JPWO2013161756A1 - Photosensitive resin composition, photosensitive film, permanent mask resist and method for producing permanent mask resist - Google Patents

Abstract

The present invention includes (A) a resin having an ethylenically unsaturated group and a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an inorganic filler, and (E) an organic filler having an amino group. Is a photosensitive resin composition satisfying the following conditions (I) to (IV). (I) (D) contains (d-1) a first inorganic filler and (d-2) a second inorganic filler. (II) The average particle size of (d-1) is 100 nm to 500 nm, the maximum particle size is 2 μm or less, and the refractive index is 1.5 to 1.8. (III) The average particle diameter of (d-2) is 5 nm to 200 nm, and the refractive index is 1.2 or more and less than 1.5. (IV) (E) contains an organic filler having an average particle size of 500 nm or less and a maximum particle size of 2 μm or less.

Description

  The present invention relates to a photosensitive resin composition, a photosensitive film, a permanent mask resist, and a method for producing a permanent mask resist. In particular, the present invention relates to a photosensitive resin composition suitable as a permanent mask resist used for printed wiring boards, semiconductor package substrates, and flexible wiring boards.

  As various electronic devices become more sophisticated, printed circuit boards, semiconductor package substrates, etc. are becoming more dense, and higher resolution is possible for the photosensitive permanent mask resist (solder resist) used for the outermost layer. Is required. In particular, a permanent mask resist used in a high-performance semiconductor package mounted on a mobile device such as a smartphone, a tablet terminal, and a notebook personal computer is required to have a minute round hole resolution with the flip chip. As the bump pitch is narrowed, the opening diameter is decreasing year by year.

On the other hand, the semiconductor package substrate is becoming thinner as a whole, and warpage caused by a difference in thermal expansion coefficient between the chip and the substrate is a serious problem. For this reason, the material used is strongly required to have a thermal expansion coefficient close to that of the chip (3 × 10 ⁻⁶ / ° C.), and the permanent mask resist used for the outermost layer of the semiconductor package substrate is also the same. Therefore, low thermal expansion is required.

  Generally, the low thermal expansion is performed by increasing the filling of the inorganic filler, increasing the cross-linking of the resin, and increasing the rigidity of the resin.

  In recent years, a photosensitive resin composition containing a silica filler has also been proposed in order to improve reflow resistance (see Patent Document 1).

JP 2011-13622 A

  However, when the inorganic filler is highly filled for low thermal expansion, the photosensitivity tends to be lowered. In addition, when the refractive index of the resin and the refractive index of the inorganic filler are different, light scattering increases, and it may not be possible to sufficiently meet the demand for further fine resolution. Moreover, high cross-linking and rigid skeletonization of the resin tend to reduce crack resistance.

  Accordingly, an object of the present invention is to provide a photosensitive resin composition that not only has excellent resolution but also has a low coefficient of thermal expansion and exhibits excellent characteristics in crack resistance.

The present invention includes (A) a resin having an ethylenically unsaturated group and a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an inorganic filler, and (E) an organic filler having an amino group. It is a photosensitive resin composition containing this, Comprising: The photosensitive resin composition which satisfy | fills the following conditions (I)-(IV) is provided.
(I) (D) contains (d-1) a first inorganic filler and (d-2) a second inorganic filler.
(II) The average particle size of (d-1) is 100 nm to 500 nm, the maximum particle size is 2 μm or less, and the refractive index is 1.5 to 1.8.
(III) The average particle diameter of (d-2) is 5 nm to 200 nm, and the refractive index is 1.2 or more and less than 1.5.
(IV) (E) contains an organic filler having an average particle size of 500 nm or less and a maximum particle size of 2 μm or less.

  The photosensitive resin composition is capable of alkali development, is excellent in resolution, has a low thermal expansion coefficient, and exhibits high crack resistance. It is considered that the combination of the two kinds of inorganic fillers and organic fillers as described above gives a low thermal expansion coefficient at the same time as high resolution for opening minute round holes. Moreover, by including the organic filler as described above, characteristics such as crack resistance, heat resistance, and plating chemical solution resistance can be greatly improved while maintaining high resolution.

  In addition, by including an elastomer (rubber-modified polyamide) having a polyamide structure (F), adhesion to the base metal is improved, and crack resistance and the like are greatly improved. It is considered that N atoms contained in the elastomer greatly contribute to adhesion. Further, it is considered that the elastomer (F) having a polyamide structure also functions as an elastomer for forming a phase separation layer in the resin, and also exhibits a role of relaxing stress applied to the resin. In order to improve the adhesion between the permanent mask resist and the copper wiring, surface treatment is generally performed to make the copper surface uneven, but recently, the unevenness is reduced to form fine wiring and reduce transmission loss. There is a tendency. Therefore, improvement in the adhesion between the permanent mask resist and the copper wiring is required. Even in such a case, it is effective to contain (F) an elastomer having a polyamide structure.

  (D) Content of an inorganic filler is 25 to 70 mass% on the basis of the total mass of the photosensitive resin composition, and the ratio of the mass of (d-1) to the mass of (d-2) is , (D-1) mass: (d-2) mass = 1.0: 0.1 to 1.0: 5.0 is desirable. Furthermore, (d-2) is silica, and it is desirable that the average particle diameter is 5 nm to 100 nm.

  In addition, (B) it is desirable to use a plurality of photopolymerization initiators in combination. However, if a compound having an oxime ester in the molecule and an aromatic ketone are contained in the photopolymerization initiator, the present photopolymerization initiator may be used in terms of sensitivity and resolution. The effects of the invention can be further extracted.

  In particular, in recent years, the exposure method is shifting to the laser direct exposure method, and higher sensitivity is required for the solder resist compared to the conventional method in which the entire surface is exposed at once. In such a case, the combination of initiators as described above is particularly effective.

  According to the present invention, there are provided a photosensitive resin composition excellent in resolution of fine round holes, having a low thermal expansion coefficient and excellent in crack resistance, a photosensitive film using the same, a permanent mask resist, and a method for producing the same. can do. In addition to this, it is possible to provide an alkali developable photosensitive resin composition excellent in copper adhesion, insulation resistance between fine wirings, etc., a photosensitive film using the same, a permanent mask resist, and a method for producing the same. .

It is a schematic cross section showing a semiconductor package substrate. It is a schematic cross section showing a flip chip type semiconductor package substrate.

  Hereinafter, preferred embodiments of the present invention will be described in detail.

  The photosensitive resin composition which concerns on suitable embodiment is demonstrated. In the present invention, (meth) acrylic acid means acrylic acid or methacrylic acid, (meth) acrylate means acrylate or methacrylate, (meth) acryloyl group means acryloyl group or methacryloyl group, The (meth) acryloxy group means an acryloxy group or a methacryloxy group. “EO-modified” means a compound having a polyoxyethylene chain.

  The photosensitive resin composition according to the present embodiment includes (A) a resin having an ethylenically unsaturated group and a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an inorganic filler, and ( E) An organic filler having an amino group is contained.

  (A) The resin having an ethylenically unsaturated group and a carboxyl group (hereinafter sometimes referred to as “component (A)”) may be any resin having an ethylenically unsaturated group and a carboxyl group. However, a reaction product obtained by adding (a3) a saturated or unsaturated polybasic acid anhydride to an esterified product of (a1) an epoxy resin and (a2) an unsaturated monocarboxylic acid can be used.

  The (a1) epoxy resin is not particularly limited, and examples thereof include bisphenol type epoxy resins, novolac type epoxy resins, biphenyl type epoxy resins, and polyfunctional epoxy resins. As the bisphenol type epoxy resin, a resin obtained by reacting bisphenol A, bisphenol F, bisphenol S and the like with epichlorohydrin is preferable.

