JPWO2007094082A1 - Method for joining upper and lower substrates in display device, joining device and electronic apparatus - Google Patents

Abstract

An object of the present invention is to be thin, light and difficult to break, and to prevent display unevenness. At least one of the opposing substrates is plastic and roll-shaped, at least one of the substrates has a plurality of pixels, at least the other substrate has a drive circuit, and the opposing substrate is It is a method of manufacturing a display device by bonding, a seal frame forming step A for forming a seal frame 140 on the substrate with a sealing agent, and a liquid crystal forming step B for applying a liquid crystal 130 in the seal frame 140 of the substrate. And at least a substrate bonding step C for bonding the substrates facing each other, and the substrate bonding step C is performed by gradually applying pressure while bending the substrate with a flexible pressing member. In this configuration, the air in the seal frame 140 is pushed out. [Selection] Figure 2

Description

  The present invention relates to a method for joining upper and lower substrates, a joining device, and an electronic apparatus in a display device used for display such as a personal computer and a mobile phone.

  As a manufacture of such a display device, a seal frame having an opening in a part is formed on one substrate, and bonded to an opposing substrate without a liquid crystal, and bonded to an upper and lower substrate without liquid crystal After creating the empty cell and eliminating the air inside the empty cell under vacuum, the liquid crystal is infused into the seal frame by capillary action by bringing the liquid crystal into contact with the opening of the seal frame and releasing to atmospheric pressure. A liquid crystal injection method is widely known (Patent Document 1).

In addition, as a means of improving productivity as the display device becomes larger, it is formed on the substrate without providing an opening in the seal frame, and after an appropriate amount of liquid crystal that fits in the seal frame is dropped by a precision dispenser or the like, A liquid crystal dropping method in which the substrate is bonded to an opposing substrate under vacuum has also been used (Patent Document 1).
Japanese Patent No. 3084975

  By the way, the manufacture of such a display device is based on the premise that a glass substrate is used. If this glass substrate is made into a plastic, it can be bent and not bent, and the manufacturing efficiency is improved. However, in producing a display device, the flatness of the surface of the plastic substrate is inferior to that of the glass substrate, so that in the pasting of the substrate, air is mixed in, or the liquid crystal to be filled in a predetermined amount overflows, or The liquid crystal cannot be formed to a predetermined thickness, and display unevenness may occur.

  The present invention has been made in view of the above points, and provides a bonding method, a bonding apparatus, and an electronic apparatus for upper and lower substrates in a display device that are thin, light and difficult to break, and can prevent display unevenness. It is an object.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

The invention described in claim 1
At least one of the opposing substrates is plastic and roll-shaped, at least one substrate has a plurality of pixels, at least the other substrate has a drive circuit, and the opposing substrates are bonded together. A method for bonding upper and lower substrates in a display device for manufacturing a display device,
A seal frame forming step of forming a seal frame on the substrate with a sealant;
Forming a liquid crystal in a sealing frame of the substrate;
A substrate bonding step of bonding the substrates facing each other;
Having at least
In the substrate bonding step, the upper and lower substrates in the display device are bonded by extruding air in the seal frame by gradually applying pressure while pliing the substrate with a flexible pressing member. It is a joining method.

The invention described in claim 2
In the substrate bonding step, the substrate is bonded from the side of the seal frame, the central portion of the seal frame, or the corner of the seal frame, and pressure is gradually applied to push out the air for bonding. 2. A method for bonding upper and lower substrates in a display device according to claim 1, wherein the upper and lower substrates are joined.

The invention according to claim 3
3. The liquid crystal forming process according to claim 1, wherein the liquid crystal forming step forms the liquid crystal in a solid shape so as to be sufficiently close to a seal frame formed on the same substrate or on the opposite substrate. This is a method for bonding upper and lower substrates in a display device.

The invention according to claim 4
Among the opposing substrates, at least one substrate is plastic and roll-shaped, at least one substrate has a plurality of pixels, at least the other substrate has a driving circuit, and bonds the opposing substrates. Device,
A seal frame forming means for forming a seal frame on the substrate with a sealant;
Liquid crystal forming means for forming a liquid crystal in a sealing frame of the substrate;
A substrate bonding means for bonding the opposing substrates;
Comprising at least
The said board | substrate bonding means is a joining apparatus characterized by applying a pressure gradually, making the said board | substrate bend, and pushing out and bonding the air in the said seal frame.

The invention described in claim 5
5. The substrate pasting means, comprising: a pressing member having flexibility; and an extruding means that gradually applies pressure while pushing the substrate to push out air in the seal frame. It is a joining apparatus of description.

