JPS6488542A - Apparatus for coating film forming substance - Google Patents

Apparatus for coating film forming substance

Info

Publication number
JPS6488542A
JPS6488542A JP24635087A JP24635087A JPS6488542A JP S6488542 A JPS6488542 A JP S6488542A JP 24635087 A JP24635087 A JP 24635087A JP 24635087 A JP24635087 A JP 24635087A JP S6488542 A JPS6488542 A JP S6488542A
Authority
JP
Japan
Prior art keywords
chamber
solution
filter
nozzle
reduced pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24635087A
Other languages
Japanese (ja)
Other versions
JP2587953B2 (en
Inventor
Hisato Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP62246350A priority Critical patent/JP2587953B2/en
Publication of JPS6488542A publication Critical patent/JPS6488542A/en
Application granted granted Critical
Publication of JP2587953B2 publication Critical patent/JP2587953B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)

Abstract

PURPOSE:To form a thin film with good quality, without unevenness in film thickness due to coating by providing a filter which has a 1st chamber comprising a porous wall and a 2nd chamber, between a nozzle and a supplying source for a resist solution to allow degassing of said solution in such a way that the passage of said solution is formed in the 1st chamber, and the 2nd chamber is a reduced pressure. CONSTITUTION:The filter 10 is provided with an enclosed cylindrical type housing 1, a porous pipe 2 provided inside of said housing, and an exhaust pipe 5. The system for applying a resist solution is constituted of the passage for supplying the resist solution in which a tank 11 for the resist solution is connected with the inlet side of a bellows pump 15 through a check value 12, and the outlet side of said pump 15 is connected with the inlet side pipe 3 of the filter 10, and the outlet 4 of said filter 10 is connected with the nozzle 14 through the check value 13. And, the exhaust pipe 5 is connected with a vacuum chamber 16 to always maintain the 2nd chamber of the housing 1 to the reduced pressure. As mentioned above, as the wall of the filter is constituted of a porous, and said 2nd chamber is maintained in the reduced pressure, a bubble contd. in said solution, is separated from said solution, followed by discharging said bubble into an outside. Thus, a coating solution which has a less bubble content spouts from the nozzle, and the film with the good quality is formed on a wafer.
JP62246350A 1987-09-30 1987-09-30 Resist coating equipment Expired - Lifetime JP2587953B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62246350A JP2587953B2 (en) 1987-09-30 1987-09-30 Resist coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62246350A JP2587953B2 (en) 1987-09-30 1987-09-30 Resist coating equipment

Publications (2)

Publication Number Publication Date
JPS6488542A true JPS6488542A (en) 1989-04-03
JP2587953B2 JP2587953B2 (en) 1997-03-05

Family

ID=17147250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62246350A Expired - Lifetime JP2587953B2 (en) 1987-09-30 1987-09-30 Resist coating equipment

Country Status (1)

Country Link
JP (1) JP2587953B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522002U (en) * 1991-09-03 1993-03-23 水道機工株式会社 Bubble discharge pipe for sodium hypochlorite
WO1998002254A1 (en) * 1996-07-11 1998-01-22 Seiko Epson Corporation Resist coating apparatus and coating method
CN102921596A (en) * 2011-08-08 2013-02-13 林英志 Continuous glue dispensing system and continuous glue dispensing method
US20130108958A1 (en) * 2011-10-26 2013-05-02 Shin-Etsu Chemical Co., Ltd. Production method of resist composition for lithography
JP2014078748A (en) * 2004-06-09 2014-05-01 Nikon Corp Exposure device, exposure method, and device manufacturing method
KR20180066808A (en) 2016-12-09 2018-06-19 쥬가이로 고교 가부시키가이샤 Coating Liquid Supply Device
JP2020068323A (en) * 2018-10-25 2020-04-30 株式会社ディスコ Protective film coating device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128261A (en) * 1974-09-03 1976-03-10 Takuzo Ichihara DATSUKISOCHI
JPS54123785A (en) * 1978-02-24 1979-09-26 Du Pont Deaerator
JPS5881404A (en) * 1981-11-12 1983-05-16 Teijin Ltd Degassing or defoaming method
JPS61198723A (en) * 1985-02-28 1986-09-03 Toshiba Corp Applicator for resist
JPS61245528A (en) * 1985-04-23 1986-10-31 Toshiba Mach Co Ltd Photosensitive material applicator
JPS647915A (en) * 1987-06-30 1989-01-11 Fuji Photo Film Co Ltd Treatment of photosensitive coating solution

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128261A (en) * 1974-09-03 1976-03-10 Takuzo Ichihara DATSUKISOCHI
JPS54123785A (en) * 1978-02-24 1979-09-26 Du Pont Deaerator
JPS5881404A (en) * 1981-11-12 1983-05-16 Teijin Ltd Degassing or defoaming method
JPS61198723A (en) * 1985-02-28 1986-09-03 Toshiba Corp Applicator for resist
JPS61245528A (en) * 1985-04-23 1986-10-31 Toshiba Mach Co Ltd Photosensitive material applicator
JPS647915A (en) * 1987-06-30 1989-01-11 Fuji Photo Film Co Ltd Treatment of photosensitive coating solution

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522002U (en) * 1991-09-03 1993-03-23 水道機工株式会社 Bubble discharge pipe for sodium hypochlorite
WO1998002254A1 (en) * 1996-07-11 1998-01-22 Seiko Epson Corporation Resist coating apparatus and coating method
CN1101280C (en) * 1996-07-11 2003-02-12 精工爱普生株式会社 Resist coating apparatus and coating method
JP2015046636A (en) * 2004-06-09 2015-03-12 株式会社ニコン Exposure device, exposure method, and device manufacturing method
JP2017016160A (en) * 2004-06-09 2017-01-19 株式会社ニコン Exposure apparatus, exposing method, and device manufacturing method
JP2016014895A (en) * 2004-06-09 2016-01-28 株式会社ニコン Exposure device, exposure method, and device manufacturing method
JP2014078748A (en) * 2004-06-09 2014-05-01 Nikon Corp Exposure device, exposure method, and device manufacturing method
CN102921596B (en) * 2011-08-08 2015-09-09 林英志 Continuity point colloid system and continuity point gluing method
CN102921596A (en) * 2011-08-08 2013-02-13 林英志 Continuous glue dispensing system and continuous glue dispensing method
TWI471691B (en) * 2011-10-26 2015-02-01 Shinetsu Chemical Co The manufacturing method of photoresist composition for micro shadowing
US8927192B2 (en) * 2011-10-26 2015-01-06 Shin-Etsu Chemical Co., Ltd. Production method of resist composition for lithography
US20130108958A1 (en) * 2011-10-26 2013-05-02 Shin-Etsu Chemical Co., Ltd. Production method of resist composition for lithography
KR20180066808A (en) 2016-12-09 2018-06-19 쥬가이로 고교 가부시키가이샤 Coating Liquid Supply Device
JP2020068323A (en) * 2018-10-25 2020-04-30 株式会社ディスコ Protective film coating device

Also Published As

Publication number Publication date
JP2587953B2 (en) 1997-03-05

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