JPWO2009093594A1 - Surface position detection apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The surface position of the test surface is detected with high accuracy without being affected by the fluctuation of the optical member. A reference member (9) having a reference surface (9a) provided in the vicinity of the test surface (Wa), and measurement light from the first pattern on the first pattern surface is guided to the test surface to form the first pattern. A light transmission optical system (5-8) that projects an intermediate image, guides the reference light from the second pattern on the second pattern surface to the reference surface, and projects the intermediate image of the second pattern, and is reflected by the test surface Receiving optical system that guides the measured light to the first observation surface to form an observation image of the first pattern, and guides the reference light reflected by the reference surface to the second observation surface to form the observation image of the second pattern (15-18) and the first position information of the first pattern observation image on the first observation plane and the second position information of the second pattern observation image on the second observation plane are detected, and the first position information and the first position information are detected. 2 Detection part (11-14; P which detects the surface position of a to-be-tested surface based on positional information ) And a.

Description

  The present invention relates to a surface position detection apparatus, an exposure apparatus, and a device manufacturing method for detecting a surface position of a surface to be measured.

  In an exposure apparatus that transfers a pattern formed on a mask onto a photosensitive substrate via a projection optical system, the projection optical system has a shallow depth of focus, and the transfer surface (exposure surface) of the photosensitive substrate is not flat. There is also. For this reason, in the exposure apparatus, it is necessary to accurately adjust the positioning of the transfer surface of the photosensitive substrate with respect to the imaging surface of the projection optical system.

  For example, a grazing incidence type autofocus sensor is known as a surface position detecting device for detecting the surface position of the photosensitive substrate (the surface position of the transfer surface) along the optical axis direction of the projection optical system (see Patent Document 1). ). In this oblique incidence type autofocus sensor, a slit image is projected from an oblique direction onto a photosensitive substrate as a test surface, and position information of the slit image formed by light reflected from the test surface is detected. The surface position of the photosensitive substrate is detected based on the position information.

JP-A-4-21015

  In the above-described grazing incidence type autofocus sensor, when a variation (position variation, refractive index variation, etc.) of an optical member in the optical system constituting the grazing incidence type autofocus sensor occurs, the optical axis direction of the projection optical system There is a problem that the surface position of the photosensitive substrate along the surface cannot be accurately detected.

  The present invention has been made in view of the above-described problems, and is a surface position detection apparatus, an exposure apparatus, and a device manufacturing device that can detect the surface position of a test surface with high accuracy without being affected by fluctuations in optical members. It aims to provide a method.

  In order to solve the above-described problem, in the surface position detection apparatus of the present invention, a reference member having a reference surface provided in the vicinity of the test surface, and measurement light from the first pattern on the first pattern surface are transmitted to the test target. Guide to the inspection surface and project the intermediate image of the first pattern onto the inspection surface, guide the reference light from the second pattern on the second pattern surface to the reference surface and the second light on the reference surface. A light transmission optical system for projecting an intermediate image of the pattern, and the measurement light reflected by the test surface is guided to a first observation surface to form an observation image of the first pattern on the first observation surface, A light receiving optical system that guides the reference light reflected by the reference surface to the second observation surface to form an observation image of the second pattern on the second observation surface, and observation of the first pattern on the first observation surface First position information of the image and the second pattern on the second observation surface Detecting a second position information of the observation image, and wherein a detection section for detecting a surface position of the test surface based on the first position information and second position information, further comprising: a.

  In the exposure apparatus of the present invention, in the exposure apparatus for transferring a pattern to a photosensitive substrate, the pattern surface on which the pattern is provided based on the surface position detection apparatus of the present invention and the detection result of the surface position detection apparatus. Or an alignment means for aligning at least one of the transfer surfaces of the photosensitive substrate, and the surface position detecting device determines at least one of the surface position of the pattern surface and the surface position of the transfer surface It is detected as a surface position of the surface to be measured.

  In the device manufacturing method of the present invention, using the above-described exposure apparatus of the present invention, an exposure step of transferring the pattern to the photosensitive substrate, and developing the photosensitive substrate to which the pattern has been transferred, form the pattern. It includes a developing step of forming a transfer pattern layer having a corresponding shape on the surface of the photosensitive substrate, and a processing step of processing the surface of the photosensitive substrate through the transfer pattern layer.

  In the surface position detection apparatus of the present invention, the reference light is guided to the second observation surface through the reference surface provided in the vicinity of the test surface and the optical member common to the measurement light. As a result, unlike the measurement light, the reference light does not include information regarding the movement of the test surface, but includes information regarding the influence of fluctuations in the optical member as with the measurement light. Therefore, for example, based on the positional deviation amount of the observation image of the reference light, it is possible to measure the detection error of the surface position of the test surface due to the fluctuation of the optical member.

  For this reason, in the surface position detection apparatus, the exposure apparatus, and the device manufacturing method of the present invention, the surface position of the surface to be measured is accurately determined based on the observation image detection result using the reference light and the observation image detection result using the measurement light. Can be detected.

It is a figure which shows schematically the structure of the exposure apparatus provided with the surface position detection apparatus concerning embodiment of this invention. It is a figure which shows the light transmission slit provided in the output surface of a pair of light transmission prism. It is a figure which shows the optical path between a pair of incident-light prisms. It is a figure which shows the light reception slit provided in the entrance plane of a pair of light reception prism. It is a figure which shows the structure which expand | deployed the optical path from a light transmission prism to a light reception prism linearly. It is a figure which shows the several light-receiving part provided in the detection surface of the photodetector. It is a figure which shows the structure of the modification provided with the light transmission pattern member which has a common pattern surface, and the observation member which has a common observation surface. It is a figure which shows the structure which expand | deployed the optical path from the light transmission prism to a light reception prism in the linear form in the modification of FIG. It is a figure which shows the example which uses a parallel plane board as a surface position correction member. It is a figure which shows the example which uses a declination prism as a surface position correction member. It is a figure which shows the example which uses a 3 times reflection type prism as a reference member. It is a figure which shows the example which uses a 1 time reflection type prism as a reference member. It is a figure which shows the example which illuminates separately the 1st pattern surface in which the light transmission slit for measurement light was formed, and the 2nd pattern surface in which the light transmission slit for reference light was formed. It is a flowchart which shows the manufacturing process of a semiconductor device. It is a flowchart which shows the manufacturing process of a liquid crystal device. It is a figure which shows another example using a 3 times reflection type prism as a reference member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source 2 Condenser lens 3, 4 Light transmission prism 5,7,15,17 Objective lens 6 Oscillation mirror 8,18 Incident prism 11 Photo detector 12 Relay lens 13,14 Light reception prism PR Signal processing part CR Control part R Reticle stage PL Projection optical system W Wafer WS Wafer stage

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a drawing schematically showing a configuration of an exposure apparatus provided with a surface position detection apparatus according to an embodiment of the present invention. In FIG. 1, the Z axis is set in the direction of the optical axis AX of the projection optical system PL, the X axis is set parallel to the paper surface of FIG. 1 in the plane perpendicular to the optical axis AX, and the Y axis is set perpendicular to the paper surface of FIG. is doing. In this embodiment, the surface position detection device of the present invention is applied to the detection of the surface position of the photosensitive substrate in the exposure apparatus.

