JPS6481853A - Polyimide polymer composition - Google Patents
Polyimide polymer compositionInfo
- Publication number
- JPS6481853A JPS6481853A JP23981687A JP23981687A JPS6481853A JP S6481853 A JPS6481853 A JP S6481853A JP 23981687 A JP23981687 A JP 23981687A JP 23981687 A JP23981687 A JP 23981687A JP S6481853 A JPS6481853 A JP S6481853A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- polyimide
- anion
- forming
- 80pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE:To obtain the titled composition capable of forming an electrically conductive polyimide film having broad electrical conductivity range, without lowering the heat-resistance and surface uniformity, by compounding a compound having electron-donative property with salts generating an anion capable of forming a charge-transfer complex with said compound. CONSTITUTION:A polyimide is compound with (A) 0.1-80pts.wt., preferably 0.5-50pts.wt. of an electron-donative compound (e.g. tetrathiafulvalene or tetraselenafulvalene) and (B) 0.5-80pts.wt., preferably 1-60pts.wt. of salts decomposable by ultraviolet or visible light irradiation to generate an anion capable of forming a charge-transfer complex with the compound A (e.g. halogen anion or hexafluoroantimonate anion) based on 100pts.wt. of the polyimide or a polyamic acid which is a reaction precursor of polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62239816A JP2573250B2 (en) | 1987-09-24 | 1987-09-24 | Polyimide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62239816A JP2573250B2 (en) | 1987-09-24 | 1987-09-24 | Polyimide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6481853A true JPS6481853A (en) | 1989-03-28 |
| JP2573250B2 JP2573250B2 (en) | 1997-01-22 |
Family
ID=17050275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62239816A Expired - Fee Related JP2573250B2 (en) | 1987-09-24 | 1987-09-24 | Polyimide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2573250B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116144163A (en) * | 2023-04-13 | 2023-05-23 | 广东腐蚀科学与技术创新研究院 | Temperature-resistant conductive polymer composite material and preparation method and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6479263A (en) * | 1987-04-03 | 1989-03-24 | Ciba Geigy Ag | Antistatic and conductive polymers and molding materials |
-
1987
- 1987-09-24 JP JP62239816A patent/JP2573250B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6479263A (en) * | 1987-04-03 | 1989-03-24 | Ciba Geigy Ag | Antistatic and conductive polymers and molding materials |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116144163A (en) * | 2023-04-13 | 2023-05-23 | 广东腐蚀科学与技术创新研究院 | Temperature-resistant conductive polymer composite material and preparation method and application thereof |
| CN116144163B (en) * | 2023-04-13 | 2023-06-30 | 广东腐蚀科学与技术创新研究院 | Temperature-resistant conductive polymer composite material and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2573250B2 (en) | 1997-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |