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

FIG. 1 is a perspective view of an inkjet head 1 according to the present invention.
As shown in FIG. 1, the inkjet head 1 includes a plurality of nozzles N provided along a plane.
Hereinafter, a plane provided with a plurality of nozzles N is defined as an XY plane, and directions along the plane and orthogonal to each other are defined as an X direction and a Y direction, respectively. A direction orthogonal to the XY plane is taken as a Z direction.

FIG. 2 is a diagram illustrating an arrangement example of the plurality of nozzles N in the XY plane.
As shown in FIG. 2, the inkjet head 1 is provided with, for example, a plurality of nozzle rows in the X direction by a plurality of nozzles N provided along the Y direction.
In FIG. 2, among the many nozzles N, the nozzles in the leftmost nozzle row are denoted by reference numerals, and the other nozzles N are omitted.

FIG. 3 is a cross-sectional view of the inkjet head 1. In FIG. 3, for convenience, four nozzles N among the plurality of nozzles N are illustrated.
As shown in FIG. 3, the plurality of nozzles N are formed on the nozzle substrate 10.
Further, on the opposite side of the nozzle substrate 10 from the direction in which ink is ejected from the plurality of nozzles N, a plurality of substrates and the like are stacked along the Z direction. Specifically, for example, the pressure chamber substrate 20, the vibration plate 30, the spacer substrate 40, and the wiring substrate 50 are stacked from the side close to the nozzle substrate 10.
Hereinafter, for convenience, a structure including a plurality of substrates in which the nozzle substrate 10, the pressure chamber substrate 20, the vibration plate 30, the spacer substrate 40, and the wiring substrate 50 are stacked is referred to as a stacked body A. In addition, among the directions along the Z direction, a predetermined direction in which ink is ejected is described as “downward” with the nozzle substrate 10 as a reference, and the opposite direction is described as “upward”.

FIG. 4 is an enlarged view of a configuration related to one nozzle N in the cross-sectional view shown in FIG.
As shown in FIGS. 3 and 4, a pressure chamber 21 communicating with the nozzle N is formed in the pressure chamber substrate 20.
The diaphragm 30 is provided above the pressure chamber 21 and constitutes one surface (upper surface) of the pressure chamber 21. That is, the vibration plate 30 is provided on the opposite side (upper side) to the pressure chamber 21 in a predetermined direction (lower side) in which ink is ejected. An actuator 60 is provided on the upper surface of the diaphragm 30. Here, the actuator 60 is in contact with the diaphragm 30.

  The diaphragm 30, the spacer substrate 40, and the wiring substrate 50 are provided with conduction paths 31, 41, 51 that communicate with the pressure chamber 21. The ink flow path formed by the conduction paths 31, 41, 51 connects the pressure chamber 21 and the common flow path 70 provided above the wiring board 50.

The common flow path 70 is provided, for example, in a housing 80 standing above the wiring board 50 and connected to an ink supply mechanism (not shown). The ink supplied from the ink supply mechanism to the common flow path 70 is supplied to the pressure chamber 21 through the common flow path 70 and the conduction paths 51, 41, 31. The ink supplied to the pressure chamber 21 is ejected from the nozzle N by applying pressure to the ink in the pressure chamber 21 by the vibration of the vibration plate 30 according to the operation of the actuator 60.
Here, the common flow path 70 functions as a supply unit for the ink supplied to the pressure chamber 21. The pressure chamber 21 stores ink ejected from the nozzle N. The actuator 60 applies a pressure for ejecting ink from the nozzle N to the pressure chamber 21.
Hereinafter, the laminated body A includes the nozzle substrate 10 on which the nozzles N are formed, the pressure chamber substrate 20 on which the pressure chambers 21 are formed, the diaphragm 30 and the actuator 60 that constitute the upper surface of the pressure chambers 21. The structure is a head substrate B. Here, the wiring board 50 is provided between the ink supply section (common flow path 70) supplied to the pressure chamber 21 and the head substrate B, and the ink conduction path communicates from the supply section to the pressure chamber 21. (Conduction path 51) is formed.

The actuator 60 is electrically connected to the wiring 52 provided on the wiring board 50.
Specifically, the actuator 60 is, for example, a rectangular piezoelectric element having an upper surface and a lower surface along the XY plane. The actuator 60 is provided with a first electrode 61 on its upper surface. The actuator 60 is provided with a second electrode 62 on its lower surface.

