JPWO2013191035A1 - Wafer lens manufacturing method and imaging lens - Google Patents

Abstract

Providing a wafer lens manufacturing method and an imaging lens manufactured thereby that can suppress the peeling of the lens when the substrate is released from the molding die when a plurality of lenses are molded on both sides of the substrate using the molding die To do. After molding the first lens L1 having a small area overlapping with the first aperture part AP1, the substrate GP is released from the first molding die MD1, thereby suppressing lens peeling, and then the first After molding the second lens L2 on the second surface S2 on the opposite side of the substrate GP on which the lens L1 is molded, the substrate GP is released from the second molding die MD2, thereby further suppressing the lens peeling. As a result, the occurrence of lens peeling can be minimized.

Description

  The present invention relates to a wafer lens manufacturing method and an imaging lens manufactured by the manufacturing method.

  In recent years, portable electronic devices such as smartphones and tablet PCs have rapidly spread, and an imaging lens for an imaging device mounted on these portable electronic devices has a simple configuration but sufficient optical performance and is small in size. Therefore, a thin type is required. As a method for manufacturing a large number of imaging lenses suitable for such portable electronic devices at low cost, a curable resin material is applied onto a transparent substrate (or a mold) made of glass having a size of 6 inches or 8 inches. A manufacturing method of an imaging lens is known in which a wafer lens is manufactured by molding and curing, and an imaging lens is manufactured by cutting and curing into individual pieces. According to this manufacturing method, a large number of imaging lenses can be manufactured at a time, which has a great merit in terms of cost. In addition, in such a method for manufacturing an imaging lens, it is also known to improve optical characteristics by providing lenses on both sides of a substrate.

  However, according to this manufacturing method, a large number of lenses, such as thousands, are formed on a single substrate, so that the mold release resistance increases and a mold release treatment such as applying a mold release agent to the mold. Even if it has applied, when releasing from a shaping | molding die, there exists a problem that a lens or a board | substrate is damaged, or a board | substrate and a lens are easy to peel. In manufacturing a wafer lens in which lenses are formed on both sides of a substrate, such a stress is applied to the substrate and the lens by reducing the stress applied to the substrate and the lens by simultaneously removing the substrate from the two molds after molding the lenses on both sides. It is possible to suppress the problem. However, since the configuration in which the substrate is released from the two molds at the same time is generally complicated, the configuration of the device tends to be complicated, and there is a new problem that a general-purpose release device cannot be used or is expensive. After forming a plurality of lenses, the substrate is released from the molding die little by little, and after forming the plurality of lenses on the other surface of the substrate, the substrate is gradually released from the molding die. The fact is.

  By the way, in the imaging lens suitable for the above-described portable electronic device, in order to cut unnecessary light incident on the lens or to further improve the optical performance, as shown in Patent Documents 1 and 2, It has been proposed to provide a thin-film aperture between them. By providing a thin diaphragm attached to the substrate, there is no need for a separate diaphragm member made of metal or the like, and it is possible to reduce the number of parts and to contribute to a reduction in the thickness of the lens in the optical axis direction.

JP 2010-72665 A US Patent Application Publication No. 2009/147368

  However, according to the study by the present inventors, when a thin-film aperture is provided between the substrate and the lens, the molded lens is peeled from the substrate when the substrate is released from the mold. It turns out that there is a problem that it becomes easy. Although this problem can be alleviated by reducing the stress applied to the substrate as much as possible during mold release and releasing the mold over time, if a long time is required for mold release, the manufacturing time of the entire imaging lens can be reduced. It cannot be shortened, which is contrary to the purpose of manufacturing the imaging lens at low cost. In addition, the wafer lens manufacturing process described above has the problem that the mold release resistance is large because a large number of lenses are molded simultaneously, and the time required for the mold release process is long in order to prevent damage to the lens and the substrate. Yes. In the case of a wafer lens having lenses on both sides of the substrate, if the mold release is performed in time series as described above, there is a problem that the manufacturing time is further increased.