  The illustrated exposure apparatus includes an illumination system IL that illuminates a reticle R as a mask on which a predetermined pattern is formed with illumination light (exposure light) emitted from an exposure light source (not shown). The reticle R is held parallel to the XY plane on the reticle stage RS. Reticle stage RS can be moved two-dimensionally along the XY plane by the action of a drive system (not shown), and its position coordinates are measured and controlled by a reticle interferometer (not shown). It is configured.

  The exposure light transmitted through the reticle R forms a reticle pattern image on the surface (transfer surface) Wa of the wafer W, which is a photosensitive substrate, via the projection optical system PL. The wafer W is held along the XY plane on the wafer stage WS. The wafer stage WS can be leveled (leveled), moved in the Z direction (focusing direction), moved two-dimensionally along the XY plane, and rotated around the Z axis by the action of a drive system (not shown). The position coordinates are measured and controlled by a wafer interferometer (not shown).

  In order to satisfactorily transfer the circuit pattern provided on the pattern surface of the reticle R to each exposure area on the transfer surface Wa of the wafer W, an image plane formed by the projection optical system PL is provided for each exposure area. It is necessary to align the current exposure area within the range of the focal depth width. For this purpose, after accurately detecting the position of each point in the current exposure area along the optical axis AX, that is, the surface position of the current exposure area, the leveling of the wafer stage WS and the Z direction are performed based on the detection result. Therefore, the wafer W may be leveled and moved in the Z direction.

  Therefore, the exposure apparatus of the present embodiment includes a surface position detection device for detecting the surface position of the exposure region. Referring to FIG. 1, the surface position detection apparatus of the present embodiment includes a light source 1 that supplies light used for the detection. In general, the surface of the wafer W, which is the test surface, is covered with a thin film such as a resist. Therefore, in order to reduce the influence of interference due to the thin film, the light source 1 is a white light source having a wide wavelength width (for example, a halogen lamp that supplies illumination light having a wavelength width of 600 to 900 nm, or illumination having a wide band similar to this. A xenon light source that supplies light is desirable. As the light source 1, a light emitting diode that supplies light in a wavelength band with low sensitivity to a resist can be used.

  The light from the light source 1 is incident on the light transmitting prism 3 for measurement light and the light transmitting prism 4 for reference light via the condenser lens 2. The light transmitting prisms 3 and 4 deflect the light from the condenser lens 2 in the −Z direction by refraction. On the exit surface (first pattern surface) 3a of the light transmission prism 3, for example, as shown in FIG. 2, a light transmission pattern having a plurality of light transmission slits S1 to S12 (first pattern) for measurement light is provided. ing. On the exit surface (second pattern surface) 4a of the light transmitting prism 4, for example, as shown in FIG. 2, a plurality of light transmitting slits S13 to S15 (second pattern) for reference light are provided.

  The exit surface 3a of the light transmission prism 3 and the exit surface 4a of the light transmission prism 4 are provided in parallel to each other. In FIG. 2, on the exit surface 3a, the y1 axis is set in a direction parallel to the Y axis of the overall coordinates, and the x1 axis is set in a direction orthogonal to the y1 axis.

  The light transmission slits S1 to S15 are rectangular (slit-shaped) light transmission portions that are elongated in an oblique direction, for example, 45 degrees with the x1 direction and the y1 direction, and the regions other than the light transmission slits S1 to S15 are light shielding portions. is there. The light transmission slits S1 to S12 for measurement light are arranged at a predetermined pitch along the x1 direction, and the light transmission slits S13 to S15 for reference light are spaced from the light transmission slits S1 to S12 for measurement light in the y1 direction. They are spaced apart and arranged at a predetermined pitch along the x1 direction.

  Further, the x1 coordinate of the light transmission slit S13 coincides with the x1 coordinate of the intermediate position between the light transmission slits S2 and S3, and the x1 coordinate of the light transmission slit S14 matches the x1 coordinate of the intermediate position between the light transmission slits S6 and S7. In addition, the x1 coordinate of the light transmission slit S15 coincides with the x1 coordinate of the intermediate position between the light transmission slits S10 and S11.

  The light source 1 and the condenser lens 2 constitute a collective illumination device that collectively illuminates the light transmission slits S1 to S12 for measurement light and the light transmission slits S13 to S15 for reference light. The light that has passed through the light transmission slits S1 to S12 is used as measurement light for detecting the surface position of the wafer W. The light that has passed through the light transmission slits S13 to S15 is used as reference light for measuring the detection error of the surface position detection device. Various modifications are possible with respect to the shape, number, arrangement, form, etc. of the light transmission slit, and various forms are possible with respect to the first pattern that defines the measurement light and the second pattern that defines the reference light.

  The measurement light that has passed through the light transmission slits S1 to S12 and the reference light that has passed through the light transmission slits S13 to S15 are incident on the second objective lens 5, the vibrating mirror 6 as scanning means, and the first objective lens 7. The light enters the prism 8. The second objective lens 5 and the first objective lens 7 cooperate to form an intermediate image of the light transmission slits S1 to S15 at a predetermined magnification. The vibrating mirror 6 is disposed at the front focal position of the first objective lens 7 and is configured to be rotatable around the Y axis as indicated by an arrow in FIG. The epi-illumination prism 8 is a columnar prism member having a parallelogram-shaped cross section along the XZ plane.

  The measurement light Lm incident on the incident surface 8a of the epi-prism 8 along the measurement optical path shown by the solid line in FIG. 3 is sequentially reflected by the reflecting surfaces 8b and 8c and translated in the Z direction, and then is viewed from the exit surface 8d. Along the measurement optical path (measurement optical path in the XZ plane) indicated by the solid line, the light beam enters the detection area A on the surface of the wafer W, that is, the transfer surface Wa as the test surface, from an oblique direction. This incident angle is set to a large angle of, for example, 80 degrees or more and less than 90 degrees. On the other hand, the reference light Lr incident on the incident surface 8a of the epi-prism 8 along the reference optical path indicated by the broken line in the figure is sequentially reflected by the reflecting surfaces 8b and 8c and translated in the Z direction, and then from the exit surface 8d. Along the reference light path (reference light path in the XZ plane) indicated by a broken line in the figure, the light enters the reflecting surface 9a on the surface of the plane mirror 9 from an oblique direction. This incident angle is set equal to the incident angle of the measurement light Lm with respect to the transfer surface Wa. In FIG. 3, the measurement optical path indicated by a solid line and the reference optical path indicated by a broken line are spaced apart in parallel not only in the Z direction but also in the Y direction.

