CN1798494A - Cooling apparatus for heat source of electronic product - Google Patents
Cooling apparatus for heat source of electronic product Download PDFInfo
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- CN1798494A CN1798494A CN 200410099039 CN200410099039A CN1798494A CN 1798494 A CN1798494 A CN 1798494A CN 200410099039 CN200410099039 CN 200410099039 CN 200410099039 A CN200410099039 A CN 200410099039A CN 1798494 A CN1798494 A CN 1798494A
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Abstract
The invention consists of: a heat sink connected to the heat source in the case; a first and a second heat pipes used for transferring the heat from one end to another end and absorbing the heat from the heat sink by using phase change of heat media in the pipe; a first and a second heat exchanging parts located near the case and connected to another end of the first and second heat pipes for use in receiving the heat transmission from heat pipes; and a first and a second heat dispersion fans located in the first and the second heat exchanging part and used for generating air flow passing through the case.
Description
[technical field]
The present invention is the relevant invention of electronic product, in more detail, is relevant invention for the cooling apparatus for heat source of the electronic product of generation heat in the cool electronic product course of action.
[background technology]
Recently, along with the Highgrade integration and the high temperatureization of the electronic product of computer and so on, the heat that the thermal source bulk storage is more, and because of this heat, there are more difficulty in the operation of electronic product and design.In order to address this problem, most electronic product uses the cooling device made from air-cooled type cooling device or heat pipe.The inside that Fig. 1 represents to have the electronic product-computer of air-cooled type cooling device constitutes exploded perspective view.
As shown in Figure 1, the computer outward appearance is formed by shell 1, and its inside is provided with various parts.The front of above-mentioned shell 1 is provided with front panel 3, forms the front appearance of computer with this.
The inside of above-mentioned shell 1 is provided with mainboard 5, and above-mentioned mainboard 5 is the plate devices with definite shape.Above-mentioned mainboard 5 is provided with central processing unit 7.Above-mentioned central processing unit 7 is the core component of computer as central calculating treatmenting equipment.Because of above-mentioned central processing unit 7 produces more heat in course of action,, utilize fin 8 for cooling off these.Above-mentioned fin 8 is positioned at the top of above-mentioned central processing unit 7.Above-mentioned fin 8 is that most the tabular cooling pins (PIN) of rectangle protrude formation at certain intervals.
Has cooling fan unit 9 above the above-mentioned fin 8.Above-mentioned cooling fan unit 9 ventilates, and forms and can make the heat of central processing unit 7 be arrived the outside by the heat exchange bulk storage that fin 8 carries out by the air-flow of above-mentioned fin 8.
Simultaneously, a side of above-mentioned shell 1 is formed with most ventilating openings 15, makes the inside and outside circulation of air of shell 1 abundant.Above-mentioned ventilating opening 15 becomes the passage of the circulation of air of above-mentioned shell 1 inside and outside, can be the inner heat delivered that takes place in the actions of computer process to outside.
But there are the following problems for above-mentioned prior art.
At first, above-mentioned cooling fan unit 9 makes air receive bulk storage after the heat delivered of thermal source-central processing units 7 bulk storages at fin 8.But because of above-mentioned cooling fan unit 9 rests on the inside of above-mentioned shell 1 by the air of fin 8, for these air by the outside of ventilating opening 15 bulk storages to shell 1, should use fan separately.That is, have such problem, shell 1 internal temperature is higher relatively, for reducing these temperature, should append and use a fan.
In addition, at existing thermal source cooling structure, the heat that thermal source-central processing unit 7 produces just is transferred to fin 8, and makes its fan unit 9 bulk storages that are cooled.Therefore, there is weak point in the thermal source of the integrated and high temperature electronic product of the relative altitude that needs are fully cooled off.So the heat of thermal source-central processing unit 7 fully bulk storage arrives the outside, and the destruction that may cause the action feature of central processing unit 7.
[summary of the invention]
Therefore, the objective of the invention is for solving the prior art problem of above-mentioned existence, is to be the thermal source of cooling down high-temperature electronic equipment more fully.