  In Patent Documents 1 and 2, in the manufacture of a wafer lens having a configuration in which a thin-film aperture is provided on a substrate and lenses are formed on both sides of the substrate, the problem of lens peeling from the substrate at the time of release is considered. There is room for improvement.

  The present invention has been made in view of such a situation, and when a plurality of lenses are molded on both surfaces of a substrate using a mold, the lens is peeled off when the substrate is released from the mold. It is an object of the present invention to provide a method for manufacturing a wafer lens that can be suppressed, and an imaging lens manufactured thereby.

The method for manufacturing a wafer lens according to claim 1, wherein a substrate, a first resin layer having a molding surface provided on one surface of the substrate and including a plurality of optical surfaces, the substrate, and the first resin layer are provided. Between the substrate and the second resin layer, a first diaphragm portion provided between the substrate, a second resin layer having a molding surface provided on the other surface of the substrate and including a plurality of optical surfaces, and A wafer lens manufacturing method comprising: a second aperture portion provided in
Forming the first diaphragm portion on one surface of the substrate in association with the plurality of optical surfaces;
A first curable resin material is interposed between the first transfer mold having a plurality of optical transfer surfaces corresponding to the plurality of optical surfaces and the substrate so that at least part of the first transfer mold overlaps the first diaphragm portion. Molding the first resin layer having the molding surface with the first transfer mold;
Releasing the substrate from the first mold;
Forming the second diaphragm portion on the other surface of the substrate in association with the plurality of optical surfaces;
After releasing the substrate on which the first resin layer is formed from the first molding die, between the second transfer die having a plurality of optical transfer surfaces corresponding to the plurality of optical surfaces, and the substrate A step of interposing a second curable resin material so that at least a part of the second squeezing portion overlaps, and molding the second resin layer having the molding surface by the second transfer mold;
Releasing the substrate from the second mold, and
When viewed in the optical axis direction, the overlapping area between the first diaphragm and the first resin layer is the overlapping area between the second diaphragm and the second resin layer facing each other across the substrate. It is characterized by being smaller than.

  As a result of various studies, the inventors have found that when a diaphragm is provided on the substrate, the lens and the substrate, and the diaphragm and the substrate have different adhesive properties, so that the boundary between the diaphragm and the substrate at the time of release. From the above, it has been found that peeling easily progresses. This phenomenon remarkably occurs when the mold release is performed quickly in order to shorten the manufacturing time. The inventors of the present invention have an overlapping area between the first diaphragm portion and the first resin layer that is smaller than an overlapping area between the second diaphragm portion and the second resin layer facing each other across the substrate. In the case where the lens is molded and released in a state where the lens is not formed on the back surface, the substrate is released from the second mold by releasing the substrate from the first mold. It has been found that lens peeling can be suppressed rather than molding. Therefore, if a thin substrate is used and a lens is formed on the other surface with no lens formed on the back surface, the mold can be released quickly by bending the substrate at the time of mold release. It is also possible to prevent the lens from peeling from the substrate during the mold release. Furthermore, when a plurality of lenses are formed on one surface of the substrate, the rigidity of the substrate is increased by attaching the lenses, compared to a case where a plurality of lenses are not formed on one surface of the substrate. Deflection of the substrate at the time of mold release can be reduced, and peeling of the lens from the substrate can be suppressed. The present invention has been made based on these findings. First, after molding the first resin layer having a small area overlapping with the first narrowed portion, the substrate is released from the first mold. By doing so, the time required for mold release is shortened while suppressing lens peeling, and then the second resin layer is molded on the opposite side of the substrate on which the first resin layer is molded, and then the second molding is performed. By releasing the substrate from the mold, the lens peeling is further suppressed, so that the occurrence of the lens peeling can be minimized. The diaphragm portion is composed of an opening having a predetermined diameter and a light shielding portion that covers the periphery of the opening.

  The wafer lens manufacturing method according to claim 2 is characterized in that, in the invention according to claim 1, the first diaphragm portion and the second diaphragm portion are made of a black resist material attached to the substrate. To do.

