JPWO2010070715A1 - Power supply - Google Patents

Abstract

The casing 2 of the power supply device 1 includes a front panel 21 having a suction port 33, a rear panel 22, two side panels 23 and 24, a bottom plate 25, a top plate 26 having an exhaust port 36, and front and rear The partition plate 28 is used. The front / rear partition plate 28 partitions the space in the housing 2 into a front-side space 30 and a rear-side space 31, and a front / rear vent 32 that connects the spaces 30 and 31 is formed. The power supply device 1 includes a capacitor 56, a heat sink 52 in which a cooling hole 53 is formed in the front side space 30, and a semiconductor element 51 disposed on the surface of the heat sink 52. Further, the power supply device 1 includes an exhaust device 81 that can exhaust the air in the back side space 31 to the outside of the housing 2 and a guide member 91 that communicates one opening of the front and rear vents 32 and the cooling hole 53.

Description

  The present invention relates to a power supply device including an electrical component such as a semiconductor element or a capacitor in a housing.

  A conventional power supply device has a plurality of power conversion units arranged side by side in a vertical direction in a casing standing up with respect to a floor surface. The power conversion unit includes a plurality of semiconductor elements and electronic components such as a plurality of electrolytic capacitors mounted in a plane on a base that is horizontal to the floor surface.

Since these electronic components generate heat during operation of the power supply device, the electronic components are cooled by flowing cooling air in a plane on the power conversion unit by a fan attached to the housing (for example, , See Patent Document 1). The semiconductor element is generally mounted via a heat sink in which a cooling hole through which cooling air generated by a fan can pass is formed in order to improve heat dissipation.
JP-A-11-27930

  In the power supply device described above, since the flow resistance of the cooling hole of the heat sink is large, the cooling air generated by the fan is difficult to pass through the cooling hole of the heat sink. Therefore, the cooling effect of the semiconductor element mounted on the heat sink is low.

  In the power supply device described above, electronic components such as semiconductor elements and electrolytic capacitors are highly required to be maintained, but these electronic components are mounted in a plane on a base that is horizontal to the floor surface. Therefore, workability at the time of maintenance is low.

  In order to solve the above-described problem, a power supply device according to the present invention is a power supply device including a housing that stands up with respect to a floor surface, and an air inlet that can suck air outside the housing into the housing is formed. A front panel, a rear panel disposed opposite to the front panel, two side panels forming a cylinder together with the front panel and the rear panel, and a space in the housing on the front side A front and rear partition plate arranged to partition the space and the rear side space, and formed with front and rear vents communicating the front side space and the rear side space; A housing having a top plate formed with an exhaust port above the side space, an exhaust device disposed at the exhaust port and capable of exhausting the air in the back side space out of the housing, and the front side of the front and rear partition plates Arranged vertically along the surface of the A plurality of capacitors and the front and rear vents along the surface on the front side of the front and rear partition plates are disposed between the front and rear vents and the capacitor, and pass through the interior from the capacitor side toward the front and rear vents. A heat sink in which a cooling hole is formed; a plurality of semiconductor elements arranged in a vertical direction along a surface on the front side of the heat sink; the front and rear vents; and the opening on the front and rear vent side of the cooling hole And a guide member that communicates with each other.

  According to the present invention, the air in the front space passes through the cooling hole of the heat sink and flows into the back space, so that the semiconductor element can be efficiently cooled. In addition, since the semiconductor element and the electrolytic capacitor that are highly required for maintenance are arranged in the front side space, the workability during maintenance can be improved.