  As the novolak type epoxy resin, a resin obtained by reacting a novolak resin obtained by reacting phenol, cresol, halogenated phenol or alkylphenol with formaldehyde in the presence of an acidic catalyst with epichlorohydrin is preferable.

  Other epoxy resins include salicylaldehyde-phenol type or cresol type epoxy resin (EPPN502H, FAE2500, etc. manufactured by Nippon Kayaku Co., Ltd.), DER-330,337,361 manufactured by Dow Chemical Co., Celoxide 2021 manufactured by Daicel Chemical Industries, Ltd. Further, TETRAD-X, C manufactured by Mitsubishi Gas Chemical Company, EPB-13, 27 manufactured by Nippon Soda Co., Ltd., etc. can be used.

  (A2) As unsaturated monocarboxylic acid, (meth) acrylic acid, crotonic acid, cinnamic acid, saturated or unsaturated polybasic acid anhydride and (meth) acrylate compound having one hydroxyl group in one molecule Half-ester, reaction product, half-ester, saturated or unsaturated dibasic acid, reaction product of saturated or unsaturated dibasic acid and (meth) acrylate compound having one hydroxyl group in one molecule And a reaction product of an unsaturated monoglycidyl compound.

  This half ester compound or reactant includes phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, succinic acid, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, tris (hydroxyethyl) Examples include reactants obtained by reacting isocyanurate di (meth) acrylate, glycidyl (meth) acrylate and the like in an equimolar ratio by a conventional method. These (a2) unsaturated monocarboxylic acids can be used alone or in combination of two or more. Among these, acrylic acid is preferable.

  (A3) Saturated or unsaturated polybasic acid anhydrides include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl Examples include hexahydrophthalic anhydride, ethylhexahydrophthalic anhydride, itaconic anhydride, trimellitic anhydride, and the like.

  (A) Resins having an ethylenically unsaturated group and a carboxyl group include CCR-1218H, CCR-1159H, CCR-1222H, PCR-1050, TCR-1335H, ZAR-1035, ZAR-2001H, ZFR-1185, and ZCR. -1569H (above, Nippon Kayaku Co., Ltd., trade name), UE-EXP-2810PM, UE-EXP-2827, EXP-3073, EXP-3133 (above, DIC Corporation, trade name) are commercially available It is available.

  As the component (A), a polyurethane compound obtained by reacting an epoxy acrylate compound having two or more hydroxyl groups and an ethylenically unsaturated group, a diisocyanate compound, and a diol compound having a carboxyl group may be used. . Such polyurethane compounds are commercially available, for example, as UXE-3011, UXE-3012, UXE-3024 (above, Nippon Kayaku Co., Ltd., trade name).

  (A) A component is used individually or in combination of 2 or more types. The refractive index of the component (A) varies depending on the structure of the resin used, but is 1.4 to 1.7 when the structure described above is used. Among these, the refractive index of many resins is around 1.57 which is the refractive index of bisphenol A type epoxy resin. The effect of the present invention is most exhibited when the photosensitive resin composition of the present invention has a refractive index of component (A) of 1.5 to 1.6. The refractive index can be measured with a commercially available apparatus as shown below. For example, the refractive index can be simply measured using a refractometer Abbemat series (manufactured by Anton paar) or a precision refractometer KPR series (manufactured by Shimadzu Corporation).

  The acid value of the component (A) is preferably 20 to 180 mgKOH / g, more preferably 30 to 150 mgKOH / g, and particularly preferably 40 to 120 mgKOH / g. Thereby, the developability with the alkaline aqueous solution of the photosensitive resin composition becomes good, and an excellent resolution can be obtained.

Here, the acid value can be measured by the following method. First, after precisely weighing about 1 g of the measurement resin solution, 30 g of acetone is added to the resin solution to uniformly dissolve the resin solution. Next, an appropriate amount of phenolphthalein as an indicator is added to the solution, and titration is performed using a 0.1N aqueous KOH solution. And an acid value is computed by following Formula.
A = 10 × Vf × 56.1 / (Wp × I)
In the formula, A represents the acid value (mgKOH / g), Vf represents the titration amount (mL) of the KOH aqueous solution, Wp represents the measurement resin solution mass (g), and I represents the nonvolatile content of the measurement resin solution. The ratio (mass%) is shown.

  The weight average molecular weight of the component (A) is preferably 3000 to 30000, more preferably 5000 to 20000, and particularly preferably 7000 to 15000 from the viewpoint of coating properties.

  In addition, a weight average molecular weight (Mw) can be calculated | required from the standard polystyrene conversion value by a gel permeation chromatography (GPC). About the measurement conditions of a weight average molecular weight, it shall be the same measurement conditions as the Example of this-application specification.

  (B) As a photopolymerization initiator (hereinafter, also referred to as “component (B)”), a compound that generates free radicals upon irradiation with active energy rays can be used. Examples of the component (B) include benzophenone, N, N, N ′, N′-tetraalkyl-4,4′-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl). -Butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1,4,4'-bis (dimethylamino) benzophenone (Michler's ketone), 4,4'-bis ( Aromatic ketones such as diethylamino) benzophenone and 4-methoxy-4′-dimethylaminobenzophenone; quinones such as alkylanthraquinone and phenanthrenequinone; benzoin compounds such as benzoin and alkylbenzoin; benzoin ethers such as benzoin alkyl ether and benzoin phenyl ether Compound, benzyldimethyl Benzyl derivatives such as ketals; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (O-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5 2,4,5-triarylimidazole dimers such as phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer; N-phenylglycine, N-phenylglycine Derivatives, acridine derivatives such as 9-phenylacridine; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzo Oxime)], 1,2-octanedione, 1- [4- (phenylthio) -phenyl, 2- (O-benzoyloxime)] and the like, and coumarin compounds such as 7-diethylamino-4-methylcoumarin. Thioxanthone compounds such as 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone; 2,4 , 6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, etc. And acylphosphine oxide compounds.

  As the component (B), from the viewpoint of high sensitivity, high resolution, and a rectangular opening shape regardless of the base material, an aromatic ketone, a compound having an oxime ester, a thioxanthone compound, or an acylphosphine oxide compound is used. It is preferable to use an aromatic ketone or a thioxanthone compound. Moreover, it is preferable to use together the compound which has oxime ester, and an aromatic ketone, and it is more preferable to use together an aromatic ketone and a thioxanthone compound.

  As the aromatic ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1 is most preferable. 2-Methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1 is commercially available as IRGACURE 907 (manufactured by BASF Corporation).

  Examples of the compound having the oxime ester include 2- (acetyloxyiminomethyl) thioxanthen-9-one, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)]. , Ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) and the like. Among these, ethanone, 1- [ Most preferred is 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime). This is commercially available as IRGACURE OXE 02 (manufactured by BASF Corporation).

  As the thioxanthone compound, 2,4-diethylthioxanthone is most preferable. This is commercially available as KAYACURE-DETX-S (Nippon Kayaku Co., Ltd.).

  In particular, in recent years, the exposure method is shifting to the laser direct exposure method. High sensitivity is required for the permanent mask resist (solder resist) as compared with the conventional method in which the entire surface is exposed, and in such a case, the combination of the photopolymerization initiators is effective.

  Moreover, a sensitizer can also be used together for (B) component as needed. Known sensitizers can be used.

  (C) Epoxy resins (hereinafter sometimes referred to as “component (C)”) include bisphenol A type epoxy resins such as bisphenol A diglycidyl ether, bisphenol F type epoxy resins such as bisphenol F diglycidyl ether, and bisphenol. Bisphenol S type epoxy resin such as S diglycidyl ether, biphenol type epoxy resin such as biphenol diglycidyl ether, bixylenol type epoxy resin such as bixylenol diglycidyl ether, hydrogenated bisphenol A type epoxy such as hydrogenated bisphenol A glycidyl ether Examples thereof include resins, dibasic acid-modified diglycidyl ether type epoxy resins, biphenyl aralkyl type epoxy resins, and tris (2,3-epoxypropyl) isocyanurate. These are used alone or in combination of two or more.

