JPWO2012020665A1 - Adhesive composition containing aromatic polyether derivative - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form an adhesive layer having a sufficient thickness by being easily dissolved in various organic solvents, and the adhesive layer is a high-temperature process such as metal bump bonding, CVD, or ion diffusion process. Provides a high heat-resistant adhesive composition with extremely low thermal weight loss and good adhesion. The following formula (1): ## STR1 ## wherein X represents a sulfonyl group or a carbonyl group, Ar1 and Ar2 each represent an arylene group having 6 to 30 carbon atoms, and T1 represents a fluoroalkylene group , A cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group which may have a substituent and a fluoroalkylene group or a cyclic alkylene group. Adhesive composition. The arylene group is a phenylene group, a naphthylene group, or an anthrylene group. The polymer is a homopolymer having one type of unit structure or a copolymer having at least two types of unit structures. [Selection figure] None

Description

  The present invention relates to an adhesive composition. More specifically, the present invention relates to an adhesive composition that adheres laminates in a step of forming a laminate of a semiconductor product such as an IC chip or an optical product.

In recent years, as electronic devices such as mobile phones and IC cards become more functional and smaller in size, higher integration of semiconductor devices has been demanded. As a technique for this, miniaturization of the semiconductor itself and a stack structure in which semiconductor elements are stacked in the vertical direction are being studied.
In manufacturing the stack structure, an adhesive is used for bonding between semiconductor elements.
However, acrylic resins, epoxy resins, and silicone resins that are known as known adhesives have a heat resistance of only about 250 ° C., and high temperatures of 250 ° C. or higher are required, such as metal bump electrode bonding and ion diffusion processes. There is a problem that it cannot be used in the process.

  On the other hand, a thick film technology in which an undercoat film containing 30% to 45% by volume of polyether ether ketone resin powder and a thermosetting resin is formed on an inorganic insulating substrate in which a glass substrate is impregnated with a silicone resin. A substrate is disclosed (Patent Document 1).

JP 2009-070875 A

The substrate on which the undercoat film is formed has a very small dimensional change with respect to moisture and heat and is excellent in moisture resistance and the like. However, the polyether ether ketone contained in these undercoat films does not dissolve in the solvent or resin solution, so it cannot be used as a coating-type adhesive, and the substrate is coated by screen printing in the form of paste ink. The way to do was taken. Further, in this composition, if the content of the polyetheretherketone resin is excessively increased, a screen-printable ink cannot be formed. Therefore, the resin can be contained only in a proportion of 30% to 45% by volume, and the heat resistance is improved. There's a problem.
As described above, acrylic resins, epoxy resins, and silicone resins known as known adhesives have a heat resistance of only about 250 ° C., and cannot be used at a high temperature of 250 ° C. or higher.
On the other hand, an adhesive of wholly aromatic polyether such as polyether ether ketone is exemplified in Patent Document 1, but the solvent solubility is extremely low and the solubility is not exhibited, so the solvent selectivity is poor and the film thickness is increased. Is difficult. Furthermore, there is a problem that the applicability is not sufficient.
As a method for improving solvent solubility, it has been proposed to introduce a flexible structure typified by long-chain alkyl, but there is a problem that heat resistance generally decreases.

  The present invention has been made in view of the above-mentioned problems, and its purpose is that it can be easily dissolved in various organic solvents to form an adhesive layer with sufficient coatability and sufficient thickness, In addition, the adhesive layer provides a high heat-resistant adhesive composition having a very low thermal weight loss and good adhesion in a high temperature process such as metal bump bonding, CVD, or ion diffusion process.

（式中、Ｘはスルホニル基又はカルボニル基を表し、Ａｒ¹及びＡｒ²はそれぞれ炭素原子数６乃至３０のアリーレン基を表し、Ｔ¹はフルオロアルキレン基、環状アルキレン基、置換基を有するアリーレン基、又は置換基を有していても良いアリーレン基とフルオロアルキレン基若しくは環状アルキレン基との組み合わせを表す。）で表される単位構造を含むポリマーを含む接着剤組成物、
第２観点として、前記アリーレン基がフェニレン基、ナフチレン基、又はアントリレン基である第１観点に記載の接着剤組成物、
第３観点として、前記ポリマーが１種類の単位構造を有する単独重合体である第１観点又は第２観点に記載の接着剤組成物、
第４観点として、前記ポリマーが少なくとも２種類の単位構造を有する共重合体である第１観点又は第２観点に記載の接着剤組成物、
第５観点として、前記Ａｒ¹及びＡｒ²がそれぞれ下記式（２）：

（式中、Ｒ¹は炭素原子数１乃至１０のアルキル基、炭素原子数１乃至４のフルオロアルキル基、ヒドロキシル基、アリル基、アリロキシ基、アミノ基、シアノ基、ニトロ基、アシル基、アシルオキシ基、カルボキシル基、第３級炭素構造を有する基、環状アルキル基、又はそれらの組み合わせを表し、ｎ１は０乃至４の整数を表す。）で表される基である上記式（１）で表される単位構造を含むポリマーを含む第１観点乃至第４観点のいずれか１つに記載の接着剤組成物、
第６観点として、前記Ｔ¹が下記式（３）で表される基である上記式（１）で表される単位構造、前記Ｔ¹が下記式（４）で表される基である上記式（１）で表される単位構造、又はそれらの単位構造の組み合わせを含むポリマーを含む第１観点乃至第５観点のいずれか１つに記載の接着剤組成物、

（式中、Ｒ²、Ｒ³及びＲ⁴はそれぞれ炭素原子数１乃至１０のアルキル基、炭素原子数１乃至４のフルオロアルキル基、ヒドロキシル基、アリル基、アリロキシ基、アミノ基、シアノ基、ニトロ基、アシル基、アシルオキシ基、カルボキシル基、第３級炭素構造を有する基、環状アルキル基、又はそれらの組み合わせを表し、ｎ２、ｎ３及びｎ４はそれぞれ０乃至４の整数を表し、Ｔ²はフルオロアルキレン基、環状アルキレン基、又はこれらの組み合わせを表す。）、
第７観点として、前記式（３）中、Ｒ²が少なくとも第３級炭素構造を有する基を含む基を表し、ｎ２が１乃至４の整数である第６観点に記載の接着剤組成物、
第８観点として、更に式（５）：

（式中、Ｘはスルホニル基又はカルボニル基を表し、Ａｒ³及びＡｒ⁴はそれぞれ炭素原子数６乃至３０のアリーレン基を表し、Ｔ³はアルキレン基、スルホニル基、カルボニル基、炭素原子数６乃至３０のアリーレン基、又はこれらの組み合わせを表す。）で表される基である単位構造を含むポリマーを含む第１観点、第２観点及び第４観点乃至第７観点のいずれか１つに記載の接着剤組成物、
第９観点として、前記アリーレン基がフェニレン基、ナフチレン基、又はアントリレン基である第８観点に記載の接着剤組成物、
第１０観点として、前記Ｔ³が式（６）：

（式中、Ｒ⁵及びＲ⁶はそれぞれ炭素原子数１乃至１０のアルキル基、炭素原子数１乃至４のフルオロアルキル基、ヒドロキシル基、アリル基、アリロキシ基、アミノ基、シアノ基、ニトロ基、アシル基、アシルオキシ基、カルボキシル基、第３級炭素構造を有する基、環状アルキル基、又はそれらの組み合わせを表し、ｎ５及びｎ６はそれぞれ０乃至４の整数を表し、Ｔ⁴はアルキレン基、スルホニル基、カルボニル基、炭素原子数６乃至３０のアリーレン基、又はこれらの組み合わせを表す。）で表される基である第８観点又は第９観点に記載の接着剤組成物、
第１１観点として、前記第３級炭素構造を有する基がターシャリーブチル基である第１観点乃至第１０観点のいずれか１つに記載の接着剤組成物、
第１２観点として、前記ポリマーの重量平均分子量が５００乃至５００００００である第１観点乃至第１１観点のいずれか１つに記載の接着剤組成物、
第１３観点として、更に架橋剤を含む第１観点乃至第１２観点のいずれか１つに記載の接着剤組成物、
第１４観点として、更に溶剤を含み、０．００１乃至５０００Ｐａ・ｓの粘度を有する第１観点乃至第１３観点のいずれか１つに記載の接着剤組成物、
第１５観点として、少なくとも２つの被接着物と、該被接着物間に設けられた第１観点乃至第１４観点のいずれか１つに記載の接着剤組成物から形成した０．１μｍ乃至２００μｍの接着層とを含む積層体、
第１６観点として、前記被接着物がそれぞれシリコン基板、ガラス基板、樹脂基板、又はセラミックス基板からなる群から選択される第１５観点に記載の積層体、に関する。As a first aspect of the present invention, the following formula (1):

(In the formula, X represents a sulfonyl group or a carbonyl group, Ar ¹ and Ar ² each represent an arylene group having 6 to 30 carbon atoms, and T ¹ represents a fluoroalkylene group, a cyclic alkylene group, or an arylene group having a substituent. Or represents a combination of an arylene group which may have a substituent and a fluoroalkylene group or a cyclic alkylene group.) An adhesive composition comprising a polymer comprising a unit structure represented by:
As a second aspect, the adhesive composition according to the first aspect, wherein the arylene group is a phenylene group, a naphthylene group, or an anthrylene group,
As a third aspect, the adhesive composition according to the first aspect or the second aspect, wherein the polymer is a homopolymer having one type of unit structure,
As a fourth aspect, the adhesive composition according to the first aspect or the second aspect, wherein the polymer is a copolymer having at least two types of unit structures,
As a fifth aspect, the Ar ¹ and Ar ² are each represented by the following formula (2):

