JPS647842B2 - - Google Patents
Info
- Publication number
- JPS647842B2 JPS647842B2 JP16279181A JP16279181A JPS647842B2 JP S647842 B2 JPS647842 B2 JP S647842B2 JP 16279181 A JP16279181 A JP 16279181A JP 16279181 A JP16279181 A JP 16279181A JP S647842 B2 JPS647842 B2 JP S647842B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- moisture content
- weight
- core layer
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 30
- 239000012792 core layer Substances 0.000 claims description 23
- 239000005056 polyisocyanate Substances 0.000 claims description 23
- 229920001228 polyisocyanate Polymers 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 20
- 239000002023 wood Substances 0.000 claims description 18
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims description 17
- 235000011613 Pinus brutia Nutrition 0.000 claims description 17
- 241000018646 Pinus brutia Species 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 230000014759 maintenance of location Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 210000000988 bone and bone Anatomy 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 239000011120 plywood Substances 0.000 description 7
- 238000005507 spraying Methods 0.000 description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- 229920001807 Urea-formaldehyde Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical class N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- -1 aliphatic isocyanate Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- CGXBXJAUUWZZOP-UHFFFAOYSA-N formaldehyde;phenol;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 CGXBXJAUUWZZOP-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Description
【発明の詳細な説明】
本発明は曲げ強さ、表面ハク離強さ、木ねじ保
持力を改良したパーテイクルボードの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing particle board with improved bending strength, surface peeling strength, and wood screw retention strength.
従来多層構造のパーテイクルボードの製造方法
においてはバインダーとして尿素樹脂、メラミン
樹脂、フエノール樹脂等を用い表裏面層の熱圧成
型前のマツト含水率を15重量％前後、中芯層の熱
圧成型前のマツト含水率を10重量％前後に保つの
が一般的である。（以下％は特記せぬ限りすべて
重量％を表わす）
従来パーテイクルボードは合板工場等から出さ
れる廃材を利用できるので省資源の観点から注目
されているが、従来技術で製造されたパーテイク
ルボードは曲げ強さ、表面ハク離強さ、木ねじ保
持力が合板に比べて劣るという欠点がある為、用
途が狭い範囲に限定されており、その改良が強く
要請されていた。 Conventionally, in the manufacturing method of particle board with a multilayer structure, urea resin, melamine resin, phenolic resin, etc. are used as a binder, and the moisture content of the pine is approximately 15% by weight before hot-pressing molding of the front and back layers, and the middle core layer is hot-pressing molded. It is common to maintain the moisture content of the pine at around 10% by weight. (All percentages below refer to weight percentages unless otherwise specified.) Conventional particle board is attracting attention from a resource-saving perspective because it can use waste materials from plywood factories, etc., but particle board manufactured using conventional technology Because it has the drawbacks of being inferior in bending strength, surface peeling strength, and wood screw retention strength compared to plywood, its use is limited to a narrow range, and there has been a strong demand for improvements.
本発明は曲げ強さ、表面ハク離強さ、木ねじ保
持力が著しく向上したボードの製造を目的とする
ものである。 The object of the present invention is to produce a board with significantly improved bending strength, surface peeling strength, and wood screw retention strength.
本発明者は、この課題を達成する為に種々検討
の結果、本願発明は水の含有量が接着剤形成に非
常に重要な因子であることを見出し、本発明に到
達した。 As a result of various studies to achieve this object, the inventors of the present invention discovered that the water content is a very important factor in adhesive formation, and arrived at the present invention.
その理由は、本発明が水及びヒドロキシ化合物
（セルロース）に活性なイソシアネート基を有す
る有機ポリイソシアネートを使用するため、水が
有機ポリイソシアネートと反応して樹脂化し、且
つ一部のイソシアネート基はチツプ（セルロー
ス）表面のヒドロキシ基とも反応して化学結合を
形成することにより接着作用を呈し、更に水がチ
ツプ層の有機ポリイソシアネートを均一に分散
し、同時に水蒸気となつてボード表面からボード
内部への迅速な熱伝導の作用をするために、接着
剤の硬化とプレス時間を著しく短縮化し、パーテ
イクルボードの製造に効果的に作用するものと考
えられる。 The reason for this is that the present invention uses an organic polyisocyanate having isocyanate groups that are active against water and hydroxy compounds (cellulose), so water reacts with the organic polyisocyanate and turns into a resin, and some of the isocyanate groups become chips ( It reacts with the hydroxyl groups on the surface of the board (cellulose) to form chemical bonds, thereby exhibiting an adhesive effect. Furthermore, the water uniformly disperses the organic polyisocyanate in the chip layer, and at the same time becomes water vapor, which quickly flows from the board surface to the inside of the board. Because of its excellent heat conduction effect, it is believed that the curing and pressing time for the adhesive is significantly shortened, which is effective in the production of particle board.