  Commercially available compounds can be used as these compounds. Specific examples of bisphenol A diglycidyl ether include Epicoat 828, Epicoat 1001, and Epicoat 1002 (all manufactured by Mitsubishi Chemical Corporation). Examples of bisphenol F diglycidyl ether include Epicoat 807 (trade name, manufactured by Mitsubishi Chemical Co., Ltd.), YSLV-80 (trade name, manufactured by Nippon Steel Chemical Co., Ltd.), and examples of bisphenol S diglycidyl ether include EBPS- 200 (Nippon Kayaku Co., Ltd., trade name), Epicron EXA-1514 (DIC Corporation, trade name), etc. can be mentioned.

  Examples of biphenol diglycidyl ether include YL6121 (trade name, manufactured by Mitsubishi Chemical Corporation). Examples of the bixylenol diglycidyl ether include YX4000H (trade name, manufactured by Mitsubishi Chemical Corporation).

  Examples of the hydrogenated bisphenol A glycidyl ether include ST-2004 and ST-2007 (both manufactured by Nippon Steel Chemical Co., Ltd., trade names). Examples of the dibasic acid-modified diglycidyl ether type epoxy resin include ST-5100 and ST-5080 (both manufactured by Nippon Steel Chemical Co., Ltd., trade names). Examples of the biphenyl aralkyl type epoxy resin include NC-3000 and NC-3000H (both manufactured by Nippon Kayaku Co., Ltd., trade names). Examples of tris (2,3-epoxypropyl) isocyanurate include TEPIC-S, TEPIC-VL, TEPIC-PASB26 (manufactured by Nissan Chemical Industries), Araldide PT810 (manufactured by BASF, trade name) and the like. .

  In addition, bisphenol A novolac type epoxy resin JER157S (trade name, manufactured by Mitsubishi Chemical Corporation) and the like can be mentioned. Examples include tetraphenylol ethane type epoxy resin, JERRY-931 (manufactured by Mitsubishi Chemical Corporation, trade name), Araldide 163 (manufactured by BASF), and the like. Examples thereof include ZX-1063 (manufactured by Nippon Steel Chemical Co., Ltd.), which is a tetraglycidylxylenoylethane resin. The naphthalene group-containing epoxy resins ESN-190, ESN-360 (all manufactured by Nippon Steel Chemical Co., Ltd., trade names), HP-4032, EXA-4750, EXA-4700 (all manufactured by DIC Corporation, trade names), etc. Can be mentioned. Examples thereof include HP-7200 and HP-7200H (both manufactured by DIC Corporation, trade names) of epoxy resins having a dicyclopentadiene skeleton. Examples thereof include CP-50S and CP-50M (both manufactured by Nippon Oil & Fats Co., Ltd., trade names), which are glycidyl methacrylate copolymer epoxy resins. Examples thereof include PB-3600 and PB-4700 (both manufactured by Daicel Chemical Industries, Ltd., trade names), which are epoxy-modified polybutadiene rubber derivatives. Examples include CTBN-modified epoxy resins YR-102 and YR-450 (both are Nippon Steel Chemical Co., Ltd., trade names). However, the component (C) is not limited to these. These epoxy resins can be used alone or in combination of two or more.

  (D) The inorganic filler (hereinafter sometimes referred to as “component (D)”) will be described. In this embodiment, (D) inorganic filler contains at least (d-1) first inorganic filler and (d-2) second inorganic filler. That is, (d-1) a first inorganic filler having an average particle size of 100 nm to 500 nm, a maximum particle size of 2 μm or less, and a refractive index of 1.5 to 1.8, (d-2) an average particle size of 5 nm The second inorganic filler having a refractive index of 1.2 to 1.5 and a refractive index of 1.2 to less than 1.5 is used. Any inorganic filler is preferably dispersed so that the maximum particle diameter is 2 μm or less.

  (D-1) The first inorganic filler has a refractive index in the range of 1.5 to 1.8, and includes aluminum oxide, aluminum hydroxide, calcium carbonate, calcium hydroxide, barium sulfate, barium carbonate, magnesium oxide. , Magnesium hydroxide, mine-derived filler (talc, mica, etc.) and the like. These are preferably pulverized by a pulverizer, classified according to circumstances, and adjusted so as to have an average particle diameter in the range of 100 nm to 500 nm and a maximum particle diameter of 2 μm or less. (D-1) The average particle diameter of the first inorganic filler is more preferably in the range of 115 nm to 500 nm, and still more preferably in the range of 130 nm to 480 nm. Further, (d-1) The maximum particle size of the first inorganic filler is more preferably 1.9 μm or less, and further preferably 1.8 μm or less.

On the other hand, the (d-2) second inorganic filler is an inorganic filler having an average particle diameter of 5 nm to 200 nm and a refractive index of 1.2 or more and less than 1.5. The (d-2) second inorganic filler preferably has a thermal expansion coefficient of 5.0 × 10 ⁻⁶ / ° C. or less, more preferably 3.0 × 10 ⁻⁶ / ° C. or less. 1.0 × 10 ⁻⁶ / ° C. or less is more preferable.

  (D-2) Any kind of the second inorganic filler can be used, but from the viewpoint of particle size, fused spherical silica, fused ground silica, fumed silica, and sol-gel silica are preferable. Among them, fumed Silica and sol-gel silica are more preferable. These silicas can be used after classification or the like and adjusting the particle diameter, if necessary. The second inorganic filler is preferably so-called nano silica having an average particle diameter in the range of 5 nm to 200 nm, more preferably nano silica having an average particle diameter in the range of 5 nm to 150 nm, and an average particle diameter of 5 nm. It is more desirable to use nano silica in the range of ˜100 nm. The second inorganic filler is desirably dispersed with a maximum particle size of 2 μm or less, more preferably dispersed with a maximum particle size of 1.5 μm or less, and dispersed with a maximum particle size of 1.3 μm or less. More preferably. Moreover, in order to disperse | distribute in the photosensitive resin composition, without aggregating, it is preferable to use a silane coupling agent.

  As the silane coupling agent, generally available ones can be used. Alkyl silane, alkoxy silane, vinyl silane, epoxy silane, amino silane, acrylic silane, methacryl silane, mercapto silane, sulfide silane, isocyanate silane, sulfur silane , Styrylsilane, alkylchlorosilane, and the like can be used.

  Specific compound names include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, isobutyltrimethoxy. Silane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, diphenyldimethoxy Silane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, n-octyldi Tylchlorosilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl) aminopropylmethyldimethoxysilane , 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane Bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, Lutriisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3 -Mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3-aminopropyltriethoxysilane, aminosilane and the like.

  A desirable silane coupling agent to be used is of a kind that reacts with the component (A) contained in the photosensitive resin composition. For example, epoxy silane, mercaptosilane, and isocyanate silane are desirable. Since these silane coupling agents strengthen the bond between silica and resin, they increase the strength of the film when used as a permanent mask resist, and contribute to improving crack resistance and the like in a temperature cycle test.

  Acrylic silane or methacrylic silane may also be used. It is considered that it reacts with the ethylenically unsaturated group of the photopolymerizable monomer having an ethylenically unsaturated group and exhibits the same effect as when the silane coupling agent is used.

  When measuring the particle size of each inorganic filler, it is desirable to use a known particle size distribution meter. For example, particle size distribution using laser diffraction scattering type particle size distribution meter, frequency analysis by dynamic light scattering method, which irradiates particles with laser light and obtains particle size distribution by calculation from intensity distribution pattern of diffracted / scattered light emitted from it Examples thereof include a particle size distribution meter of nanoparticles for which distribution is obtained. Moreover, the refractive index of each inorganic filler can be measured with a commercially available apparatus as shown below. For example, the refractive index can be simply measured using a refractometer Abbemat series (manufactured by Anton paar) or a precision refractometer KPR series (manufactured by Shimadzu Corporation).