Other purpose of the present invention is the inside for the high heat insulationization electronic product of more abundant cooling.
Another other purpose of the present invention is, keeps functions of components before this, and it is used for heat insulation.
To achieve these goals, the present invention includes following part and constitute characteristics: the fin that is connected with thermal source of the present invention; Utilize the phase transformation of internal operation body, heat is transferred to the other end from an end, and at least more than one the heat pipe that disperses to transmit behind the heat of above-mentioned fin; Be connected with the other end of above-mentioned heat pipe respectively, receive heat delivered, and play at least more than one heat exchange department of heat-blocking action; Form heat emission fan unit by the air-flow of above-mentioned heat exchange department.
Above-mentioned heat exchange department is to be made of with most individual certain intervals laminations the heat radiation pin.
Above-mentioned heat exchange department is adjacent with the shell that constitutes the electronic product outward appearance, and above-mentioned heat emission fan unit connects above-mentioned shell, forms air-flow.
In above-mentioned heat emission fan unit, at least one is to play a part air is flowed to the shell inside and outside, and another heat emission fan unit plays a part to form the air-flow of other parts that are intended to cool off above-mentioned enclosure.
According to other characteristics of the present invention, parts are set and as described in the electronic product that constitutes, comprise that following part constitutes: the fin that is connected with thermal source that above-mentioned enclosure possesses as the enclosure that constitutes outward appearance of the present invention; Utilize the phase transformation of internal operation body, heat is transferred to the other end from an end, and disperse the 1st and the 2nd heat pipe that transmits behind the heat of above-mentioned fin; Be arranged on the adjacent locations with above-mentioned shell, and be connected with the 2nd heat pipe other end with the above-mentioned the 1st respectively, receive heat delivered, and play the 1st and the 2nd heat exchange department of heat-blocking action; Form air-flow, make this air-flow can be by the above-mentioned the 1st and the 1st and the 2nd heat emission fan unit of the 2nd heat exchange department by above-mentioned shell.
In the above-mentioned the 1st and the 2nd heat emission fan unit, one plays a part air is flowed to the shell inside and outside, and another heat emission fan unit plays a part to form the air-flow of other electronic unit that is intended to cool off above-mentioned enclosure.
Other electronic unit of the air-flow cooling that is formed with one in above-mentioned heat emission fan unit fan unit is power supply.
One in the above-mentioned heat exchange department is provided in a side of between above-mentioned other electronic unit and the shell, and the air-flow by forming with one in above-mentioned heat emission fan unit fan unit, carries out heat exchange.
More than the electronic product cooling apparatus for heat source of the present invention of Gou Chenging not only can not make the number of components of electronic product itself increase, the thermal source of cool electronic product more fully, and can relatively reduce the internal temperature of electronic product.
As mentioned above, the cooling apparatus for heat source of electronic product of the present invention constitutes the heat that thermal source is produced and is distributed to a plurality of heat exchange departments at fin, and it is transmitted respectively, and therefore, heat insulation area is wider relatively, can cool off the more thermal source of caloric value fully.
In addition, heat exchange department of the present invention is because of adjacent with the ventilating opening that is formed on shell, and the air of finishing exchange heat at heat exchange department can not be transferred to the inside of shell, can keep relatively low electronic product inner space temperature.
In addition,, can move other function, can reduce the parts-heat emission fan unit of electronic product relatively, also can obtain the effect of the noise that reduces cost and fan because of the heat emission fan that forms the air-flow by heat exchange department constitutes in the present invention.
[description of drawings]
Fig. 1 is the inner part notch exploded perspective view that constitutes of the general computer of expression.
Fig. 2 is the brief strabismus map that expression electronic product cooling apparatus for heat source embodiment of the present invention constitutes.
Fig. 3 is expression embodiment of the invention cooling apparatus for heat source is adopted state by electronic product a brief strabismus map.
Fig. 4 is the movement state diagram that the cooling apparatus for heat source action of the expression embodiment of the invention causes air-flow.