  When the first diaphragm portion and the second diaphragm portion are made of a black resist material attached to the substrate, a separate diaphragm member is not necessary and the thickness of the wafer lens in the optical axis direction can be reduced. Adhesiveness with the substrate at the time of mold release tends to be insufficient, and the effect of the present invention is particularly remarkable.

According to a third aspect of the present invention, there is provided the wafer lens manufacturing method according to the first or second aspect of the invention, wherein an overlapping area between the first aperture part and the first resin layer is 3 mm ² or less. And

For example, when the wafer lens manufactured by the manufacturing method of the present invention is used for an imaging lens, the diameter of the aperture varies depending on the application and size, etc. In the case where they are different from each other, the effect of the present invention can be obtained by first forming the one with the smaller overlap between the aperture portion and the lens. However, if the overlapping area between the first diaphragm portion and the first resin layer is too large, it becomes difficult to achieve both the mold release speed at the time of mold release and the prevention of lens peeling. The area overlapped with one resin layer is preferably 3 mm ² or less. More preferably, it is 2 mm ² or less.

The method of manufacturing a wafer lens according to claim 4 includes: a substrate; two resin layers each having a molding surface that includes a plurality of optical surfaces provided on opposing surfaces of the substrate; and the substrate and one surface. A manufacturing method of a wafer lens comprising a diaphragm provided only between the first resin layers,
Forming the diaphragm portion on one surface of the substrate in association with the plurality of optical surfaces;
The first resin layer is formed by interposing a first curable resin material between a first transfer mold having a plurality of optical transfer surfaces corresponding to a plurality of optical surfaces and the other surface of the substrate. A step of releasing the substrate from the first mold;
A second transfer mold having a plurality of optical transfer surfaces corresponding to a plurality of optical surfaces after releasing the substrate on which the first resin layer is formed from the first mold; and one surface of the substrate; A step of releasing the substrate from the second mold after forming the second resin layer with the second curable resin material interposed so that at least a part of the second curable resin material is interposed between the second mold and the second mold. It is characterized by having.

  In the present invention, first, after molding a resin layer on one surface of the substrate that does not have a diaphragm portion, the substrate is released from the first molding die, thereby suppressing the release of the lens and releasing the mold. Can be done fast. Next, after the resin layer is molded on the other surface of the substrate, the substrate is released from the second mold, thereby further suppressing the lens peeling, thereby generating the lens peeling. Can be minimized.

  According to a fifth aspect of the present invention, there is provided the wafer lens manufacturing method according to the fourth aspect of the invention, wherein the aperture portion is made of a black resist material attached to the substrate.

  If the aperture is made of a black resist material attached to the substrate, a separate aperture member is not required, and the thickness of the wafer lens in the optical axis direction can be reduced. The effect of the present invention is particularly remarkable.

  The method for producing a wafer lens according to claim 6 is the invention according to any one of claims 1 to 5, wherein the curable resin material is individually applied to each of the plurality of optical transfer surfaces. And

  When the curable resin material is individually applied to the plurality of optical transfer surfaces, the cutting work when separating into pieces becomes easy, and the half surface that makes it easy to bend the substrate at the time of mold release, the starting point of peeling Since this tends to occur for each lens, the effect of the present invention is particularly remarkable.

  A lens unit according to a seventh aspect of the present invention is formed by cutting a wafer lens manufactured by the method for manufacturing a wafer lens according to any one of the first to sixth aspects.

  The lens unit according to claim 8 is formed by laminating wafer lenses manufactured by the method for manufacturing wafer lenses according to any one of claims 1 to 6 and then cutting the wafer lenses.

  According to the present invention, when a plurality of lenses are molded on both sides of a substrate using a mold, when the substrate is released from the mold, the time required for the mold release is shortened, and at the time of mold release It is possible to provide a wafer lens manufacturing method capable of suppressing lens peeling and a lens unit manufactured thereby.

It is the schematic for demonstrating process (a)-(h) which manufactures the wafer lens WL concerning 1st Embodiment. It is the schematic for demonstrating process (a), (b) which manufactures a lamination type lens combining wafer lens WL, WL '. It is the schematic for demonstrating process (a)-(h) which manufactures wafer lens WL "concerning 2nd Embodiment. It is a perspective view of wafer lens WL. (A) is the figure which looked at the lens L1 in the optical axis direction, (b) is the figure which looked at the lens L2 in the optical axis direction.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing each process relating to a method of manufacturing a wafer lens, but the shape and size of the lens are schematically exaggerated and representative examples are not limited thereto. However, various modifications are possible.

(First embodiment)
First, as shown in FIG. 1A, a parallel plate glass (or resin) substrate GP having a first surface S1 and a second surface S2 is prepared, and as shown in FIG. By applying a black resist material to the first surface S1 and the second surface S2, and performing mask exposure and development, a plurality of donut shapes arranged at equal intervals at positions corresponding to lens portions to be described later First aperture portion AP1 and second aperture portion AP2 are formed (see also FIG. 4). By forming the aperture portion on the substrate using a photolithographic method or the like, it is not necessary to provide a metal aperture member separately, and the thickness in the optical axis direction can be reduced. The substrate GP has a thickness of about 0.2 to 0.7 mm, and can be bent to some extent at the time of mold release. For the formation of the aperture portion, for example, a technique disclosed in Japanese Patent Application Laid-Open No. 2010-72665 can be used. You may form an aperture | diaphragm | squeeze part by screen printing or the printing by an inkjet using a black coating material.

Next, an appropriate amount of the first resin material PL1 that is a photocurable resin material is individually dropped into a plurality of cavities (optical transfer surfaces) MD1c arranged in a matrix of the first mold MD1.
Then, as shown in FIG. 1C, the first molding material MD1 is brought close to the substrate GP, and the first resin material is formed at a position corresponding to the first aperture portion AP1 on the first surface S1 of the substrate GP. PL1 is sandwiched between the substrate GP and the first mold MD1.

  In this state, the first resin material PL1 is cured by irradiating light of a predetermined wavelength such as UV light from the outside, so that the first lens (first resin layer) is formed on the first surface S1 of the substrate GP. ) L1 is formed. By individually dropping the resin material, a space can be formed between the lenses arranged in the direction perpendicular to the optical axis, so that the lens is less likely to be damaged during separation, and the cutting operation is facilitated. Further, since the resin does not cover the entire surface of the substrate, it is difficult to hinder the bending of the substrate at the time of mold release after the first resin layer molding.

  Next, as shown in FIG. 1D, a configuration in which a part of the periphery of the first surface S1 of the substrate GP is held in a wedge shape (a portion of the substrate GP is held) with the first molding die MD1 fixed. If the jig ZG is inserted and moved little by little in the direction away from the first mold MD1, the substrate GP is released from the first mold MD1 from the jig ZG side. At this time, the first lens L1 is released from the substrate GP while being stuck on the substrate GP. As shown in FIG. 1E, the first lens L1 has an optical surface OP1 and a flange portion FL1 around the optical surface OP1, but the boundary is the first surface from the optical surface OP1 and the flange portion FL1. It is close to S1. That is, the flange portion FL1 functions so as not to overflow from the cavity MD1c even if the amount of the first resin material PL1 varies. The surfaces of the optical surface OP1 and the flange portion FL1 constitute a molding surface.

  Next, as shown in FIG. 1E, the substrate GP is inverted so that the first lens L1 is on the upper surface side and the second surface S2 is on the lower surface side of the substrate GP. In the present embodiment, the resin material is supplied to the mold, which is advantageous for suppressing bubbles, but is not limited thereto, and may be supplied to the substrate side.

  Further, a plurality of cavities (optical transfer surfaces) in which the second resin material PL2 that is a photo-curable resin material is arranged in a row or matrix of the second molding die MD2 formed corresponding to the cavities MD1c described above. An appropriate amount is individually dropped into MD2c. Then, as shown in FIG. 1 (f), the second molding material MD2 is brought close to the substrate GP, and the second resin material is formed at a position corresponding to the second aperture portion AP2 on the second surface S2 of the substrate GP. PL2 is sandwiched between the substrate GP and the second mold MD2.

