JPS648730U - - Google Patents
Info
- Publication number
- JPS648730U JPS648730U JP10223587U JP10223587U JPS648730U JP S648730 U JPS648730 U JP S648730U JP 10223587 U JP10223587 U JP 10223587U JP 10223587 U JP10223587 U JP 10223587U JP S648730 U JPS648730 U JP S648730U
- Authority
- JP
- Japan
- Prior art keywords
- boat
- thermocouple
- heater
- gap
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
Description
第１図は一実施例を示す断面図、第２図Ａは同
実施例で使用されるパドルを示す側面図、同図Ｂ
は同図ＡのＡ―Ａ線位置での断面図、第３図Ａは
同実施例で使用されるボート示す側面図、同図Ｂ
は同ボートの正面図である。第４図Ａは改良され
た熱処理装置の加熱炉を軸に直交する方向で切断
して示す断面図、同図Ｂは同熱処理装置を軸方向
に切断して示す断面図である。
２……炉体、４―１〜４―３……ヒータ、６…
…パドル、８……半導体ウエハ、１０……ボート
、１２……パドルの溝、１４……ボート下部の空
隙、１６……熱電対、１８……ＣＰＵ。
Figure 1 is a sectional view showing one embodiment, Figure 2A is a side view showing a paddle used in the embodiment, Figure B
Figure 3A is a cross-sectional view taken along line A--A in Figure 3A, Figure 3A is a side view of the boat used in the same embodiment, Figure 3B is a side view of the boat used in this embodiment.
is a front view of the same boat. FIG. 4A is a sectional view showing the heating furnace of the improved heat treatment apparatus taken in a direction perpendicular to the axis, and FIG. 4B is a sectional view showing the same heat treatment apparatus taken in the axial direction. 2... Furnace body, 4-1 to 4-3... Heater, 6...
...Paddle, 8...Semiconductor wafer, 10...Boat, 12...Groove of paddle, 14...Gap at the bottom of boat, 16...Thermocouple, 18...CPU.
Claims (1)
を保持するボートと、このボートを支持する支持
部材の間に空隙を形成し、その空隙に熱電対を挿
入し、この熱電対の検出温度が設定温度になるよ
うに前記ヒータへの通電を制御する熱処理装置。 Inside a heating furnace equipped with a heater, a gap is formed between a boat that holds semiconductor wafers and a support member that supports this boat, and a thermocouple is inserted into the gap, and the detection temperature of this thermocouple is set. A heat treatment device that controls power supply to the heater so that the temperature is maintained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10223587U JPS648730U (en) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10223587U JPS648730U (en) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648730U true JPS648730U (en) | 1989-01-18 |
Family
ID=31331957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10223587U Pending JPS648730U (en) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648730U (en) |
-
1987
- 1987-07-01 JP JP10223587U patent/JPS648730U/ja active Pending