  (D) The content of the inorganic filler is preferably 25% by mass or more and 70% by mass or less, more preferably 35% by mass or more and 60% by mass or less based on the total mass of the photosensitive resin composition. It is more desirable that the content be not less than 55% by mass.

  Moreover, (D) The ratio of the mass of (d-1) and the mass of (d-2) of the inorganic filler is the mass of (d-1): mass of (d-2) = 1.0: 0. 1-1.0: 5.0 is desirable, 1.0: 0.2-1.0: 3.0 is more desirable, 1.0: 0.5-1.0: 1 .5 is more desirable.

  (E) An organic filler having an amino group (hereinafter sometimes referred to as “component (E)”) will be described. The component (E) has an average particle size of 500 nm or less and a maximum particle size of 2 μm or less. (E) It is preferable that the average particle diameter of a component is 400 nm or less. Moreover, it is preferable that the maximum particle diameter of (E) component is 1.5 micrometers or less. Such an organic filler is desirably dispersed in the composition. The average particle size and the maximum particle size of the organic filler can be measured by the same method as described for the (D) inorganic filler.

  Furthermore, due to the recent trend of miniaturization of wiring, insulation resistance between fine wirings of 5/5 μm is required in line / space, but the maximum particle size of the organic filler is set in the same manner as the first inorganic filler. By setting it to 2 μm or less, it is possible to achieve insulation resistance between fine wirings of 5/5 μm.

  (E) As an organic filler having an amino group, melamine, acetoguanamine, benzoguanamine, melamine-phenol-formalin resin, dicyandiamide, triazine compound, ethyldiamino-S-triazine, 2,4-diamino-S-triazine, 2, Examples include triazine derivatives such as 4-diamino-6-xylyl-S-triazine, imidazole series, thiazole series and triazole series, and additives such as silane coupling agents. As commercial products, 2MZ-AZINE, 2E4MZ-AZINE, C11Z-AZINE, 2MA-OK (both manufactured by Shikoku Kasei Kogyo Co., Ltd.) are available.

  The component (E) improves the characteristics such as pre-shear cooker resistance (PCT resistance), crack resistance, heat resistance, plating agent resistance, and electric corrosion resistance in addition to the adhesion between the photosensitive resin composition layer and the metal. Can do. The component (E) can also be dispersed in the resin composition using a predetermined pulverizer, disperser, classifier or the like.

  (E) The content of the organic filler having an amino group is desirably 0.1 parts by mass or more and 20 parts by mass or less, and 0.5 parts by mass or more and 15 parts by mass or less with respect to 100 parts by mass of the total solid content. Is more desirable. This organic filler shows the antioxidant effect of the underlying wiring metal, but the antioxidant effect can be improved by setting it to 0.1 parts by mass or more, and the resolution can be further improved by setting it to 20 parts by mass or less. It can be sufficient, and contamination of the plating bath can be reduced.

  (F) An elastomer having a polyamide structure (hereinafter sometimes referred to as “component (F)”) is a block copolymer having a flexible component comprising a rubber component and a rigid component comprising an aromatic polyamide component in the molecule. It consists of a polymer. Examples of the rubber component include butadiene rubber, butadiene-acrylonitrile rubber, butyl rubber, acrylonitrile rubber, silicone rubber, ethylene propylene rubber, sulfonated polyethylene, acrylic rubber, urethane rubber, silicone rubber, hydrogenated nitrile rubber, and the like. The component (F) is preferably a block copolymer obtained by reacting a phenolic hydroxyl group-containing polyamide with a butadiene-acrylonitrile rubber (polybutadiene / acrylonitrile) having a carboxyl group at the terminal. As such a compound, for example, KAYAFLEX BPAM155, BPAM01H (manufactured by Nippon Kayaku Co., Ltd., trade name) and the like are listed as commercial products.

  The content of the component (F) is desirably 0.5% by mass or more and 15% by mass or less, and more desirably 1.0% by mass or more and 10% by mass or less, based on the total mass of the photosensitive resin composition. More preferably, it is 1.0 mass% or more and 5.0 mass% or less. When the content is 0.5% by mass or more, adhesion, flexibility, toughness, and the like can be further improved, and when the content is 15% by mass or less, the resolution is further improved. be able to.

  The photosensitive resin composition may contain other elastomer components as necessary. Examples of such an elastomer include known styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, and silicone elastomers. Examples of the styrene elastomer include styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, and the like.

  The photosensitive resin composition may contain a photopolymerizable monomer as necessary. The photopolymerizable monomer component that can be used in the photosensitive resin composition is not particularly limited and contains a photopolymerizable monomer having two or more ethylenically unsaturated groups in the molecule. This is preferable. A photopolymerizable monomer is used individually or in combination of 2 or more types. In particular, it is desirable to contain at least one polyfunctional photopolymerizable monomer having three or more ethylenically unsaturated groups in one molecule.

  For example, it can be obtained by reacting a bisphenol A (meth) acrylate compound, a polyhydric alcohol with an α, β-unsaturated carboxylic acid, and a glycidyl group-containing compound with an α, β-unsaturated carboxylic acid. Examples thereof include urethane monomers and urethane oligomers such as compounds and (meth) acrylate compounds having a urethane bond in the molecule. As the urethane monomer, UX-5120D (Nippon Kayaku Co., Ltd., trade name) and the like are available. Besides these, nonylphenoxy polyoxyethylene acrylate, γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyalkyl-β ′-(meth) acryloyloxy Examples thereof include phthalic acid compounds such as alkyl-o-phthalate, (meth) acrylic acid alkyl esters, EO-modified nonylphenyl (meth) acrylate, and the like. Especially, the polyfunctional photopolymerization monomer which has six or more ethylenically unsaturated groups in 1 molecule is effective in the improvement of the crack tolerance at the time of reflow mounting.

Trimethylolpropane triethoxytriacrylate (SR-454, Nippon Kayaku Co., Ltd., trade name) is commercially available as a polyfunctional photopolymerizable monomer having three or more ethylenically unsaturated groups in one molecule. Is possible.
Examples of the polyfunctional photopolymerizable monomer having 6 or more ethylenically unsaturated groups in one molecule include dipentaerythritol hexaacrylate and a similar structure thereof. KAYARAD D-330, KAYARAD DPCA-20, 30, and KAYARAD DPCA-60, 120 (all manufactured by Nippon Kayaku Co., Ltd., trade names) are available.

  A pigment component can be used for the photosensitive resin composition as needed. For example, colorants or dyes such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, malachite green, crystal violet, titanium oxide, carbon black, naphthalene black, and azo organic pigments can be used.

  Further, the photosensitive resin composition is a polymerization inhibitor such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, phenothiazine, nitroso compound, thixotropic agent such as benton, montmorillonite, aerosil, amide wax, silicone, Fluorine-based and polymer-based antifoaming agents, leveling agents, and the like may be included in a range that does not affect the desired properties of the photosensitive resin composition.

  A diluent can be used in the photosensitive resin composition as necessary. A conventionally well-known organic solvent can be used as a diluent.

  When using the photosensitive resin composition in a liquid state, the content of the diluent is preferably 5 to 40% by mass in the total mass of the photosensitive resin composition.

  Next, the photosensitive film of suitable embodiment is demonstrated.

  The photosensitive film which concerns on this invention is equipped with a support body and the photosensitive resin composition layer (photosensitive layer) which consists of the photosensitive resin composition of this invention formed on this support body. On this photosensitive resin composition layer, you may further provide the protective film which coat | covers this photosensitive resin composition layer.