It is the perspective view of the front side of the power supply device which concerns on the 1st Embodiment of this invention, Comprising: It is the figure which abbreviate | omitted the electrical wiring and showed the state which removed the front panel. It is the perspective view of the back side of FIG. 1, Comprising: It is the figure which showed the state which removed the back panel. It is the typical front view of FIG. 1, Comprising: A part of front panel is notched and it is the figure which showed the flow of the main air. It is the IV-IV arrow line view of FIG. It is the front view side perspective view of the power supply device which concerns on the 2nd Embodiment of this invention, Comprising: It is the figure which abbreviate | omitted the electrical wiring and showed the state which removed the front panel. FIG. 6 is a perspective view of the back side of FIG. 5, showing a state in which the back panel is removed. FIG. 6 is a schematic front view of FIG. 5, showing a main air flow with a part of the front panel cut away. It is a VIII-VIII arrow line view of FIG. It is the figure which showed the power supply device which concerns on the 3rd Embodiment of this invention, Comprising: It is the figure which showed the cross section with FIG. It is the figure which showed the power supply device which concerns on the 4th Embodiment of this invention, Comprising: It is the figure which showed the cross section similar to FIG. It is the figure which showed the power supply device which concerns on the 5th Embodiment of this invention, Comprising: It is the figure which showed the cross section similar to FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Power supply device, 2 ... Housing, 3 ... Floor surface, 21 ... Front panel, 22 ... Rear panel, 23, 24 ... Side panel, 25 ... Bottom plate, 26 ... Top plate, 27 ... Vertical partition plate, 28 ... Front and rear Partition plate, 29 ... upper space, 30 ... front side space, 31 ... back side space, 32 ... front and rear vents, 33 ... intake ports, 34 ... lattices, 35 ... legs, 36 ... exhaust ports, 37 ... legs, DESCRIPTION OF SYMBOLS 51 ... Semiconductor element, 52 ... Heat sink, 53 ... Cooling hole, 54 ... Opening part on the front and rear vent side of cooling hole, 55 ... Opening part on the electrolytic capacitor side of cooling hole, 56 ... Electrolytic capacitor, 57 ... Main body of electrolytic capacitor 58, electrolytic capacitor terminal, 59 ... support member, 61 ... AC reactor, 62 ... DC reactor, 63 ... control transformer, 64 ... support plate, 71 ... circuit breaker, 72 ... filter capacitor, 73 ... main circuit connection Conductor, 81 ... exhaust equipment , 82 ... Fan, 91 ... guide member, 92 ... standing plate, 93 ... end plate, 94 ... parallel plate

(First embodiment)
A power supply device according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the front side of the power supply device according to the first embodiment of the present invention, in which electrical wiring is omitted and the front panel is removed. FIG. 2 is a perspective view of the back side of FIG. 1 and shows a state in which the back panel is removed. FIG. 3 is a schematic front view of FIG. 1, in which a part of the front panel is cut away to show the main air flow. 4 is a view taken in the direction of arrows IV-IV in FIG.

  The power supply device 1 according to the first embodiment of the present invention is configured by mounting electrical components such as a semiconductor element 51 and an electrolytic capacitor 56 in a housing 2. This mounting structure is a main feature of the power supply device 1.

  First, the structure of the housing 2 will be described. The housing 2 stands upright with respect to the floor surface 3 on which the power supply device 1 is installed, and a mounting space for electrical components is formed therein. The outer shape of the housing 2 is composed of a front panel 21 and a rear panel 22 facing each other, two side panels 23 and 24 facing each other, a bottom plate 25 and a top plate 26, and It is a rectangular parallelepiped extending vertically. The housing 2 has upper and lower partition plates 27 and front and rear partition plates 28 inside thereof.

  The upper and lower partition plates 27 are horizontally disposed in the housing 2 so as to partition the space in the housing 2 into upper and lower portions, and form an upper space and a lower space 29 in the housing 2. Upper and lower vents (not shown) are formed in a range in contact with the back side space 31 (described later) of the upper and lower partition plates 27. The lower space 29 and the back side space 31 are provided with the upper and lower vents. It communicates through the mouth.

  The front and rear partition plates 28 are arranged vertically in the upper space so as to partition the upper space back and forth, and form a front side space 30 and a rear side space 31 in the housing 2. Front and rear vents 32 are formed along the vertical direction on both sides in the width direction of the front and rear partition plates 28, and the front side space 30 and the rear side space 31 communicate with each other through the front and rear vents 32. ing.