As shown in FIG. 4, the first electrode 61 is electrically connected to the wiring 52 provided on the lower surface side of the wiring substrate 50 via the connection portion 90. The connection unit 90 is provided to connect the first electrode 61 and the wiring 52 along the Z direction.
The connection part 90 has bumps 91 formed on the wiring board 50.
Specifically, the bump 91 is formed by wire bonding using gold as a material, for example. The bump 91 is formed on the lower surface of the wiring 52, for example. The wiring 52 is made of, for example, a conductive metal (for example, aluminum) plate provided so that at least the lower surface is a flat surface.
A conductive material 92 is applied to the lower end side of the bump 91. Specifically, the conductive material 92 is, for example, a conductive adhesive. The conductive adhesive is an adhesive mixed with conductive metal powder (for example, silver powder) and has conductivity.
As described above, the connection unit 90 electrically connects the wiring substrate 50 and the actuator 60 via the bump 91 formed on the wiring substrate 50 and the conductive material 92 applied to the bump 91.

5A to 5C are diagrams illustrating a process of forming the connection portion 90. FIG.
First, as shown in FIG. 5A, the wiring board 50 is prepared independently. That is, in the laminate A, the substrates below the spacer substrate 40 are not yet bonded to the wiring substrate 50.
Next, bumps 91 are formed by wire bonding using gold as shown in FIG. 5B.
Next, as shown in FIG. 5C, the conductive material 92 is applied to the lower end side of the bump 91 by applying the conductive material 92 using an applicator (not shown).
5A to 5C are descriptions relating to the formation of one connection portion 90, but in actuality, the lower surface of each of the plurality of wirings 52 corresponding to each of the plurality of nozzles N included in the inkjet head 1 is used. On the other hand, the formation of the bumps 91 and the application of the conductive material 92 can be performed collectively.

The wiring board 50 includes, for example, a plate-shaped interposer 53 that is a base of the wiring board 50, insulating layers 54 and 55 that cover the upper surface and the lower surface of the interposer 53, and the insulating layer 54, the interposer 53, and the insulating layer. A through electrode 56 provided in a through hole penetrating 55, a wiring 57 provided on the upper surface of the insulating layer 54 and electrically connected to an upper end of the through electrode 56, an upper surface of the wiring 57, and the wiring 57 An insulating layer 58 that covers the upper surface of the insulating layer 54 that is not provided with, a wiring 52 that is provided on the lower surface of the insulating layer 55 and is electrically connected to the lower end of the through electrode 56, Among them, the insulating layer 59 covering the lower surface of the portion where the bump 91 is not formed and the lower surface of the insulating layer 55 where the wiring 52 is not provided, the insulating layer 58, the insulating layer 54, the interposer 53, and the insulating layer 5. And it has a guide passage 51 extending through the insulating layer 59, a.
The wiring 52 is connected to a control unit (not shown) related to the application of voltage to the actuator 60 via the through electrode 56 and the wiring 57.

Further, the second electrode 62 is in contact with the diaphragm 30. The diaphragm 30 is a conductor and functions as an electrode that electrically connects the second electrode 62 and the control unit. Specifically, the second electrode 62 is connected to the control unit via, for example, the diaphragm 30 and a wiring (not shown) connected to the diaphragm 30.
In the piezoelectric element, the first electrode 61 is connected to the control unit via the connection unit 90, the wiring 52, the through electrode 56, and the wiring 57, and the second electrode 62 is connected to the diaphragm 30 and a wiring (not shown). By being connected to the control unit, it operates as the actuator 60 under the control of the control unit.

The spacer substrate 40 secures a space corresponding to the width along the Z direction of the actuator 60 and the connection portion 90 between the diaphragm 30 and the wiring substrate 50.
Specifically, the spacer substrate 40 has an opening 42 corresponding to the position where the actuator 60 is disposed on the upper surface side of the diaphragm 30. The opening 42 penetrates the spacer substrate 40 in the Z direction.

6A to 6C are explanatory views according to a joining example of the diaphragm 30 and the spacer substrate 40.
As shown in FIG. 6A, a spacer substrate 40 is prepared. Further, as shown in FIG. 6B, a head substrate B is prepared. Here, an actuator 60 is provided on the upper surface of the diaphragm 30.
6C, the spacer substrate 40 and the vibration plate 30 are bonded so that the actuator 60 is positioned at the position of the opening 42 of the spacer substrate 40, and the head substrate B and the spacer substrate 40 are bonded. The body is formed.