The invention described in claim 6
The substrate bonding means is configured to extrude air in the seal frame by gradually applying pressure while injecting a fluid into a flexible hollow member to expand the substrate and bending the substrate. The joining apparatus according to claim 4.

The invention described in claim 7
The substrate laminating means is to apply pressure gradually while laminating the substrate from the side of the seal frame, the center of the seal frame, or the corner of the seal frame, and paste by laminating the air. It is a joining apparatus of Claim 4 thru | or 6 characterized by the above-mentioned.
The invention according to claim 8 provides:
8. The liquid crystal forming unit according to claim 4, wherein the liquid crystal forming unit forms the liquid crystal in a solid shape so as to be sufficiently close to a seal frame formed on the same substrate or on the opposite substrate. It is a joining device.

The invention described in claim 9
An electronic apparatus comprising: a display device manufactured by the method for bonding upper and lower substrates in the display device according to claim 1.

  With the above configuration, the present invention has the following effects.

In invention of Claim 1 and Claim 4,
Of the opposing substrates, at least one substrate is plastic and roll-shaped, at least one substrate has a plurality of pixels, at least the other substrate has a driving circuit, a seal frame and a liquid crystal on one substrate In the state where is formed, liquid is sufficiently formed in the liquid crystal region by applying pressure gradually while pressing the substrate with a flexible pressing member to push out the air in the seal frame and bonding Thus, a display device can be manufactured that can be smooth without any space, can be thin and lightly broken, and can prevent display unevenness.

  In the inventions according to claim 2 and claim 7, the pressure is gradually applied while the substrate is bent from the side of the seal frame, the center of the seal frame, or the corner of the seal frame, and air is surely supplied. It can be extruded and bonded.

  In the invention according to claim 3 and claim 8, the liquid crystal is formed in a solid shape so as to be sufficiently close to the inside of the seal frame formed on the same substrate or on the opposite substrate, and the air is surely pushed out. By doing so, the liquid crystal can be made flat in a short time.

  In the invention according to claim 5, the pressing member is a structure in which a fluid is injected into a hollow member having flexibility and expanded, and pressure is gradually applied while the substrate is bent with a simple structure. The air can be reliably pushed out and bonded.

  The invention according to claim 6 is configured to extrude air in the seal frame by gradually applying pressure while injecting a fluid into a flexible hollow member to expand the substrate and bending the substrate. Pressure can be gradually applied while the substrate is bent by the structure, and air can be reliably pushed out and bonded.

  The invention according to claim 9 includes a display device manufactured by the method of joining the upper and lower substrates in the display device according to claims 1 to 3, the display device is thin and lightly difficult to break, and display unevenness occurs. Can be prevented.

  Hereinafter, embodiments of the bonding method of the upper and lower substrates, the bonding apparatus, and the electronic device in the display device of the present invention will be described. However, the embodiment of the present invention shows the most preferable embodiment of the present invention. It is not limited to this. 1 is a cross-sectional view of the display device, FIG. 2 is a schematic view of the manufacturing process of the display device, FIG. 3 is a side view showing the seal frame forming step, FIG. 4 is a plan view showing the seal frame forming step, and FIG. FIG. 6 is a plan view showing the liquid crystal forming step, FIG. 7 is a side view showing the substrate bonding step, FIG. 8 is a plan view showing the substrate bonding step, and FIG. 9 is another embodiment. The side view which shows a board | substrate bonding process, FIG. 10 is a top view which shows the board | substrate bonding process of other embodiment, FIG. 11 is the top view which shows the board | substrate bonding process of other embodiment, FIG. The side view which shows the board | substrate bonding process of embodiment, FIG. 13 is a perspective view of a personal computer, FIG. 14 is a perspective view of a mobile telephone.

First, the configuration of a display device according to the present invention will be described with reference to FIG. The display device 101 according to this embodiment includes a first substrate 110, a second substrate 120, a liquid crystal 130 interposed between the first substrate 110 and the second substrate 120, and a first substrate. 110 and a seal frame 140 formed by applying a sealant that bonds the second substrate 120 together.

  The first substrate 110 is an array substrate having a plurality of pixels, and has a structure in which a thin film switching element 112 is formed on a glass 111. Examples of the thin film switching element 112 include a thin film diode, an amorphous silicon thin film transistor, and a polysilicon thin film transistor. Of the above, it is preferable to use a polysilicon thin film transistor because the mobility is high and the switching element can be formed in a small area and the drive circuit can be formed.

The second substrate 120 is plastic and roll-shaped, and is made of, for example, a plastic film 121. Examples of the plastic film 121 include polyethylene naphthalate, aromatic polyamide, polyimide, polybenzothiazole, and polybenzoxazole.