  Thus, an intermediate image of the measurement light transmission slits S1 to S12 is projected onto the detection region A. That is, in the detection area A, twelve measurement light irradiation areas extending in an oblique direction that forms 45 degrees with the X direction and the Y direction corresponding to the light transmission slits S1 to S12 have a predetermined pitch along the X direction. Formed with. The center of each measurement light irradiation region corresponds to the detection point in the detection region A. Further, an intermediate image of the reference light transmitting slits S13 to S15 is projected onto the reflecting surface 9a of the flat mirror 9, and forms 45 degrees with the X direction and the Y direction corresponding to the transmitting slits S13 to S15. Three rectangular reference light irradiation regions that are elongated in the oblique direction are formed at a predetermined pitch along the X direction.

  Thus, the plane mirror 9 constitutes a reference member having a reflection surface 9a as a reference surface provided in the vicinity of the transfer surface Wa. Further, the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the incident prism 8 guide the measurement light from the light transmission slits S1 to S12 on the emission surface 3a to the transfer surface Wa and transmit the light transmission slit S1. The intermediate image of S12 is projected onto the transfer surface Wa, the reference light from the light transmission slits S13 to S15 on the exit surface 4a is guided to the reflection surface 9a, and the intermediate image of the light transmission slits S13 to S15 is projected onto the reflection surface 9a. The light transmission optical system is configured. Here, the exit surface 3a is disposed on the conjugate surface of the transfer surface Wa by the light transmission optical system or a surface in the vicinity thereof, and the exit surface 4a is on the conjugate surface of the reflection surface 9a by the light transmission optical system or a surface in the vicinity thereof. Has been placed.

  The measurement light Lm reflected by the transfer surface Wa and the reference light Lr reflected by the reflection surface 9a are incident on the incident light prism 18. The epi-illumination prism 18 is disposed at a position symmetrical to the epi-illumination prism 8 with respect to a predetermined YZ plane (for example, the YZ plane including the optical axis AX) and has a symmetric configuration. Specifically, the reflecting prism 18 has a configuration in which the reflecting prism 8 is inverted with respect to the exit surface 8d. Therefore, the measurement light Lm and the reference light Lr incident on the incident surface 18a of the epi-prism 18 are sequentially reflected by the reflecting surfaces 18b and 18c and translated in the Z direction, and then emitted from the exit surface 18d.

  Referring to FIG. 1, the measurement light emitted from the epi-illumination prism 18 enters the light-receiving prism 13 for measurement light via the first objective lens 17, the mirror 16, and the second objective lens 15. The reference light emitted from the incident light prism 18 enters the light receiving prism 14 for reference light via the first objective lens 17, the mirror 16, and the second objective lens 15. The first objective lens 17, the mirror 16, and the second objective lens 15 are related to a predetermined YZ plane (for example, a YZ plane including the optical axis AX), the first objective lens 7, the vibrating mirror 6, and the second objective lens 5. Are arranged at symmetrical positions and have symmetrical structures. However, unlike the vibration mirror 6, the mirror 16 is fixedly installed.

  The light receiving prisms 13 and 14 are disposed at symmetrical positions with respect to the light transmitting prisms 3 and 4 with respect to a predetermined YZ plane (for example, the YZ plane including the optical axis AX), and have symmetrical configurations.

  However, as shown in FIG. 4, twelve light receiving slits Sa1 to Sa12 corresponding to the light transmitting slits S1 to S12 are formed on the incident surface 13a of the light receiving prism 13 (the surface corresponding to the exit surface 3a of the light transmitting prism 3). Is provided. In addition, on the incident surface 14a of the light receiving prism 14 (the surface corresponding to the exit surface 4a of the light transmitting prism 4), as shown in FIG. 4, three light receiving slits Sa13 to Sa15 corresponding to the light transmitting slits S13 to S15 are provided. Is provided. In FIG. 4, on the incident surface 13a of the light receiving prism 13 parallel to the incident surface 14a of the light receiving prism 14, the y2 axis is in a direction parallel to the Y axis of the entire coordinates, and the x2 axis is orthogonal to the y2 axis on the incident surface 13a. It is set.

  The light receiving slits Sa <b> 1 to Sa <b> 15 are rectangular (slit-shaped) light transmitting portions that are elongated in an oblique direction forming 45 degrees with the x <b> 2 direction and the y <b> 2 direction, and regions other than the light receiving slits Sa <b> 1 to Sa <b> 15 are light shielding portions. The light receiving slits Sa1 to Sa12 are arranged at a predetermined pitch along the x2 direction, and the light receiving slits Sa13 to Sa15 are spaced apart from the light receiving slits Sa1 to Sa12 in the y2 direction, and at a predetermined pitch along the x2 direction. It is arranged.

  Observation images of the measurement light transmission slits S1 to S12 are formed on the incident surface 13a of the light receiving prism 13, and observation images of the reference light transmission slits S13 to S15 are formed on the incident surface 14a of the light reception prism 14. Is done. That is, on the incident surface 13a of the light receiving prism 13, twelve rectangular measurement observation images extending in an oblique direction that forms 45 degrees with the x2 direction and the y2 direction correspond to the light transmission slits S1 to S12. Are formed at a predetermined pitch. In addition, on the incident surface 14a of the light receiving prism 14, three rectangular reference observation images that are elongated in an oblique direction forming 45 degrees with the x2 direction and the y2 direction correspond to the light transmission slits S13 to S15. Are formed at a predetermined pitch.

  As described above, the incident-light prism 18, the first objective lens 17, the mirror 16, and the second objective lens 15 guide the measurement light reflected by the transfer surface Wa to the incident surface (first observation surface) 13a of the light receiving prism 13. Then, measurement observation images of the light transmission slits S1 to S12 are formed on the incident surface 13a, and the reference light reflected by the reflecting surface 9a is guided to the incident surface (second observation surface) 14a of the light receiving prism 14 and transmitted to the incident surface 14a. A light receiving optical system for forming reference observation images of the optical slits S13 to S15 is configured. That is, by this light receiving optical system and the above-described light transmitting optical system, the incident surface 13a is disposed on the conjugate surface of the exit surface 3a or a surface in the vicinity thereof via the transfer surface Wa, and the incident surface 14a is disposed on the reflective surface 9a. And disposed on the conjugate surface of the exit surface 4a or a surface in the vicinity thereof.