  The front panel 21 is detachably attached to the housing 2 in consideration of convenience when mounting electrical components in the front space 30. The front panel 21 is formed with an air inlet 33 that opens from the lower part of the range in contact with the front side space 30 to the upper part of the range in contact with the lower space 29, so that the space outside the housing 2 and the front surface The side space 30 and the space outside the housing 2 and the lower space 29 communicate with each other through the intake port 33. A grid 34 for preventing electric shock is attached to the intake port 33.

  The back panel 22 is detachably attached to the housing 2 in consideration of convenience when mounting electrical components in the back space 31. The back panel 22 is made of a magnetic metal in order to suppress radiation noise from leaking outside the housing 2.

  Legs 35 are provided on the lower surface of the bottom plate 25, and the power supply device 1 is fixed to the floor 3 by bolting the legs 35 to the floor 3.

  An exhaust port 36 is formed in a range where the top plate 26 is in contact with the back side space 31, and the back side space 31 and the space outside the housing 2 communicate with each other through the exhaust port 36. .

  Next, a mounting structure for electrical components will be described. The power supply device 1 includes a semiconductor element 51, a heat sink 52, an electrolytic capacitor 54, an AC reactor 61, a DC reactor 62, a control transformer 63, a circuit breaker 71, a filter capacitor 72, and a main circuit connection conductor 73 in the housing 2.

  The semiconductor element 51, the heat sink 52 and the electrolytic capacitor 56 are accommodated in the front side space 30. The plurality of electrolytic capacitors 56 are arranged in the vertical direction at the center in the width direction of the front surface of the front and rear partition plates 28. 1 to 4, as an example, 24 electrolytic capacitors 56 are arranged in two rows. Each electrolytic capacitor 56 includes a cylindrical main body portion 57 and a terminal portion 58 protruding from one end surface thereof. The front and rear partition plates 28 are supported by a support member 59 so that the main body portion 57 stands up with respect to the front and rear partition plates 28. Is attached.

  The plurality of heat sinks 52 are arranged on the front surface side of the front and rear partition plates 28, and are arranged side by side in the vertical direction between the front and rear vent holes 32 and the plurality of electrolytic capacitors 54. In FIG. 1 to FIG. 4, as an example, eight heat sinks 52 are arranged in two rows between 24 electrolytic capacitors 54 and two front and rear vents 32. Each heat sink 52 is a plate-like body, and a plurality of cooling holes 53 penetrating the inside thereof in the surface direction are formed. Each heat sink 52 is arranged such that the cooling hole 53 extends in the width direction.

  The plurality of semiconductor elements 51 are arranged in the vertical direction on the front surface of the plurality of heat sinks 52. In FIG. 1 to FIG. 4, as an example, 16 semiconductor elements 51 are arranged in two rows on 8 heat sinks 52. Heat generated from the semiconductor element 51 is radiated mainly through the heat sink 52.

  The AC reactor 61, the DC reactor 62, and the control transformer 63 are accommodated in the back space 31. The plurality of AC reactors 61 are installed on the upper and lower partition plates 27. A support plate 64 is provided above the plurality of AC reactors 61. The support plate 64 is attached to the side panels 23 and 24 so as to be horizontal to the floor surface 3. The plurality of DC reactors 62 and the plurality of control transformers 63 are disposed on the support plate 64.

  The circuit breaker 71, the filter capacitor 72 and the main circuit connection conducting wire 73 are accommodated in the lower space 29. The circuit breaker 71 is installed at the center of the bottom plate 25 in the front-rear direction. The filter capacitor 72 is installed on the back side of the bottom plate 25, and the main circuit connecting conductor 73 is installed on the front side of the bottom plate 25.

