JPS648789U - - Google Patents

Info

Publication number
JPS648789U
JPS648789U JP10265387U JP10265387U JPS648789U JP S648789 U JPS648789 U JP S648789U JP 10265387 U JP10265387 U JP 10265387U JP 10265387 U JP10265387 U JP 10265387U JP S648789 U JPS648789 U JP S648789U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
fitting
cylindrical projection
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10265387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10265387U priority Critical patent/JPS648789U/ja
Publication of JPS648789U publication Critical patent/JPS648789U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1実施例を示す電子機器の
プリント配線板取付け構造の一部破断断面図、第
2図は第1図に示す上下のケースを分離した状態
の要部断面図、第3図は第1図に示す筒状突起付
き支持座と嵌合突起付き嵌合部の斜視図、第4図
は第1図に示す電子機器筺体の斜視図、第5図は
本考案の第2実施例を示す電子機器のプリント配
線板取付け構造の要部断面図、第6図は第5図に
示すプリント配線板取付け構造の要部斜視図、第
7図a,b,cは第5図に示すプリント配線板取
付け構造の使用順序を示す断面図、第8図a,b
は従来のプリント配線板取付け構造を示す斜視図
及び要部断面図、第9図a,bは従来の別のプリ
ント配線板取付け構造を示す要部斜視図及び要部
断面図、第10図a,bは従来の更に別のプリン
ト配線板取付け構造を示す要部斜視図及び要部断
面図である。 図において、11は筺体、12は下ケース、1
3は上ケース、14はプリント配線板、16は支
持座、18は筒状突起、19はスリツト、20は
取付け穴、21は嵌合部、22は嵌合突起、23
は嵌合穴をそれぞれ示す。
FIG. 1 is a partially cutaway sectional view of a printed wiring board mounting structure for an electronic device showing a first embodiment of the present invention; FIG. 2 is a sectional view of essential parts with the upper and lower cases shown in FIG. 1 separated; 3 is a perspective view of the support seat with the cylindrical projection and the fitting part with the fitting projection shown in FIG. 1, FIG. 4 is a perspective view of the electronic device housing shown in FIG. 1, and FIG. 6 is a sectional view of the main parts of the printed wiring board mounting structure for electronic equipment showing the second embodiment, FIG. 6 is a perspective view of the main parts of the printed wiring board mounting structure shown in FIG. Cross-sectional views showing the order of use of the printed wiring board mounting structure shown in Figure 5, Figures 8a and b
9 is a perspective view and a sectional view of a main part showing a conventional printed wiring board mounting structure, FIGS. 9a and 9b are a perspective view and a sectional view of a main part showing another conventional printed wiring board mounting structure, and FIG. 10a , b are a perspective view and a sectional view of a main part showing still another conventional printed wiring board mounting structure. In the figure, 11 is the housing, 12 is the lower case, 1
3 is an upper case, 14 is a printed wiring board, 16 is a support seat, 18 is a cylindrical projection, 19 is a slit, 20 is a mounting hole, 21 is a fitting part, 22 is a fitting projection, 23
indicate the fitting holes, respectively.

Claims (1)