(Wherein R ¹ is an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group) A group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n1 represents an integer of 0 to 4, and is represented by the above formula (1). The adhesive composition according to any one of the first to fourth aspects, comprising a polymer containing a unit structure
The as sixth aspect, wherein T ¹ is a group unit structure represented by the above formula (1) is a group represented by the following formula (3), wherein T ¹ is represented by the following formula (4) above The adhesive composition according to any one of the first to fifth aspects, comprising a polymer comprising a unit structure represented by formula (1) or a combination of these unit structures;

(Wherein R ² , R ³ and R ⁴ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, A nitro group, an acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof; n2, n3 and n4 each represents an integer of 0 to 4, and T ² is A fluoroalkylene group, a cyclic alkylene group, or a combination thereof).
As a seventh aspect, the adhesive composition according to the sixth aspect, in which, in the formula (3), R ² represents a group containing a group having at least a tertiary carbon structure, and n2 is an integer of 1 to 4.
As an eighth aspect, formula (5):

(Wherein X represents a sulfonyl group or a carbonyl group, Ar ³ and Ar ⁴ each represent an arylene group having 6 to 30 carbon atoms, and T ³ represents an alkylene group, a sulfonyl group, a carbonyl group, or 6 to 6 carbon atoms) 30 arylene groups, or a combination thereof.) According to any one of the first aspect, the second aspect, and the fourth to seventh aspects, including a polymer including a unit structure that is a group represented by: Adhesive composition,
As a ninth aspect, the adhesive composition according to the eighth aspect, wherein the arylene group is a phenylene group, a naphthylene group, or an anthrylene group,
As a tenth aspect, the T ³ is the formula (6):

Wherein R ⁵ and R ⁶ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, n5 and n6 each represent an integer of 0 to 4, T ⁴ is an alkylene group, a sulfonyl group , A carbonyl group, an arylene group having 6 to 30 carbon atoms, or a combination thereof.) The adhesive composition according to the eighth aspect or the ninth aspect,
As an eleventh aspect, the adhesive composition according to any one of the first to tenth aspects, wherein the group having a tertiary carbon structure is a tertiary butyl group,
As a twelfth aspect, the adhesive composition according to any one of the first aspect to the eleventh aspect, wherein the polymer has a weight average molecular weight of 500 to 5000000.
As a thirteenth aspect, the adhesive composition according to any one of the first to twelfth aspects, further including a crosslinking agent,
As a fourteenth aspect, the adhesive composition according to any one of the first aspect to the thirteenth aspect, further including a solvent and having a viscosity of 0.001 to 5000 Pa · s,
As a fifteenth aspect, an adhesive composition of 0.1 μm to 200 μm formed from at least two adherends and the adhesive composition according to any one of the first aspect to the fourteenth aspect provided between the adherends. A laminate comprising an adhesive layer,
As a sixteenth aspect, the present invention relates to the laminate according to the fifteenth aspect, in which the adherend is selected from the group consisting of a silicon substrate, a glass substrate, a resin substrate, or a ceramic substrate.

According to the present invention, the adhesive composition of the present invention contains a polymer having an aromatic polyether structure such as aromatic polyetheretherketone or aromatic polyetherethersulfone, so that it easily dissolves in various solvents. And good coatability can be obtained. In addition, the adhesive composition of the present invention can form an adhesive layer having a sufficient thickness for bonding, and extremely low thermal weight loss in high-temperature processes such as metal bump bonding, CVD, and ion diffusion processes. An adhesive layer having high adhesion can be formed even after a high temperature process.
Thereby, the adhesive composition containing the polymer having a polyether structure of the present invention is a workpiece such as an electronic substrate used for a semiconductor device or the like that needs to be processed in a high temperature process (for example, heat treatment, pressure treatment, Or, it is effective for adhesion of a laminated material processed through lithography or the like.
In addition, since the laminate of the present invention has a high heat-resistant adhesive layer, the adherend can be processed in a high temperature process and can be used under high temperature conditions.

This invention is an adhesive composition containing the polymer containing the unit structure represented by Formula (1).
The above-mentioned adhesive composition contains a polymer containing a unit structure represented by the formula (1) and a solvent, and, as an optional component, an additional resin, a tackifier, a plasticizer, an adhesive for improving the performance of the adhesive Auxiliaries, stabilizers, colorants, surfactants and the like can be contained.
The adhesive composition of the present invention has a solid content of 0.1 to 80% by mass, preferably 1 to 60% by mass. Solid content is shown with the ratio of the remainder which remove | eliminated the solvent from this adhesive composition with respect to adhesive composition. The proportion of the polymer containing the unit structure represented by the formula (1) in the solid content can be 30 to 100% by mass, preferably 50 to 100% by mass.

The polymer used in the present invention is preferably a thermoplastic resin.
The molecular weight of the polymer used in the present invention is 500 to 5000000, preferably 1000 to 1000000, and preferably 1000 to 100000 as a weight average molecular weight.

In formula (1), X represents a sulfonyl group or a carbonyl group, Ar ¹ and Ar ² each represent an arylene group having 6 to 30 carbon atoms, and T ¹ has a fluoroalkylene group, a cyclic alkylene group, or a substituent. An arylene group or a combination of an arylene group which may have a substituent and a fluoroalkylene group or a cyclic alkylene group is represented.
The arylene group having a substituent represents an arylene group having a substituent described below.
The arylene group which may have a substituent represents a substituted or unsubstituted arylene group, and represents a combination of these arylene groups with a fluoroalkylene group or a cyclic alkylene group.
Examples of the arylene group include a phenylene group, a naphthyl group, and an anthryl group, and a phenylene group or a naphthyl group is preferable.
Examples of the fluoroalkylene group include a fluoroalkylene group having 1 to 10 carbon atoms. Specific examples thereof include a fluoromethylene group, a fluoroethylene group, a fluoro-n-propylene group, a fluoroisopropylene group, and a fluoropropane. Examples include -2,2-diyl group, fluoro-n-butylene group, fluoroisobutylene group, fluoro-s-butylene group, and fluoro-t-butylene group. Among them, C1-C4 fluoroalkylene groups such as perfluoropropane-2,2-diyl group are exemplified. As these fluoroalkylene groups, a fully fluorinated (perfluorinated) alkylene group or a partially fluorinated alkylene group (monofluorinated, difluorinated, etc.) can be used.
Examples of the cyclic alkylene group include cyclic alkylene groups having 3 to 30 carbon atoms, such as cyclopropylene group, cyclobutylene group, cyclohexylene group, 1-methyl-cyclopentylene group, 2-methyl-cyclopentylene. Len group, 3-methyl-cyclopentylene group, 1-ethyl-cyclobutylene group, 2-ethyl-cyclobutylene group, 3-ethyl-cyclobutylene group, 1,2-dimethyl-cyclobutylene group, 1,3- Dimethyl-cyclobutylene group, 2,2-dimethyl-cyclobutylene group, 2,3-dimethyl-cyclobutylene group, 2,4-dimethyl-cyclobutylene group, 3,3-dimethyl-cyclobutylene group, 1-n- Propyl-cyclopropylene group, 2-n-propyl-cyclopropylene group, 1-i-propyl-cyclopropylene group, 2-i Propyl-cyclopropylene group, 1,2,2-trimethyl-cyclopropylene group, 1,2,3-trimethyl-cyclopropylene group, 2,2,3-trimethyl-cyclopropylene group, 1-ethyl-2-methyl- Examples include cyclopropylene group, 2-ethyl-1-methyl-cyclopropylene group, 2-ethyl-2-methyl-cyclopropylene group, and 2-ethyl-3-methyl-cyclopropylene group. Further, a divalent organic group derived from adamantane or norbornene can be used.

In the polymer including a unit structure represented by the formula (1) used in the present invention, T ¹ can be used alone or in combination of these functional groups.
The polymer can be used as a homopolymer having one type of repeating unit structure, or can be used as a copolymer having two or more repeating unit structures.