  Next, the exhaust device 81 and the guide member 91 will be described. The exhaust device 81 is attached to the top plate 26 so as to block the exhaust port 35 of the top plate 26. The exhaust device 81 includes a fan 82 that can exhaust the air in the back space 31 to the outside of the housing 2. That is, when the fan 82 rotates, the inside of the housing 2 becomes negative pressure, so that air outside the housing 2 flows into the housing 2 from the intake port 33, and air inside the housing 2 flows from the exhaust port 36. Discharged.

  The guide member 91 is a member that guides the air in the front side space 30 to the back side space 31 so that the air in the front side space 30 flows into the back side space 31 after passing through the cooling holes 53 of the heat sink 52.

  Specifically, the guide member 91 includes an upright plate 92, an end plate 93, and a parallel plate 94, and is attached to the front and rear partition plates 28. The upright plate 92 is a plate-like member that extends from the edge of the front and rear vent 32 far from the heat sink 52 to the front side by the thickness of the heat sink 52. The end plate 93 is a plate-like member that extends from the both vertical edges of the front and rear vents 32 to the front side by the thickness of the heat sink 52. The parallel plate 94 is a plate-like member that extends horizontally with respect to the front and rear partition plates 28 from the end edges of the upright plate 92 and the end plate 93 to the surface of the heat sink 52 on the semiconductor element 51 side.

  That is, the guide member 91 integrally covers the front and rear vent holes 32 and the opening 55 of the cooling hole 53 closer to the front and rear vent holes 32, and allows the front and rear vent holes 32 and the cooling hole 53 to communicate with each other. Due to the presence of the guide member 91, when the air in the front side space 30 flows into the back side space 31, it passes through the cooling holes 53.

  The flow of air in the housing 2 when the fan 82 is rotated will be described. The air outside the housing 2 passes through the air inlet 33 and enters the front side space 30 and the lower space 29 because the air inlet 33 opens from the lower part of the front side space 30 to the upper part of the lower space 29. It flows in at the same time.

  The air in the front side space 30 moves to the back side space 31 through the front and rear vents 32 because the back side space 31 has a negative pressure. Here, due to the presence of the guide member 91, the air in the front side space 30 flows into the back side space 31 after passing through the cooling holes 53 of the heat sink 52. When passing through the cooling hole 53, it enters the cooling hole 53 from the opening on the electrolytic capacitor 56 side (opening closer to the electrolytic capacitor 56) 54 and opens on the front and rear vent 32 side (front and rear vent 32. (Outside opening portion) 55 exits from the cooling hole 53.

  That is, the air in the front space 30 gathers in the opening 54 on the electrolytic capacitor 56 side, and at that time, the adjacent electrolytic capacitor 56 is cooled (see FIG. 3). Further, the air toward the rear side space 31 cools the semiconductor element 51 through the heat sink 52 by passing through the cooling holes 53 of the heat sink 52.

  The air that has flowed into the back side space 31 from the front side space 30 rises while rotating in the back side space 31 and is exhausted outside the housing 2. Here, for example, when the rotation of the fan 82 is counterclockwise, the air in the rear side space 31 rises while rotating counterclockwise (see FIG. 4). At this time, the air in the back side space 31 cools the AC reactor 61, the DC reactor 62, and the control transformer 63 disposed in the back side space 31.

  On the other hand, the air in the lower space 29 moves to the back side space 31 through the upper and lower vents because the back side space 31 has a negative pressure. At this time, the air in the lower space 29 cools the circuit breaker 71 and the filter capacitor 72 arranged in the lower space 29.

  As described above, the air that has flowed into the back side space 31 from the lower space 29 rises while rotating in the back side space 31, cools the AC reactor 61, the DC reactor 62, and the control transformer 63, and out of the housing 2. Exhausted.

  Hereinafter, effects of the power supply device according to the first embodiment of the present invention will be described. According to this embodiment, the air in the front side space 30 passes through the cooling holes 53 of the heat sink 52 and flows into the back side space 31. Therefore, the semiconductor element 51 having a high necessity for cooling can be efficiently cooled. Further, since the air in the front side space 30 gathers in the opening 54 of the cooling hole 53 closer to the electrolytic capacitor 56, the electrolytic capacitor 56 adjacent to the opening 54 can be efficiently cooled.