  FIG. 5 is a diagram schematically showing a configuration from the light source to the light receiving prism by linearly developing an optical path from the light transmitting prism to the light receiving prism. In FIG. 5, in order to facilitate understanding of the configuration from the light source 1 to the light receiving prisms 13, 14, a light transmission optical system including the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the incident prism 8. SL is simplified with one lens, and the light receiving optical system JL including the incident prism 18, the first objective lens 17, the mirror 16, and the second objective lens 15 is simplified with one lens, and the light transmitting optical system SL and the light receiving optics are simplified. Each optical path of the system JL is developed linearly.

  Referring to FIG. 1, the measurement light incident on the light receiving prism 13 passes through the light receiving slits Sa <b> 1 to Sa <b> 12, is deflected by a predetermined angle, and then exits from the light receiving prism 13. The reference light incident on the light receiving prism 14 passes through the light receiving slits Sa13 to Sa15, is deflected by a predetermined angle, and then is emitted from the light receiving prism 14. The measurement light and the reference light emitted from the light receiving prisms 13 and 14 are converted into conjugate images of observation images of the light transmitting slits S1 to S15 formed inside the light receiving slits Sa1 to Sa15 via the relay lens 12, respectively. It is formed on the detection surface 11 a of the photodetector 11.

  On the detection surface 11a of the photodetector 11, as shown in FIG. 6, 15 light receiving portions RS1 to RS15 include 12 light receiving slits Sa1 to Sa12 for measurement light and 3 light receiving slits for reference light. It is provided so as to correspond to Sa13 to Sa15. The light receiving units RS1 to RS15 receive light that has passed through the light receiving slits Sa1 to Sa15, respectively. That is, the twelve light receiving parts RS1 to RS12 receive the measurement light that has passed through the twelve light receiving slits Sa1 to Sa12 corresponding to the light sending slits S1 to S12, and the three light receiving parts RS13 to RS15 are the light sending slits S13. Reference light that has passed through the light receiving slits Sa13 to Sa15 corresponding to .about.S15 is received.

  The measurement observation images of the light transmission slits S1 to S12 move in the x2 direction with the movement of the transfer surface Wa along the Z direction. On the other hand, since the reference observation images of the light transmission slits S13 to S15 do not pass through the transfer surface Wa unlike the measurement observation images, they are not affected at all by the movement of the transfer surface Wa along the Z direction. Therefore, the light amount of the measurement light passing through the light receiving slits Sa1 to Sa12 changes according to the movement of the transfer surface Wa in the Z direction, but the light amount of the reference light passing through the light receiving slits Sa13 to Sa15 is changed in the Z direction movement of the transfer surface Wa. It is constant without dependence. In other words, the measurement light that has passed through the light receiving slits Sa1 to Sa12 includes information relating to the Z direction movement of the transfer surface Wa, while the reference light that has passed through the light receiving slits Sa13 to Sa15 is information relating to the Z direction movement of the transfer surface Wa. Is not included.

  In the surface position detection apparatus of the present embodiment, measurement observation images of the transmission slits S1 to S12 for measurement light are received by the light receiving slits Sa1 to Sa12 in a state where the transfer surface Wa coincides with the imaging surface of the projection optical system PL. The observation images of the reference light transmission slits S13 to S15 are formed at the positions of the light receiving slits Sa13 to Sa15. The detection signals of the light receiving units RS1 to RS15 change in synchronization with the vibration of the vibrating mirror 6 and are supplied to the signal processing unit PR.

  As described above, when the transfer surface Wa moves up and down in the Z direction along the optical axis AX of the projection optical system PL, the measurement observation image formed on the incident surface 13a of the light receiving prism 13 moves up and down on the transfer surface Wa. Correspondingly, positional deviation occurs in the pitch direction (x2 direction). In the signal processing unit PR, for example, based on the principle of the photoelectric microscope disclosed in Japanese Patent Application Laid-Open No. 6-97045 by the present applicant, the positional deviation amount of the measurement observation image is detected, and the detection region A is detected based on the detected positional deviation amount. The Z direction position of each detection point is calculated.

  However, as described above, for example, the transfer surface Wa coincides with the imaging surface of the projection optical system PL due to the position variation and refractive index variation of the optical member constituting the surface position detection device (in the best focus state). Nevertheless, the position of each measurement observation image formed on the incident surface 13a of the light receiving prism 13 may be displaced from the position of the corresponding light receiving slits Sa1 to Sa12. In this case, a detection error of the surface position of the transfer surface Wa occurs according to the amount of positional deviation from the light receiving slits Sa1 to Sa12 at the positions of the respective measurement observation images.

  In the surface position detection apparatus of the present embodiment, the reference light from the light transmission slits S13 to S15 is guided to the incident surface 14a of the light receiving prism 14 through the reflection surface 9a provided in the vicinity of the transfer surface Wa. A reference observation image is formed along an optical member common to the measurement light along the reference optical path close to the optical axis. Therefore, unlike the measurement light, the reference light does not include information regarding the movement of the transfer surface Wa in the Z direction, but includes information regarding the influence of fluctuations in the optical member common to the measurement light, as with the measurement light. That is, the amount of positional deviation from the light receiving slits Sa13 to Sa15 corresponding to the position of each reference observation image formed by the reference light in the best focus state is the position of each measurement observation image formed by the measurement light in the best focus state. The amount of positional deviation from the corresponding light receiving slits Sa1 to Sa12 is substantially equal. Therefore, in the surface position detection apparatus of this embodiment, the detection error of the surface position of the transfer surface Wa is measured and corrected based on the positional deviation amount from the light receiving slits Sa13 to Sa15 corresponding to the position of each reference observation image. can do.

  Moreover, in the surface position detection apparatus of this embodiment, since the incident surface 13a is arrange | positioned through the transfer surface Wa in the conjugate surface of the output surface 3a, or the surface of the vicinity, each measurement observation image is on the incident surface 13a. Each of the reference observation images is sharply formed on the incident surface 14a because it is sharply formed and the incident surface 14a is disposed on the conjugate surface of the exit surface 4a or a surface in the vicinity thereof via the reflecting surface 9a. For this reason, in the surface position detection apparatus of the present embodiment, the detection error of the surface position of the transfer surface Wa when the transfer surface Wa is at or near the best focus state can be measured with high accuracy. Based on the result, the detection error of the surface position of the transfer surface Wa can be corrected with high accuracy.

  The signal processing unit PR detects the Z-direction positions of the 12 detection points corresponding to the 12 measurement light transmission slits S1 to S12 based on the signals related to the measurement light from the light receiving units RS1 to RS12. Further, the signal processing unit PR measures, for example, detection errors at the Z-direction positions of the four detection points corresponding to the light transmission slits S1 to S4 based on a signal related to the reference light from the light receiving unit RS13.