  As the support, a polymer film having heat resistance and solvent resistance, such as polyethylene terephthalate, polypropylene, polyethylene, and polyester can be used. The thickness of the support (polymer film) is preferably 5 to 25 μm, more preferably 5 to 20 μm, and still more preferably 10 to 20 μm. When the thickness is 5 μm or more, tearing of the support can be sufficiently suppressed when the support is peeled off before development. When the thickness is less than 25 μm, sufficient resolution can be obtained even when exposure is performed through the support. In addition, you may laminate | stack the said polymer film on both surfaces of the photosensitive resin composition layer by using one as a support body and the other as a protective film.

  As the protective film, a polymer film having heat resistance and solvent resistance such as polyethylene terephthalate, polypropylene, polyethylene, and polyester can be used. The thickness of the protective film is preferably 1 to 100 μm, more preferably 5 to 50 μm, further preferably 5 to 30 μm, and particularly preferably 15 to 30 μm.

  The photosensitive resin composition layer is prepared by dissolving the photosensitive resin composition of the present invention in an organic solvent (diluent) to obtain a solution (coating solution) having a solid content of about 30 to 70% by mass, and then applying the solution (coating solution). (Liquid) is preferably applied on a support and dried.

  The application can be performed by a known method using, for example, a roll coater, comma coater, gravure coater, air knife coater, die coater, bar coater or the like. Moreover, the said drying can be performed at 70-150 degreeC and about 5 to 30 minutes. The amount of the residual organic solvent in the photosensitive resin composition after drying is preferably 3% by mass or less with respect to the total mass of the photosensitive resin composition from the viewpoint of preventing the diffusion of the organic solvent in the subsequent step. .

  The thickness of the photosensitive layer made of the photosensitive resin composition varies depending on the use, but is preferably 10 to 100 μm, more preferably 15 to 60 μm, and more preferably 20 to 50 μm after drying. Particularly preferred. When the thickness is 10 μm or more, coating can be easily performed, and when the thickness is 100 μm or less, sufficient sensitivity can be obtained even inside the photosensitive layer, and the resolution can be improved.

  The photosensitive film may further include intermediate layers such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer. Moreover, the obtained photosensitive film can be stored in the form of a sheet or wound around a roll in the form of a roll. In addition, it is preferable to wind up so that a support body may become the outermost part in this case. An end face separator is preferably installed on the end face of the roll-shaped photosensitive film roll from the viewpoint of end face protection, and a moisture-proof end face separator is preferably installed from the viewpoint of edge fusion resistance. Moreover, as a packing method, it is preferable to wrap and package in a black sheet with low moisture permeability. Examples of the winding core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, ABS resin (acrylonitrile-butadiene-styrene copolymer).

  Next, a method for forming a resist pattern using the photosensitive film of the present invention will be described.

First, a photosensitive layer made of the above-described photosensitive resin composition is formed on a substrate on which a resist pattern is to be formed. After peeling the protective film of the photosensitive film from the photosensitive resin composition layer, the exposed surface of the photosensitive resin composition layer is laminated so as to cover the conductor layer having the circuit pattern formed on the substrate. (Adhering step). A method of laminating under reduced pressure is also preferable from the viewpoint of improving adhesion and followability. In addition, the photosensitive resin composition can also be apply | coated on a board | substrate by well-known methods, such as the method of apply | coating the solution (varnish) of the photosensitive resin composition with a screen printing method, a roll coater, etc.
Next, if necessary, a removal step of removing the support from the photosensitive film described above is performed, and a predetermined portion of the photosensitive resin composition layer is irradiated with actinic light (pattern irradiation) through the mask pattern, thereby exposing the irradiated portion to light. An exposure step of photocuring the conductive resin composition layer is performed. Note that direct exposure may be performed in which pattern irradiation is performed without using a mask pattern.

  Further, when a support is present on the photosensitive resin composition layer, the support is removed, and then a portion of the photosensitive resin composition layer that has not been photocured by wet development or dry development (unexposed). The resist pattern can be formed by removing the portion and developing (developing step).

  As a developing method, known methods such as spraying, rocking immersion, brushing, and scraping are appropriately employed.

  As a developing solution, 0.1-5 mass% dilute solution of sodium carbonate, 0.1-5 mass% dilute solution of potassium carbonate, 0.1-5 mass% dilute solution of sodium hydroxide, 0.1-5 A dilute solution of mass% sodium tetraborate is preferred. The pH of these developers is preferably in the range of 9-11. The temperature of such an alkaline aqueous solution is adjusted according to the developability of the photosensitive layer and is preferably 20 to 50 ° C. Further, a surfactant, an antifoaming agent or the like may be mixed in the alkaline aqueous solution in order to promote development.

  In the method for forming a resist pattern according to this embodiment, two or more kinds of development methods described above may be used in combination as necessary. Development methods include a dip method, a battle method, a spray method, a high-pressure spray method, brushing, and slapping. The high pressure spray method is most suitable for improving the resolution.

  For etching the metal surface after development, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, or the like can be used.

Next, a preferred embodiment of the permanent mask resist of the present invention using the photosensitive film of the present invention and a method for producing the same will be described.
A permanent mask resist can be formed by the same method as the above resist pattern forming method. After the development step, it is preferable to perform ultraviolet irradiation (ultraviolet irradiation step) or heating (heating step) using a high-pressure mercury lamp for the purpose of improving solder heat resistance, chemical resistance and the like. When irradiating with ultraviolet rays, the irradiation amount can be adjusted as necessary. For example, irradiation can be performed with an irradiation dose of about 0.05 to 10 J / cm ² . Moreover, when heating a resist pattern, it is preferable to carry out for about 15 to 90 minutes in the range of about 130-200 degreeC.

  Both ultraviolet irradiation and heating may be performed. In this case, both may be performed at the same time, and after either one is performed, the other may be performed. When performing ultraviolet irradiation and heating simultaneously, it is preferable to heat to 60-150 degreeC from a viewpoint of providing solder heat resistance and chemical resistance more favorably.

  The permanent mask resist according to the present embodiment also serves as a protective film for wiring after soldering the substrate. The permanent mask resist according to this embodiment has various properties as a protective film, and can be used as a permanent mask resist for printed wiring boards, semiconductor package substrates, and flexible wiring boards.

  The permanent mask resist is used as, for example, a plating resist or an etching resist when plating, etching, or the like is performed on a substrate. In addition, it is left on the substrate as it is and used as a protective film for protecting the wiring and the like.

  In the above exposure step, when exposure is performed using a mask or drawing data having a pattern in which a predetermined portion of a conductor layer having a circuit pattern formed on the substrate is unexposed, by developing this, A resist having an opening pattern in which an unexposed portion is removed and a part of the conductor layer is exposed is obtained. Thereafter, it is preferable to perform a process necessary for forming the above-described permanent mask resist.

[Semiconductor package]
The photosensitive resin composition of this embodiment can be used suitably for formation of the permanent mask resist of the printed wiring board for semiconductor packages. That is, this invention provides the semiconductor package which has a permanent mask resist which consists of hardened | cured material of the above-mentioned photosensitive resin composition. FIG. 1 is a schematic cross-sectional view showing a semiconductor package substrate. The semiconductor package 10 includes a semiconductor chip mounting substrate 50 and a semiconductor chip 120 mounted on the semiconductor chip mounting substrate 50. The semiconductor chip mounting substrate 50 and the semiconductor chip 120 are bonded with an adhesive 117 made of a die bond film or a die bond paste. The semiconductor chip mounting substrate 50 includes an insulating substrate 100. On one surface of the insulating substrate 100, a wire bonding wiring terminal 110 and a permanent mask resist in which an opening through which a part of the wiring terminal 110 is exposed is formed. 90 is provided, and a permanent mask resist 90 and solder connection terminals 111 are provided on the opposite surface. The permanent mask resist 90 is a layer made of a cured product of the photosensitive resin composition of the present embodiment. Solder connection terminals 111 have solder balls 114 mounted thereon for electrical connection with the printed wiring board. The semiconductor chip 120 and the wire bonding wiring terminal 110 are electrically connected using a gold wire 115. The semiconductor chip 120 is sealed with a semiconductor sealing resin 116.

