JPS648752U - - Google Patents
Info
- Publication number
- JPS648752U JPS648752U JP10369887U JP10369887U JPS648752U JP S648752 U JPS648752 U JP S648752U JP 10369887 U JP10369887 U JP 10369887U JP 10369887 U JP10369887 U JP 10369887U JP S648752 U JPS648752 U JP S648752U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- source
- electrode
- drain
- connection portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10369887U JPH0526767Y2 (cs) | 1987-07-07 | 1987-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10369887U JPH0526767Y2 (cs) | 1987-07-07 | 1987-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS648752U true JPS648752U (cs) | 1989-01-18 |
| JPH0526767Y2 JPH0526767Y2 (cs) | 1993-07-07 |
Family
ID=31334762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10369887U Expired - Lifetime JPH0526767Y2 (cs) | 1987-07-07 | 1987-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526767Y2 (cs) |
-
1987
- 1987-07-07 JP JP10369887U patent/JPH0526767Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526767Y2 (cs) | 1993-07-07 |
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