After that, the joined body of the head substrate B and the spacer substrate 40 shown in FIG. 6C and the wiring substrate 50 on which the connection portion 90 shown in FIG. The actuator 60 and the wiring 52 of the wiring board 50 are electrically connected via the connecting portion 90.
Here, the thickness of the spacer substrate 40 corresponds to the width of the actuator 60 and the connecting portion 90 along the Z direction. Specifically, the thickness of the spacer substrate 40 corresponds to the sum of the width of the actuator 60 in the Z direction and the width of the connection portion 90 in the Z direction. More specifically, the thickness of the spacer substrate 40 is, for example, 50 [μm] or more and 200 [μm] or less. Thus, by providing the spacer substrate 40 thinner, the degree of thermal expansion of the spacer substrate 40 can be minimized, so that the substrate warp due to the difference in the thermal expansion coefficient between the substrates or peeling between the substrates. Problems can be prevented more reliably.

  Further, the thickness of the spacer substrate 40 affects the length of the conduction path 41 between the common flow path 70 and the pressure chamber 21. Here, the shorter the conduction path 41, the smaller the flow path resistance for the ink passing through the conduction path 41. Therefore, since the thickness of the spacer substrate 40 can be further reduced by further reducing the width of the actuator 60 and the connecting portion 90 along the Z direction, the flow path resistance with respect to the ink can be further reduced.

In addition, the spacer substrate 40 has a structure (glue guard) for preventing the adhesive bonding the spacer substrate 40 and the wiring substrate 50 from entering the opening 42 side, and a structure for releasing air (air escape). ) Is provided.
Specifically, for example, as shown in FIGS. 7A and 7B, the spacer substrate 40 extends along the Y direction at both ends of a row of the opening portions 42 formed by the opening portions 42 provided along the Y direction. A linear pattern 43 is formed. The pattern 43 functions as a glue guard and an air escape.
More specifically, the spacer substrate 40 is subjected to photolithography on both sides in order to form the opening 42. Here, by forming the pattern 43 only on one surface (upper surface), a linear counterbore is formed on the surface.

As shown in FIGS. 7A and 7B, among the plurality of openings 42 forming the row of the openings 42, the openings 42 adjacent to each other along the Y direction are continuous. And the pattern 43 is formed so that it may continue from the opening part 42 located in the both ends of the row | line | column of the opening part 42. FIG. Accordingly, when the bonded body of the head substrate B and the spacer substrate 40 shown in FIG. 6C and the wiring substrate 50 on which the connection portion 90 shown in FIG. 5A is bonded by heating, the volume is increased by heating. Increasing air in the opening 42 can escape from the pattern 43. That is, the pattern 43 functions as an air escape. Further, the adhesive for bonding between the spacer substrate 40 and the wiring substrate 50 comes into contact with the frame portion on the upper plate surface of the spacer substrate 40 shown in FIG. 7B. If there is, surplus adhesive will move along the upper plate surface in search of a destination. Here, since the pattern 43 exists, excess adhesive does not enter the pattern 43 and enter the opening 42. That is, the pattern 43 functions as a glue guard.
In FIG. 7, among the many existing openings 42, patterns 43, and actuators 60, reference numerals are given to the leftmost four, and the remaining reference numerals of the same configuration are omitted.

The pressure chamber substrate 20, the diaphragm 30, the wiring substrate 50, and the spacer substrate 40 each have a difference in thermal expansion coefficient that is a predetermined value or less. Here, “the difference between the respective thermal expansion coefficients is equal to or less than a predetermined value” means that the difference between the respective thermal expansion coefficients of the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 is the respective substrate. This is a range that does not cause problems due to warping.
Specifically, the material of the pressure chamber substrate 20, the vibration plate 30, and the wiring substrate 50 is silicon (Si). The material of the spacer substrate 40 is 42 alloy.
More specifically, the pressure chamber substrate 20 and the diaphragm 30 are entirely made of silicon. In the wiring substrate 50, the interposer 53 is formed of silicon. Since the interposer 53 is configured to occupy most of the configuration of the wiring substrate 50, the interposer 53 is formed of silicon, so that the thermal expansion coefficient of the wiring substrate 50 can be changed to the pressure chamber substrate 20 and the diaphragm. 30 can be substantially the same.
Further, 42 alloy which is a material of the spacer substrate 40 is an alloy composed of nickel [42]%, iron [57]% by weight, and the balance of a small amount of additive substances (for example, copper, manganese, etc.). .