  The photosensitive resin composition of the present embodiment can also be applied to flip chip type semiconductor packages. FIG. 2 is a schematic cross-sectional view showing a flip chip type semiconductor package substrate. The flip chip type semiconductor package substrate 20 includes a semiconductor chip mounting substrate 50 and a semiconductor chip 120 mounted on the semiconductor chip mounting substrate 50. The semiconductor chip mounting substrate 50 and the semiconductor chip 120 are filled with an underfill agent 118. The semiconductor chip mounting substrate 50 has a configuration in which an insulating substrate 100b, an insulating substrate 100a, and a permanent mask resist 90 are stacked in this order. The permanent mask resist 90 is a layer made of a cured product of the photosensitive resin composition of the present embodiment. The insulating substrate 100b has a patterned copper wiring 80 on the surface on the insulating substrate 100a side, and the insulating substrate 100a has a patterned copper wiring 80 on the surface on the permanent mask resist 90 side. The copper wiring 80 on the insulating substrate 100b and at least a part of the copper wiring 80 on the insulating substrate 100a are electrically connected by the solder connection terminal 111 formed so as to penetrate the insulating substrate 100a and the insulating substrate 100b. It is connected. The permanent mask resist 90 is formed so as to cover the copper wiring 80 on the insulating substrate 100a. However, the copper wiring 80 is exposed on the copper wiring 80 corresponding to the connection terminal 111 for solder connection. An opening 112 is formed. The copper wiring 80 on the insulating substrate 100 a is electrically connected via the copper wiring 80 formed on the surface of the semiconductor chip 120 facing the semiconductor chip mounting substrate 50 and the solder ball 114 provided in the opening 112. It is connected.

  The present invention can also be said to be an invention relating to application of the photosensitive resin composition, for example. That is, one aspect of the present invention is (A) a resin having an ethylenically unsaturated group and a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an inorganic filler, and (E) an amino group. (D) is (d-1) having an average particle size of 100 nm to 500 nm, a maximum particle size of 2 μm or less, and a refractive index of 1.5 to 1. And (d-2) a second inorganic filler having an average particle diameter of 5 nm to 200 nm and a refractive index of 1.2 or more and less than 1.5, and (E) is Application of the photosensitive resin composition containing an organic filler having an average particle diameter of 500 nm or less and a maximum particle diameter of 2 μm or less for the production of a photosensitive film.

  In another aspect of the present invention, (A) a resin having an ethylenically unsaturated group and a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an inorganic filler, and (E) amino A photosensitive resin composition containing an organic filler having a group, wherein (D) is (d-1) having an average particle diameter of 100 nm to 500 nm, a maximum particle diameter of 2 μm or less, and a refractive index of 1.5 to 1. And (d-2) a second inorganic filler having an average particle diameter of 5 nm to 200 nm and a refractive index of 1.2 or more and less than 1.5, and (E) Is an application of a photosensitive resin composition containing an organic filler having an average particle diameter of 500 nm or less and a maximum particle diameter of 2 μm or less as a photosensitive resin composition for producing a permanent mask resist.

  The substrate provided with the permanent mask resist of the present invention is then mounted with a semiconductor element or the like (for example, wire bonding, C4 solder connection, etc.) and mounted on an electronic device such as a personal computer.

  The present invention has been described in detail based on the embodiments. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

(Examples 1-13 and Comparative Examples 1-9)
[Preparation of photosensitive resin composition solution]
First, about Examples 1-13 and Comparative Examples 1-9, each component shown in Table 1 and Table 2 is mixed with the compounding quantity (mass part) shown to the same table, respectively, and methyl ethyl ketone (MEK) is added as a diluent. Thus, a photosensitive resin composition solution was obtained. In addition, the detail of each component in a table | surface is as follows.

(A) Component: Resin EXP-3133 having an ethylenically unsaturated group and a carboxyl group: Bisphenol F novolac acid-modified epoxy resin (manufactured by DIC, weight average molecular weight 7000, acid value 63 mgKOH / g)
EXP-3073: Acid-modified cresol novolac epoxy acrylate (manufactured by DIC, sample name)
UXE-3024: urethane-modified bisphenol A acid-modified epoxy acrylate (manufactured by Nippon Kayaku Co., Ltd., weight average molecular weight 10,000, acid value 67 mg KOH / g, trade name)

[Measurement of weight average molecular weight]
The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC), and was derived by conversion using a standard polystyrene calibration curve. The GPC conditions are shown below.
GPC condition pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., product name)
Column: Gelpack GL-R420, Gelpack GL-R430, Gelpack
GL-R440 (Hitachi Chemical Co., Ltd., product name)
Eluent: Tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd., product name)

Component (B): Photopolymerization initiator I907: 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (trade name: IRGACURE 907, manufactured by BASF)
DETX-S: 2,4-diethylthioxanthone (Nippon Kayaku Co., Ltd., trade name: KAYACURE-DETX-S)
OXE-02: Ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) (manufactured by BASF, trade name: IRGACURE OXE 02)

(C) Component: Epoxy resin NC-3000H: Biphenyl aralkyl type epoxy resin (Nippon Kayaku Co., Ltd., trade name)
YSLV-80: Bisphenol F type epoxy resin (trade name, manufactured by Nippon Steel Chemical Co., Ltd.)

Component (D): Inorganic filler (d-1) First inorganic filler ASA having an average particle size of 100 nm to 500 nm, a maximum particle size of 2 μm or less, and a refractive index of 1.5 to 1.8: barium sulfate (Japan) (Product name by Solvay)
HK-001: Aluminum hydroxide (made by Showa Denko KK, trade name Hijilite HK-001)
BMT-3LV: Boehmite type aluminum hydroxide particles (manufactured by Kawai Lime Industry Co., Ltd., trade name)
CS-3N-A30: Calcium carbonate (trade name, manufactured by Ube Materials)
All the fillers were pulverized and dispersed at a peripheral speed of 12 m / s by using a wet milling machine Star Mill LMZ (manufactured by Ashizawa Finetech Co., Ltd.) using zirconia beads having a diameter of 1.0 mm to prepare a dispersion. The average particle size after dispersion and the maximum particle size were measured using a laser diffraction scattering type microtrack particle size distribution analyzer “MT-3100” (manufactured by Nikkiso Co., Ltd.). Respectively, average 184 nm, maximum 0.58 μm, average 480 nm, maximum 1.73 μm, average 393 nm, maximum 1.15 μm, average 135 nm, maximum 0.88 μm, average particle diameter is 100 nm to 500 nm, maximum particle diameter Was confirmed to be 2 μm or less. The refractive indexes were 1.64, 1.57, 1.65, and 1.68, respectively, and it was confirmed that the refractive index was 1.5 to 1.8.
(D-2) Second inorganic filler silica A having an average particle diameter of 5 nm to 200 nm and a refractive index of 1.2 or more and less than 1.5: sol-gel nanosilica and methacrylsilane as a silane coupling agent Sample 2-N coupled with methacryloxypropyltrimethoxysilane (manufactured by Admatechs, sample name)
Silica B: SIRMIBK (manufactured by CIK Nanotech Inc., sample name) which is fumed silica was used.
The dispersion state was measured using a dynamic light scattering nanotrack particle size distribution analyzer “UPA-EX150” (manufactured by Nikkiso Co., Ltd.). It was confirmed that the average particle size was 50 nm and 100 nm, respectively, and the maximum particle size was 1 μm or less. It was confirmed that both the refractive index and the thermal expansion coefficient were 1.45 and 0.5 × 10 ⁻⁶ / ° C.