  Further, the main air flowing into the front space 30 flows so as to cool the electrolytic capacitor 56, the semiconductor element 51, the AC reactor 61, the DC reactor 62, and the control transformer 63, so that the cooling efficiency of the entire power supply device can be improved. .

  Further, since air outside the housing 2 flows into the front side space 30 and the lower space 29 at the same time and each forms an independent flow path, the semiconductor element 51, the electrolytic capacitor 56, the circuit breaker 71, and the filter The condenser 72 can be cooled independently. Therefore, since the semiconductor element 51 and the electrolytic capacitor 56 are not cooled by the air after cooling the circuit breaker 71 and the filter capacitor 72, the semiconductor element 51 and the electrolytic capacitor 56 can be efficiently cooled. Or since the circuit breaker 71 and the filter capacitor 72 are not cooled by the air after cooling the semiconductor element 51 and the electrolytic capacitor 56, the circuit breaker 71 and the filter capacitor 72 can be efficiently cooled.

  Moreover, since the air in the back side space 31 rises while rotating, the AC reactor 61, the DC reactor 62, and the control transformer 63 can be efficiently cooled.

  According to the present embodiment, since the semiconductor element 51 and the electrolytic capacitor 56 that are extremely necessary for maintenance are arranged in the front side space 30, workability during maintenance is good. For the same reason, the workability at the time of assembling the power supply device 1 is also good.

  In addition, since the AC reactor 61, the DC reactor 62, and the control transformer 63 that generate radiation noise are arranged in the back surface space 31, leakage of radiation noise to the front surface side of the power supply device 1 can be suppressed. Furthermore, since the back panel 22 is made of a magnetic metal, leakage of radiation noise to the back side of the power supply device 1 can be suppressed.

  Furthermore, since the air inlet 33 is provided on the front panel and the air outlet 36 is provided on the top plate 26, a space for air intake and exhaust is not required, and the power supply device 1 is installed adjacent to other equipment and walls. it can. Moreover, since the housing | casing 1 is a rectangular parallelepiped extended in the up-down direction, the installation space of the power supply device 1 can be reduced.

(Second Embodiment)
A power supply device according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a perspective view of the front side of the power supply device according to the second embodiment of the present invention, in which the electrical wiring is omitted and the front panel is removed. 6 is a perspective view of the back side of FIG. 5 and shows a state in which the back panel is removed. FIG. 7 is a schematic front view of FIG. 5, in which a part of the front panel is cut away to show the main air flow. FIG. 8 is a view taken along arrow VIII-VIII in FIG. In addition, this embodiment is a modification of 1st Embodiment, Comprising: The same code | symbol is attached | subjected to the same part as 1st Embodiment, or a similar part, and duplication description is abbreviate | omitted.

  In the power supply device 1 according to the second embodiment of the present invention, the front and rear vents 32 are provided along the vertical direction on one side of the front and rear partition plate 28 in the width direction (the right end in FIGS. 5 and 7). Is formed.

  The plurality of electrolytic capacitors 54 are arranged in the vertical direction on the side surface (the left end portion in FIGS. 5 and 7) on the front surface of the front and rear partition plate 28 where the front and rear vent holes 32 are not formed. Has been placed. 5 to 7, as an example, eight electrolytic capacitors 54 are arranged in a line.

  The plurality of heat sinks 52 are on the front side surface of the front and rear partition plate 28 and between the front and rear vents 32 and the plurality of electrolytic capacitors 54 (the front side surface of the front and rear partition plate 28 and in the center in the width direction). Are arranged side by side in the vertical direction. In FIG. 1 to FIG. 4, as an example, four heat sinks 52 are arranged in a line between eight electrolytic capacitors 54 and one front and rear vent 32. For example, eight semiconductor elements 51 are arranged in a line on four heat sinks 52.