In this invention, the polymer containing the unit structure represented by the said Formula (1) whose Ar < ¹ > and Ar < ² > are groups each represented by Formula (2) can be included.
In the formula (2), R ¹ is an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, or an acyl group. , An acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n1 represents an integer of 0 to 4.
In formula (2), the alkyl group representing R ¹ is an alkyl group having 1 to 10 carbon atoms, such as a methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i- Butyl, s-butyl, t-butyl, n-pentyl, 1-methyl-n-butyl, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl -N-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, n-hexyl group, 1-methyl-n-pentyl group 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group, 1,3-dimethyl-n-butyl group, 2,2-dimethyl-n-butyl group Group, 2,3-dimethyl-n-butyl group, 3,3-dimethyl-n-butyl group, 1-ethyl-n-butyl group, 2-ethyl-n-butyl group, 1,1,2-trimethyl -N-propyl group, 1,2,2-trimethyl-n-propyl group, 1-ethyl-1-methyl-n-propyl group, 1-ethyl-2-methyl-n-propyl group and the like can be mentioned.
Examples of the fluoroalkyl group include a fluoroalkyl group having 1 to 10 carbon atoms, and a fluoroalkyl group having 1 to 4 carbon atoms. Examples thereof include a fluoromethyl group, a fluoroethyl group, a fluoro-n-propyl group, a fluoroisopropyl group, a fluoro-n-butyl group, a fluoroisobutyl group, a fluoro-s-butyl group, and a fluoro-t-butyl group. As these fluoroalkyl groups, fully fluorinated (perfluorinated) or partially fluorinated alkyl groups can be used.
Examples of the acyl group include an acyl group having 2 to 10 carbon atoms, such as a methylcarbonyl group, an ethylcarbonyl group, an n-propylcarbonyl group, an i-propylcarbonyl group, a cyclopropylcarbonyl group, and an n-butylcarbonyl group. I-butylcarbonyl group, s-butylcarbonyl group, t-butylcarbonyl group, cyclobutylcarbonyl group, 1-methyl-cyclopropylcarbonyl group, 2-methyl-cyclopropylcarbonyl group, n-pentylcarbonyl group, 1- Methyl-n-butylcarbonyl group, 2-methyl-n-butylcarbonyl group, 3-methyl-n-butylcarbonyl group, 1,1-dimethyl-n-propylcarbonyl group, 1,2-dimethyl-n-propylcarbonyl Group, 2,2-dimethyl-n-propylcarbonyl group, 1-ethyl n-propylcarbonyl group, cyclopentylcarbonyl group, 1-methyl-cyclobutylcarbonyl group, 2-methyl-cyclobutylcarbonyl group, 3-methyl-cyclobutylcarbonyl group, 1,2-dimethyl-cyclopropylcarbonyl group, 2, 3-dimethyl-cyclopropylcarbonyl group, 1-ethyl-cyclopropylcarbonyl group, 2-ethyl-cyclopropylcarbonyl group, n-hexylcarbonyl group, 1-methyl-n-pentylcarbonyl group, 2-methyl-n-pentyl Carbonyl group, 3-methyl-n-pentylcarbonyl group, 4-methyl-n-pentylcarbonyl group, 1,1-dimethyl-n-butylcarbonyl group, 1,2-dimethyl-n-butylcarbonyl group, 1,3 -Dimethyl-n-butylcarbonyl group, 2,2-dimethyl-n Butylcarbonyl group, 2,3-dimethyl-n-butylcarbonyl group, 3,3-dimethyl-n-butylcarbonyl group, 1-ethyl-n-butylcarbonyl group, 2-ethyl-n-butylcarbonyl group, 1, Examples include 1,2-trimethyl-n-propylcarbonyl group.
Examples of the acyloxy group include an acyloxy group having 2 to 10 carbon atoms, such as a methylcarbonyloxy group, an ethylcarbonyloxy group, an n-propylcarbonyloxy group, an i-propylcarbonyloxy group, a cyclopropylcarbonyloxy group, n -Butylcarbonyloxy group, i-butylcarbonyloxy group, s-butylcarbonyloxy group, t-butylcarbonyloxy group, cyclobutylcarbonyloxy group, 1-methyl-cyclopropylcarbonyloxy group, 2-methyl-cyclopropylcarbonyl Oxy group, n-pentylcarbonyloxy group, 1-methyl-n-butylcarbonyloxy group, 2-methyl-n-butylcarbonyloxy group, 3-methyl-n-butylcarbonyloxy group, 1,1-dimethyl-n -Propylcarbo Ruoxy group, 1,2-dimethyl-n-propylcarbonyloxy group, 2,2-dimethyl-n-propylcarbonyloxy group, 1-ethyl-n-propylcarbonyloxy group, cyclopentylcarbonyloxy group, 1-methyl-cyclo Butylcarbonyloxy group, 2-methyl-cyclobutylcarbonyloxy group, 3-methyl-cyclobutylcarbonyloxy group, 1,2-dimethyl-cyclopropylcarbonyloxy group, 2,3-dimethyl-cyclopropylcarbonyloxy group, 1 -Ethyl-cyclopropylcarbonyloxy group, 2-ethyl-cyclopropylcarbonyloxy group, n-hexylcarbonyloxy group, 1-methyl-n-pentylcarbonyloxy group, 2-methyl-n-pentylcarbonyloxy group, 3- Methyl-n-pentylca Bonyloxy group, 4-methyl-n-pentylcarbonyloxy group, 1,1-dimethyl-n-butylcarbonyloxy group, 1,2-dimethyl-n-butylcarbonyloxy group, 1,3-dimethyl-n-butylcarbonyl Oxy group, 2,2-dimethyl-n-butylcarbonyloxy group, 2,3-dimethyl-n-butylcarbonyloxy group, 3,3-dimethyl-n-butylcarbonyloxy group, 1-ethyl-n-butylcarbonyl An oxy group, 2-ethyl-n-butylcarbonyloxy group, 1,1,2-trimethyl-n-propylcarbonyloxy group and the like can be mentioned.
As the group having a tertiary carbon structure, a tertiary butyl group can be preferably used.
Examples of the cyclic alkyl group include cyclic alkyl groups having 3 to 30 carbon atoms, such as cyclopropyl group, cyclobutyl group, cyclohexyl group, 1-methyl-cyclopentyl group, 2-methyl-cyclopentyl group, 3-methyl. -Cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutyl group, 1,2-dimethyl-cyclobutyl group, 1,3-dimethyl-cyclobutyl group, 2,2-dimethyl-cyclobutyl Group, 2,3-dimethyl-cyclobutyl group, 2,4-dimethyl-cyclobutyl group, 3,3-dimethyl-cyclobutyl group, 1-n-propyl-cyclopropyl group, 2-n-propyl-cyclopropyl group, 1 -I-propyl-cyclopropyl group, 2-i-propyl-cyclopropyl group, 1,2,2 Trimethyl-cyclopropyl group, 1,2,3-trimethyl-cyclopropyl group, 2,2,3-trimethyl-cyclopropyl group, 1-ethyl-2-methyl-cyclopropyl group, 2-ethyl-1-methyl- Examples include a cyclopropyl group, a 2-ethyl-2-methyl-cyclopropyl group, and a 2-ethyl-3-methyl-cyclopropyl group. Further, a monovalent organic group derived from adamantane or norbornene can be used.

Polymer used in the present invention, apart from the selection of the Ar ¹ and Ar ^2, or together with selecting the Ar ¹ and Ar ^2, the formula T ¹ is a group represented by the formula (3) (1) unit structure represented, T ¹ can include a polymer containing a combination of unit structures, or their unit structure represented by the formula is a group represented by (4) the formula (1).
That is, Ar ¹ and Ar ² are a unit structure represented by the above formula (1) which is a group represented by the formula (2), and T ¹ is a group represented by the formula (3). A unit structure represented by the above formula, a unit structure represented by the above formula (1) in which T ¹ is a group represented by the formula (4), Ar ¹ and Ar ² are groups represented by the formula (2) And T ¹ is a group represented by formula (3), Ar ¹ and Ar ² are groups represented by formula (2), and T ¹ is represented by formula (3). A polymer containing the unit structure represented by the above formula (1), which is a group represented by 4), or a combination thereof can be used.

In formulas (3) and (4), R ² , R ³ and R ⁴ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, An amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n2, n3 and n4 are each an integer of 0 to 4 Represents. T ² represents a fluoroalkylene group, a cyclic alkylene group, or a combination thereof.
The above-mentioned examples can be used for the alkyl group having 1 to 10 carbon atoms, the fluoroalkyl group having 1 to 4 carbon atoms, the group having a tertiary carbon structure, the cyclic alkyl group, the acyl group, and the acyloxy group.
The above-mentioned illustrations can be used for the fluoroalkylene group and the cyclic alkylene group, and these can be used alone or in combination.
In the formula (3), a unit structure in which R ² includes at least a group having a tertiary carbon structure and n2 is an integer of 1 to 4 can be used.

In the present invention, in addition to the unit structure represented by the formula (1), a copolymer containing a unit structure represented by the formula (5) can be used. In formula (5), X represents a sulfonyl group or a carbonyl group, Ar ³ and Ar ⁴ each represent an arylene group having 6 to 30 carbon atoms, and T ³ represents an alkylene group, a sulfonyl group, a carbonyl group, or the number of carbon atoms. It represents 6 to 30 arylene groups or a combination thereof. As these arylene group and alkylene group, the above-mentioned examples can be used.
In the formula (5), as the arylene group, a substituted or unsubstituted phenylene group, naphthylene group, or anthrylene group can be used.
In the formula (5), the alkylene group includes an alkylene group having 1 to 10 carbon atoms. These alkylene groups include, for example, a methylene group, an ethylene group, a propylene group, an isopropylene group, propane-2,2-diyl. Group, n-butylene group, isobutylene group, s-butylene group, t-butylene group and the like. Among them, an alkylene group having 1 to 4 carbon atoms such as a propane-2,2-diyl group is exemplified.
In the formula (5), a group represented by the formula (6) can be used as T ³ . In the formula (6), R ⁵ and R ⁶ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, or a nitro group. Group, an acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n5 and n6 each represents an integer of 0 to 4. T ⁴ represents an alkylene group, a sulfonyl group, a carbonyl group, an arylene group having 6 to 30 carbon atoms, or a combination thereof. Examples of the alkyl group, the fluoroalkyl group having 1 to 4 carbon atoms, the acyl group, the acyloxy group, the group having a tertiary carbon structure, the cyclic alkyl group, the alkylene group, and the arylene group can be exemplified above. .
In the present invention, the group having a tertiary carbon structure is a functional group having a tertiary carbon structure. This functional group replaces a hydrogen atom on the carbon atom to produce a quaternary carbon. Examples of the organic group bonded to the tertiary carbon atom of the tertiary carbon structure include an alkyl group such as a methyl group, an ethyl group, and a propyl group, and an aryl group such as a phenyl group. Among them, a methyl group is preferable. Used. A tertiary butyl group having three methyl groups can be preferably used as a group having a tertiary carbon structure.

