JPS6475296A - Plastic package for memory medium built-in card - Google Patents
Plastic package for memory medium built-in cardInfo
- Publication number
- JPS6475296A JPS6475296A JP62230982A JP23098287A JPS6475296A JP S6475296 A JPS6475296 A JP S6475296A JP 62230982 A JP62230982 A JP 62230982A JP 23098287 A JP23098287 A JP 23098287A JP S6475296 A JPS6475296 A JP S6475296A
- Authority
- JP
- Japan
- Prior art keywords
- case half
- case
- engagement
- face
- projecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
PURPOSE: To uniformly and strongly adhere joint faces of the outer periphery of case halves, by comprising a first case half comprising an engagement part of a recessed part and a second case half comprising a second engagement part of a projecting part to be engaged with the first engagement part of the first case half, and adhering the first and second engagement parts with an adhesive agent. CONSTITUTION: A recessed part 101c of a case half 101 is coated with an adhesive agent 105, then a storage part 103a and a connector 103b of a card main body 103 are mounted on an adhesive part 101b and a connector holding part 101e of the case half 101, and a case half 102 is overlapped to the case half 101. On this occasion, a projecting part 102c formed on a joint face 102b of the case half 102 is fitted to the recessed part 101c formed on the joint face 101b of the case half 101, a point face of the projecting part 102c is brought into contact with a bottom face of the recessed part 101c, and the pressure is added from the outside of one of the case halves, so that the point of the projecting part 102c is compressed and deformed to be expanded outward, whereby the joint faces 101b, 102b are closely adhered with each other.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62230982A JPS6475296A (en) | 1987-09-17 | 1987-09-17 | Plastic package for memory medium built-in card |
US07/151,982 US4798946A (en) | 1987-04-09 | 1988-02-03 | Plastic package for an IC card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62230982A JPS6475296A (en) | 1987-09-17 | 1987-09-17 | Plastic package for memory medium built-in card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6475296A true JPS6475296A (en) | 1989-03-20 |
Family
ID=16916373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62230982A Pending JPS6475296A (en) | 1987-04-09 | 1987-09-17 | Plastic package for memory medium built-in card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6475296A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0345397A (en) * | 1989-07-13 | 1991-02-26 | Mitsubishi Electric Corp | Ic card |
CN100412891C (en) * | 2005-09-20 | 2008-08-20 | 财团法人工业技术研究院 | Package structure of radio-frequency identifying volume label jointed with microassembly |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232641A (en) * | 1985-04-09 | 1986-10-16 | Nec Corp | Semiconductor package |
JPS6148429B2 (en) * | 1978-06-28 | 1986-10-24 | Ricoh Kk |
-
1987
- 1987-09-17 JP JP62230982A patent/JPS6475296A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148429B2 (en) * | 1978-06-28 | 1986-10-24 | Ricoh Kk | |
JPS61232641A (en) * | 1985-04-09 | 1986-10-16 | Nec Corp | Semiconductor package |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0345397A (en) * | 1989-07-13 | 1991-02-26 | Mitsubishi Electric Corp | Ic card |
CN100412891C (en) * | 2005-09-20 | 2008-08-20 | 财团法人工业技术研究院 | Package structure of radio-frequency identifying volume label jointed with microassembly |
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