すなわち本発明は、多層構造のパーテイクルボ
ードを製造するに際し、バインダーとして有機ポ
リイソシアネートを用い、表裏面層の熱圧成形前
のマツト含水率を20重量％〜40重量％、中芯層の
マツト含水率を５重量％以下に保ち、且つ有機ポ
リイソシアネートを乾燥木材チツプに対して、表
裏面層が３〜15重量％、中芯層が１〜10重量％の
割合で含水マツトに塗布し、次いで熱圧する事を
特徴とする多層構造のパーテイクルボードの製造
方法である。 That is, when manufacturing a particle board with a multilayer structure, the present invention uses an organic polyisocyanate as a binder, and adjusts the moisture content of the pine of the front and back layers to 20% to 40% by weight before hot-pressing, and the moisture content of the pine of the middle core layer to 20% to 40% by weight. Maintaining the moisture content at 5% by weight or less, and applying organic polyisocyanate to the dry wood chips at a ratio of 3 to 15% by weight for the front and back layers and 1 to 10% by weight for the core layer, This is a method for manufacturing particle board with a multilayer structure, which is then subjected to hot pressing.
本発明でいう多層構造のパーテイクルボードと
は３層以上の層より構成されるパーテイクルボー
ドのことである。 A particle board with a multilayer structure as used in the present invention refers to a particle board composed of three or more layers.
本発明でいう有機ポリイソシアネートは、少な
くとも２個の−NCO基を分子中に有する化合物
であり代表的なものにより説明すればヘキサメチ
レンジイソシアネートの様な脂肪族イソシアネー
ト、ｍ−又はｐ−フエニレンジイソシアネート、
トリレン−２，４−又は−２，６−ジイソシアネ
ート、ジフエニルメタン−４，4′−ジイソシアネ
ート、クロルフエニレン−２，４−ジイソシアネ
ート、ナフチレン−１，５−ジイソシアネート、
ジフエニレン−４，4′−ジイソシアネート、４，
4′−ジイソシアネート−３，3′−ジメチルジフエ
ニル、３−メチル−ジフエニルメタン−４，4′−
ジイソシアネート及びジフエニルエーテルジイソ
シアネートの様な芳香族イソシアネート、２，４
−シクロヘキサンジイソシアネート、２，６−シ
クロヘキサンジイソシアネート並びにその混合物
及びビス−（イソシアネートシクロヘキシル）−メ
タンの様な脂環式ジイソシアネート、２，４，６
−トリイソシアネートトルエン、及び２，４，
4′−トリイソシアネートジフエニルエーテルの様
なトリイソシアネートを含む。また各種イソシア
ネートの混合物、例えばトリレンジイソシアネー
ト異性体の混合物、例えば２，４−及び２，６−
異性体の市販混合物、またアニリン／ホルムアル
デヒド縮合物のホスゲン化により製造された、２
官能又は３官能以上の高級ポリイソシアネートの
混合物がある。これにはメチレン架橋ポリフエニ
ルポリイソシアネートを含む粗製ホスゲン化生成
物が含まれ、それらはジイソシアネート、トリイ
ソシアネート及び高級ポリイソシアネート共に任
意のホスゲン化副生物を含有する。またポリエチ
レングリコール、ポリプロピレングリコール等の
ポリオールを過剰の前記ポリイソシアネートでプ
レポリマー化したNCO末端プレポリマーも、或
いは過剰のポリオールで予め前記ポリイソシアネ
ートをポリマー化したOH末端プレポリマーにジ
フエニルメタンジイソシアネート等のポリイソシ
アネートを過剰に添加反応させたものも含まれ
る。 The organic polyisocyanate referred to in the present invention is a compound having at least two -NCO groups in the molecule, and representative examples include aliphatic isocyanate such as hexamethylene diisocyanate, m- or p-phenylene diisocyanate. ,
tolylene-2,4- or -2,6-diisocyanate, diphenylmethane-4,4'-diisocyanate, chlorophenylene-2,4-diisocyanate, naphthylene-1,5-diisocyanate,
Diphenylene-4,4'-diisocyanate, 4,
4'-diisocyanate-3,3'-dimethyldiphenyl, 3-methyl-diphenylmethane-4,4'-
Aromatic isocyanates, such as diisocyanates and diphenyl ether diisocyanates, 2,4
- cycloaliphatic diisocyanates such as cyclohexane diisocyanate, 2,6-cyclohexane diisocyanate and mixtures thereof and bis-(isocyanatecyclohexyl)-methane, 2,4,6
- triisocyanate toluene, and 2,4,
Contains triisocyanates such as 4'-triisocyanate diphenyl ether. Also mixtures of various isocyanates, such as mixtures of tolylene diisocyanate isomers, such as 2,4- and 2,6-
2, prepared by commercially available mixtures of isomers and also by phosgenation of aniline/formaldehyde condensates.