The unit structure represented by Formula (1) used for this invention can be illustrated below.

上記式（Ａ）中、Ｑ¹は上述のアルキル基や、ハロゲン原子（フッ素、塩素、臭素、ヨウ素）が置換された上述のアルキル基を表し、ｋ１は０乃至５の整数である。The polymer containing the unit structure represented by the formula (1) may have a terminal hydroxyl group or a halogen group, or may be obtained by capping by replacing a hydrogen atom or a halogen group of the hydroxyl group with a phenyl group or the like. This capping group is represented by the following formula (A).

In the above formula (A), Q ¹ represents the above alkyl group or the above alkyl group substituted with a halogen atom (fluorine, chlorine, bromine, iodine), and k1 is an integer of 0 to 5.

  In the present invention, a crosslinking agent may be used. The crosslinking agent is not particularly limited, but a crosslinking agent having two or more, for example, 2 to 6, or 2 to 4 substituents capable of reacting with the functional group of the polymer is preferable. The proportion of the crosslinking agent in the solid content can be 0 to 50% by mass, preferably 5 to 40% by mass.

  Examples of the crosslinking agent used in the present invention include nitrogen-containing compounds having a nitrogen atom substituted with a hydroxymethyl group or an alkoxymethyl group. For example, a nitrogen-containing compound having a nitrogen atom substituted with a group such as a hydroxymethyl group, a methoxymethyl group, an ethoxymethyl group, a butoxymethyl group, and a hexyloxymethyl group. Moreover, an epoxy group-containing compound, an epoxy group-containing polymer, an allyl group-containing compound, an allyl group-containing polymer, an isocyanate group-containing compound, or an isocyanate group-containing polymer can be used as a crosslinking agent.

Specific examples of nitrogen-containing compounds include hexamethoxymethyl melamine, tetramethoxymethyl benzoguanamine, 1,3,4,6-tetrakis (butoxymethyl) glycoluril, 1,3,4,6-tetrakis (hydroxymethyl) glycol. Uril, 1,3-bis (hydroxymethyl) urea, 1,1,3,3-tetrakis (butoxymethyl) urea, 1,1,3,3-tetrakis (methoxymethyl) urea, 1,3-bis (hydroxy) And nitrogen-containing compounds such as methyl) -4,5-dihydroxy-2-imidazolinone and 1,3-bis (methoxymethyl) -4,5-dimethoxy-2-imidazolinone.
As cross-linking agents, methoxymethyl type melamine compounds (trade names: Cymel 300, Cymel 301, Cymel 303, Cymel 350) manufactured by Mitsui Cytec Co., Ltd., butoxymethyl type melamine compounds (trade names: Mycoat 506, Mycoat 508) , Glycoluril compound (trade name Cymel 1170, powder link 1174), methylated urea resin (trade name UFR65), butylated urea resin (trade names UFR300, U-VAN10S60, U-VAN10R, U-VAN11HV), Dainippon Ink Examples include commercially available compounds such as urea / formaldehyde resin (high condensation type, trade name Becamine J-300S, Becamine P-955, Becamine N) manufactured by Chemical Industry Co., Ltd.
The crosslinking agent is a compound obtained by condensing the melamine compound, urea compound, glycoluril compound and benzoguanamine compound as described above in which the hydrogen atom of the amino group is substituted with a hydroxymethyl group or an alkoxymethyl group. Also good. For example, a high molecular weight compound produced from a melamine compound (trade name Cymel 303) and a benzoguanamine compound (trade name Cymel 1123) described in US Pat. No. 6,323,310 can be used as the crosslinkable compound.
As the crosslinking agent, N-hydroxymethyl acrylamide, N-methoxymethyl methacrylamide, N-ethoxymethyl acrylamide, N-butoxymethyl methacrylamide and the like acrylamide compound or methacrylamide substituted with hydroxymethyl group or alkoxymethyl group Polymer compounds produced using the compounds can be used. Examples of such a polymer compound include poly (N-butoxymethyl acrylamide), a copolymer of N-butoxymethyl acrylamide and styrene, a copolymer of N-hydroxymethyl methacrylamide and methyl methacrylate, and N-ethoxymethyl methacryl. Examples thereof include a copolymer of amide and benzyl methacrylate, a copolymer of N-butoxymethylacrylamide, benzyl methacrylate, and 2-hydroxypropyl methacrylate.

As the crosslinking agent containing an epoxy group, for example, a compound having 1 to 6 or 2 to 4 epoxy rings can be used. As the compound having an epoxy ring, for example, it can be produced from a compound having two or more hydroxyl groups or carboxyl groups such as a diol compound, a triol compound, a dicarboxylic acid compound and a tricarboxylic acid compound, and a glycidyl compound such as epichlorohydrin. Mention may be made of compounds having two or more glycidyl ether structures or glycidyl ester structures. For example, 1,4-butanediol diglycidyl ether, 1,2-epoxy-4- (epoxyethyl) cyclohexane, glycerol triglycidyl ether, diethylene glycol diglycidyl ether, 2,6-diglycidyl phenyl glycidyl ether, 1,1,3 -Tris [p- (2,3-epoxypropoxy) phenyl] propane, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, 4,4'-methylenebis (N, N-diglycidylaniline), 3,4-epoxycyclohexyl Methyl-3,4-epoxycyclohexanecarboxylate, trimethylolethane triglycidyl ether, triglycidyl-p-aminophenol, tetraglycidylmetaxylenediamine, tetraglycidyldiaminodiphenylmethane, Traglycidyl-1,3-bisaminomethylcyclohexane, bisphenol-A-diglycidyl ether, bisphenol-S-diglycidyl ether, pentaerythritol tetraglycidyl ether resorcinol diglycidyl ether, phthalic acid diglycidyl ester, neopentyl glycol diglycidyl ether , Polypropylene glycol diglycidyl ether, tetrabromobisphenol-A-diglycidyl ether, bisphenol hexafluoroacetone diglycidyl ether, pentaerythritol diglycidyl ether, tris- (2,3-epoxypropyl) isocyanurate, monoallyl diglycidyl isocyanurate , Diglycerol polydiglycidyl ether, pentaerythritol polyglycidyl ether 1,4-bis (2,3-epoxypropoxyperfluoroisopropyl) cyclohexane, sorbitol polyglycidyl ether, trimethylolpropane polyglycidyl ether, resorcin diglycidyl ether, 1,6-hexanediol diglycidyl ether, polyethylene glycol Diglycidyl ether, phenyl glycidyl ether, p-tertiary butyl phenyl glycidyl ether, adipic acid diglycidyl ether, o-phthalic acid diglycidyl ether, dibromophenyl glycidyl ether, 1,2,7,8-diepoxyoctane, 1, 6-dimethylol perfluorohexane diglycidyl ether, 4,4′-bis (2,3-epoxypropoxyperfluoroisopropyl) diphenyl ether, 2,2-bi (4-glycidyloxyphenyl) propane, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexyloxirane, 2- (3,4-epoxycyclohexyl) -3 ′, 4'-epoxy-1,3-dioxane-5-spirocyclohexane, 1,2-ethylenedioxy-bis (3,4-epoxycyclohexylmethane), 4 ', 5'-epoxy-2'-methylcyclohexylmethyl- 4,5-epoxy-2-methylcyclohexanecarboxylate, ethylene glycol-bis (3,4-epoxycyclohexanecarboxylate), bis- (3,4-epoxycyclohexylmethyl) adipate, and bis (2,3-epoxycyclopentyl) ) Ether can be mentioned .
As the cross-linking agent, only one compound can be used, or two or more compounds can be used in combination.

The adhesive composition of the present invention can contain a crosslinking catalyst. By using a crosslinking catalyst, the reaction of the crosslinkable compound is promoted.
Examples of crosslinking catalysts include p-toluenesulfonic acid, trifluoromethanesulfonic acid, methanesulfonic acid, pyridinium-p-toluenesulfonic acid, salicylic acid, camphorsulfonic acid, sulfosalicylic acid, citric acid, benzoic acid, and hydroxybenzoic acid. Compounds can be used.
An aromatic sulfonic acid compound can be used as the crosslinking catalyst. Specific examples of the aromatic sulfonic acid compound include p-toluenesulfonic acid, pyridinium-p-toluenesulfonic acid, sulfosalicylic acid, 4-chlorobenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, benzenedisulfonic acid, and 1-naphthalenesulfonic acid. And pyridinium-1-naphthalenesulfonic acid.