  The rotation direction of the fan 82 of the exhaust device 81 is such that the air immediately after passing through the front and rear vents 32 moves in the back side space 31 substantially perpendicularly (in the back direction) with respect to the front and rear partition plates 28. ing. Referring to FIG. 8, since the front / rear vent 32 is formed at the right end of the front / rear partition plate 28 in the width direction, the fan 82 rotates counterclockwise. Then, the air immediately after passing through the front and rear vents 32 moves in the back side space 31 substantially perpendicularly (in the back direction) with respect to the front and rear partition plates 28, and then rises while rotating counterclockwise.

  According to this embodiment, since the air in the back side space 31 rotates smoothly, the AC reactor 61, the DC reactor 62, and the control transformer 63 can be efficiently cooled.

(Third embodiment)
A power supply device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a view showing a power supply device according to the third embodiment of the present invention, and is a view showing a cross section with FIG. In addition, this embodiment is a modification of 1st Embodiment, Comprising: The same code | symbol is attached | subjected to the same part as 1st Embodiment, or a similar part, and duplication description is abbreviate | omitted.

  In the power supply device 1 according to the third embodiment of the present invention, notches are formed along the vertical direction on both sides in the width direction of the front and rear partition plates 28, and the notches and the side panels 23 and 24. The front and rear vents 32 are formed in the gap.

  The guide member 91 includes an end plate 93 and a parallel plate 94. The parallel plate 94 extends from the inner surfaces of the side panels 23 and 24 toward the surface of the heat sink 52 on the semiconductor element 51 side. Further, the end plate 93 extends from both vertical edges of the front and rear vents 32 to both vertical ends of the parallel plate 94.

  Also in this embodiment, the same effect as that of the power supply device 1 according to the first embodiment of the present invention can be obtained.

(Fourth embodiment)
A power supply device according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a view showing a power supply device according to the fourth embodiment of the present invention, and is a view showing a cross section similar to FIG. In addition, this embodiment is a modification of 1st Embodiment, Comprising: The same code | symbol is attached | subjected to the same part as 1st Embodiment, or a similar part, and duplication description is abbreviate | omitted.

  In the power supply device 1 according to the fourth embodiment of the present invention, the front and rear vents 32 are formed in the center in the width direction of the front and rear partition plates 28 along the vertical direction.

  The plurality of electrolytic capacitors 56 are arranged in two rows in the vertical direction at both ends in the width direction of the front surface of the front and rear partition plates 28. The plurality of heat sinks 52 are arranged in two lines in the vertical direction on the front surface of the front / rear partition plate 28 and between the front / rear vent 32 and the plurality of electrolytic capacitors 56.

  The guide member 91 includes an end plate 93 and a parallel plate 94. The parallel plate 94 extends across the surfaces of the two rows of the plurality of heat sinks 52 on the semiconductor element 51 side. Further, the end plate 93 extends from both vertical edges of the front and rear vents 32 to both vertical ends of the parallel plate 94.

  Also in this embodiment, the same effect as that of the power supply device 1 according to the first embodiment of the present invention can be obtained.

(Fifth embodiment)
A power supply device according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 11 is a view showing a power supply device according to the fifth embodiment of the present invention, and is a view showing a cross section similar to FIG. In addition, this embodiment is a modification of 1st Embodiment, Comprising: The same code | symbol is attached | subjected to the same part as 1st Embodiment, or a similar part, and duplication description is abbreviate | omitted.

  In the power supply device 1 according to the fifth embodiment of the present invention, the guide member 91 is formed integrally with the heat sink 52. Specifically, the parallel plate 94 is formed by extending the surface of the heat sink 52 on the semiconductor element 51 side in the side surface direction.

  According to the present embodiment, heat radiation can be performed not only in the heat sink 52 but also in the induction member 91, so that the heat radiation effect of the semiconductor element 51 can be improved.