Component (E): Organic filler having an amino group (an organic filler having an average particle size of 500 nm or less and a maximum particle size of 2 μm or less)
Melamine: Fine melamine (trade name, manufactured by Nissan Chemical Industries, Ltd.)
Dicyandiamide (Mitsubishi Chemical Corporation, trade name)
Any organic filler (d-1) was pulverized and dispersed in the same manner as the inorganic filler, and it was used after confirming that the average particle size was 500 nm or less and the maximum particle size was 2.0 μm or less. Measurement was performed using MT3000 (manufactured by Nikkiso Co., Ltd.), a laser diffraction particle size distribution meter.

(F) Component: Elastomer KAYAFLEX BPAM155 having a polyamide structure (trade name, manufactured by Nippon Kayaku Co., Ltd.)
(Other) Component Photopolymerizable monomer having an ethylenically unsaturated group includes DPHA (trade name, manufactured by Nippon Kayaku Co., Ltd.), UX-5102D (trade name, manufactured by Nippon Kayaku Co., Ltd.), and butadiene elastomer. Epolide PB3600 (manufactured by Daicel Chemical Industries, trade name), Antage 500 (manufactured by Kawaguchi Chemical Industries, trade name) as a polymerization inhibitor, and HCP-PM-5385 (trade name, manufactured by Toyo Ink Co., Ltd.) as a pigment are used. It was.

The components used only in the comparative example will be described.
(D-1) The first inorganic filler ASA (dispersion condition 1) having an average particle diameter of 100 nm to 500 nm, a maximum particle diameter of 2 μm or less, and a refractive index of 1.5 to 1.8: barium sulfate, An inorganic filler dispersed under the same conditions as in Examples was used (average particle size 184 nm, maximum particle size 0.58 μm, refractive index 1.64).
ASA (dispersion condition 2): Barium sulfate, and an inorganic filler prepared by shortening the dispersion time was used (average particle size 345 nm, maximum particle size 3.20 μm, refractive index 1.64).
SG-95: Talc (average particle size 1.5 μm, maximum particle size 20.6 μm, refractive index 1.57)
The average particle size and the maximum particle size were measured using a laser diffraction scattering type microtrack particle size distribution meter “MT-3100” (manufactured by Nikkiso Co., Ltd.).
(D-2) Second inorganic filler silica C having an average particle diameter of 5 nm to 200 nm and a refractive index of 1.2 or more and less than 1.5: high purity fused silica filler FLB-1 “silica” (manufactured by Tatsumori Co., Ltd.) (Average particle size 520 nm, refractive index 1.64, thermal expansion coefficient 0.5 × 10 ⁻⁶ / ° C., maximum particle size 15.2 μm).
The average particle size and the maximum particle size were measured using a dynamic light scattering nanotrack particle size distribution analyzer “UPA-EX150” (manufactured by Nikkiso Co., Ltd.).

[Production of photosensitive film]
Next, a photosensitive resin composition layer is formed by uniformly coating this photosensitive resin composition solution on a 16 μm-thick polyethylene terephthalate film (G2-16, product name, manufactured by Teijin Ltd.) as a support, It was dried at 100 ° C. for about 10 minutes using a hot air convection dryer. The film thickness after drying of the photosensitive resin composition layer was 25 μm.

  Subsequently, on the surface of the photosensitive resin composition layer opposite to the side in contact with the support, a polyethylene film (NF-15, manufactured by Tamapoly Co., Ltd., trade name) is bonded as a protective film, and the photosensitive film Got.

[Evaluation of sensitivity and resolution]
The copper surface of a printed wiring board substrate (E-679, manufactured by Hitachi Chemical Co., Ltd., trade name) obtained by laminating a 12 μm thick copper foil on a glass epoxy substrate was polished with an abrasive brush, washed with water, and dried. Using a press-type vacuum laminator (MVLP-500, trade name, manufactured by Meiki Seisakusho) on this printed wiring board substrate, press hot plate temperature 70 ° C., evacuation time 20 seconds, laminating press time 30 seconds, pressure 4 kPa Hereinafter, under the condition of a pressure bonding pressure of 0.4 MPa, the protective film of the photosensitive film was peeled and laminated to obtain a laminate for evaluation.

  Thereafter, after standing at room temperature for 1 hour or longer, a 41-step step tablet (manufactured by Hitachi Chemical Co., Ltd.) is brought into close contact with the support of the obtained laminate for evaluation, and direct imaging exposure using an ultrahigh pressure mercury lamp as a light source. Exposure was performed using apparatus DXP-3512 (manufactured by Oak Manufacturing Co., Ltd.).

After standing for 30 minutes at room temperature after exposure, the polyethylene terephthalate film on the support is removed, and the photosensitive resin composition in the unexposed area is spray-developed with a 1% by mass aqueous sodium carbonate solution at 30 ° C. for 60 seconds. A cured film of the composition was obtained. The amount of exposure energy at which the number of remaining steps of the 41-step tablet after the development was 10.0 was defined as the sensitivity (unit: mJ / cm ² ) of the photosensitive resin composition. The photosensitive resin composition was evaluated using the pattern exposed with this sensitivity.

The sensitivity was evaluated by the amount of exposure energy at which the number of remaining steps was 10.0. That is, the 200 mJ / cm ² or less was "3", 200 mJ / cm ² ultra 300 mJ / cm ² a "2" or less, the case of 300 mJ / cm ² than to "1". Note that the smaller the exposure energy amount, the shorter the time required for exposure with higher sensitivity, and in particular, the throughput in direct imaging exposure is improved.

  The evaluation of the resolution is the line width (unit: μm) in which exposure and spray development are performed with an exposure energy amount that the remaining number of steps is 10.0, and in the optical microscope observation of the resist pattern after the development processing, peeling and twist are not observed. ) By measuring the smallest width. The smaller the value of the line width (μm) remaining as line and space, the better the value. The results are shown in Tables 3 and 4 with the minimum width as the resolution (μm).

[Evaluation of copper adhesion]
Using a press-type vacuum laminator (MVLP-500, trade name, manufactured by Meiki Seisakusho Co., Ltd.) for a copper foil of 35 μm thickness, press hot plate temperature 70 ° C., evacuation time 20 seconds, laminating press time 30 seconds, atmospheric pressure 4 kPa Hereinafter, under the condition of a pressure bonding pressure of 0.4 MPa, the protective film of the photosensitive film was peeled and laminated to obtain a laminate for evaluation. Then, after leaving at room temperature for 1 hour or longer, a 41-step tablet (manufactured by Hitachi Chemical Co., Ltd.) is brought into close contact with the obtained support for the evaluation laminate, and the exposure energy at which the number of remaining steps is 10.0. The amount was irradiated. Thereafter, the unexposed photosensitive resin composition was spray-developed with a 1 mass% sodium carbonate aqueous solution at 30 ° C. for 60 seconds to obtain a cured film of the photosensitive resin composition. Thereafter, 1 J / cm ^{2 was} irradiated with a conveyor type UV irradiator, and then heat curing was performed at 160 ° C./1 hour with a hot air circulation dryer, followed by post curing. In this way, a permanent mask resist was formed on the copper foil.
The copper foil on which the permanent mask resist was formed was cut out with a cutter so that the line width was 5 mm. The said permanent mask resist part was fixed with the adhesive agent, the copper foil peeling test was done, and copper adhesiveness was evaluated. The test was conducted at a tensile rate of 50 mm / min in a 90 ° C direction tensile test, and an autograph AG-100C manufactured by Shimadzu Corporation was used as a measuring device. Copper adhesion was evaluated according to the following criteria. The case where the copper foil peel strength (unit: kN / m) is 1.0 or more is “3”, the case where it is 0.7 or more and less than 1.0 is “2”, the case where it is less than 0.7 1 ”. The obtained results are shown in Tables 3 and 4.