There are mixtures of functional or trifunctional or higher functional polyisocyanates. This includes crude phosgenation products, including methylene-bridged polyphenyl polyisocyanates, which contain diisocyanates, triisocyanates, and higher polyisocyanates as well as any phosgenation by-products. In addition, NCO-terminated prepolymers made by prepolymerizing polyols such as polyethylene glycol and polypropylene glycol with an excess of the above-mentioned polyisocyanate, or diphenylmethane diisocyanate and the like added to OH-terminated prepolymers made by prepolymerizing the above-mentioned polyisocyanate with an excess of polyol. It also includes those obtained by adding and reacting an excessive amount of polyisocyanate.
また前記イソシアネートに対して、単官能アル
コールにエチレンオキサイド、又はエチレンオキ
サイドおよびプロピレンオキサイドを付加した化
合物を作用させてなる生成物も含まれる。要は平
均して−NCO基を分子中に２個以上有する化合
物はすべて該当し、勿論これらのうち２種以上の
混合物であつても良い。好適なポリイソシアネー
トを挙げれば価格的に比較的安価なトリレン−
２，４−又は２，６−ジイソシアネート及びこれ
らの混合物、ジフエニルメタン−４，4′−ジイソ
シアネート、アニリン／ホルムアルデヒド縮合物
のホスゲン化により製造された２官能又は３官能
以上の高級ポリイソシアネートの混合物（粗製ジ
フエニルメタンジイソシアネート）又はこの混合
物に対して単官能アルコールにエチレンオキサイ
イド又はエチレンオキサイドおよびプロピレンオ
キサイドを付加した化合物を作用させてなる生成
物などがある。 Also included are products obtained by reacting the isocyanate with a compound obtained by adding ethylene oxide or ethylene oxide and propylene oxide to a monofunctional alcohol. In short, all compounds having two or more --NCO groups in the molecule on average are applicable, and of course, a mixture of two or more of these may be used. A suitable polyisocyanate is trilene, which is relatively inexpensive.
2,4- or 2,6-diisocyanates and mixtures thereof, diphenylmethane-4,4'-diisocyanate, mixtures of difunctional or trifunctional or higher polyisocyanates produced by phosgenation of aniline/formaldehyde condensates (crude Diphenylmethane diisocyanate) or a mixture thereof is treated with a compound obtained by adding ethylene oxide or ethylene oxide and propylene oxide to a monofunctional alcohol.
さらに特に好適なポリイソシアネートを挙げれ
ば常温で液状であり、蒸気圧が比較的低く取扱い
易いアニリン／ホルムアルデヒド縮合物のホスゲ
ン化により製造された２官能又は３官能以上の高
級ポリイソシアネートの混合物（粗製ジフエニル
メタンジイソシアネート）又はこの混合物に対し
て単官能アルコールにエチレンオキサイド又はエ
チレンオキサイド及びプロピレンオキサイドを付
加した化合物を作用させてなる生成物などがあ
る。 A particularly suitable polyisocyanate is a mixture of difunctional or trifunctional or higher polyisocyanates (crude diphthalate) produced by phosgenation of an aniline/formaldehyde condensate, which is liquid at room temperature and has a relatively low vapor pressure and is easy to handle. There are products obtained by reacting a compound obtained by adding ethylene oxide or ethylene oxide and propylene oxide to a monofunctional alcohol on a monofunctional alcohol (enylmethane diisocyanate) or a mixture thereof.
本発明でいう表裏面層とは、多層ボードの最も
外側の２層の事であり中芯層とは上記表裏面層の
内側のすべての層の事を言う。 In the present invention, the front and back layers refer to the two outermost layers of the multilayer board, and the core layer refers to all the layers inside the front and back layers.