  In this state, the second resin material PL2 is cured by irradiating light of a predetermined wavelength such as UV light from the outside, so that the second lens (second resin layer) is formed on the second surface S2 of the substrate GP. ) L2 is formed. In addition, the 2nd resin material may use the same thing as a 1st resin material, and may use a different kind of thing.

  Next, as shown in FIG. 1G, with the second molding die MD2 fixed, a wedge-shaped jig ZG is inserted into a part of the periphery of the second surface S2 of the substrate GP, and the second molding die is inserted. When the substrate GP is moved away from the mold MD2, the substrate GP is separated from the second mold MD2 from the jig ZG side, but at this time, the second lens L2 is detached from the substrate GP. Molded (FIG. 1 (h)). Thereby, a wafer lens WL as shown in FIG. 4 is formed. As shown in FIG. 5B, the second lens L2 also has an optical surface OP2 and a flange portion FL2 around the optical surface OP2, but the boundary is the second surface from the optical surface OP2 and the flange portion FL2. It is close to S2. The surfaces of the optical surface OP2 and the flange portion FL2 constitute a molding surface. 4 shows only the lens on the front surface of the substrate, the lens is also formed on the back surface of the substrate.

5A and 5B are views of the lenses L1 and L2 viewed in the optical axis direction. Referring to FIGS. 5A and 5B, when viewed from the optical axis direction, the overlapping donut-shaped area (hatching region in the upper diagram) of the first aperture part AP1 and the first lens L1. Has an inner diameter of φ1 and an outer diameter of φ2, and the inner diameter of the overlapping donut-shaped area (hatched area in the figure below) between the second aperture section AP2 and the second lens L2 is φ3, and the outer diameter is φ4. The following formula is established.
π ((φ2-φ1) / 2) ² <π ((φ4-φ3) / 2) ² (1)

  According to this embodiment, after molding the first lens L1 having a small area overlapping with the first aperture part AP1 in accordance with the above-described formula (1), the substrate GP is released from the first mold MD1. By forming a lens with high adhesion, the substrate is bent without the lens on the back side of the substrate and then released, thereby releasing the lens in a relatively short time while suppressing lens peeling. It can be carried out. Next, after forming the second lens L2 on the second surface S2 on the opposite side of the substrate GP on which the first lens L1 is formed, the substrate GP is released from the second molding die MD2, thereby further increasing the lens. The suppression of peeling is aimed at. Thereby, generation | occurrence | production of lens peeling can be suppressed to the minimum.

  Further, through a similar process, after another wafer lens WL ′ having the first lens L1 ′ and the second lens L2 ′ is formed on the substrate GP ′, alignment not shown formed on the substrates GP and GP ′. As shown in FIG. 2A, the wafer lenses WL and WL ′ are superposed and bonded via the spacer SP while aligning the optical axes of the two wafer lenses WL and WL ′ with reference to the mark or the like. Apply and fix the agent.

  Thereafter, the intermediate product IM obtained by bonding the wafer lenses WL and WL ′ is cut by dicing between the lenses arranged in the plane direction of the substrate at a position indicated by a dotted line shown in FIG. A lens unit LS as shown in b) can be obtained. The intermediate product IM can be used as it is as a compound eye lens unit without being cut. In other words, it is used as a compound eye lens unit used in a so-called compound eye type imaging device that obtains a higher resolution image by synthesizing a plurality of images obtained by forming images at different positions of the laminated lens portions arranged in the plane direction. be able to. The lens unit LS of this example includes, from the object side, a first lens L1 that is convex on the object side, a second lens L2 that is concave on the image side, a third lens L2 ′ that is convex on the object side, and a fourth lens that is concave on the image side. The aperture diameter of the second aperture section AP2 is the smallest, the aperture diameter of the first aperture section AP1 and the third aperture section AP2 ′ is larger than that, and the aperture diameter of the fourth aperture section AP1 ′ is the largest. It is getting bigger. As a specific example, the ratio of the area of the overlapping portion of each lens can be L1: L2: L1 ′: L2 ′ = 2.27: 1.35: 1.63: 1.88. Of course, these ratios may be changed as long as the optical characteristics are not impaired. By changing the area of the overlapping portion between the aperture portion and the lens within a range where the optical characteristics are not impaired, it is possible to achieve both prevention of peeling of the lens at the time of releasing and shortening of the releasing time.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIG. The portions other than those described in the following description are the same as those in the first embodiment. First, as shown in FIG. 3A, a parallel plate glass (or resin) substrate GP having a first surface S1 and a second surface S2 is prepared. As shown in FIG. Only on the second surface S2 of GP, a doughnut-shaped black resist is applied at equal intervals to form the second aperture part AP2.

