JPS647631A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS647631A
JPS647631A JP62162914A JP16291487A JPS647631A JP S647631 A JPS647631 A JP S647631A JP 62162914 A JP62162914 A JP 62162914A JP 16291487 A JP16291487 A JP 16291487A JP S647631 A JPS647631 A JP S647631A
Authority
JP
Japan
Prior art keywords
bonding
coordinates
temperature
corrected
displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62162914A
Other languages
Japanese (ja)
Inventor
Atsushi Takahashi
Yasuhisa Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62162914A priority Critical patent/JPS647631A/en
Publication of JPS647631A publication Critical patent/JPS647631A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the generation of the shortage of bonding strength, etc., due to the short circuit of a ball and an internal wiring and the reduction of the area of the contact bonding of the ball and an electrode by measuring the temperature of a semiconductor element during bonding, arithmetically operating the displacement of the position coordinates of the electrode due to the thermal expansion of the element and bonding a wire while the coordinates are corrected. CONSTITUTION:In a thermocompression wire bonding method, the temperature of a semiconductor element 8 during bonding is measured, the displacement of the position coordinates of an electrode due to the thermal expansion of the element 8 is arithmetically operated, and wires are bonded while the coordinates are corrected. Picture information by a TV camera 1 is binary-coded by a picture processor 2, the retrieval of a recognition area on the element 8 and the arithmetic operation of the quantity of displacement from a reference position are conducted by a control unit 3, and the origin of the coordinates of bonding memorized to a memory 4 is corrected. The temperature of the element 8 is detected by a temperature sensor 9 fitted to a heating plate 10, the thermal expansion coefficient of the element 8 is input previously to a coordinate arithmetic unit 5, and the quantities of displacement of the coordinates of each electrode 12 due to the thermal expansion of the element 8 at the temperature are arithmetically operated, and corrected.
JP62162914A 1987-06-30 1987-06-30 Wire bonding method Pending JPS647631A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62162914A JPS647631A (en) 1987-06-30 1987-06-30 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62162914A JPS647631A (en) 1987-06-30 1987-06-30 Wire bonding method

Publications (1)

Publication Number Publication Date
JPS647631A true JPS647631A (en) 1989-01-11

Family

ID=15763627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62162914A Pending JPS647631A (en) 1987-06-30 1987-06-30 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS647631A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258866A (en) * 1991-03-18 1993-11-02 Alps Electric Co., Ltd. Method of connecting liquid crystal display and circuit board with thermal expansion compensation
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258866A (en) * 1991-03-18 1993-11-02 Alps Electric Co., Ltd. Method of connecting liquid crystal display and circuit board with thermal expansion compensation
JP2002261114A (en) * 2001-03-02 2002-09-13 Nec Corp Wire bonding apparatus and wire bonding method

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