  The second substrate 120 includes a driving circuit 122 and drives the liquid crystal 130. The drive circuit 122 is configured by a transparent electrode. The second substrate 120 may or may not have the driving circuit 122 depending on the driving mode of the liquid crystal 130. When the driving mode of the liquid crystal 130 is twisted nematic (TN), vertical alignment, polymer dispersion, or the like, the driving circuit 122 is included. In the case of in-plane switching (IPS), the driving circuit 122 is included. Absent. The drive circuit 122 may be a color filter substrate or a transparent substrate, but it is preferable to use a color filter substrate because colorization can be easily performed. As a method of colorizing the second substrate 20 without using a color filter substrate, a method of converting the first substrate 110 into a color filter (color filter-on-array method), a method of switching the color of the backlight ( Field sequential method).

  The seal frame 140 is formed in a substantially rectangular shape by applying a sealant that progresses a curing reaction at 30 ° C. or less, for example, and the first substrate 110 and the second substrate 120 are bonded together via the seal frame 140. The seal frame 140 seals the liquid crystal 130 interposed between the first substrate 110 and the second substrate 120. As this sealing agent, a two-component mixed curable resin in which the curing reaction proceeds by mixing the main agent and the curing agent, an ultraviolet curable resin in which the curing reaction proceeds by irradiating ultraviolet rays, or the like can be used. . Since the curing time is short, it is preferable to use an ultraviolet curable resin, and it is possible to cure in a room temperature environment by irradiating ultraviolet rays.

  In this way, the first substrate 110 and the second substrate 120 are provided with the seal frame 140 in which the spacer beads 131 are dispersed in the inner periphery between the two substrates in a substantially rectangular shape, and the spacer beads 131 serving as the spacers are used as predetermined. The gap is sealed with a so-called cell gap. As the spacer beads 131, plastic particles such as silica particles and polystyrene particles, particles obtained by coating a thermoplastic resin around the silica particles, and the like can be used. The seal frame 140 defines a liquid crystal region between the first substrate 110 and the second substrate 120.

  Of the first substrate 110 and the second substrate 120 facing each other, at least one second substrate 120 is plastic and roll-shaped, and at least one first substrate 110 has a plurality of pixels. At least the other second substrate 120 has a drive circuit 122, and the display device 101 is manufactured by bonding the first substrate 110 and the second substrate 120 facing each other.

  Hereinafter, the manufacturing process of the display device according to this embodiment will be described with reference to FIG.

  As shown in FIG. 2, the manufacturing method of the display device according to this embodiment includes a seal frame forming process A in which a seal agent is applied to the first substrate 110 to form the seal frame 140, and the liquid crystal 130 is first used. A liquid crystal forming process B applied and formed in the seal frame 140 of the substrate 110, and a substrate bonding process C for bonding the first substrate 110 and the second substrate 120 facing each other.

  In the seal frame forming step A, the first substrate 110 is placed on the support base 150 by the seal frame forming means A1, and the seal frame 140 is formed by applying a sealant on the first substrate 110. However, the seal frame 140 may be formed on the second substrate 120. As the seal frame forming means A1, as shown in FIGS. 3 and 4, a dispenser 1 is used, and a sealant is supplied from the storage tank 2 to the dispenser 1 and applied. The seal frame forming means A1 is not limited to the dispenser 1, and can be formed by a method such as screen printing or ink jet printing. The shape of the seal frame 140 is not particularly limited. For example, as shown in FIG. 4, the seal frame 140 may have a quadrangular shape in plan view, and the corners of the seal frame 140 may be curved. Thus, the liquid crystal may be filled smoothly.

As the sealant, an ultraviolet curable resin, a thermosetting adhesive, or a photocurable adhesive can be used. For example, acryloyl bisphenol A oligomer at both ends as a curable resin component, isocyanuric acid triacrylate, tetraethylene glycol diacrylate, and 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184 manufactured by Ciba Specialty Chemical Co.) as an initiator An ultraviolet curable resin having aluminum oxide having a maximum particle size of 2 μm or less and silicon oxide having a maximum particle size of 0.5 μm or less as a material was used as a sealant. This sealant can be cured in a temperature environment of 25 ° C. by irradiating ultraviolet rays of 2000 mJ / cm ^{2 with} a high-pressure mercury lamp.