[embodiment]
Below with reference to accompanying drawings electronic product cooling apparatus for heat source embodiment of the present invention is elaborated.
Fig. 2 is the brief strabismus map that expression electronic product cooling apparatus for heat source embodiment of the present invention constitutes, and Fig. 3 is a state of representing that probably the cooling apparatus for heat source of the embodiment of the invention is adopted by electronic product.
According to these accompanying drawings, fin 30 and thermal source are connected as existing with central processing unit.That is, above-mentioned fin 30 is adjacent with thermal source or directly contact the heat of reception thermal source transmission.The above-mentioned fin 30 of the present invention pin (PIN) that do not dispel the heat, but can be formed with separately heat radiation pin.That is, can constitute by the heat radiation pin to a certain extent bulk storage be transferred to the heat of fin 30.Such fin should form with heat conductibility preferred metal material.
With the above-mentioned fin 30 of lateral direction penetrating, connect an end of the 1st and the 2nd heat pipe 31,32 respectively.The the above-mentioned the 1st and the 2nd heat pipe 31,32 has certain-length respectively, and utilizes the phase transformation of the moving body that its inside possesses, the transmission heat.That is, transmit heat to the other end from an end of above-mentioned heat pipe 31,32, but this embodiment from above-mentioned fin 30 to heat exchange department 35, the 37 transmission heats that the following describes.
The other end of the above-mentioned the 1st and the 2nd heat pipe 31,32 has the 1st and the 2nd heat exchange department 35,37 respectively.Above-mentioned heat exchange department the 35, the 37th, by most heat radiation pins lamination and forming at certain intervals, air can flow from a side direction opposite side.The heat radiation pin that constitutes above-mentioned heat exchange department 35,37 probably forms with shape, and relatively short upper and lower side is connected with adjacent heat radiation pin and constitutes.Certainly, air can and circulate from side direction opposite side perforation, and above-mentioned heat exchange department 35,37 constitutes also harmless in any form.
With the above-mentioned heat exchange department 35,37 of lateral direction penetrating, by the other end insertion of the above-mentioned the 1st and the 2nd heat pipe 31,32.Above-mentioned heat pipe 31,32 connects the heat radiation pin of above-mentioned heat exchange department 35,37, can transmit heat.So the heat of above-mentioned heat pipe 31,32 transmits to above-mentioned heat radiation pin.
Simultaneously, the above-mentioned the 1st and the 2nd heat exchange department 35,37 possesses the 1st and the 2nd heat emission fan unit 36,38 respectively.The air-flow that above-mentioned heat emission fan unit 36,38 forms by above-mentioned heat exchange department 35,37.When above-mentioned heat emission fan unit 36,38 forms by the air-flow of above-mentioned heat emission fan unit 36,38, also move other function.
To be described in more detail these below.The outward appearance of electronic product has shell 40 as shown in Figure 3, and not only is provided with cooling device of the present invention in above-mentioned shell 40 inside, also is provided with various parts.Form the ventilating opening 41 of its inside and outside air that is intended to circulate on the above-mentioned shell 40.Above-mentioned ventilating opening 41 forms as one with most in certain field of above-mentioned shell 40.This embodiment has 3 place's ventilating openings 41.
The inside of above-mentioned shell 40 has for driving the power supply that power supply is provided 50 of electronic product.More exactly, above-mentioned power supply 50 is switching mode power supply (SMPS).Above-mentioned power supply 50 produces more heat, for bulk storage these, above-mentioned shell 40 forms the cooled gas flow that is intended to that connects above-mentioned power supply 50.That is, by above-mentioned shell 40, air directly is transferred to above-mentioned power supply 50, and by power supply 50, to the outside exhaust of shell 40.
Here, the 1st heat exchange department 35 is attached to corresponding shell 40 inboards of the ventilating opening that forms with shell 40 back sides 41.In addition, the 1st heat emission fan unit 36 that possesses with above-mentioned the 1st heat exchange department 35 forms air-flow, and the air that makes above-mentioned shell 40 inside is to above-mentioned shell 40 flows outside.