本発明でいう熱圧成型前のマツト含水率とはバ
インダーが塗付された後、ホツトプレスに挿入さ
れる前のチツプに含まれる水分を絶乾チツプに対
して重量パーセントで示したものである。（以下
単にマツト含水率と称する。）
本発明において、ボード表裏面層のマツト含水
率は20〜40％でなければならず、20％未満では、
有機ポリイソシアネートが均一に分散せず、且つ
樹脂化が不十分となつて従来ボードに比べて曲げ
強さ、表面ハク離強さ、木ねじ保持力の大巾な向
上は期待出来ない。一方ボード表裏面層のマツト
含水率が40％を越える場合には、熱圧時間を延長
する必要があり、パンクも発生し易くなるので、
実用することが難かしい。 In the present invention, the moisture content of the pine before hot-pressing molding refers to the water content in the chips after the binder has been applied and before they are inserted into the hot press, expressed as a percentage by weight of the absolutely dry chips. (Hereinafter, simply referred to as pine moisture content.) In the present invention, the pine moisture content of the front and back layers of the board must be 20 to 40%, and if it is less than 20%,
Since the organic polyisocyanate is not uniformly dispersed and the resinization is insufficient, it is not possible to expect significant improvements in bending strength, surface peeling strength, and wood screw holding power compared to conventional boards. On the other hand, if the moisture content of the pine on the front and back layers of the board exceeds 40%, it is necessary to extend the heat pressing time, and punctures are more likely to occur.
Difficult to put into practice.
ボード中芯層のマツト含水率は５％以下でなけ
ればならず５％を越える場合は中芯層の水蒸気が
抜け難くなり、水分が多すぎるため接着効果が不
十分になり、また解圧した時にボードが割れてし
まう（パンク）等して曲げ強さ、表面ハク離強
さ、木ねじ保持力の向上は期待出来ない。 The moisture content of the pine in the core layer of the board must be 5% or less. If it exceeds 5%, it will be difficult for water vapor to escape from the core layer, and the adhesive effect will be insufficient due to too much moisture, and the pressure will decompress. Sometimes the board cracks (puncture), so improvements in bending strength, surface peeling strength, and wood screw retention cannot be expected.
次に本発明の有機ポリイソシアネートの木材チ
ツプへの塗付量は、その絶乾重量に対してボード
表裏面層において３％以上が必要であり、好まし
くは５〜15％の範囲である。この値が３％未満で
はパーテイクルボードの性能が充分ではなく、逆
に15％を越えると使用量に見合う程の性能向上が
余り期待出来ない。又ボード中芯層における有機
ポリイソシアネートの木材チツプへの塗付量はチ
ツプ絶乾重量に対し１％以上が必要であり好まし
くは、２〜10％の範囲である。この値が１％未満
では、パーテイクルボードの性能が充分ではな
く、逆に10％を越えると使用量に見合う程の性能
向上が余り期待出来ない。従来パーテイクルボー
ドの製造に通常用いられている樹脂、例えば尿素
ホルムアルデヒド樹脂、メラミンホルムアルデヒ
ド樹脂、フエノールホルムアルデヒド樹脂、尿
素・メラミンホルムアルデヒド樹脂、メラミンフ
エノールホルムアルデヒド樹脂等があるが、通常
これらの樹脂は、樹脂分が40〜70％であり、適正
な樹脂添加量は、ボード表裏面層において10〜15
％、ボード中芯層において５〜８％である。その
適正な樹脂添加量を保ちながら、中芯層マツト含
水率を５％以下に保つ事は難かしい。勿論極めて
不揮発分の高い塗布に多大の困難がある樹脂を用
いるか、樹脂吹付後に工程を加えて乾燥する事で
中芯層のマツト含水率を５％以下に保つ事は可能
であるが、これらの手段では実用性に乏しい上、
接着力の発現も劣り、この場合に表裏面層に前記
従来樹脂を用い、表裏面層マツト含水率を20％〜
40％の範囲に保つた場合は勿論これを適正な15％
前後に保つても、有機ポリイソシアネートを用い
る場合の様な特徴は全く得られない。 Next, the amount of the organic polyisocyanate of the present invention applied to the wood chips must be 3% or more, and preferably in the range of 5 to 15%, on the front and back layers of the board based on the absolute dry weight. If this value is less than 3%, the performance of the particle board will not be sufficient, and if it exceeds 15%, it cannot be expected that the performance will improve enough to match the amount used. The amount of organic polyisocyanate applied to the wood chips in the core layer of the board must be 1% or more based on the bone dry weight of the chips, and is preferably in the range of 2 to 10%. If this value is less than 1%, the performance of the particle board will not be sufficient, and if it exceeds 10%, it cannot be expected that the performance will improve enough to match the amount used. Conventionally, there are resins commonly used in the production of particle board, such as urea formaldehyde resin, melamine formaldehyde resin, phenol formaldehyde resin, urea/melamine formaldehyde resin, and melamine phenol formaldehyde resin. is 40 to 70%, and the appropriate amount of resin added is 10 to 15% in the front and back layers of the board.