  Similarly, the signal processing unit PR, based on the signals related to the reference light from the light receiving units RS14 and RS15, the detection errors of the Z direction positions of the four detection points corresponding to the light transmission slits S5 to S8, and the light transmission slit S9. The detection errors of the Z direction positions of the four detection points corresponding to S12 are measured. Then, the signal processing unit PR corrects the detection result of the Z direction position of each detection point based on the measurement result of the detection error of each detection point. The correction detection result of the signal processing unit PR is supplied to the control unit CR.

  The controller CR adjusts the position of the wafer stage WS in the Z direction by a required amount based on the correction detection result obtained by the signal processor PR, and detects the detection area A on the transfer surface Wa and thus the current of the wafer W. The exposure area is aligned with the image plane position (best focus position) of the projection optical system PL. As described above, the light receiving prisms 13 and 14, the relay lens 12, the photodetector 11, and the signal processing unit PR are positional information on the observation images of the measurement light transmitting slits S <b> 1 to S <b> 12 on the incident surface 13 a of the light receiving prism 13. And detecting the surface position of the transfer surface Wa based on the position information, and detecting the position information of the observation images of the light transmission slits S13 to S15 for the reference light on the incident surface 14a of the light receiving prism 14, A detection unit that corrects the detection result of the surface position of the transfer surface Wa based on the position information is configured.

  As described above, in the surface position detection device according to the present embodiment, the transfer surface Wa is not affected by the change in the optical member by measuring the detection error caused by the change in the optical member constituting the surface position detection device. Can be detected with high accuracy. Therefore, in the exposure apparatus of the present embodiment, the surface position of the transfer surface Wa of the wafer W can be detected with high accuracy, and as a result, transferred to the imaging surface of the projection optical system PL corresponding to the pattern surface of the reticle R. The surface Wa can be aligned with high accuracy.

  In the above-described embodiment, the light transmission prism (first pattern member) 3 provided with the light transmission slits S1 to S12 (first pattern) for measurement light and the light transmission slits S13 to S15 (reference light) are provided. Although the light transmission prism (second pattern member) 4 provided with the second pattern) is provided separately, the light transmission prisms 3 and 4 may be provided as an integral prism. Similarly, a light receiving prism (first observation member) 13 having an incident surface (first observation surface) 13a and a light receiving prism (second observation member) 14 having an incident surface (second observation surface) 14a are separately provided. However, the light receiving prisms 13 and 14 may be provided integrally. By integrating the light-transmitting prisms 3 and 4 or by integrating the light-receiving prisms 13 and 14, the positional stability between the light-transmitting slits S1 to S12 and the light-transmitting slits S13 to S15 and the light-receiving slit Sa1. It is possible to improve the positional stability between .about.Sa12 and the light receiving slits Sa13.about.Sa15. As a result, the detection error of the surface position of the transfer surface Wa can be measured and corrected more stably and with high accuracy.

  Further integration of the light transmission prism may include a light transmission pattern member having a common pattern surface provided with light transmission slits S1 to S12 for measurement light and light transmission slits S13 to S15 for reference light. it can. Similarly, further integration of the light receiving prism may include an observation member having a common observation surface including a first observation surface on which a measurement observation image is formed and a second observation surface on which a reference observation image is formed. it can. Hereinafter, with reference to FIG. 7, a modified example including a light transmission pattern member having a common pattern surface and an observation member having a common observation surface will be described. FIG. 8 is a diagram schematically showing a configuration from the light source to the light receiving prism by linearly developing the optical path from the light transmitting prism to the light receiving prism in the modified example of FIG. 7, similarly to FIG.

  The modification of FIG. 7 has a configuration similar to that of the embodiment of FIG. However, in the modified example of FIG. 7, a common light transmitting prism 21 is provided instead of the pair of light transmitting prisms 3 and 4, and a common light receiving prism 24 is provided instead of the pair of light receiving prisms 13 and 14. This is basically different from the embodiment. 7 and FIG. 8, the same reference numerals as those in FIG. 1 and FIG. 5 are given to components that perform the same functions as those in FIG. 1 and FIG. Hereinafter, the configuration and operation of the modified example of FIG. 7 will be described with a focus on differences from the embodiment of FIG.

  In the modification of FIG. 7, light from the light source 1 enters the common light transmission prism 21 via the condenser lens 2. The common light transmission prism 21 deflects the light beam from the condenser lens 2 in the −Z direction by refraction. For example, 12 measurement light transmission slits S1 to S12 and three reference light transmission slits S13 to S12 as shown in FIG. S15 is provided in the same plane.

  The measurement light that has passed through the light transmission slits S <b> 1 to S <b> 12 is incident on the transfer surface Wa via the plane-parallel plate 22, the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the incident prism 8. The reference light that has passed through the light transmission slits S13 to S15 does not pass through the parallel plane plate 22, but passes through the second objective lens 5, the vibrating mirror 6, the first objective lens 7, and the epi-illumination prism 8, and the plane mirror 9 Is incident on the reflection surface 9a.

  The measurement light reflected by the transfer surface Wa is incident on the common light receiving prism 24 via the incident light prism 18, the first objective lens 17, the mirror 16, the second objective lens 15, and the parallel plane plate 23. The reference light reflected by the reflecting surface 9a of the plane mirror 9 passes through the incident light prism 18, the first objective lens 17, the mirror 16, and the second objective lens 15 and does not pass through the parallel plane plate 23 and is received by the common light. The light enters the prism 24. The parallel plane plate 23 is disposed at a position symmetrical to the parallel plane plate 22 with respect to a predetermined YZ plane (for example, a YZ plane including the optical axis AX) and has a symmetric configuration.

  The common light receiving prism 24 is disposed at a position symmetrical to the common light transmitting prism 21 with respect to a predetermined YZ plane (for example, a YZ plane including the optical axis AX) and has a symmetric configuration. However, twelve light receiving slits Sa1 to Sa12 and three light receiving slits Sa13 to Sa13 as shown in FIG. 4 are provided on the incident surface 24a of the common light receiving prism 24 (the surface corresponding to the exit surface 21a of the common light transmitting prism 21). Sa15 is provided in the same plane. Thus, on the incident surface 24a, which is a common observation surface of the common light receiving prism 24, an observation image of the measurement light transmission slits S1 to S12 and an observation image of the reference light transmission slits S13 to S15 are formed. .

  The measurement light and reference light incident on the common light receiving prism 24 pass through the light receiving slits Sa1 to Sa12 and Sa13 to Sa15, respectively, are deflected by a predetermined angle, and then emitted from the common light receiving prism 24, respectively. The measurement light and the reference light emitted from the common light receiving prism 24 are converted into a conjugate image of the observation images of the light transmission slits S1 to S15 and the light reception slits Sa1 to Sa15 via the relay lens 12, and the detection surface of the photodetector 11. It is formed on 11a.