Above-mentioned the 2nd heat exchange department 37 is attached to the inboard of the corresponding shell 40 of the ventilating opening that forms with a side of above-mentioned shell 40 41.Here, above-mentioned the 2nd heat exchange department 37 is between above-mentioned shell 40 1 sides and above-mentioned power supply 50 1 sides.Above-mentioned the 2nd heat exchange department 37 and form between shell 40 1 sides of above-mentioned ventilating opening 41 and have the 2nd heat emission fan unit 38.Above-mentioned the 2nd heat emission fan unit 38 makes it enter into above-mentioned power supply 50 by above-mentioned the 2nd heat exchange department 37 from the shell 40 outside air that absorb.
Simultaneously, by air process above-mentioned power supply 50 inside of above-mentioned the 2nd heat emission fan unit 38, also discharge to the outside of shell 40 by the ventilating opening 41 that is formed on above-mentioned shell 40 back sides from the outside absorption of shell 38.
Below, will describe the effect of the cooling apparatus for heat source of the above electronic product of the present invention that constitutes in detail.
If action, the just various parts of power drives that provide with above-mentioned power supply 50 are provided electronic product.That is the power drives that also provides of the above-mentioned the 1st and the 2nd heat emission fan unit 36,38, with power supply 50.
In addition, above-mentioned fin 30 receives the heat of thermal source transmission, with the end perforation of above-mentioned fin 30 and the 1st and the 2nd heat pipe 31,32 that inserts the heat of above-mentioned fin 30 is transferred to the above-mentioned the 1st and the 2nd heat exchange department 35,37 respectively respectively.That is, because of the other end of above-mentioned heat pipe 31,32 connects the above-mentioned the 1st and the 2nd heat exchange department 35,37, and exist and connect, the heat of above-mentioned fin 30 can be transferred to heat exchange department 35,37 respectively by each heat pipe 31,32.
Be transferred to of the driving of the heat of above-mentioned the 1st heat exchange department 35, be transferred to the outside with air-flow from the internal transmission of above-mentioned shell 40 to the outside because of above-mentioned the 1st heat emission fan unit 36.That is, cross in the process of above-mentioned the 1st heat exchange department 35, receive control transfer of heat, and, be transferred to the outside of shell 40 by above-mentioned ventilating opening 41 because of the air communication that above-mentioned heat emission fan unit 36 forms.
In addition, be transferred to the driving of the heat of above-mentioned the 2nd heat exchange department 37 because of above-mentioned the 2nd heat emission fan unit 38, the air-flow that absorbs with the outside from above-mentioned shell 40 transmits.Certainly, the air by above-mentioned the 2nd heat exchange department 37 is not the inside that enters shell 40, but is transferred to the inside of above-mentioned power supply 50.The air-flow that is transferred to above-mentioned power supply 50 inside is through above-mentioned power supply 50, and the ventilating opening 41 that the back side by shell 40 forms is discharged to the outside.
In addition, according to design condition, above-mentioned the 2nd heat exchange department 37 and the 2nd heat emission fan unit 38 also can be arranged between the back side of above-mentioned power supply 50 and shell 40.That is, finish the air communication of exchange heat in power supply 50 and cross in the process of the 2nd heat exchange department 37, can carry out exchange heat once more.
Right of the present invention is not limited to the embodiment of above explanation, but depends on the content of claim item, and the related work personnel can carry out various change and modification fully in the interest field that does not depart from the record of this invention claim item.
Such as, also can be set to more than 2 by heat exchange department.That is, can be set to more quantity to the heat exchange department that receives above-mentioned fin heat delivered by heat pipe, and connect each heat exchange department, the air-flow of formation is got final product through the heat emission fan unit that moves independent function than embodiment described above.
Claims (8)
1, electronic product cooling apparatus for heat source comprises:
The fin that is connected with thermal source;
Utilize the phase transformation of internal operation body, heat is transferred to the other end from an end, and what disperse to transmit behind the heat of above-mentioned fin is one heat pipe at least;
Be connected with the other end of above-mentioned heat pipe respectively, receive heat delivered, and what play heat-blocking action is one heat exchange department at least;
Can form heat emission fan unit by the air-flow of heat exchange department.