When a crosslinking agent having an epoxy group is used, a phenol resin, an amine, a polyamide resin, an imidazole, a polymercaptan, an acid anhydride, or the like can be used as a crosslinking catalyst.
Examples of the phenol resin include phenol novolac resin and cresol novolac resin.
Examples of amines include piperidine, N, N-dimethylpiperazine, triethylenediamine, 2,4,6-tris (dimethylaminomethyl) phenol, benzyldimethylamine, 2- (dimethylaminomethyl) phenol, diethylenetriamine, and triethylenetetramine. , Tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperazine, di (1-methyl-2-aminocyclohexyl) methane, mensendiamine, isophoronediamine, diaminodicyclohexylmethane, 1,3-diaminomethylcyclohexane, xylene Examples include diamine, metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone. Among these, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperazine, di (1-methyl-2-aminocyclohexyl) methane, mensendiamine, isophoronediamine, diaminodicyclohexylmethane, etc. Can be preferably used.
The polyamide resin is produced by condensation of dimer acid and polyamine, and includes a polyamide amine having a primary amine and a secondary amine in the molecule.
Examples of imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, epoxy imidazole adduct, and the like.
Examples of the polymercaptan include those having a mercaptan group at the end of a polypropylene glycol chain and those having a mercaptan group at the end of a polyethylene glycol chain.
The acid anhydride is preferably an anhydride of a compound having a plurality of carboxyl groups in one molecule. These acid anhydrides include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol trislimitate, maleic anhydride, tetrahydrophthalic anhydride, methyl Tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride, methyl Examples include cyclohexene dicarboxylic acid anhydride and chlorendic acid anhydride.
Other crosslinking catalysts include organic phosphorus compounds such as triphenylphosphine and tributylphosphine, quaternary phosphonium salts such as ethyltriphenylphosphonium bromide, diethyl tetrabutylphosphonium dithiophosphate, 1,8-diazabicyclo (5, Quaternary ammonium salts such as 4,0) undecan-7-ene, 1,8-diazabicyclo (5,4,0) undecan-7-ene and octyl acid, zinc octylate, tetrabutylammonium bromide It is done.

In the case of using a crosslinking agent having an allyl group, for example, a radical polymerization initiator and a cationic polymerization initiator can be used as a curing catalyst.
Examples of radical polymerization initiators include imidazole compounds, diazo compounds, bisimidazole compounds, N-aryl glycine compounds, organic azide compounds, titanocene compounds, aluminate compounds, organic peroxides, N-alkoxypyridinium salt compounds, and thioxanthone compounds. Etc.
Examples of organic azide compounds include p-azidobenzaldehyde, p-azidoacetophenone, p-azidobenzoic acid, p-azidobenzalacetophenone, 4,4′-diazidochalcone, 4,4′-diazidodiphenyl sulfide, and 2 , 6-bis (4′-azidobenzal) -4-methylcyclohexanone and the like.
Examples of the diazo compound include 1-diazo-2,5-diethoxy-4-p-tolylmercaptobenzeneborofluoride, 1-diazo-4-N, N-dimethylaminobenzene chloride, and 1-diazo-4-N, Examples thereof include N-diethylaminobenzeneborofluoride.
Examples of the bisimidazole compound include 2,2′-bis (o-chlorophenyl) -4,5,4 ′, 5′-tetrakis (3,4,5-trimethoxyphenyl) 1,2′-bisimidazole, and 2 , 2'-bis (o-chlorophenyl) 4,5,4 ', 5'-tetraphenyl-1,2'-bisimidazole and the like.
As titanocene compounds, dicyclopentadienyl-titanium-dichloride, dicyclopentadienyl-titanium-bisphenyl, dicyclopentadienyl-titanium-bis (2,3,4,5,6-pentafluorophenyl) Dicyclopentadienyl-titanium-bis (2,3,5,6-tetrafluorophenyl), dicyclopentadienyl-titanium-bis (2,4,6-trifluorophenyl), dicyclopentadienyl -Titanium-bis (2,6-difluorophenyl), dicyclopentadienyl-titanium-bis (2,4-difluorophenyl), bis (methylcyclopentadienyl) -titanium-bis (2,3,4, 5,6-pentafluorophenyl), bis (methylcyclopentadienyl) -titanium-bis (2,3,5,6-tetrafluoro Enyl), bis (methylcyclopentadienyl) -titanium-bis (2,6-difluorophenyl), and dicyclopentadienyl-titanium-bis (2,6-difluoro-3- (1H-pyrrol-1-) Yl) -phenyl) and the like.
As the radical polymerization initiator, 1,3-di (tert-butyldioxycarbonyl) benzophenone, 3,3 ′, 4,4′-tetrakis (tert-butyldioxycarbonyl) benzophenone, 3-phenyl-5 -Isoxazolone, 2-mercaptobenzimidazole, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-benzyl-2-dimethylamino-1- ( 4-morpholinophenyl) -butanone and the like can be mentioned.

Examples of the cationic polymerization initiator include sulfonic acid ester, sulfonimide compound, disulfonyldiazomethane compound, dialkyl-4-hydroxysulfonium salt, arylsulfonic acid-p-nitrobenzyl ester, silanol-aluminum complex, (η6-benzene) (η5 -Cyclopentadienyl) iron (II) and the like.
Examples of the sulfonimide compound include N- (trifluoromethanesulfonyloxy) succinimide, N- (nonafluoro-normalbutanesulfonyloxy) succinimide, N- (camphorsulfonyloxy) succinimide, N- (trifluoromethanesulfonyloxy) naphthalimide, and the like. Is mentioned.
Examples of the disulfonyldiazomethane compound include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, and bis (2,4-dimethylbenzenesulfonyl). ) Diazomethane, methylsulfonyl-p-toluenesulfonyldiazomethane, and the like.
Examples of the cationic polymerization initiator may include 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one.
In addition, aromatic iodonium salt compounds, aromatic sulfonium salt compounds, aromatic diazonium salt compounds, aromatic phosphonium salt compounds, triazine compounds and iron arene complex compounds are used as radical polymerization initiators and cationic polymerization initiators. be able to.
Aromatic iodonium salt compounds include diphenyliodonium hexafluorophosphate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoro-normal butanesulfonate, diphenyliodonium perfluoro-normaloctanesulfonate, diphenyliodonium camphorsulfonate, bis (4-tert- Examples thereof include butylphenyl) iodonium camphorsulfonate and bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate.
Examples of the aromatic sulfonium salt compound include triphenylsulfonium hexafluoroantimonate, triphenylsulfonium nonafluoronormal butane sulfonate, triphenylsulfonium camphorsulfonate, triphenylsulfonium trifluoromethanesulfonate, and the like.
Only 1 type can be used for a crosslinking catalyst and it can also be used in combination of 2 or more type.

  The crosslinking catalyst is 0 to 10 parts by mass, or 0.01 to 10 parts by mass, or 0.05 to 8 parts by mass, or 0.1 to 5 parts by mass, or 0.3 to 3 parts by mass, or It can be used at 0.5 to 1 part by mass.

  Moreover, as a to-be-adhered object used for this invention, a silicon substrate, a glass substrate, a resin substrate, and a ceramic substrate can be illustrated, for example. These substrates can be used as a support for the laminate of the present invention.

  Examples of the adherend used in the present invention include inorganic materials such as silicon, silicon oxide, glass, and silicon nitride, metal materials such as aluminum and copper, polyamide resin, polyimide resin, epoxy resin, polyacrylic acid resin, and polymethacrylic resin. Examples thereof include resin materials such as acid resins, polybenzoxazole resins, polyhydroxystyrene resins, and benzocyclobutene resins.

The adhesive composition can be dissolved using an organic solvent for spin coating. As long as the polymer is dissolved in an organic solvent and the solution viscosity is in the range of 0.001 to 5000 Pa · s, the polymer solution can be used as a coating solution exhibiting spin coating properties.
The organic solvent is not particularly limited as long as it is a solvent that can be used in other semiconductor processes; ketones such as cyclohexanone, methyl isoamyl ketone, and 2-heptanone; ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, Polyhydric alcohols such as propylene glycol, propylene glycol monoacetate, dipropylene glycol or dipropylene glycol monoacetate, such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether and their derivatives; cyclic such as dioxane Ethers; and methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, Methyl acid, are preferably used esters such as ethyl ethoxypropionate. These may be used alone or in combination of two or more.