  In the modification of FIG. 7, the parallel flat plate 22 arranged in the measurement light path on the light transmission side is a first pattern surface (corresponding to the emission surface 3 a described above) on which light transmission slits S1 to S12 for measurement light are formed. The surface of the first pattern surface is corrected by correcting the relative position between the second pattern surface (surface corresponding to the exit surface 4a) formed with the reference light transmission slits S13 to S15. It functions as a surface position correction member on the light transmission side for matching the position with the surface position of the second pattern surface. That is, the plane-parallel plate 22 sets the length (air conversion length) of the measurement light path from the first pattern surface to the second objective lens 5 from the exit surface 3a to the second objective lens 5 in the embodiment of FIG. The surface positions of the first pattern surface and the second pattern surface are made to coincide with each other while being equal to the length of the optical path of the measurement light.

  On the other hand, the plane parallel plate 23 arranged in the measurement light path on the light receiving side is a first observation surface (a surface corresponding to the incident surface 13a described above) on which measurement observation images of the transmission slits S1 to S12 for measurement light are formed. ) And the second observation surface (the surface corresponding to the incident surface 14a) on which the reference observation images of the reference light transmission slits S13 to S15 are formed, the first observation surface is corrected. Functions as a surface position correcting member on the light receiving side that matches the surface position of the second observation surface. That is, the plane-parallel plate 23 sets the length of the optical path of the measurement light from the second objective lens 15 to the first observation surface (air conversion length) from the second objective lens 15 to the incident surface 13a in the embodiment of FIG. The surface positions of the first observation surface and the second observation surface are made to coincide with each other while maintaining the same length of the optical path of the measurement light.

  As described above, in the modification of FIG. 7, the surface position of the first pattern surface is set to the light transmission optical by the action of the parallel flat plate 22 as the surface position correction member on the light transmission side, compared to the embodiment shown in FIG. 1. It is moved in the optical axis direction of the system so as to coincide with the surface position of the second pattern surface, and the surface position of the first observation surface of the light receiving optical system is set by the action of the parallel flat plate 23 as the surface position correcting member on the light receiving side. It is moved in the optical axis direction so as to coincide with the surface position of the second observation surface. As a result, the positional stability between the light transmission slits S1 to S12 (measurement pattern) and the light transmission slits S13 to S15 (reference pattern) and the position between the light reception slits Sa1 to Sa12 and the light reception slits Sa13 to Sa15. Stability can be improved, and each light transmission slit and each light receiving slit can be provided at a desired position on the common surface with high accuracy, so that the detection error of the surface position of the transfer surface Wa is more stable. Can be measured and corrected with high accuracy.

  In the modification of FIG. 7, the surface position of the first pattern surface and the surface position of the second pattern surface are matched, and the surface position of the first observation surface and the surface position of the second observation surface are matched. However, the surface position of the first pattern surface is made closer to the surface position of the second pattern surface, compared to the embodiment shown in FIG. The surface position detection error of the transfer surface Wa is more stably measured and corrected more accurately than the embodiment shown in FIG. 1 by bringing the surface position of the second observation surface closer to the surface position of the second observation surface. Can do.

  In the modification of FIG. 7, the plane parallel plates 22 and 23 arranged in the measurement optical path are used as the surface position correction member, but the specific configuration of the surface position correction member is not limited to this. Various forms of numbers, positions, etc. are possible. In general, the surface position correction member is provided on at least one of the optical path of the measurement light and the optical path of the reference light, and the incident surface and the exit surface are perpendicular to the optical axis of the light transmitting optical system or the optical axis of the light receiving optical system. The light transmissive member provided on the surface may be included.

  The surface position correction member is provided on at least one of the optical path of the measurement light and the optical path of the reference light, and is arranged in parallel with the optical axis of the light transmission optical system or the optical axis of the light reception optical system. The light-transmitting member may be included. As an example, as shown in FIG. 9, a parallel plane plate 25 that is disposed to be inclined with respect to the optical axis of the light transmission optical system SL in the reference optical path between the common pattern surface 21 a and the light transmission optical system SL. As a surface position correction member on the light transmission side, a parallel flat plate 26 disposed at an inclination with respect to the optical axis of the light reception optical system JL in the reference optical path between the light reception optical system JL and the incident surface 24a is disposed on the light reception side. A surface position correction member can be used.

  Further, the surface position correction member can include an optical deflection member that is provided on at least one of the optical path of the measurement light and the optical path of the reference light and changes the relative angle between the measurement light and the reference light. As an example, as shown in FIG. 10, the deflection angle is arranged in the reference optical path in the light transmission optical system SL (for example, between the second objective lens 5 and the first objective lens 7) and transmits and deflects the reference light. The prism 27 is used as a surface position correction member on the light transmission side, and is arranged in a reference light path in the light receiving optical system JL (for example, between the first objective lens 17 and the second objective lens 15) to transmit and deflect the reference light. The declination prism 28 can be a surface position correction member on the light receiving side. Further, a plurality of different types of surface position correcting members described above may be combined, and different types of surface position correcting members may be used for the light transmitting optical system and the light receiving optical system.

  In the embodiment of FIG. 1 and the modification of FIG. 7, the flat mirror 9 is used as a reference member having a reference surface provided in the vicinity of the transfer surface Wa as a test surface, but the present invention is not limited to this. Without limitation, various configurations for the configuration of the reference member are possible. For example, a three-time reflection type prism 31 as shown in FIG. 11 can be used as the reference member. In this case, the reference light Lr incident on the incident surface 31a of the prism 31 from the incident light prism 8 is reflected by the reflecting surface 31b and then enters the reflecting surface 31c as a reference surface parallel to the XY plane. The incident angle of the reference light with respect to this reflective surface 31c is made smaller than the incident angle of the reference light with respect to the reflective surface 9a of the embodiment of FIG.

  The reference light Lr reflected by the reflecting surface 31c is reflected by the reflecting surface 31d and then exits from the exit surface 31e toward the epi-illumination prism 18. In FIG. 11, the prism 31 is positioned with the reflecting surface 31c serving as the reference surface facing upward, but the prism 31 is positioned upside down, that is, with the reflecting surface 31c serving as the reference surface facing down. 31 can also be used. The three-time reflection type prism 31 has three reflecting surfaces 31b, 31c, and 31d, and the normal lines of the incident surface 31a and the emitting surface 31e are provided in parallel to the XZ plane.

  Further, when the three-time reflection type prism 31 is used, for example, the reference light Lr can be made incident as shown in FIG. That is, the reference light Lr emitted from the epi-prism 8 is deflected by the declination prism (wedge prism) 51 provided on or near the exit surface 8 d of the epi-prism 8 and is incident on the incident surface 31 a of the prism 31. be able to. Then, the reference light Lr exiting from the exit surface 31e of the prism 31 can be incident on the entrance surface 18a via the incident surface 18a of the incident light prism 18 or a declination prism (wedge prism) 52 provided in the vicinity thereof. it can.