(Other embodiments)
The above embodiments are merely examples, and the present invention is not limited thereto. For example, the number of electrical elements such as the semiconductor element 51 and the electrolytic capacitor 57 is not limited to the above embodiment. Moreover, you may combine the characteristic of each embodiment.

It is the perspective view of the front side of the power supply device which concerns on the 1st Embodiment of this invention, Comprising: It is the figure which abbreviate | omitted the electrical wiring and showed the state which removed the front panel. It is the perspective view of the back side of FIG. 1, Comprising: It is the figure which showed the state which removed the back panel. It is the typical front view of FIG. 1, Comprising: A part of front panel is notched and it is the figure which showed the flow of the main air. It is the IV-IV arrow line view of FIG. It is the front view side perspective view of the power supply device which concerns on the 2nd Embodiment of this invention, Comprising: It is the figure which abbreviate | omitted the electrical wiring and showed the state which removed the front panel. FIG. 6 is a perspective view of the back side of FIG. 5, showing a state in which the back panel is removed. FIG. 6 is a schematic front view of FIG. 5, showing a main air flow with a part of the front panel cut away. It is a VIII-VIII arrow line view of FIG. It is the figure which showed the power supply device which concerns on the 3rd Embodiment of this invention, Comprising: It is the figure which showed the cross section similar to FIG. It is the figure which showed the power supply device which concerns on the 4th Embodiment of this invention, Comprising: It is the figure which showed the cross section similar to FIG. It is the figure which showed the power supply device which concerns on the 5th Embodiment of this invention, Comprising: It is the figure which showed the cross section similar to FIG.

DESCRIPTION OF SYMBOLS 1 ... Power supply device, 2 ... Housing, 3 ... Floor surface, 21 ... Front panel, 22 ... Rear panel, 23, 24 ... Side panel, 25 ... Bottom plate, 26 ... Top plate, 27 ... Vertical partition plate, 28 ... Front and rear the partition plate, 29 ... lower side space, 30 ... front-side space, 31 ... rear-side space, 32 ... front-rear vents, 33 ... intake port, 34 ... grid, 35 ... leg portion, 36 ... exhaust port, 37 ... leg 51 ... Semiconductor element, 52 ... Heat sink, 53 ... Cooling hole, 54 ... Opening on the electrolytic capacitor side of the cooling hole, 55 ... Opening on the front and rear vent side of the cooling hole, 56 ... Electrolytic capacitor, 57 ... Electrolytic capacitor Main body part 58 ... Electrolytic capacitor terminal part 59 ... Support member 61 ... AC reactor 62 ... DC reactor 63 ... Control transformer 64 ... Support plate 71 ... Circuit breaker 72 ... Filter capacitor 73 ... Main circuit Connection lead, 81 ... exhaust equipment , 82 ... Fan, 91 ... guide member, 92 ... standing plate, 93 ... end plate, 94 ... parallel plate

Next, a mounting structure for electrical components will be described. The power supply device 1 includes a semiconductor element 51, a heat sink 52, an electrolytic capacitor 56 , an AC reactor 61, a DC reactor 62, a control transformer 63, a circuit breaker 71, a filter capacitor 72, and a main circuit connection conductor 73 in the housing 2.

The plurality of heat sinks 52 are arranged on the front surface side of the front and rear partition plates 28 and arranged in the vertical direction between the front and rear vent holes 32 and the plurality of electrolytic capacitors 56 . In FIG. 1 to FIG. 4, as an example, eight heat sinks 52 are arranged in two rows between 24 electrolytic capacitors 56 and two front and rear vents 32. Each heat sink 52 is a plate-like body, and a plurality of cooling holes 53 penetrating the inside thereof in the surface direction are formed. Each heat sink 52 is arranged such that the cooling hole 53 extends in the width direction.