%, and 5 to 8% in the board core layer. It is difficult to maintain the moisture content of the core layer pine below 5% while maintaining the appropriate amount of resin added. Of course, it is possible to keep the pine moisture content of the core layer below 5% by using a resin that is very difficult to apply with an extremely high non-volatile content, or by adding a drying process after spraying the resin. In addition to being impractical,
Adhesive strength is also poor, and in this case, the above-mentioned conventional resin is used for the front and back layers, and the moisture content of the front and back layers is set to 20% or more.
If you keep it within the 40% range, of course change this to the appropriate 15%.
Even if the temperature is maintained around the same range, the characteristics obtained when using an organic polyisocyanate cannot be obtained at all.
有機ポリイソシアネートは、一般的にマツト含
水率が高くとも、接着剤として有効に作用し、出
来たボード性能も良好であるが、表裏面層のマツ
ト含水率を20〜40％に保ち、中芯層のマツト含水
率を５％以下に保つ事で初めて本発明の目的は達
成される。即ち本発明の方法によれば、パーテイ
クルボードの性能、特に曲げ強さ、表面ハク離強
さ、木ねじ保持力が著しく向上し合板と比較して
も同水準の強度が得られる。この事は、永い間要
望されながら従来技術では突破出来なかつた点で
あり本発明の実用上の価値は極めて高い。 Organic polyisocyanates generally act effectively as adhesives even when the moisture content of the pine is high, and the performance of the resulting board is good. The object of the present invention can only be achieved by keeping the pine moisture content of the layer below 5%. That is, according to the method of the present invention, the performance of particle board, particularly the bending strength, surface peeling strength, and wood screw retention strength, is significantly improved, and even when compared with plywood, the same level of strength can be obtained. This is a point that has been desired for a long time but has not been able to be overcome with the prior art, and the practical value of the present invention is extremely high.
次に実施例によつて本発明を説明するが、本発
明はこれらにより何ら限定されるものではない。
以下において部は特記せぬ限り重量部である。 EXAMPLES Next, the present invention will be explained with reference to Examples, but the present invention is not limited thereto.
In the following, parts are by weight unless otherwise specified.
実施例 １
含水率５％の表裏面層用チツプに水を吹付け含
水率を25％に調整し、これにMDI−CR−200（三
井東圧化学(株)の商品、粗製ジフエニルメタンジイ
ソシアネート）を常法により絶乾チツプ重量に対
して14％塗付した。Example 1 Water was sprayed on chips for the front and back layers with a moisture content of 5% to adjust the moisture content to 25%, and MDI-CR-200 (a product of Mitsui Toatsu Chemical Co., Ltd., crude diphenylmethane diisocyanate) was added to the chips. ) was applied in an amount of 14% based on the weight of the bone dry chips using a conventional method.
含水率３％の中芯層用チツプに上記MDI−CR
−200を絶乾チツプ重量に対して2.5％塗付した。
樹脂塗付後の表裏面層と中芯層のチツプの重量比
が（表面層）：（中芯層）：（裏面層）＝１：３：１
になる様フオーミングし熱圧温度170℃、熱圧時
間6min、圧締圧30Kgｆ／m2で板厚13ｍ／ｍ、平
均ボード密度0.8ｇ／cm3に成型した。JIS Ａ−
5908に定められた方法でボード物性を評価した結
果以下の通りであつた。 The above MDI-CR is added to the core layer chip with a moisture content of 3%.
-200 was applied at 2.5% based on the weight of the bone dry chips.
The weight ratio of chips between the front and back layers and the core layer after resin coating is (surface layer): (core layer): (back layer) = 1:3:1
The board was formed to have a board thickness of 13 m/m and an average board density of 0.8 g/cm 3 at a hot pressing temperature of 170°C, a hot pressing time of 6 minutes, and a compacting pressure of 30 kgf/m 2 . JIS A-
The physical properties of the board were evaluated using the method specified in 5908, and the results were as follows.
曲げ強さ 484Kgｆ／cm2
表面ハク離強さ 41Kgｆ／cm2
木ねじ保持力 120Kgｆ
(注)表面ハク離強さは、JIS Ａ−5908には、定めら
れていないが、５cm×５cmの試験片を採取し、
表面に接着面が10cm2である様な治具を貼りつ
け、荷重速度１mm／minで板面に垂直な方向に
引張り試験を行なつた。Bending strength 484Kgf/cm 2 Surface peeling strength 41Kgf/cm 2 Wood screw retention force 120Kgf (Note) Surface peeling strength is not specified in JIS A-5908, but a 5cm x 5cm test piece was Collect,
A jig with an adhesive surface of 10 cm 2 was attached to the surface, and a tensile test was conducted in a direction perpendicular to the board surface at a loading rate of 1 mm/min.