2, as the cooling apparatus for heat source of claim item 1 described electronic product, it is characterized in that,
Above-mentioned heat exchange department is to be made of with most certain intervals laminations the heat radiation pin.
3, as the cooling apparatus for heat source of claim item 2 described electronic products, it is characterized in that,
Above-mentioned heat exchange department is adjacent with the shell that constitutes the electronic product outward appearance, and above-mentioned heat emission fan unit connects above-mentioned shell, forms air-flow.
4, as the cooling apparatus for heat source of claim item 1 described electronic product, it is characterized in that,
At least one is to play a part air is flowed to the shell inside and outside in the above-mentioned heat emission fan unit, and another heat emission fan unit plays a part to form the air-flow that is intended to cool off above-mentioned other electronic unit of enclosure.
5, electronic product cooling apparatus for heat source comprises:
The fin that is connected with thermal source that above-mentioned enclosure possesses;
Utilize the phase transformation of internal operation body, heat is transferred to the other end from an end, and after disperseing the heat of above-mentioned fin, the 1st and the 2nd heat pipe that transmits;
Be arranged on the adjacent locations with above-mentioned shell, and be connected with the 2nd heat pipe other end with the above-mentioned the 1st respectively, receive heat delivered, and play the 1st and the 2nd heat exchange department of heat-blocking action;
Form air-flow, make this air-flow can be by the above-mentioned the 1st and the 1st and the 2nd heat emission fan unit of the 2nd heat exchange department by above-mentioned shell.
6, as claim item 5 described electronic product cooling apparatus for heat source, it is characterized in that,
One in the above-mentioned the 1st and the 2nd heat emission fan unit is to play a part air is flowed to the shell inside and outside;
All the other heat emission fan units play a part to form the air-flow that is intended to cool off above-mentioned other electronic unit of enclosure.
7, as claim item 6 described electronic product cooling apparatus for heat source, it is characterized in that,
In the above-mentioned heat emission fan unit one and other electronic unit of the air-flow cooling that forms is power supply.
8, as claim item 6 described electronic product cooling apparatus for heat source, it is characterized in that,
One in the above-mentioned heat exchange department is arranged between above-mentioned electronic unit and the shell, in above-mentioned heat emission fan unit one and the air communication that forms is out-of-date, carries out exchange heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410099039 CN1798494A (en) | 2004-12-27 | 2004-12-27 | Cooling apparatus for heat source of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410099039 CN1798494A (en) | 2004-12-27 | 2004-12-27 | Cooling apparatus for heat source of electronic product |
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| Publication Number | Publication Date |
|---|---|
| CN1798494A true CN1798494A (en) | 2006-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200410099039 Pending CN1798494A (en) | 2004-12-27 | 2004-12-27 | Cooling apparatus for heat source of electronic product |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102257711A (en) * | 2008-12-19 | 2011-11-23 | 东芝三菱电机产业系统株式会社 | Electric power source device |
| CN101902894B (en) * | 2008-12-10 | 2013-03-06 | 索尼株式会社 | Heat dissipating device for electronic apparatus, and electronic apparatus |
| CN109588015A (en) * | 2018-12-21 | 2019-04-05 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of distribution heat reservoir |
-
2004
- 2004-12-27 CN CN 200410099039 patent/CN1798494A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902894B (en) * | 2008-12-10 | 2013-03-06 | 索尼株式会社 | Heat dissipating device for electronic apparatus, and electronic apparatus |
| CN102257711A (en) * | 2008-12-19 | 2011-11-23 | 东芝三菱电机产业系统株式会社 | Electric power source device |
| CN109588015A (en) * | 2018-12-21 | 2019-04-05 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of distribution heat reservoir |
| CN109588015B (en) * | 2018-12-21 | 2020-12-29 | 中国航空工业集团公司西安航空计算技术研究所 | Distributed heat storage system |
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