In the adhesive composition according to the present embodiment, a miscible additive, for example, an additional resin or an adhesive for improving the performance of the adhesive, as long as the essential characteristics of the present invention are not impaired. Commonly used agents such as an imparting agent, a plasticizer, an adhesion aid, a stabilizer, a colorant, and a surfactant can be added.
Additional resins (polymers) for improving adhesive performance include addition polymerization of polyester, polystyrene, polyimide, acrylic polymer, methacrylic polymer, polyvinyl ether, phenol novolac, naphthol novolac, polyether, polyamide, polycarbonate, etc. Polymers or polycondensation polymers can be used. A polymer having an aromatic ring structure such as a benzene ring, naphthalene ring, anthracene ring, triazine ring, quinoline ring and quinoxaline ring is preferably used.
Examples of such additional resin (polymer) include benzyl acrylate, benzyl methacrylate, phenyl acrylate, naphthyl acrylate, anthryl methacrylate, anthryl methyl methacrylate, styrene, hydroxystyrene, benzyl vinyl ether, and N-phenylmaleimide. Examples include addition polymerization polymers containing an addition polymerizable monomer as a structural unit, and condensation polymerization polymers such as phenol novolac and naphthol novolak.
Further, as the additional resin (polymer), a polymer having no aromatic ring structure can be used. Examples of such a polymer include only addition polymerizable monomers having no aromatic ring structure such as alkyl acrylate, alkyl methacrylate, vinyl ether, alkyl vinyl ether, acrylonitrile, maleimide, N-alkyl maleimide, and maleic anhydride. An addition polymerization polymer containing as a structural unit is mentioned.
When an addition polymerization polymer is used as the additional resin (polymer), the polymer may be a homopolymer or a copolymer. An addition polymerizable monomer is used for the production of the addition polymerization type polymer. Examples of such addition polymerizable monomers include acrylic acid, methacrylic acid, acrylic ester compounds, methacrylic ester compounds, acrylamide compounds, methacrylamide compounds, vinyl compounds, styrene compounds, maleimide compounds, maleic anhydride, and acrylonitrile. Can be mentioned.
As acrylic ester compounds, methyl acrylate, ethyl acrylate, normal hexyl acrylate, isopropyl acrylate, cyclohexyl acrylate, benzyl acrylate, phenyl acrylate, anthryl methyl acrylate, 2-hydroxyethyl acrylate, 3-chloro-2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2-trichloroethyl acrylate, 2-bromoethyl acrylate, 4-hydroxybutyl acrylate, 2-methoxyethyl acrylate, tetrahydrofurfuryl acrylate, 2-methyl-2-adamantyl acrylate, 5-acryloyloxy-6-hydroxynorbornene-2- Rubokishirikku 6- lactone, 3-acryloxypropyl triethoxysilane, and the like, such as glycidyl acrylate.
Methacrylic acid ester compounds include methyl methacrylate, ethyl methacrylate, normal hexyl methacrylate, isopropyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, phenyl methacrylate, anthryl methyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2,2, 2-trifluoroethyl methacrylate, 2,2,2-trichloroethyl methacrylate, 2-bromoethyl methacrylate, 4-hydroxybutyl methacrylate, 2-methoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, 2-methyl-2-adamantyl methacrylate, 5 -Methacryloyloxy-6-hydroxynorbornene-2-carboxy Click-6-lactone, 3-methacryloxypropyl triethoxysilane, glycidyl methacrylate, 2-phenylethyl methacrylate, hydroxyphenyl methacrylate, and bromophenyl methacrylate.
Examples of the acrylamide compound include acrylamide, N-methylacrylamide, N-ethylacrylamide, N-benzylacrylamide, N-phenylacrylamide, N, N-dimethylacrylamide, and N-anthrylacrylamide.
Examples of the methacrylamide compound include methacrylamide, N-methyl methacrylamide, N-ethyl methacrylamide, N-benzyl methacrylamide, N-phenyl methacrylamide, N, N-dimethyl methacrylamide, and N-anthryl acrylamide. It is done.
Examples of vinyl compounds include vinyl alcohol, 2-hydroxyethyl vinyl ether, methyl vinyl ether, ethyl vinyl ether, benzyl vinyl ether, vinyl acetic acid, vinyl trimethoxysilane, 2-chloroethyl vinyl ether, 2-methoxyethyl vinyl ether, vinyl naphthalene, and vinyl anthracene. Is mentioned.
Examples of the styrene compound include styrene, hydroxystyrene, chlorostyrene, bromostyrene, methoxystyrene, cyanostyrene, and acetylstyrene.
Examples of the maleimide compound include maleimide, N-methylmaleimide, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, and N-hydroxyethylmaleimide.

The molecular weight of the additional resin (polymer) used in the adhesive composition of the present invention is, for example, 1000 to 1000000, or 3000 to 300000, for example, 5000 to 200000, as a weight average molecular weight. Or 10,000 to 100,000.
When an additional resin (polymer) is included in the adhesive composition of the present invention, the content thereof is, for example, 0 to 40% by mass, 0 to 20% by mass, or 1 to 19% by mass.

The tackifier is added for controlling the elastic modulus, viscosity control, and surface state of the adhesive layer. The type of tackifier is preferably determined in consideration of the viscosity of the adhesive layer. Specifically, aliphatic petroleum resins, aromatic petroleum resins, aliphatic / aromatic copolymer petroleum resins, fats Cyclic hydrogenated petroleum resin, alkylphenol resin, xylene resin, coumarone indene resin, terpene resin, terpene phenol resin, aromatic modified terpene resin, hydrogenated terpene resin, rosin resin, hydrogenated rosin resin, disproportionation One type or a combination of two or more types of rosin resin, dimerized rosin resin, esterified rosin resin and the like can be mentioned. The tackifier can be contained in a proportion of 0 to 100 parts by weight with respect to 100 parts by weight of the polyether which is the main component of the adhesive composition.
Therefore, the amount of the tackifier added is more preferably in the range of 0 to 100 parts by weight, and still more preferably in the range of 0 to 50 parts by weight.

The present invention also relates to a laminate comprising at least two adherends and an adhesive layer formed from the adhesive composition of the present invention provided between the adherends.
The present invention includes a step of applying the adhesive composition of the present invention on a first adherend by spin coating and baking at 50 to 300 ° C. to form an adhesive layer, and the second adhesive layer is formed through the formed adhesive layer. By the method including the step of bonding the adherend to the first adherend, a laminate of the adherend can be obtained. Furthermore, the process of processing the to-be-adhered layer of a laminated body can be included.
Further, a step of forming an adhesive layer on the second adherend, a step of adhering the third adherend to the second adherend through the formed adhesive layer, and bonding as necessary The laminated body which consists of a several to-be-adhered thing and the contact bonding layer formed among them can also be formed by repeating the process of processing the to-be-adhered article layer obtained by this.
In the present invention, the thickness of the adhesive applied to the semiconductor wafer by spin coating can be 0.1 μm or more and 200 μm or less. If the thickness is less than 0.1 μm, the surface irregularities cannot be followed and voids may be formed during bonding, and if it is more than 200 μm, cracks may occur in the adhesive layer. More preferably, the thickness of the adhesive layer is 1 μm to 50 μm.

The Example which confirmed the characteristic of the adhesive composition which concerns on this invention below is demonstrated.
However, the present invention is not limited to this embodiment.
The GPC analysis of the polymer compound obtained in the synthesis example described below was performed according to the following measurement conditions using the following apparatus.
Apparatus: Integrated high-speed GPC system HLC-8220GPC manufactured by Tosoh Corporation Column: KF-G, KF804L
Column temperature: 40 ° C
Solvent: THF
Flow rate: 1.0 mL / min Standard sample: Polystyrene Detector: R1

Synthesis example 1
In a flask equipped with a stirrer, a reflux device, a thermometer, and a dropping tank, 20.10 g of 4,4′-dichlorodiphenyl-sulfone, 24.77 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, potassium carbonate 29.02 g and N-methyl-2-pyrrolidinone 369.50 g were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 1 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyether ether sulfone (corresponding to the formula (1-1)) used in the present invention. When the GPC analysis of the obtained aromatic polyether was conducted, the weight average molecular weight was 18600 in standard polystyrene conversion.

Synthesis example 2
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 68.20 g of 4,4′-dichlorodiphenyl-sulfone, 84.06 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, potassium carbonate 103.68 g and N-methyl-2-pyrrolidinone 456.98 g were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. Thereafter, a sample prepared by dissolving 32.83 g of 4-fluorobenzene trifluoride in 160.48 g of N-methyl-2-pyrrolidinone as a capping agent was dropped, and the mixture was further stirred for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 100 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid at a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain a product obtained by capping the aromatic polyether used in the present invention with a substituent. When the GPC analysis of the obtained aromatic polyether ether sulfone (equivalent to Formula (1-1)) was performed, the weight average molecular weight was 17000 in standard polystyrene conversion.

Synthesis example 3
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 16.37 g of 4,4′-dichlorodiphenyl-sulfone, 9.97 g of tert-butylhydroquinone, 24.90 g of potassium carbonate, N-methyl-2- 79.04 g of pyrrolidinone was added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. Thereafter, a sample prepared by dissolving 7.90 g of 4-fluorobenzene trifluoride in 28.94 g of N-methyl-2-pyrrolidinone as a capping agent was dropped, and the mixture was further stirred for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain a product obtained by capping the aromatic polyether used in the present invention with a substituent. When the GPC analysis of the obtained aromatic polyether ether sulfone (equivalent to Formula (1-2)) was performed, the weight average molecular weight was 14800 in standard polystyrene conversion.

Synthesis example 4
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 13.64 g of 4,4′-dichlorodiphenyl-sulfone, 13.42 g of 1,1-bis (4-hydroxyphenyl) cyclohexane, potassium carbonate 20. 78 g and 81.23 g of N-methyl-2-pyrrolidinone were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. Thereafter, a sample prepared by dissolving 6.55 g of 4-fluorobenzene trifluoride in 28.75 g of N-methyl-2-pyrrolidinone was added dropwise and further stirred for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyether (capped with a substituent) used in the present invention. The obtained aromatic polyether When GPC analysis of ether sulfone (corresponding to the formula (1-3)) was performed, the weight average molecular weight was 14600 in terms of standard polystyrene.