  Here, the thermal expansion coefficient of silicon is 2.5 × 10 ^ −6 [1 / ° C.] to 4.0 × 10 ^ −6 [1 / ° C.]. The thermal expansion coefficient of 42 alloy is 4.5 × 10 ^ -6 [1 / ° C.] to 6.0 × 10 ^ -6 [1 / ° C.]. Thus, both the thermal expansion coefficient of silicon and the thermal expansion coefficient of 42 alloy are extremely small. Moreover, the difference between the thermal expansion coefficient of silicon and the thermal expansion coefficient of 42 alloy is 0.5 × 10 ^ −6 [1 / ° C.] to 3.5 × 10 ^ −6 [1 / ° C.]. In other words, the difference between the thermal expansion coefficient of silicon and the thermal expansion coefficient of 42 alloy is 3.5 × 10 ^ −6 [1 / ° C.] or less, so the predetermined value is 3.5 × 10 ^ -6 [ 1 / ° C.]. Thus, the thermal expansion coefficient of silicon and the thermal expansion coefficient of 42 alloy are substantially the same. For this reason, even if a temperature change due to various factors such as a temperature change due to heating or the like performed on each substrate performed in the formation of the laminate A, or a temperature change due to heat generated by the operation of the inkjet head 1 occurs in each substrate, Since the degree of thermal expansion of the substrates is extremely small and substantially the same, it is possible to prevent the occurrence of problems due to the warpage of the substrates due to the difference in the thermal expansion coefficient between the substrates and the separation between the substrates. That is, it is possible to prevent a change in the ink discharge angle from the nozzle N due to the warp of the substrate. Further, ink does not leak from the peeled portion between the substrates. Thus, according to the inkjet head 1 of this embodiment, the reliability of the inkjet head 1 can be improved more.

In addition, each material of the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 is ink-jetted by peeling between the substrates due to the warpage of the substrates that may be caused by the difference in thermal expansion coefficient between them. The electrical connection (for example, the connection part 90 etc.) in the head 1 is determined within a range in which the connection is not broken.
As an example, when the spacer substrate 40 has the maximum thickness (200 [μm]) assumed in this embodiment, the inkjet head 1 is changed from normal temperature (for example, around 25 [° C.]) to 80 [° C.]. If the degree of peeling between the substrates is 0.16 [μm] or less, there is no problem. The condition required for the substrate material to realize such a degree of peeling is a thermal expansion coefficient of 10 × 10 ^ −6 [1 / ° C.] or less.
The above is an example in the case where the spacer substrate 40 has the maximum thickness (200 [μm]) assumed in the present embodiment. When the spacer substrate 40 is thinner, naturally, the spacer substrate 40 Since the degree of thermal expansion is reduced, the upper limit of the thermal expansion coefficient is more relaxed. Thus, although the thermal expansion coefficient calculated | required by material can be suitably changed according to a specific structure, it is thought that it should just be below 10x10 ^ -6 [1 / C]. Both silicon and 42 alloy are materials showing a thermal expansion coefficient lower than 10 × 10 ^ −6 [1 / ° C.].

The material of the nozzle substrate 10 is silicon.
Since the nozzle substrate 10 is made of silicon, the thermal expansion coefficient of the nozzle substrate 10 is substantially the same as the thermal expansion coefficients of the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50 and the spacer substrate 40. Therefore, the difference between the thermal expansion coefficient of the nozzle substrate 10 and the thermal expansion coefficient of the other substrate, such as preventing leakage of ink from the gap due to the peeling between the nozzle substrate 10 and the pressure chamber substrate 20. It is possible to prevent the occurrence of problems due to warpage that may occur due to the above.

The nozzle N is formed by dry etching on the nozzle substrate 10, for example.
By forming the nozzle N by dry etching, the accuracy of the position and diameter of the nozzle N can be made higher. That is, since the amount of ink ejected from the nozzle N and the ejection position can be adjusted with higher accuracy, it is possible to provide the inkjet head 1 that can eject ink with higher accuracy. it can.

The pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 are made of a material having a thermal conductivity of 10 [W · m ⁻¹ · K ⁻¹ ] or more.
Specifically, the thermal conductivity of silicon that is a material of the pressure chamber substrate 20, the vibration plate 30, and the wiring substrate 50 is 168 [W · m ⁻¹ · K ⁻¹ ]. Moreover, the thermal conductivity of 42 alloy which is the material of the spacer substrate 40 is 15 [W · m ⁻¹ · K ⁻¹ ].
As described above, the material of the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 has a thermal conductivity of 10 [W · m ⁻¹ · K ⁻¹ ] or more, so that the laminate Since the temperature can be made uniform in the temperature distribution in A, particularly the temperature distribution in the surface direction, the temperature of the plurality of nozzles N can be made uniform, and the temperature condition of each nozzle N can be made substantially the same. The plurality of nozzles N of the inkjet head 1 have different heat amounts due to the difference in the injection rate of each nozzle N, but the laminate A has a thermal conductivity of 10 [W · m ⁻¹ · K ⁻¹ ]. Since it consists of the above material, heat transfer between each nozzle is performed satisfactorily, and the temperature of the plurality of nozzles N becomes uniform regardless of the injection rate of each nozzle N. Therefore, the variation in the ejection characteristics of the ink that can be caused by the temperature difference between the nozzles N can be further reduced, so that the ink can be ejected with higher accuracy.

Further, the spacer substrate 40 is subjected to a surface treatment.
Specifically, the spacer substrate 40 is subjected to, for example, nickel (Ni) plating as a surface treatment. The surface treatment is performed after the spacer substrate 40 is subjected to shape processing such as the conduction path 41 and the opening 42.
Since the spacer substrate 40 can obtain resistance to rust and solvent by surface treatment, the durability of the spacer substrate 40 can be further improved. In particular, since the conductive path 41 is provided in the spacer substrate 40, the surface treatment functions effectively in order to ensure resistance to the solvent and the like contained in the ink.
The surface treatment is not limited to the plating treatment with nickel (Ni), but may be any surface treatment that can obtain rust prevention and resistance to solvents. As another specific example of the surface treatment, for example, a treatment for forming a film made of ethyl silicate such as TEOS (Tetraethyl orthosilicate) or a film made of a paraxylylene polymer such as Parylene (registered trademark) on the surface of the spacer substrate 40 may be used. Can be mentioned. As a specific process for forming the film, for example, a vapor deposition process such as sputtering can be used. These illustrations relating to the surface treatment are merely examples, and are not limited thereto.

  As described above, according to the inkjet head 1 of the present embodiment, since the bumps 91 are formed on the wiring substrate 50, the actuator 60 is not damaged by heat and vibration associated with the formation of the bumps 91. In production, the yield of the inkjet head 1 can be further improved.

  Further, when the actuator 60 is a piezoelectric element as in the present embodiment, since the surface of the piezoelectric element has irregularities, if the bump 91 is formed on the piezoelectric element side, the bump 91 and the first electrode However, according to the inkjet head 1 of the present embodiment, the bump 91 is formed on the lower surface side of the wiring 52 provided so that the lower surface is a flat surface. Good adhesion between the bump 91 and the wiring 52 can be ensured.

  In addition, since the conductive material 92 is applied to the bump 91, the bump 91 and the actuator 60 can be connected by the conductive material 92 by the conductive material 92. Therefore, the actuator 91 is connected by the bump 91 and the conductive material 92. The wiring board 50 can be connected better.

  In addition, since the conductive material 92 is a conductive adhesive, in addition to being able to easily apply the conductive material 92 to the bumps 91, the conductive material 92 is bonded to the actuator 60. Since it can be performed easily, the process relating to the manufacture of the inkjet head 1 including the connection between the actuator 60 and the wiring substrate 50 can be made easier.

  Further, since the difference in thermal expansion coefficient between the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 is not more than a predetermined value, the change in the ejection angle of ink from the nozzle N due to the warp of the substrate, In addition, it is possible to prevent the occurrence of problems due to the warpage of the substrate due to the difference in the thermal expansion coefficient between the substrates and the separation between the substrates, such as the leakage of ink from the separation portion between the substrates.