Next, the exhaust device 81 and the guide member 91 will be described. The exhaust device 81 is attached to the top plate 26 so as to close the exhaust port 36 of the top plate 26. The exhaust device 81 includes a fan 82 that can exhaust the air in the back space 31 to the outside of the housing 2. That is, when the fan 82 rotates, the inside of the housing 2 becomes negative pressure, so that air outside the housing 2 flows into the housing 2 from the intake port 33, and air inside the housing 2 flows from the exhaust port 36. Discharged.

Further, since the air inlet 33 is provided on the front panel and the air outlet 36 is provided on the top plate 26, a space for air intake and exhaust is not required, and the power supply device 1 is installed adjacent to other equipment and walls. it can. Moreover, since the housing | casing 2 is a rectangular parallelepiped extended in the up-down direction, the installation space of the power supply device 1 can be reduced.

The plurality of electrolytic capacitors 56 are arranged in the vertical direction on the front surface of the front / rear partition plate 28 and on the side portion (the left end portion in FIGS. 5 and 7) where the front / rear vent holes 32 are not formed. Has been placed. 5 to 7, as an example, eight electrolytic capacitors 56 are arranged in a line.

The plurality of heat sinks 52 are on the front side surface of the front and rear partition plates 28 and between the front and rear vents 32 and the plurality of electrolytic capacitors 56 (the front side surfaces of the front and rear partition plates 28 and in the center in the width direction). Are arranged side by side in the vertical direction. 5 to 8 , as an example, four heat sinks 52 are arranged in a line between eight electrolytic capacitors 56 and one front and rear vent 32. For example, eight semiconductor elements 51 are arranged in a line on four heat sinks 52.

(Third embodiment)
A power supply device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a view showing a power supply device according to the third embodiment of the present invention, and is a view showing a cross section similar to FIG. In addition, this embodiment is a modification of 1st Embodiment, Comprising: The same code | symbol is attached | subjected to the same part as 1st Embodiment, or a similar part, and duplication description is abbreviate | omitted.

Claims (8)

A power supply device having a casing standing up against a floor surface,
A front panel formed with an air inlet capable of sucking air outside the housing into the housing;
A rear panel disposed opposite to the front panel;
Two side panels forming a cylinder with the front panel and the back panel;
A front and rear partition plate arranged to partition the space in the housing into a front side space and a back side space, and formed with front and rear vents communicating the front side space and the back side space;
A casing having a top plate disposed on the upper end surface of the cylindrical body and having a top plate formed with an exhaust port above the back side space;
An exhaust device disposed at the exhaust port and capable of exhausting the air in the back side space out of the housing;
A plurality of capacitors arranged in a vertical direction along the front surface of the front and rear partition plates;
A cooling hole is formed between the front and rear vents and the capacitor along the front surface of the front and rear partition plates, and passes through the interior from the capacitor side toward the front and rear vents. A heat sink,
A plurality of semiconductor elements arranged in a vertical direction along the front surface of the heat sink;
A guiding member communicating the front and rear vents with the opening on the front and rear vent side of the cooling hole;
A power supply device comprising: The power supply device according to claim 1, wherein the air in the front side space flows into the back side space after passing through the cooling hole and the front and rear vents. The power supply device according to claim 2, wherein a DC reactor, an AC reactor, and a control transformer are arranged in the back side space. The power supply device according to claim 3, wherein at least a part of the back panel is made of a magnetic metal. The casing has an upper and lower partition plate arranged to partition the space in the casing into an upper space and a lower space, and formed with upper and lower vents that communicate the back side space and the lower space. And
The front and rear partition plates are arranged to partition the upper space into a space and a lower space,
The power supply apparatus according to claim 2, wherein the air in the lower space flows through the upper and lower vents and flows into the rear side space. The power supply device according to claim 5, wherein a circuit breaker and a filter capacitor are arranged in the lower space. The power supply device according to claim 2, wherein the exhaust device includes a fan that can raise the air in the rear side space while rotating. The front and rear vents are formed only at one end in the width direction of the front and rear partition plates,
The power supply device according to claim 7, wherein the fan rotates so that air immediately after passing through the front and rear vents moves in the rear side space in the rear side space.

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