  In the liquid crystal forming step B, as shown in FIGS. 5 and 6, the liquid crystal 130 is applied and formed in the seal frame 140 of the first substrate 110 by the liquid crystal forming means B1, but may be formed by transfer or the like. . As the liquid crystal forming means B1, the droplet discharge head 3 is used, the liquid crystal 130 is supplied from the storage tank 4 to the droplet discharge head 3, and the portion surrounded by the seal frame 140 formed on the first substrate 110 is A predetermined amount of liquid crystal 130 is applied in a planar shape by the droplet discharge head 3. As a method of the droplet discharge head 3, for example, a piezo jet type using a piezoelectric element can be used. However, a method other than this piezo jet type may be used, and vibration is applied by an ultrasonic motor, a linear motor, or the like. Alternatively, the liquid crystal may be emitted by applying pressure in the storage tank 4. Here, it is desirable that the liquid crystal in the storage tank 4 has been defoamed in advance. The droplet discharge head 3 may be configured as a system in which the liquid crystal in the storage tank 4 or a mixture of the liquid crystal and the low-viscosity volatile liquid is heated and the liquid crystal is ejected by expansion and foaming of the substance. Good.

  As described above, the liquid crystal 130 is formed in a solid shape so as to be sufficiently close to the inside of the seal frame 140 formed on the first substrate 110, but the same applies when the seal frame is formed on the second substrate 120. It is preferable that the liquid crystal 130 is formed in a solid shape so as to be sufficiently close to the inside of the seal frame because the liquid crystal 130 can be flattened in a short time. Many may be applied.

  In the substrate bonding step C, as shown in FIG. 7 and FIG. 8, a large amount of liquid crystal 130 is applied to the central portion in the seal frame 140 formed on the first substrate 110, and the first substrate 110 is covered with the liquid crystal 130. The second substrate 120 is stacked. This 2nd board | substrate 120 is unwound from the unwinding axis | shaft 170, the 1st board | substrate 110 and the board | substrate 120 which oppose by the board | substrate bonding means C1 are bonded, the 2nd board | substrate 120 is punched out, and it shows in FIG. A display device 101 as shown is manufactured, and the remaining second substrate 120 punched out is taken up on a take-up shaft 171.

  The board | substrate bonding means C1 has the press member 160 which has a softness | flexibility, and the extrusion means 161 which extrudes the air in the seal frame 140 by applying a pressure gradually, making a board | substrate flexible. The pressing member 160 has a configuration in which a fluid 160b is injected and expanded into a hollow member 160a having flexibility. The hollow member 160a is formed of rubber, resin, or the like, and air, liquid, or the like is used as the fluid 160b. The extruding means 161 has a plate-like member 161 a larger than the first substrate 110, and applies pressure to the plate-like member 161 a so that the second substrate 120 is bent by the flexible pressing member 160. Is gradually added to push out the air in the seal frame 140, and the first substrate 110 and the second substrate 120 facing each other are bonded together. In this embodiment, the pressing member 160 has a structure in which a fluid 160b is injected into a hollow member 160a having flexibility and expanded, and pressure is applied while the second substrate 120 is bent with a simple structure. Slowly add and reliably push out the air for pasting.

  In this embodiment, as shown in FIG. 8, the liquid crystal 130 is formed in the liquid crystal region by gradually applying pressure while pushing the second substrate 120 from the center of the seal frame 140 while pushing the air. It is possible to manufacture the display device 101 that is sufficiently filled, does not generate a space, is thin, is not easily cracked, and can prevent display unevenness.

  In this board | substrate bonding process C, as shown in FIG.9 and FIG.10, pressure is gradually applied and the air is pushed out while bonding the 2nd board | substrate 120 from the one side 140a of the seal frame 140, and also, As shown in FIG. 11, the pressure may be gradually applied while the second substrate 120 is folded from the corner portion 140 b of the seal frame 140, and air may be pushed out for bonding.

  Moreover, the board | substrate bonding process C can be comprised as shown in FIG. 12, and in this embodiment, the flexible hollow member 180 has the injection port 180a, and the fluid 181 is supplied from this injection port 180a. The pressure is gradually applied while the second substrate 120 is bent by injecting and expanding the air to push out the air in the seal frame 140. When the fluid 181 is air, the plate-like member 182 that restricts the expansion is required upward. However, when the fluid 181 is liquid, pressure can be applied to the second substrate 120 by the gravity of the liquid, and the structure is simple. The pressure can be gradually applied while the second substrate 120 is bent, and the air can be surely pushed out and bonded.

  Next, specific examples of electronic devices to which the display device according to the present invention can be applied will be described with reference to FIGS.

  First, an example in which the display device 101 according to the present invention is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 13 is a perspective view showing the configuration of the personal computer. The personal computer 191 includes a main body 193 having a keyboard 192 and a display 194 to which the display device 101 according to the present invention is applied.

  Next, an example in which the display device according to the present invention is applied to a display unit of a mobile phone will be described. FIG. 14 is a perspective view showing the configuration of the mobile phone. The mobile phone 292 includes a display unit 296 to which the display device 101 according to the present invention is applied, in addition to the plurality of operation buttons 293, as well as the earpiece 294 and the mouthpiece 295.

  In addition to the personal computer shown in FIG. 13 and the mobile phone shown in FIG. 14, the electronic apparatus to which the display device according to the present invention can be applied is a liquid crystal television, a viewfinder type / monitor direct view type video tape. A recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a video phone, a POS terminal, a digital still camera, and the like are exemplified, but the invention is not particularly limited.

  The present invention can be applied to a manufacturing method of a display device used for display of a personal computer, a mobile phone, etc., a manufacturing device of a display device, and an electronic device, and is thin, light and difficult to break, and can prevent occurrence of display unevenness. is there.

It is sectional drawing of a display apparatus. It is the schematic of the manufacturing process of a display apparatus. It is a side view which shows a seal frame formation process. It is a top view which shows a seal frame formation process. It is a side view which shows a liquid crystal formation process. It is a top view which shows a liquid crystal formation process. It is a side view which shows a board | substrate bonding process. It is a top view which shows a board | substrate bonding process. It is a side view which shows the board | substrate bonding process of other embodiment. It is a top view which shows the board | substrate bonding process of other embodiment. It is a top view which shows the board | substrate bonding process of other embodiment. The side view which shows the board | substrate bonding process of other embodiment, It is a perspective view of a personal computer. It is a perspective view of a mobile phone.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Display apparatus 110 1st board | substrate 120 2nd board | substrate 130 Liquid crystal 140 Seal frame A Seal frame formation process A1 seal frame formation means B Liquid crystal formation process B1 Liquid crystal formation means C Substrate bonding process C1 board bonding means

Claims (9)

At least one of the opposing substrates is plastic and roll-shaped, at least one substrate has a plurality of pixels, at least the other substrate has a drive circuit, and the opposing substrates are bonded together. A method for bonding upper and lower substrates in a display device for manufacturing a display device,
A seal frame forming step of forming a seal frame on the substrate with a sealant;
Forming a liquid crystal in a sealing frame of the substrate;
A substrate bonding step of bonding the substrates facing each other;
Having at least
In the substrate bonding step, the upper and lower substrates in the display device are bonded by extruding air in the seal frame by gradually applying pressure while pliing the substrate with a flexible pressing member. Joining method.   In the substrate bonding step, the substrate is bonded from the side of the seal frame, the central portion of the seal frame, or the corner of the seal frame, and pressure is gradually applied to push out the air for bonding. 2. The method for bonding the upper and lower substrates in the display device according to claim 1, wherein:   3. The liquid crystal forming process according to claim 1, wherein the liquid crystal forming step forms the liquid crystal in a solid shape so as to be sufficiently close to a seal frame formed on the same substrate or on the opposite substrate. A method for bonding upper and lower substrates in a display device. Among the opposing substrates, at least one substrate is plastic and roll-shaped, at least one substrate has a plurality of pixels, at least the other substrate has a driving circuit, and bonds the opposing substrates. Device,
A seal frame forming means for forming a seal frame on the substrate with a sealant;
Liquid crystal forming means for forming a liquid crystal in a sealing frame of the substrate;
A substrate bonding means for bonding the opposing substrates;
Comprising at least
The said board | substrate bonding means applies a pressure gradually, making the said board | substrate bend, pushes out the air in the said seal frame, and bonds it.   5. The substrate pasting means comprises a pressing member having flexibility and an extruding means for gradually applying pressure while pushing the substrate to push out air in the seal frame. The joining apparatus as described.   The substrate pasting means is configured to extrude air in the seal frame by gradually applying pressure while injecting a fluid into a flexible hollow member and expanding the fluid to cause the substrate to bend. The joining apparatus according to claim 4.   The substrate laminating means is to apply pressure gradually while laminating the substrate from the side of the seal frame, the center of the seal frame, or the corner of the seal frame, and paste by laminating the air. The joining apparatus according to claim 4, wherein the joining apparatus is characterized.   8. The liquid crystal forming unit according to claim 4, wherein the liquid crystal forming unit forms the liquid crystal in a solid shape so as to be sufficiently close to a seal frame formed on the same substrate or on the opposite substrate. Joining device.   An electronic apparatus comprising: a display device manufactured by the method for joining upper and lower substrates in the display device according to claim 1.