Further, since the pressure chamber substrate 20, the vibration plate 30, the wiring substrate 50, and the spacer substrate 40 are made of a material having a thermal conductivity of 10 [W · m ⁻¹ · K ⁻¹ ] or more, each of the components constituting the inkjet head 1. Since the temperature can be made uniform in the temperature distribution of the substrate, particularly the temperature distribution in the surface direction, the temperature of the plurality of nozzles N becomes uniform, and the temperature condition of each nozzle N can be made substantially the same. As a result, the variation in the ejection characteristics of the ink that can be caused by the temperature difference between the nozzles N can be further reduced, so that the ink can be ejected with higher accuracy.

  Further, since the material of the pressure chamber substrate 20, the diaphragm 30, and the wiring substrate 50 is silicon, and the material of the spacer substrate 40 is an alloy in which 42% nickel is mixed with iron, it is generally available. With a possible material, it is possible to manufacture the inkjet head 1 with higher reliability that can prevent the occurrence of problems due to the warpage of the substrates due to the difference in thermal expansion coefficient between the substrates and the separation between the substrates.

  In addition, since the thickness of the spacer substrate 40 is 50 [μm] or more and 200 [μm] or less, the thinness of the spacer substrate 40 can suppress the degree of thermal expansion of the spacer substrate 40 to a minimum. It is possible to more reliably prevent the occurrence of problems due to the warpage of the substrate due to the difference in thermal expansion coefficient between the two and the separation between the substrates.

  Furthermore, when the conduction path 41 is formed in the spacer substrate 40 as in the present embodiment, the conduction path 41 can be shortened due to the thinness of the spacer substrate 40, so that the flow path resistance against ink is further increased. Can be small.

  Further, since the surface treatment is applied to the spacer substrate 40, the durability against the rust prevention and the solvent can be obtained, so that the durability of the spacer substrate 40 can be further improved.

  Further, since the material of the nozzle substrate 10 is silicon, it is possible to prevent the occurrence of a problem due to warpage that may be caused by the difference between the thermal expansion coefficient of the nozzle substrate 10 and the thermal expansion coefficient of another substrate.

  Further, since the nozzle N is formed by dry etching with respect to the nozzle substrate 10, the accuracy of the position and the diameter of the nozzle N can be made higher, so the amount of ink discharged from the nozzle N The ejection position can be adjusted with higher accuracy, and the inkjet head 1 that can eject ink with higher accuracy can be provided.

  The embodiment of the present invention should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

For example, in the above embodiment, a conductive adhesive is used as the conductive material 92, but this is an example and the present invention is not limited to this.
For example, the conductive material 92 may be solder. Specifically, for example, the solder can be used as the conductive material 92 by applying cream solder to the wiring board 50 on which the bumps 91 are formed as shown in FIG. In this case, the conductive material 92 can be collectively applied to the plurality of bumps 91 corresponding to the plurality of nozzles N.
In addition, as the conductive material 92, a paste or the like containing 60% to 70% of silver can also be used.

  In the above embodiment, the pressure chamber substrate 20, the material satisfying the condition that the difference between the thermal expansion coefficients of the pressure chamber substrate 20, the vibration plate 30, the spacer substrate 40, and the wiring substrate 50 is a predetermined value or less. Silicon is used for the diaphragm 30 and the wiring substrate 50, and 42 alloy is used for the spacer substrate 40, but this is an example and the present invention is not limited to this. That is, the description does not use any other material in which the difference in thermal expansion coefficient among the pressure chamber substrate 20, the diaphragm 30, the spacer substrate 40, and the wiring substrate 50 is equal to or less than a predetermined value at present and in the future. It is not a hindrance.

  Further, in the above embodiment, the entire surface of the spacer substrate 40 is subjected to the surface treatment, but this is an example and the present invention is not limited to this. As long as the surface treatment is applied to the conduction path 41 provided in the spacer substrate 40, the antirust property and the resistance to the solvent related to the contact with the ink can be ensured.