Synthesis example 5
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 13.64 g of 4,4′-dichlorodiphenyl-sulfone, 8.41 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, 2, 2-bis (4-hydroxyphenyl) propane 5.71 g, potassium carbonate 34.56 g, and N-methyl-2-pyrrolidinone 83.44 g were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. Thereafter, a sample prepared by dissolving 6.56 g of 4-fluorobenzene trifluoride in 29.56 g of N-methyl-2-pyrrolidinone was added dropwise and further stirred for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain a product obtained by capping the aromatic polyether used in the present invention with a substituent. When GPC analysis of the obtained aromatic polyether ether sulfone (corresponding to the formula (1-4)) was performed, the weight average molecular weight was 17700 in terms of standard polystyrene.

Synthesis Example 6
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 13.64 g of 4,4′-dichlorodiphenyl-sulfone, 8.41 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, tert- 4.16 g of butylhydroquinone, 34.55 g of potassium carbonate, and 78.95 g of N-methyl-2-pyrrolidinone were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. Thereafter, a sample prepared by dissolving 6.56 g of 4-fluorobenzene trifluoride in 28.06 g of N-methyl-2-pyrrolidinone was added dropwise, and the mixture was further stirred for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain a product obtained by capping the aromatic polyether used in the present invention with a substituent. When GPC analysis of the obtained aromatic polyether ether sulfone (corresponding to the formula (1-5)) was performed, the weight average molecular weight was 17300 in terms of standard polystyrene.

Synthesis example 7
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 94.26 g of 4,4′-difluorobenzophenone, 44.88 g of tert-butylhydroquinone, 33.52 g of methylhydroquinone, 82.10 g of potassium carbonate, N— 764.27 g of methyl-2-pyrrolidinone was added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 140 ° C. and reacted for 20 hours. The synthesized aromatic polyetheretherketone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water, and vacuum-dried at 85 ° C. for 1 day to obtain a product obtained by capping the aromatic polyether used in the present invention with a substituent. When the GPC analysis of the obtained aromatic polyetheretherketone (corresponding to the formula (1-6)) was performed, the weight average molecular weight was 15200 in terms of standard polystyrene.

Synthesis Example 8
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 14.07 g of 4,4′-dichlorodiphenylsulfone, 8.40 g of 1,1-bis (4-hydroxyphenyl) hexafluoropropane, 1,1 -6.71 g of bis (4-hydroxyphenyl) cyclohexane, 20.75 g of potassium carbonate, and 87.68 g of N-methyl-2-pyrrolidinone were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, the mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyether ether sulfone (corresponding to the formula (1-7)) used in the present invention. When the GPC analysis of the obtained aromatic polyether was conducted, it was the weight average molecular weight 43000 in standard polystyrene conversion.

Synthesis Example 9
In a flask equipped with a stirrer, a reflux condenser, a thermometer, and a dropping tank, 74.19 g of 4,4′-difluorobenzophenone, 94.14 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, and trimethylhydroquinone 18. 26 g, potassium carbonate 60.81 g, and N-methyl-2-pyrrolidinone 742.22 g were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 140 ° C. and reacted for 20 hours. The synthesized aromatic polyetheretherketone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyetheretherketone (corresponding to the formula (1-8)) used in the present invention. When the GPC analysis of the obtained aromatic polyether was conducted, it was the weight average molecular weight 24700 in standard polystyrene conversion.

Synthesis Example 10
In a flask equipped with a stirrer, a refluxer, a thermometer, and a dropping tank, 40.42 g of 4,4′-difluorobenzophenone, 73.97 g of 2,2-bis (4-hydroxyphenyl) hexafluoropropane, 2,2- Bis (4-hydroxy-3,5-dihydroxymethylphenyl) propane (4.03 g), potassium carbonate (32.01 g), and N-methyl-2-pyrrolidinone (752.16 g) were added. Thereafter, the inside of the flask was purged with nitrogen, and then heated to 140 ° C. and reacted for 20 hours. The synthesized aromatic polyetheretherketone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyether ether ketone (corresponding to the formula (1-9)) used in the present invention. When the GPC analysis of the obtained aromatic polyether was conducted, it was weight average molecular weight 19000 in standard polystyrene conversion.

Comparative Synthesis Example 1
In a flask equipped with a stirrer, a refluxer, a thermometer and a dropping tank, 12.00 g of 4,4′-dichlorodiphenyl-sulfone, 12.56 g of 2,2-bis (4-hydroxyphenyl) propane, potassium carbonate; 37 g and N-methyl-2-pyrrolidinone 82.61 g were added, and then the atmosphere in the flask was replaced with nitrogen, and then heated to 160 ° C. and reacted for 20 hours. The synthesized aromatic polyether ether sulfone is cooled to room temperature and then filtered to collect the filtrate, which is mixed with 30 ml of a mixture of N-methyl-2-pyrrolidinone and 2 mol / l hydrochloric acid having a volume ratio of 90:10. I let you. Thereafter, this mixed solution was poured into methanol for reprecipitation purification.
Thereafter, the obtained precipitate was washed with methanol and water and vacuum-dried at 85 ° C. for 1 day to obtain an aromatic polyether ether sulfone (corresponding to the formula (2-1)) used in Comparative Example 1. When the GPC analysis of the obtained aromatic polyether was conducted, it was 16700 in weight average molecular weight in standard polystyrene conversion.

Comparative Synthesis Example 2
Polymethyl methacrylate (manufactured by Wako Pure Chemical Industries, Ltd.), which is an acrylic resin synthesized as a commercial product, was prepared.

(Solvent solubility evaluation)
(1) Propylene glycol monomethyl ether (PGME) and (2) as solvents for the aromatic polyether obtained from Synthesis Examples 1 to 10 and Comparative Synthesis Example 1 and 5 parts by mass of the acrylic resin of Comparative Synthesis Example 2, respectively. Propylene glycol monomethyl ether acetate (PGMEA), (3) ethyl lactate (EL), (4) cyclohexanone (Cy), (5) N-methyl-2-pyrrolidinone (NMP), (6) dimethylacetamide (DMAC), ( 7) 4-methyl 2-pentanone (MIBK), (8) 5-methyl-2-hexanone (MIAK), (9) ethyl acetoacetate (EAA), (10) gamma butyl lactone (GBL), (11) cyclo Pentanone (Cp) was added at a ratio of 95 parts by mass to evaluate the solubility.
The results are shown in Table 1. ○ is dissolved, Δ is slightly dissolved, and × is insoluble.

    The aromatic polyethers obtained from Synthesis Examples 1 to 10 showed the same solubility as the acrylic resin used as Comparative Synthesis Example 2, and higher solubility than the polysulfone obtained in Comparative Synthesis Example 1.

(Heat resistance evaluation)
Regarding the heat resistance of the aromatic polyether obtained from Synthesis Examples 1 to 10 and Comparative Synthesis Example 1 and the polymethyl methacrylate used as Comparative Synthesis Example 2 TG-DTA (Bulker AXS, TG / DTA2010SR) The temperature was raised at 10 ° C./min and the temperature at which a weight loss of 5 mass% was produced was evaluated. The results are shown in Table 2.

  As for the aromatic polyethers of Synthesis Examples 1 to 10 used in the present invention, the 5% by weight weight loss temperature is 450 ° C. or more as in the case of the aromatic polyether of Comparative Synthesis Example 1, and the acrylic resin of Comparative Synthesis Example 2 High heat resistance was shown in comparison.

(Adjustment of adhesive composition)
Using the aromatic polyethers obtained from Synthesis Examples 1 to 10 and Comparative Synthesis Example 1 and the acrylic resin of Comparative Synthesis Example 2, adhesive compositions were prepared with the following compositions, respectively.

Example 1
The aromatic polyether obtained from Synthesis Example 1 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 2
The aromatic polyether obtained from Synthesis Example 2 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 3
The aromatic polyether obtained from Synthesis Example 3 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 4
The aromatic polyether obtained from Synthesis Example 4 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 5
The aromatic polyether obtained from Synthesis Example 5 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 6
The aromatic polyether obtained from Synthesis Example 6 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 7
The aromatic polyether obtained from Synthesis Example 7 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 8
The aromatic polyether obtained from Synthesis Example 8 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 9
The aromatic polyether obtained from Synthesis Example 9 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 10
The aromatic polyether obtained from Synthesis Example 10 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

Example 11
5 mass% of Cymel 303 (crosslinking agent) was dissolved in cyclohexanone with respect to the aromatic polyether obtained from Synthesis Example 10 to prepare an adhesive composition containing 20 mass% as a solid content.

Example 12
5% by mass of Pine Crystal KE100 (plasticizer, manufactured by Arakawa Chemical Industry Co., Ltd., trade name, component: esterified rosin resin) with respect to the aromatic polyether obtained from Synthesis Example 7 was dissolved in cyclohexanone and solid An adhesive composition containing 20% by mass was prepared.

Comparative Example 1
The aromatic polyether obtained from Comparative Synthesis Example 1 was dissolved in N-methyl-2-pyrrolidinone to prepare an adhesive composition containing 10% by mass as a solid content.

Comparative Example 2
The polymethylmethacrylate of Comparative Synthesis Example 2 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content.

(Applicability evaluation)
The adhesive compositions obtained in Examples 1 to 12, Comparative Example 1 and Comparative Example 2 were each spin-coated on a silicon wafer under application conditions of 1000 rpm for 30 seconds, and baked at 100 ° C. and 250 ° C. for 2 minutes each. The film formed by performing the evaluation was evaluated. The results are shown in Table 3.