以下の実施例、参考例、比較例にある表面ハ
ク離強さも総てこの方法で測定されている。 The surface peel strength in the Examples, Reference Examples, and Comparative Examples below were all measured by this method.
参考例 １
市販されている厚さ12ｍ／ｍのコンクリート型
わく用合板について、実施例１と同じ様に曲げ強
さの試験を行なつた。試験片は、表板の繊維と平
行な方向と直角な方向とから採取し、両者の曲げ
強さの平均値は以下のとおりである。Reference Example 1 A bending strength test was conducted in the same manner as in Example 1 on commercially available plywood for concrete mold frames with a thickness of 12 m/m. The test pieces were taken from the direction parallel to and perpendicular to the fibers of the top plate, and the average values of the bending strengths of both were as follows.
また同時に表面ハク離強さ、木ねじ保持力も測
定した結果を併記する。 At the same time, the results of measuring the surface peeling strength and wood screw retention strength are also listed.
曲げ強さ 420Kgｆ／cm2
表面ハク離強さ 39Kgｆ／cm2
木ねじ保持力 130Kgｆ
実施例 ２
含水率27％の表裏面層用のチツプに対して、
TDI−80／20（三井東圧化学(株)の２，４−トリレ
ンジイソシアネートと２，６−トリレンジイソシ
アネートとの80／20（重量比）の混合物）を絶乾
チツプ重量に対して12％塗付した。含水率４％の
中芯層用のチツプに対し、上記TDI−80／20を絶
乾チツプ重量に対して９％塗付した。樹脂吹付後
の表裏面層と中芯層用のチツプ重量比が１：４：
１になる様にフオーミングし、熱圧温度160℃、
熱圧時間10min、圧締圧30Kgｆ／cm2で板厚15ｍ／
ｍ平均ボード密度0.78ｇ／cm3に成型した。JIS Ａ
−5908に定められた方法でボードの物性を評価し
た。Bending strength 420Kgf/cm 2 Surface peeling strength 39Kgf/cm 2 Wood screw retention force 130Kgf Example 2 For chips for front and back layers with a moisture content of 27%,
TDI-80/20 (80/20 (weight ratio) mixture of 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate from Mitsui Toatsu Chemical Co., Ltd.) was added to % applied. The above TDI-80/20 was applied in an amount of 9% based on the weight of the bone dry chip to a core layer chip having a moisture content of 4%. Chip weight ratio for front and back layers and core layer after resin spraying is 1:4:
1, heat pressure temperature 160℃,
Heat pressing time 10min, pressing pressure 30Kgf/ cm2 , plate thickness 15m/
It was molded to an average board density of 0.78 g/cm 3 . JIS A
The physical properties of the board were evaluated using the method specified in -5908.
曲げ強さ 459Kgｆ／cm2
表面ハク離強さ 40Kgｆ／cm2
木ねじ保持力 135Kgｆ
実施例 ３
ジエチレングリコールモノメチルエーテル
219.0部と水酸化カリウム4.45部をオートクレー
ブに入れ、窒素ガス置換後90℃に昇温してからエ
チレンオキサイド1052部を加圧下に反応させ、更
にプロピレンオキサイド211.4部を反応させた。
その後反応生成物を理論量のりん酸で中和しろ過
後製品とした。（以下この製品をＡ−１と略称）
この化合物Ａ−１の25部を反応容器に仕込み、窒
素気流下常温て1000部のMDI−CR−200（三井東
圧化学(株)）の商品、粗製ジフエニルメタンジイソ
シアネート）を装入、混合し反応容器の内温を80
℃まで昇温し、80℃にて２時間混合撹拌した。得
られた反応物（以下AI−１と略称）は粘度195セ
ンチポイズ（25℃）であつた。この化合物AI−
１を33％の濃度になる様水中へ分散させ、含水率
13％の表裏面層用チツプにこの分散液を、化合物
AI−１が絶乾チツプ重量に対して６％になる様
塗付した。この時表裏面層用のマツト含水率は25
％であつた。Bending strength 459Kgf/cm 2 Surface peeling strength 40Kgf/cm 2 Wood screw retention force 135Kgf Example 3 Diethylene glycol monomethyl ether
219.0 parts and 4.45 parts of potassium hydroxide were placed in an autoclave, the autoclave was purged with nitrogen gas, the temperature was raised to 90°C, and 1052 parts of ethylene oxide were reacted under pressure, followed by further reaction with 211.4 parts of propylene oxide.