【実用新案登録請求の範囲】 1 一対のケース12,13からなる2分割構造
の筺体11と、筺体11内に収容されるプリント
配線板14とを備えた電子機器において、 一方のケース12にはプリント配線板14を載
置するための複数個の支持座16を設け、 各支持座16にはばね性を有し且つ長手方向の
中間部が半径方向に膨らみ且つ長手方向に延びる
複数個のスリツト19を有する筒状突起18を設
け、 プリント配線板14には対応する筒状突起18
に嵌合可能な複数個の取付け穴20を形成し、 他方のケース13には対応する筒状突起18に
嵌合可能な複数個の嵌合部21を設け、 筒状突起18にプリント配線板14の取付け穴
20と嵌合部21とを嵌合させたときに筒状突起
18が取付け穴20と嵌合部21に圧接すること
により一対のケース12,13とプリント配線板
14とが一体に固定されることを特徴とする電子
機器のプリント配線板取付け構造。 2 嵌合部21が筒状突起18の内側への嵌合に
より筒状突起18をそのばね力に抗して拡径させ
る嵌合突起22を有しており、筒状突起18の拡
径により筒状突起18の外面がプリント配線板1
4の取付け穴20の内面に圧接されると共に筒状
突起18の内面が嵌合突起22の外面に圧接され
るようになついる実用新案登録請求の範囲第1項
に記載の電子機器のプリント配線板取付け構造。 3 嵌合部21が筒状突起18を受容する嵌合穴
23を有しており、嵌合穴23の入口及びプリン
ト配線板14の取付け穴20の内径が筒状突起1
8の中間部の最大外径よりも小径とされており、
筒状突起18が取付け穴20及び嵌合穴23に嵌
合される際にそのばね力に抗して縮径し、且つ、
筒状突起18が取付け穴20及び嵌合穴23に完
全に嵌合した際にそのばね力により筒状突起18
の外面がプリント配線板14の取付け穴20の内
面及び嵌合穴23の内面に圧接されるようになつ
ている実用新案登録請求の範囲第1項に記載の電
子機器のプリント配線板取付け構造。
[Claims for Utility Model Registration] 1. In an electronic device comprising a housing 11 with a two-part structure consisting of a pair of cases 12 and 13, and a printed wiring board 14 housed in the housing 11, one of the cases 12 includes: A plurality of support seats 16 are provided on which printed wiring boards 14 are placed, and each support seat 16 has a plurality of slits that have spring properties, bulge in the radial direction at the middle portion in the longitudinal direction, and extend in the longitudinal direction. A cylindrical projection 18 having a diameter of 19 is provided, and a corresponding cylindrical projection 18 is provided on the printed wiring board 14.
The other case 13 is provided with a plurality of fitting parts 21 that can be fitted into the corresponding cylindrical protrusions 18, and the cylindrical protrusions 18 are fitted with a printed wiring board. When the mounting holes 20 of 14 and the fitting portions 21 are fitted, the cylindrical protrusion 18 comes into pressure contact with the mounting holes 20 and the fitting portions 21, so that the pair of cases 12, 13 and the printed wiring board 14 are integrated. A printed wiring board mounting structure for electronic equipment, characterized in that it is fixed to a printed wiring board. 2. The fitting part 21 has a fitting projection 22 that expands the diameter of the cylindrical projection 18 by fitting inside the cylindrical projection 18 against the spring force. The outer surface of the cylindrical projection 18 is the printed wiring board 1
Printed wiring for an electronic device according to claim 1, wherein the wiring is pressed against the inner surface of the mounting hole 20 of No. 4, and the inner surface of the cylindrical projection 18 is pressed against the outer surface of the fitting projection 22. Board-mounted structure. 3. The fitting part 21 has a fitting hole 23 that receives the cylindrical projection 18, and the entrance of the fitting hole 23 and the inner diameter of the mounting hole 20 of the printed wiring board 14 correspond to the cylindrical projection 1.
The diameter is smaller than the maximum outer diameter of the middle part of 8.
When the cylindrical projection 18 is fitted into the mounting hole 20 and the fitting hole 23, the diameter is reduced against the spring force, and
When the cylindrical projection 18 is completely fitted into the mounting hole 20 and the fitting hole 23, the spring force causes the cylindrical projection 18 to
The printed wiring board mounting structure for an electronic device according to claim 1, wherein the outer surface of the printed wiring board 14 is pressed against the inner surface of the mounting hole 20 and the inner surface of the fitting hole 23 of the printed wiring board 14.
JP10265387U 1987-07-06 1987-07-06 Pending JPS648789U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10265387U JPS648789U (en) 1987-07-06 1987-07-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10265387U JPS648789U (en) 1987-07-06 1987-07-06

Publications (1)

Publication Number Publication Date
JPS648789U true JPS648789U (en) 1989-01-18

Family

ID=31332759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10265387U Pending JPS648789U (en) 1987-07-06 1987-07-06

Country Status (1)

Country Link
JP (1) JPS648789U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266406A (en) * 2006-03-29 2007-10-11 Mitsubishi Electric Corp Grasping structure of substrate and electronic control device using the grasping structure
US8194400B2 (en) 2009-12-11 2012-06-05 Kabushiki Kaisha Toshiba Electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266406A (en) * 2006-03-29 2007-10-11 Mitsubishi Electric Corp Grasping structure of substrate and electronic control device using the grasping structure
US8194400B2 (en) 2009-12-11 2012-06-05 Kabushiki Kaisha Toshiba Electronic device

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