Moreover, the structure of the laminated body A in said embodiment is an example to the last, Comprising: It is not restricted to this.
For example, as illustrated in FIG. 8, another substrate (intermediate substrate 100) may be further provided between the nozzle substrate 10 and the pressure chamber substrate 20. The intermediate substrate 100 is provided, for example, for the purpose of providing the conduction path 101 between the nozzle substrate 10 and the pressure chamber substrate 20. As shown in FIG. 8, by providing the conduction path 101 with the intermediate substrate 100, the shape of the flow path of the ink reaching the nozzle N can be more easily set to an arbitrary shape, such as a shape in which the diameter of the path through which the ink passes is reduced. Therefore, the shape of the ink path for adjusting the kinetic energy applied to the ink in relation to the ejection of the ink can be adjusted more easily.
In the case of the example shown in FIG. 8, it is desirable that the difference in thermal expansion coefficient between the intermediate substrate 100 and other substrates is not more than a predetermined value. Specifically, the intermediate substrate 100 is made of, for example, silicon, so that the difference in thermal expansion coefficient from other substrates can be set to a predetermined value or less.

  The head substrate B in the above embodiment is a structure in which a plurality of substrates such as the nozzle substrate 10, the pressure chamber substrate 20, and the vibration plate 30 are stacked. However, the head substrate B is an example and is not limited thereto. The head substrate B is in contact with a nozzle N that ejects ink in a predetermined direction, a pressure chamber 21 that accommodates ink ejected from the nozzle N, and a surface of the pressure chamber 21 opposite to the predetermined direction. Any actuator that has the actuator 60 provided may be used.

  In the above embodiment, the pressure chamber substrate 20 and the diaphragm 30 are separately provided and stacked, but this is an example and the present invention is not limited thereto. For example, the pressure chamber substrate 20 and the diaphragm 30 may be integrally formed.

  The present invention can be used in an inkjet head and a method for manufacturing the inkjet head.

DESCRIPTION OF SYMBOLS 1 Inkjet head 10 Nozzle substrate 20 Pressure chamber substrate 21 Pressure chamber 30 Diaphragm 40 Spacer substrate 41, 51 Conduction path 50 Wiring board 52 Wiring 53 Interposer 60 Actuator 70 Common flow path 90 Connection part 91 Bump 92 Conductive material A Laminate B Head substrate N Nozzle

Claims (11)

A head substrate having a nozzle that ejects ink in a predetermined direction, a pressure chamber in which the ink is accommodated, and an actuator provided to abut one surface of the pressure chamber opposite to the predetermined direction; ,
A wiring board provided between the head substrate and an ink supply unit supplied to the pressure chamber and having an ink conduction path communicating from the supply unit to the pressure chamber;
A bump having a bump formed on the wiring board, and a connection part for electrically connecting the wiring of the wiring board and the actuator;
An ink jet head comprising:   The inkjet head according to claim 1, wherein the connection portion electrically connects the wiring board and the actuator via a conductive material applied to a bump.   The inkjet head according to claim 2, wherein the conductive material is either a conductive adhesive or solder. The head substrate has a pressure chamber substrate in which the pressure chamber is formed,
The inkjet head is
Further comprising a spacer substrate that forms the one surface of the pressure chamber and is laminated on the predetermined direction side of the diaphragm so as to be positioned between the diaphragm that contacts the actuator and the wiring board;
The inkjet according to any one of claims 1 to 3, wherein the pressure chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate each have a difference in thermal expansion coefficient that is a predetermined value or less. head. The pressure chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate are made of a material having a thermal conductivity of 10 [W · m ⁻¹ · K ⁻¹ ] or more. Inkjet head. The material of the pressure chamber substrate, the diaphragm, and the wiring substrate is silicon,
6. The ink jet head according to claim 4, wherein a material of the spacer substrate is 42 alloy.   The thickness of the said spacer board | substrate is 50 [micrometer] or more and 200 [micrometer] or less, The inkjet head as described in any one of Claim 4 to 6 characterized by the above-mentioned.   8. The spacer substrate is provided with an ink conduction path communicating with the pressure chamber, and at least a surface treatment is applied to the ink conduction path. The inkjet head as described. The head substrate further includes a nozzle substrate on which the nozzle is formed,
The inkjet head according to claim 4, wherein the nozzle substrate is made of silicon.   The inkjet head according to claim 9, wherein the nozzle is formed by dry etching on the nozzle substrate. It is a manufacturing method of the ink-jet head according to any one of claims 1 to 10,
Forming the bumps on the wiring board;
And a step of electrically connecting the wiring of the wiring board and the actuator via the bumps.

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