  The adhesive composition prepared in Comparative Example 1 was poor in coating and could not form a uniform film, whereas the aromatic polyether adhesive composition prepared in Examples 1 to 12 of the present invention. The adhesive composition of the acrylic resin used as Comparative Example 2 and the product was able to form a uniform film of 1 μm or more.

(Adhesion evaluation)
The adhesive compositions obtained in Examples 1 to 12 and Comparative Examples 1 and 2 were applied on a silicon wafer at 1000 rpm for 30 seconds and then baked at 100 ° C. and 250 ° C. for 2 minutes, respectively. A coating film was formed on each silicon wafer. This silicon wafer was cut into 2 cm squares, placed on a glass wafer that had been allowed to stand in advance on a 270 ° C. hot plate, the coated surface was faced down, and pressure-bonded from above to evaluate the adhesion. The results are shown in Table 4. The case where it adhered without a void (hole) in the state seen from the glass wafer surface was made favorable.

    The adhesive composition obtained in Comparative Example 1 had poor adhesion and could not be uniformly bonded, whereas the adhesive compositions of Examples 1 to 12 of the present invention and Comparative Example 2 The adhesive composition showed good adhesion.

(Preparation of adhesive strength evaluation sample)
Samples for evaluating the adhesive strength of the aromatic polyether prepared in Synthesis Example 7 and Synthesis Example 9 and the acrylic resin of Comparative Synthesis Example 2 were prepared by the following method.

Example 13
The aromatic polyether obtained from Synthesis Example 7 was dissolved in cyclohexanone to prepare an adhesive composition containing 27% by mass as a solid content. The obtained adhesive composition was spin-coated on a 4-inch silicon wafer for 60 seconds under a coating condition of 1500 rpm, and baked at 100 ° C. and 230 ° C. for 2 minutes each to form a film having a thickness of 5.5 μm. Formed. Then, using a bonding apparatus (Ayumi Kogyo Co., Ltd., VJ-300), a silicon wafer is formed into a 4-inch glass wafer through a film under the conditions of a vacuum of 10 Pa or less, a temperature of 250 ° C., and a bonding pressure of 300 kg. Glued. The wafer was cut into 1 cm square by a dicing apparatus (DAD321, manufactured by DISCO Corporation) to prepare a sample.

Example 14
The aromatic polyether obtained from Synthesis Example 9 was dissolved in cyclohexanone to prepare an adhesive composition containing 27% by mass as a solid content. The obtained adhesive composition was spin-coated on a 4-inch silicon wafer for 60 seconds under application conditions of 1500 rpm, and baked at 100 ° C. and 230 ° C. for 2 minutes each, and a film thickness of 4.9 μm. Formed. Then, using a bonding apparatus (Ayumi Kogyo Co., Ltd., VJ-300), a silicon wafer is formed into a 4-inch glass wafer through a film under the conditions of a vacuum degree of 10 Pa or less, a temperature of 270 ° C., and a bonding pressure of 300 kg. Glued. The wafer was cut into a 1 cm square dicing device (DAD321, manufactured by DISCO Corporation) to prepare a sample.

Comparative Example 3
The acrylic resin of Comparative Synthesis Example 2 was dissolved in cyclohexanone to prepare an adhesive composition containing 20% by mass as a solid content. The obtained adhesive composition was spin-coated on a 4-inch silicon wafer for 60 seconds under a coating condition of 1300 rpm, and baked for 2 minutes each at 100 ° C. and 200 ° C. to form a film having a thickness of 5.0 μm. Formed. Then, using a bonding apparatus (Ayumi Kogyo Co., Ltd., VJ-300), a silicon wafer is formed into a 4-inch glass wafer through a film under conditions of a vacuum of 10 Pa or less, a temperature of 270 ° C., and a bonding pressure of 400 kg. Glued. The wafer was cut into 1 cm square using a dicing saw (manufactured by DISCO Corporation, DAD321) to prepare a sample.

(Adhesive strength evaluation 1)
Araldite 2014 (trade name, manufactured by Huntsman Advanced Materials Co., Ltd.) was applied to both surfaces of the adhesive strength evaluation samples obtained in Example 13 and Example 14 and Comparative Example 3, and was used exclusively for adhesive strength (shear) measurement. After both surfaces were bonded to the jig, the adhesive force (shear) was evaluated with an autograph (manufactured by Shimadzu Corporation, Autograph AGS-100NX). The adhesive force was measured at a pulling speed of 1 mm / min. The results are shown in Table 5.

  In Table 5, an adhesive strength value of 1000 N or more indicates that the adhesive strength measuring instrument is at least the measurement limit.

  The samples obtained in Example 13 and Example 14 showed higher adhesion than the sample obtained in Comparative Example 3.

(Adhesive strength evaluation 2)
The adhesive strength evaluation samples obtained in Examples 13 and 14 and Comparative Example 3 were allowed to stand on a hot plate heated to 350 ° C. for 1 hour, and Araldite 2014 (Huntsman Advanced Materials Co., Ltd., product name) was applied, and both sides were bonded to a dedicated jig for measuring adhesive shear force, and then the adhesive strength (shear) was evaluated by Autograph (manufactured by Shimadzu Corporation, Autograph AGS-100NX). . The adhesive force was measured at a pulling speed of 1 mm / min. The results are shown in Table 6.

    In Table 6, an adhesive strength value of 1000 N or more indicates that the adhesive strength measuring instrument is at least the measurement limit.

  The samples obtained in Example 13 and Example 14 maintained high adhesive strength, whereas the sample obtained in Comparative Example 3 had reduced adhesive strength.

  It can be easily dissolved in various organic solvents to form a sufficiently thick adhesive layer with good coatability, and the adhesive layer can be thermally weighted in high-temperature processes such as metal bump bonding, CVD, and ion diffusion processes. It is possible to obtain a high heat-resistant adhesive composition with very little reduction and good adhesion.

Claims (16)

Following formula (1):

(In the formula, X represents a sulfonyl group or a carbonyl group, Ar ¹ and Ar ² each represent an arylene group having 6 to 30 carbon atoms, and T ¹ represents a fluoroalkylene group, a cyclic alkylene group, or an arylene group having a substituent. Or a combination of an arylene group which may have a substituent and a fluoroalkylene group or a cyclic alkylene group.) An adhesive composition comprising a polymer comprising a unit structure represented by: The adhesive composition according to claim 1, wherein the arylene group is a phenylene group, a naphthylene group, or an anthrylene group. The adhesive composition according to claim 1 or 2, wherein the polymer is a homopolymer having one type of unit structure. The adhesive composition according to claim 1 or 2, wherein the polymer is a copolymer having at least two types of unit structures. Ar ¹ and Ar ² are each represented by the following formula (2):

(Wherein R ¹ is an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group) A group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n1 represents an integer of 0 to 4). The adhesive composition of any one of Claims 1 thru | or 4 containing the polymer containing the unit structure represented. Unit structure wherein T ¹ is represented by the above formula is a group represented by the following formula (3) (1), wherein T ¹ is the above formula (1) is a group represented by the following formula (4) The adhesive composition of any one of Claims 1 thru | or 5 containing the polymer containing the unit structure represented or the combination of those unit structures.

(Wherein R ² , R ³ and R ⁴ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, A nitro group, an acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, and n2, n3, and n4 each represent an integer of 0 to 4. T ² is an integer of 0 to 4. Represents a fluoroalkylene group, a cyclic alkylene group, or a combination thereof.) In the formula (3) include a group having a R ² are at least tertiary carbon structures, n2 adhesive composition according to claim 6 which is an integer of 1 to 4. Furthermore, Formula (5):

(Wherein X represents a sulfonyl group or a carbonyl group, Ar ³ and Ar ⁴ each represent an arylene group having 6 to 30 carbon atoms, and T ³ represents an alkylene group, a sulfonyl group, a carbonyl group, or 6 to 6 carbon atoms) The adhesive composition according to any one of claims 1, 2, and 4 to 7, comprising a polymer comprising a unit structure represented by 30 arylene groups or a combination thereof. object. The adhesive composition according to claim 8, wherein the arylene group is a phenylene group, a naphthylene group, or an anthrylene group. Said T ³ is represented by formula (6):

Wherein R ⁵ and R ⁶ are each an alkyl group having 1 to 10 carbon atoms, a fluoroalkyl group having 1 to 4 carbon atoms, a hydroxyl group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, acyl group, an acyloxy group, a carboxyl group, a group having a tertiary carbon structure, a cyclic alkyl group, or a combination thereof, n5 and n6 each represent an integer of 0 to 4, T ⁴ is an alkylene group, a sulfonyl group , A carbonyl group, an arylene group having 6 to 30 carbon atoms, or a combination thereof.) The adhesive composition according to claim 8 or 9. The adhesive composition according to any one of claims 1 to 10, wherein the group having a tertiary carbon structure is a tertiary butyl group. The adhesive composition according to any one of claims 1 to 11, wherein the polymer has a weight average molecular weight of 500 to 5000000. The adhesive composition according to claim 1, further comprising a crosslinking agent. The adhesive composition according to any one of claims 1 to 13, further comprising a solvent and having a viscosity of 0.001 to 5000 Pa · s. 15. An adhesive layer of 0.1 μm to 200 μm formed from the adhesive composition according to claim 1 provided between at least two adherends and the adherends. Laminated body. The laminate according to claim 15, wherein the adherends are each selected from the group consisting of a silicon substrate, a glass substrate, a resin substrate, and a ceramic substrate.