Thereafter, the reaction product was neutralized with a theoretical amount of phosphoric acid and filtered to obtain a product. (Hereinafter, this product will be abbreviated as A-1)
25 parts of this compound A-1 was charged into a reaction vessel, and 1000 parts of MDI-CR-200 (a product of Mitsui Toatsu Chemical Co., Ltd., crude diphenylmethane diisocyanate) was charged and mixed at room temperature under a nitrogen atmosphere. and the internal temperature of the reaction vessel to 80
The mixture was heated to 80°C and mixed and stirred for 2 hours. The obtained reaction product (hereinafter abbreviated as AI-1) had a viscosity of 195 centipoise (25°C). This compound AI−
1 in water to a concentration of 33%, and the water content
This dispersion was applied to the 13% front and back layer chips, and the compound
AI-1 was applied in an amount of 6% based on the weight of the bone dry chips. At this time, the pine moisture content for the front and back layers is 25
It was %.
含水率３％の中芯層用チツプにMDI−CR−
200を絶乾チツプに対して５％塗付した。 MDI-CR- for the core layer chip with a moisture content of 3%
200 was applied at 5% to bone dry chips.
樹脂吹付後の表裏面層と中芯層のチツプの重量
比が１：３：１になる様フオーミングし熱圧温度
170℃、熱圧時間6min、圧締圧30Kgｆ／cm2で板厚
13ｍ／ｍ、平均ボード密度0.8ｇ／cm3に成型した。
JIS Ａ−5908に定められた方法でボード物性を評
価した結果以下の通りであつた。 After resin spraying, the chips are formed so that the weight ratio of the front and back layers and the core layer chips is 1:3:1, and heated to a hot pressure temperature.
170℃, heat pressure time 6min, compaction pressure 30Kgf/ cm2 , plate thickness
13 m/m and an average board density of 0.8 g/cm 3 .
The physical properties of the board were evaluated using the method specified in JIS A-5908, and the results were as follows.
曲げ強さ 425Kgｆ／cm2
表面ハク離強さ 42Kgｆ／cm2
木ねじ保持力 135Kgｆ
比較例 １
実施例１で用いた含水率５％の表裏面層用チツ
プに水を吹付け含水率を15％に調整し以下実施例
１と全く同様の方法でパーテイクルボードを成型
した。JIS−A5908に定められた方法でボードの
物性を評価した結果、以下の通りであつた。Bending strength 425Kgf/cm 2 Surface peeling strength 42Kgf/cm 2 Wood screw retention strength 135Kgf Comparative example 1 Water was sprayed on the front and back layer chips used in Example 1 with a moisture content of 5% to bring the moisture content to 15%. After adjustment, a particle board was molded in exactly the same manner as in Example 1. The physical properties of the board were evaluated using the method specified in JIS-A5908, and the results were as follows.
曲げ強さ 254Kgｆ／cm2
表面ハク離強さ 17Kgｆ／cm2
木ねじ保持力 75Kgｆ
この様にボード性能は一般的なパーテイクルボ
ードの水準は充分に越えているが、合板の域には
達しない。Bending strength: 254Kgf/cm 2 Surface peeling strength: 17Kgf/cm 2 Wood screw retention strength: 75Kgf As you can see, the board performance is well above the level of general particle board, but it does not reach the level of plywood.
比較例 ２
実施例１で用いた含水率３％の中芯層用チツプ
に水を吹付け含水率を10％に調整し、これ以外は
すべて実施例１と同様の方法でパーテイクルボー
ドを成型した。JIS−A5908に定められた方法で
ボードの物性を評価した結果、以下の通りであつ
た。Comparative Example 2 Particle board was molded in the same manner as in Example 1 except by spraying water on the core layer chips with a moisture content of 3% used in Example 1 and adjusting the moisture content to 10%. did. The physical properties of the board were evaluated using the method specified in JIS-A5908, and the results were as follows.
曲げ強さ 271Kgｆ／cm2
表面ハク離強さ 21Kgｆ／cm2
木ねじ保持力 69Kgｆ
この様にボード性能は一般的なパーテイクルボ
ードの水準は充分に越えているが、合板の域には
達しない。Bending strength: 271Kgf/cm 2 Surface peeling strength: 21Kgf/cm 2 Wood screw retention strength: 69Kgf As you can see, the board performance is well above the standard of general particle board, but it does not reach the level of plywood.
比較例 ３
尿素ホルムアルデヒド樹脂液（三井東圧化学(株)
の商品ユーロイド755、樹脂分65％）を用い下記
の様な重量割合で配合糊液をつくり
ユーロイド755 100部
水 ８ 〃
NH4Cl １ 〃
実施例１で用いた含水率５％の表裏面層用チツ
プに対して塗付した。樹脂固形分吹付率は絶乾チ
ツプ重量に対して15％とした。Comparative example 3 Urea formaldehyde resin liquid (Mitsui Toatsu Chemical Co., Ltd.)