  Next, an appropriate amount of the first resin material PL1 that is a photocurable resin material is individually dropped into a plurality of cavities (optical transfer surfaces) MD1c arranged in a row or matrix of the first mold MD1. This is the same position as in the above-described embodiment. Then, as shown in FIG. 3C, the first mold MD1 is brought close to the substrate GP, and the first resin material PL1 is sandwiched between the substrate GP and the first mold MD1.

  In this state, the first resin material PL1 is cured by irradiating light of a predetermined wavelength such as UV light from the outside, whereby the first lens (resin layer) L1 is formed on the first surface S1 of the substrate GP. Will be formed.

  Next, as shown in FIG. 3D, with the first molding die MD1 fixed, a wedge-shaped jig ZG is inserted into a part of the periphery of the first surface S1 of the substrate GP, and the first molding is performed. When the substrate GP is moved away from the mold MD1, the substrate GP is released from the first molding die MD1 from the jig ZG side, but at this time, the first lens L1 is detached from the substrate GP. Typed.

  Next, as shown in FIG. 3E, the substrate GP is inverted so that the first lens L1 is the upper surface side and the second surface S2 is the lower surface side of the substrate GP.

  Further, a plurality of cavities (optical transfer surfaces) in which the second resin material PL2 that is a photo-curable resin material is arranged in a row or matrix of the second molding die MD2 formed corresponding to the cavities MD1c described above. An appropriate amount is individually dropped into MD2c. Then, as shown in FIG. 3 (f), the second molding material MD2 is brought close to the substrate GP, and the second resin material is formed at a position corresponding to the second aperture portion AP2 on the second surface S2 of the substrate GP. PL2 is sandwiched between the substrate GP and the second mold MD2.

  In this state, the second resin material PL2 is cured by irradiating light of a predetermined wavelength such as UV light from the outside, whereby the second lens (resin layer) L2 is formed on the second surface S2 of the substrate GP. Will be formed.

  Next, as shown in FIG. 3G, with the second molding die MD2 fixed, a wedge-shaped jig ZG is inserted into a part of the periphery of the second surface S2 of the substrate GP, and the second molding die is inserted. When the substrate GP is moved away from the mold MD2, the substrate GP is separated from the second mold MD2 from the jig ZG side, but at this time, the second lens L2 is detached from the substrate GP. Typed. As a result, a wafer lens WL ″ having no diaphragm on the first surface S1 is formed (FIG. 3H).

  According to the present embodiment, since there is no diaphragm portion between the first lens L1 and the substrate GP, the substrate GP is released from the first molding die MD1 after the first lens L1 is molded. The second lens L2 is then molded on the second surface S2 on the opposite side of the substrate GP on which the first lens L1 is molded, and then the substrate GP is removed from the second molding die MD2. By performing the mold release, it is possible to suppress lens peeling on both sides even when the second aperture part AP2 is formed. Since there is no diaphragm on one surface of the substrate, the adhesion between the lens and the substrate is high, and the mold can be released quickly by bending the substrate and releasing it. Incidentally, the wafer lens WL ″ formed in this way can form a lens unit after being cut in combination with another wafer lens, as shown in FIG.

  The present invention is not limited to the embodiments described in the specification, and it is apparent to those skilled in the art from the embodiments and technical ideas described in the present specification that other modifications are included. . The description and the embodiments are for illustrative purposes only, and the scope of the present invention is indicated by the following claims. For example, the wafer lens may be stacked not only in two layers but also in three or more layers. In addition, the shape of the lens and the diaphragm is not limited to a circle, and may be a non-circular shape. Even in this case, the areas of overlapping regions are compared with each other.

AP1 First aperture portion AP2 Second aperture portion FL1 Flange portion FL2 Flange portion GP Substrate IM Intermediate product L1 First lens L2 Second lens LS Lens unit MD1 First mold MD1c Cavity MD2 Second molding Mold MD2c Cavity OP1 Optical surface OP2 Optical surface PL1 First resin material PL2 Second resin material S1 First surface S2 Second surface SP Spacer WL, WL ′, WL ”Wafer lens ZG Jig

Claims (8)

A substrate, a first resin layer provided on one surface of the substrate and having a molding surface including a plurality of optical surfaces, a first diaphragm provided between the substrate and the first resin layer, A wafer lens comprising a second resin layer provided on the other surface of the substrate and having a molding surface including a plurality of optical surfaces, and a second diaphragm portion provided between the substrate and the second resin layer. A manufacturing method of
Forming the first diaphragm portion on one surface of the substrate in association with the plurality of optical surfaces;
A first curable resin material is interposed between the first transfer mold having a plurality of optical transfer surfaces corresponding to the plurality of optical surfaces and the substrate so that at least part of the first transfer mold overlaps the first diaphragm portion. Molding the first resin layer having the molding surface with the first transfer mold;
Releasing the substrate from the first mold;
Forming the second diaphragm portion on the other surface of the substrate in association with the plurality of optical surfaces;
After releasing the substrate on which the first resin layer is formed from the first molding die, between the second transfer die having a plurality of optical transfer surfaces corresponding to the plurality of optical surfaces, and the substrate A step of interposing a second curable resin material so that at least a part of the second squeezing portion overlaps, and molding the second resin layer having the molding surface by the second transfer mold;
Releasing the substrate from the second mold, and
When viewed in the optical axis direction, the overlapping area between the first diaphragm and the first resin layer is the overlapping area between the second diaphragm and the second resin layer facing each other across the substrate. A method for producing a wafer lens, wherein the method is smaller.   2. The method of manufacturing a wafer lens according to claim 1, wherein the first aperture portion and the second aperture portion are made of a black resist material attached to the substrate. 3. The method for manufacturing a wafer lens according to claim 1, wherein an overlapping area between the first aperture portion and the first resin layer is 3 mm ² or less. 4. Provided only between the substrate, two resin layers provided on opposite surfaces of the substrate, each having a molding surface including a plurality of optical surfaces, and the first resin layer on one surface A method for producing a wafer lens comprising a diaphragm unit,
Forming the diaphragm portion on one surface of the substrate in association with the plurality of optical surfaces;
The first resin layer is formed by interposing a first curable resin material between a first transfer mold having a plurality of optical transfer surfaces corresponding to a plurality of optical surfaces and the other surface of the substrate. A step of releasing the substrate from the first mold;
A second transfer mold having a plurality of optical transfer surfaces corresponding to a plurality of optical surfaces after releasing the substrate on which the first resin layer is formed from the first mold; and one surface of the substrate; A step of releasing the substrate from the second mold after forming the second resin layer with the second curable resin material interposed so that at least a part of the second curable resin material is interposed between the second mold and the second mold. A method for producing a wafer lens, comprising:   The method of manufacturing a wafer lens according to claim 4, wherein the aperture portion is made of a black resist material attached to the substrate.   The method of manufacturing a wafer lens according to claim 1, wherein the curable resin material is individually applied to each of the plurality of optical transfer surfaces.   An imaging lens formed by cutting a wafer lens manufactured by the method for manufacturing a wafer lens according to claim 1.   An imaging lens formed by laminating and then cutting wafer lenses manufactured by the wafer lens manufacturing method according to claim 1.

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