[Evaluation of thermal expansion coefficient (CTE)]
By exposing the entire surface of the evaluation laminate (photosensitive laminate) produced in the same manner as in the above “Evaluation of Sensitivity and Resolution” to development, ultraviolet irradiation, and heat treatment, polyethylene terephthalate having a thickness of 16 μm is obtained. A permanent mask resist was formed on a film (G2-16, trade name, manufactured by Teijin Limited). Next, a polyethylene terephthalate film on which a permanent mask resist was formed was cut out with a cutter knife into a width of 3 mm and a length of 30 mm. The polyethylene terephthalate on the permanent mask resist was peeled off to obtain a permanent mask resist for thermal expansion coefficient evaluation.
Using a TMA apparatus SS6000 (manufactured by Seiko Instruments Inc.), the thermal expansion coefficient was measured in the tensile mode. The tensile load was 2 g, the span (distance between chucks) was 15 mm, and the heating rate was 10 ° C./min. First, a sample (permanent mask resist for thermal expansion coefficient evaluation) was mounted on the apparatus, heated from room temperature (25 ° C.) to 160 ° C., and left for 15 minutes. Then, it cooled to -60 degreeC and measured on conditions with a temperature increase rate of 10 degree-C / min from -60 degreeC to 250 degreeC. CTE was evaluated according to the following criteria. The inflection point seen in the range from 25 ° C. to 200 ° C. is Tg, and the temperature at that time is “3” when the temperature is 120 ° C. or higher, “2” when the temperature is 100 ° C. or higher and lower than 120 ° C. The thing was set to "1".
CTE used the inclination of the tangent of the curve obtained at the temperature below Tg. With the CTE value obtained in Example 1 as the reference value, the difference from this reference value is less than 30% is “3”, the difference between 30% and less than 50% is “2”, and the difference is 50% or more. The thing was set to "1". The results are shown in Tables 3 and 4.

[Evaluation of HAST resistance]
Printed wiring board substrate (MCL-E-679FG, Hitachi Chemical Co., Ltd., trade name) in which 12 μm thick copper foil is laminated on a glass epoxy base material as a core material, build-up material for forming semi-additive wiring (AS-ZII, Comb electrodes having a line / space of 8 μm / 8 μm were produced using Hitachi Chemical Co., Ltd. (trade name), and this was used as an evaluation substrate.

On the comb electrode on this evaluation substrate, a permanent mask resist was formed in the same manner as in the above “evaluation of sensitivity and resolution” (exposure by exposure so that the permanent mask resist remains on the comb electrode portion, development, ultraviolet irradiation, Formed by heat treatment). Further, the obtained permanent mask resist was exposed to a condition of 130 ° C., 85% RH, 6V for 200 hours. Thereafter, the resistance value was measured and the degree of migration was observed with a 100-fold metal microscope, and evaluated according to the following criteria.
That is, the resistance value of 1.0 × 10 ¹⁰ Ω or more is maintained, and “3” is set when no migration occurs in the permanent mask resist, and the resistance value of 1.0 × 10 ¹⁰ Ω or more is maintained. However, it was “2” when a slight migration occurred, and “1” when a resistance value was less than 1.0 × 10 ¹⁰ Ω and a large migration occurred. The results are shown in Tables 3 and 4.

[Evaluation of crack resistance]
On the evaluation laminate produced in the same manner as in the above “evaluation of sensitivity and resolution”, photo data having a 2 mm square pattern was obtained using a direct imaging exposure apparatus DXP-3512 (manufactured by Oak Manufacturing). Exposure was carried out with an energy amount such that the number of steps remaining after development of the stepped tablet (manufactured by Hitachi Chemical Co., Ltd.) was 10.0. Next, after standing at room temperature (25 ° C.) for 1 hour, the polyethylene terephthalate film on the laminate substrate for evaluation was peeled off, and the minimum development time (unexposed area was developed with a 1% by mass aqueous sodium carbonate solution at 30 ° C. Spray development was carried out for 2.0 times the minimum time) to form a cured film of the photosensitive resin composition having a pattern. Thereafter, 1 J / cm ^{2 was} irradiated with a conveyor type UV irradiator, and then heat curing was performed at 160 ° C./1 hour with a hot air circulation dryer, followed by post curing. The evaluation substrate on which the permanent mask resist having the pattern thus obtained was formed was used as an evaluation substrate for crack resistance.

The evaluation substrate is exposed to the atmosphere of −65 ° C. for 15 minutes, then heated at a rate of temperature increase of 180 ° C./min, and then exposed to the atmosphere of 150 ° C. for 15 minutes, and then the temperature is decreased to 180 ° C./min. The heat cycle of decreasing the temperature at a rate was repeated 1000 times. After being exposed to such an environment, the crack and peeling degree of the permanent mask resist on the evaluation substrate were observed with a 100-fold metal microscope, and crack resistance was evaluated according to the following criteria.
That is, when 10 places of 2 mm square openings were confirmed and cracks and peeling of the permanent mask resist film could not be observed at all, “3” was given, and cracks and peeling were observed in 2 or less of 10 places. And “1” when cracks and peeling were observed in 3 or more of 10 locations. The results are shown in Tables 3 and 4.

DESCRIPTION OF SYMBOLS 10 ... Semiconductor package, 20 ... Flip chip type semiconductor package, 50 ... Semiconductor chip mounting substrate, 80 ... Copper wiring, 90 ... Permanent mask resist, 100a, 100b ... Insulating substrate, 110 ... Wiring terminal for wire bonding, 111 ... Solder Connection terminal for connection, 112... Opening, 114... Solder ball, 115... Gold wire, 116... Semiconductor sealing resin, 117.

Claims (9)

(A) a resin having an ethylenically unsaturated group and a carboxyl group,
(B) a photopolymerization initiator,
(C) epoxy resin,
(D) an inorganic filler, and
(E) a photosensitive resin composition containing an organic filler having an amino group,
A photosensitive resin composition satisfying the following conditions (I) to (IV).
(I) (D) contains (d-1) a first inorganic filler and (d-2) a second inorganic filler.
(II) The average particle size of (d-1) is 100 nm to 500 nm, the maximum particle size is 2 μm or less, and the refractive index is 1.5 to 1.8.
(III) The average particle diameter of (d-2) is 5 nm to 200 nm, and the refractive index is 1.2 or more and less than 1.5.
(IV) (E) contains an organic filler having an average particle size of 500 nm or less and a maximum particle size of 2 μm or less.   (F) The photosensitive resin composition of Claim 1 which further contains the elastomer which has a polyamide structure.   3. The photosensitive resin composition according to claim 2, wherein (F) is a block copolymer of a phenolic hydroxyl group-containing polyamide and polybutadiene / acrylonitrile.   The content of (D) is 25% by mass or more and 70% by mass or less based on the total mass of the photosensitive resin composition, and the ratio of the mass of (d-1) to the mass of (d-2) is 1. The photosensitive resin composition as described in any one of Claims 1-3 which is 0.0: 0.1-1.0: 5.0.   (D-2) is the photosensitive resin composition as described in any one of Claims 1-4 which is a silica with an average particle diameter of 5 nm-100 nm.   The photosensitive resin composition as described in any one of Claims 1-5 containing the compound and aromatic ketone which have oxime ester as (B).   The photosensitive film provided with the photosensitive resin composition as described in any one of Claims 1-6 on a support body.   The permanent mask resist which consists of a hardened | cured material of the photosensitive resin composition as described in any one of Claims 1-6, and is formed on the board | substrate for printed wiring boards. A lamination step of providing a photosensitive layer comprising the photosensitive resin composition according to any one of claims 1 to 6 on a substrate,
An exposure step of pattern irradiating the photosensitive layer with actinic rays;
A development step of developing the photosensitive layer after the exposure step;
A method for producing a permanent mask resist.

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