  Thus, the reference light Lr incident on the incident light prism 8 in parallel with the measurement light Lm is deflected by the declination prism 51 and incident on the prism 31 in a state inclined with respect to the measurement light Lm along the XZ plane. Can do. Further, the reference light Lr tilted with respect to the measurement light Lm along the XZ plane and emitted from the prism 31 can be deflected by the declination prism 52 and incident on the incident light prism 18 in parallel with the measurement light Lm.

  In FIG. 16, the measurement light Lm and the reference light Lr are incident on the epi-illumination prism 8 in a state where they are overlapped when viewed from the Y direction, and are similarly emitted from the epi-illumination prism 18 when they are overlapped when viewed from the Y direction. Yes. The deflection prisms 51 and 52 are provided so as to transmit only the reference light Lr out of the measurement light Lm and the reference light Lr.

  As a reference member, a one-time reflection type prism 32 as shown in FIG. 12 can be used. In this case, the reference light Lr incident on the incident surface 32a of the prism 32 from the incident light prism 8 is incident on the reflecting surface 32b as a reference surface parallel to the XY plane. The incident angle of the reference light with respect to the reflecting surface 32b is made smaller than the incident angle of the reference light with respect to the reflecting surface 9a of the embodiment of FIG. The reference light Lr reflected by the reflection surface 32b is emitted from the emission surface 32c toward the incident light prism 18. The once reflecting prism 32 has one reflecting surface 32b, and the normal lines of the incident surface 32a and the exit surface 32c are provided in parallel to the XZ plane. Here, in the case where the three-time reflection type prism 31 or the one-time reflection type prism 32 is used, the length of the optical path between the measurement light Lm and the reference light Lr is compared with the case where the plane mirror 9 is used. The shape and refractive index (refractive index of the glass) of the prisms 31 and 32 are optimized so as not to cause a difference in (air conversion length), or in the optical path of at least one of the measurement light Lm and the reference light Lr. A configuration in which an optical member (for example, a plane parallel plate) that corrects the difference in the length of the optical path is disposed may be provided. In addition, since the incident angle of the reference light with respect to the reflective surfaces 31c and 32b as a reference surface is made smaller than the incident angle of the reference light with respect to the reflective surface 9a, when using several light transmission slits for reference light, a plane mirror is used. Rather than using 9, it is easier to ensure the required length of the reference surface along the X direction.

  Further, in the embodiment of FIG. 1 and the modification of FIG. 7, the illumination device including the light source 1 and the condenser lens 2 is used to transmit the measurement light transmission slits S1 to S12 and the reference light transmission slits S13 to S15. Illuminated in a lump. However, the present invention is not limited to this, for example, as shown in FIG. 13, using a pair of illumination devices 41 and 42, the first pattern surface 43 in which the light transmission slit for measurement light is formed, and the reference light It is also possible to individually illuminate the second pattern surface 44 on which the light transmission slits are formed. In this case, for example, the light transmission slit for measurement light and the light transmission slit for reference light can be illuminated with illumination light having different wavelengths, and the optimum wavelength for each of the measurement light and the reference light is appropriately selected. Can do.

  In the embodiment of FIG. 1 and the modification of FIG. 7, the positions of a plurality of detection points are detected using a light transmission pattern for measurement light composed of a plurality of light transmission slits, but the present invention is not limited to this. It is also possible to detect the position of one detection point using a measurement light transmission pattern composed of one light transmission slit. In the embodiment of FIG. 1 and the modification of FIG. 7, the number of slits of the reference light transmission slit is smaller than that of the measurement light transmission slit. The number of slits may be the same, or the number of slits for reference light may be increased compared to that for measurement light.

  In the above-described embodiment, the light transmitting optical system and the light receiving optical system have a symmetric configuration with respect to a predetermined YZ plane (for example, the YZ plane including the optical axis AX). The configuration is not limited, and an asymmetric configuration may be used.

  In the above-described embodiment, the surface position of the test surface is detected based on the principle of the photoelectric microscope (measurement principle using a vibrating mirror). However, the present invention is not limited to this. For example, detection using image processing is performed. The position information of the measurement observation image and the reference observation image can be detected by the system, and the position of the test surface can be calculated based on the detected position information.

  In the above-described embodiment, an example in which the exposure apparatus includes a single surface position detection device is described. However, the present invention is not limited to this, and a plurality of sets of surface position detection devices may be used as necessary. The detection visual field can also be divided. In this case, each surface position detection device can be calibrated based on a detection result in a common visual field between the detection field of the first surface position detection device and the detection field of the second surface position detection device.

  In the above-described embodiment, the present invention is applied to the detection of the surface position of the photosensitive substrate of the exposure apparatus. However, the present invention is not limited to this, and the surface position of the pattern surface of the mask of the exposure apparatus is not limited to this. The present invention can also be applied to detection. In the above-described embodiment, the present invention is applied to the detection of the surface position of the photosensitive substrate in the exposure apparatus. However, the present invention is not limited to this, and general inspections in various apparatuses other than the exposure apparatus are possible. The present invention can also be applied to detection of the surface position of a surface. In the above-described embodiment, the present invention is applied to an exposure apparatus that uses a projection optical system. However, the present invention is also applicable to an exposure apparatus that does not use a projection optical system, such as a proximity exposure apparatus. Can do.

  In the above-described embodiment, a variable pattern forming apparatus that forms a predetermined pattern based on predetermined electronic data can be used instead of a mask. By using such a variable pattern forming apparatus, the influence on the synchronization accuracy can be minimized even if the pattern surface is placed vertically. As the variable pattern forming apparatus, for example, a DMD (digital micromirror device) including a plurality of reflecting elements driven based on predetermined electronic data can be used. An exposure apparatus using DMD is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-304135 and International Patent Publication No. 2006/080285. In addition to a non-light-emitting reflective spatial light modulator such as DMD, a transmissive spatial light modulator may be used, or a self-luminous image display element may be used. Note that a variable pattern forming apparatus may be used even when the pattern surface is placed horizontally.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  Next, a device manufacturing method using the exposure apparatus according to the above-described embodiment will be described. FIG. 14 is a flowchart showing a manufacturing process of a semiconductor device. As shown in FIG. 14, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer W to be a semiconductor device substrate (step S40), and a photoresist, which is a photosensitive material, is applied on the vapor-deposited metal film. (Step S42). Subsequently, using the exposure apparatus of the above-described embodiment, the pattern formed on the reticle R as a mask is transferred to each shot area on the wafer W (step S44: exposure process), and the transfer of the wafer W after the transfer is completed. Development, that is, development of the photoresist to which the pattern has been transferred is performed (step S46: development process). Thereafter, the resist pattern generated on the surface of the wafer W in step S46 is used as a processing mask, and processing such as etching is performed on the surface of the wafer W (step S48: processing step).