Using the product Euroid 755 (resin content: 65%), prepare a paste solution with the following weight ratio: Euroid 755 100 parts Water 8 〃 NH 4 Cl 1 〃 Front and back layers with a water content of 5% used in Example 1 It was applied to the tip. The resin solid content spraying rate was 15% based on the weight of the bone dry chips.
実施例１で用いた含水率３％の中芯層用チツプ
に上記配合糊液を樹脂固形分吹付率が絶乾チツプ
重量に対して９％になる様に塗付した。この時の
マツト含水率は表裏面層が15％、中芯層が９％で
あつた。 The above blended size liquid was applied to the core layer chips used in Example 1 with a water content of 3% so that the resin solid content spraying rate was 9% based on the weight of the bone-dry chips. The moisture content of the pine at this time was 15% in the front and back layers and 9% in the middle core layer.
樹脂吹付後の表裏面層と中芯層チツプの重量比
が１：３：１になる様フオーミングし、熱圧温度
170℃、熱圧時間6min、圧締圧30Kgｆ／cm2で板厚
13ｍ／ｍ、平均ボード密度0.8ｇ／cm3に成型した。
JIS Ａ−5908に定められた方法でボードの物性を
評価した結果以下の通りであつた。 Forming is performed so that the weight ratio of the front and back layers and the core layer chips after resin spraying is 1:3:1, and the heat-pressing temperature is
170℃, heat pressure time 6min, compaction pressure 30Kgf/ cm2 , plate thickness
13 m/m and an average board density of 0.8 g/cm 3 .
The physical properties of the board were evaluated using the method specified in JIS A-5908, and the results were as follows.
曲げ強さ 215Kgｆ／cm2
表面ハク離強さ 16Kgｆ／cm2
木ねじ保持力 55Kgｆ／cm2
以上の様にボード性能は一般的なパーテイクル
ボードの水準には充分達しているが、合板の域に
は達しない。Bending strength: 215Kgf/cm 2 Surface peeling strength: 16Kgf/cm 2 Wood screw retention strength: 55Kgf/cm 2 As shown above, the board performance has fully reached the level of general particle board, but it is in the level of plywood. is not reached.
Claims (1)
際し、バインダーとして有機ポリイソシアネート
を用い、表裏面層の熱圧成形前のマツト含水率を
20重量％〜40重量％、中芯層のマツト含水率を５
重量％以下に保ち、且つ有機ポリイソシアネート
を乾燥木材チツプに対して、表裏面層が３〜15重
量％、中芯層が１〜10重量％の割合で含水マツト
に塗布し、次いで熱圧する事を特徴とする多層構
造のパーテイクルボード製造方法。1 When manufacturing particle board with a multilayer structure, organic polyisocyanate is used as a binder, and the moisture content of the pine is controlled before hot-press molding of the front and back layers.
20% to 40% by weight, pine moisture content of the middle core layer 5
% by weight or less, and apply organic polyisocyanate to the dry wood chips at a ratio of 3 to 15% by weight for the front and back layers and 1 to 10% by weight for the core layer, and then heat press. A method for manufacturing particle board with a multilayer structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16279181A JPS5863434A (en) | 1981-10-14 | 1981-10-14 | Manufacture of particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16279181A JPS5863434A (en) | 1981-10-14 | 1981-10-14 | Manufacture of particle board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5863434A JPS5863434A (en) | 1983-04-15 |
| JPS647842B2 true JPS647842B2 (en) | 1989-02-10 |
Family
ID=15761270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16279181A Granted JPS5863434A (en) | 1981-10-14 | 1981-10-14 | Manufacture of particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5863434A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2354909A1 (en) * | 2001-08-08 | 2003-02-08 | Liheng Chen | Low density oriented strand board |
| US6632873B2 (en) * | 2001-11-19 | 2003-10-14 | Ashland, Inc. | Two-part polyurethane adhesives for structural finger joints and method therefor |
| CN100434267C (en) * | 2005-11-11 | 2008-11-19 | 蒋世亮 | Composite board made of timber and alumina only and its making process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH605104A5 (en) * | 1973-12-22 | 1978-09-29 | Texaco Ag | |
| ZA794752B (en) * | 1978-09-29 | 1980-08-27 | Upjohn Co | Polymeric isocyanate binder with internal release agent |
-
1981
- 1981-10-14 JP JP16279181A patent/JPS5863434A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5863434A (en) | 1983-04-15 |
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