  Here, the resist pattern is a photoresist layer (transfer pattern layer) in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus of the above-described embodiment is generated, and the recess penetrates the photoresist layer. It is what you are doing. In step S48, the surface of the wafer W is processed through this resist pattern. The processing performed in step S48 includes, for example, at least one of etching of the surface of the wafer W or film formation of a metal film or the like. In step S44, the exposure apparatus of the above-described embodiment performs pattern transfer using the wafer W coated with the photoresist as a photosensitive substrate.

  FIG. 15 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in FIG. 15, in the liquid crystal device manufacturing process, a pattern formation process (step S50), a color filter formation process (step S52), a cell assembly process (step S54), and a module assembly process (step S56) are sequentially performed.

  In the pattern forming step in step S50, predetermined patterns such as a circuit pattern and an electrode pattern are formed on the glass substrate coated with a photoresist as the photosensitive substrate, using the exposure apparatus of the above-described embodiment. The pattern forming process includes an exposure process in which a pattern is transferred to a photoresist layer using the exposure apparatus of the above-described embodiment, and development of a photosensitive substrate to which the pattern is transferred, that is, development of a photoresist layer on a glass substrate. And a development step for generating a photoresist layer (transfer pattern layer) having a shape corresponding to the pattern, and a processing step for processing the surface of the glass substrate through the developed photoresist layer.

  In the color filter forming process in step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction.

  In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  The present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device or a liquid crystal device. For example, an exposure apparatus for a display device such as a plasma display, an image sensor (CCD or the like), a micromachine, The present invention can be widely applied to an exposure apparatus for manufacturing various devices such as a thin film magnetic head and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

Claims (19)

A reference member having a reference surface provided in the vicinity of the test surface;
Measuring light from the first pattern on the first pattern surface is guided to the test surface, an intermediate image of the first pattern is projected onto the test surface, and the second pattern on the second pattern surface is projected from the second pattern. A light transmission optical system that guides reference light to the reference surface and projects an intermediate image of the second pattern onto the reference surface;
The measurement light reflected by the test surface is guided to a first observation surface to form an observation image of the first pattern on the first observation surface, and the reference light reflected by the reference surface is second observed. A light receiving optical system that leads to a surface and forms an observation image of the second pattern on the second observation surface;
First position information of an observation image of the first pattern on the first observation plane and second position information of an observation image of the second pattern on the second observation plane are detected, and the first position information and the second position information are detected. A detection unit that detects a surface position of the test surface based on position information;
A surface position detecting device comprising: The surface position detection apparatus according to claim 1, wherein the light transmission optical system includes a surface position correction member that corrects a relative position between the first pattern surface and the second pattern surface. The surface position detection apparatus according to claim 2, wherein the surface position correction member matches a surface position of the first pattern surface with a surface position of the second pattern surface. The surface position detection apparatus according to claim 1, wherein the light receiving optical system includes a surface position correction member that corrects a relative position between the first observation surface and the second observation surface. 5. The surface position detection apparatus according to claim 4, wherein the surface position correction member matches a surface position of the first observation surface with a surface position of the second observation surface. The surface position correcting member is disposed so as to be inclined with respect to the optical axis of the light transmitting optical system, and a light transmitting member having an incident surface and an exit surface perpendicular to the optical axis of the light transmitting optical system. 4. The surface position detecting device according to claim 2, further comprising at least one of a parallel plate-shaped light transmitting member and a light deflecting member that changes a relative angle between the measurement light and the reference light. 5. . The surface position correcting member includes a light transmitting member in which an incident surface and an exit surface are provided perpendicular to the optical axis of the light receiving optical system, and a parallel member that is inclined with respect to the optical axis of the light receiving optical system. 6. The surface position detection apparatus according to claim 4, further comprising at least one of a flat light transmitting member and a light deflection member that changes a relative angle between the measurement light and the reference light. The surface position detection device according to claim 2, wherein the surface position correction member is provided in at least one of an optical path of the measurement light and an optical path of the reference light. The surface position detection according to any one of claims 1 to 8, wherein the first pattern member having the first pattern surface and the second pattern member having the second pattern surface are integrally provided. apparatus. The surface position detection apparatus according to claim 3, further comprising a light transmission pattern member having a common pattern surface including the first pattern surface and the second pattern surface. The surface position detection according to any one of claims 1 to 10, wherein a first observation member having the first observation surface and a second observation member having the second observation surface are integrally provided. apparatus. The surface position detection apparatus according to claim 5, further comprising an observation member having a common observation surface including the first observation surface and the second observation surface. 13. The reference member according to claim 1, wherein the reference member has an odd number of reflecting surfaces including the reference surface, and each normal line of the odd number of reflecting surfaces is provided in parallel to a predetermined surface. The surface position detecting device according to claim 1. The surface position detecting device according to claim 13, wherein the reference member is a prism integrally including the odd number of reflecting surfaces. The prism includes an incident surface on which the reference light is incident, the reference surface that reflects the reference light transmitted through the incident surface, and an emission surface on which the reference light reflected on the reference surface is transmitted and emitted. The surface position detection apparatus according to claim 14, wherein normal lines of the incident surface and the exit surface are provided in parallel to the predetermined surface. The prism includes an incident surface on which the reference light is incident, a first reflecting surface that reflects the reference light transmitted through the incident surface, and the reference surface that reflects the reference light reflected on the first reflecting surface. A second reflection surface that reflects the reference light reflected by the reference surface; and an emission surface that transmits and emits the reference light reflected by the second reflection surface, the incident surface and the emission surface The surface position detecting device according to claim 14, wherein each of the normals is provided in parallel to the predetermined surface. 17. A collective illumination device that collectively illuminates the first pattern and the second pattern or an individual illumination device that individually illuminates the first pattern and the second pattern. The surface position detection apparatus of any one of these. In an exposure apparatus that transfers a pattern to a photosensitive substrate,
A surface position detection device according to any one of claims 1 to 17,
Alignment means for aligning at least one of the pattern surface provided with the pattern or the transfer surface of the photosensitive substrate based on the detection result of the surface position detection device;
The exposure apparatus according to claim 1, wherein the surface position detection device detects at least one of a surface position of the pattern surface and a surface position of the transfer surface as a surface position of the test surface. An exposure step of transferring the pattern to the photosensitive substrate using the exposure apparatus according to claim 18;
Developing the photosensitive substrate to which the pattern has been transferred, and forming a transfer pattern layer having a shape corresponding to the pattern on the surface of the photosensitive substrate;
And a processing step of processing the surface of the photosensitive substrate through the transfer pattern layer.

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