JPS6473751A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS6473751A
JPS6473751A JP22966587A JP22966587A JPS6473751A JP S6473751 A JPS6473751 A JP S6473751A JP 22966587 A JP22966587 A JP 22966587A JP 22966587 A JP22966587 A JP 22966587A JP S6473751 A JPS6473751 A JP S6473751A
Authority
JP
Japan
Prior art keywords
resin
lead terminals
lead
section
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22966587A
Other languages
Japanese (ja)
Inventor
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP22966587A priority Critical patent/JPS6473751A/en
Publication of JPS6473751A publication Critical patent/JPS6473751A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve a semiconductor device of this design in a moisture resistant property and prevent it from decreasing in a breakdown strength and its terminal leads from being contaminated due to the migration of metal by a method wherein polyimide resin is formed to cover a lead terminal adjacent to the interface section between a resin sealed section and a non-resin sealed section. CONSTITUTION:A semiconductor device is composed of a semiconductor element mounting section 1, a semiconductor element 2, lead terminals 3, bonding wires 4, a sealing resin 5, and a polyimide series resin layer 6. The lead terminals 3 are reinforced by a tie bar 3a, polyimide series resin is applied through printing onto both faces of the lead terminals 3 adjacent to and along the profile of the resin sealed section 5 indicated by a one-dot chain line and made to be hardened for the formation of the polyimide series resin layer 6 as it covers. The resin layer 6 is made to be into a belt-like film covering spaces between the adjacent lead terminals aid fixes the terminals firmly. Next, the semiconductor element 2 is mounted on a semiconductor mounting section 1 of a lead frame, an electrode of the element is connected with the lead terminals through the intermediary of bonding wires 4, sealing is accomplished using the sealing resing 5, and frame 7 and the tie bar 3a are removed.
JP22966587A 1987-09-16 1987-09-16 Resin sealed semiconductor device Pending JPS6473751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22966587A JPS6473751A (en) 1987-09-16 1987-09-16 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22966587A JPS6473751A (en) 1987-09-16 1987-09-16 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS6473751A true JPS6473751A (en) 1989-03-20

Family

ID=16895758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22966587A Pending JPS6473751A (en) 1987-09-16 1987-09-16 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6473751A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004729A1 (en) * 1990-09-10 1992-03-19 Olin Corporation Leadframe for molded plastic electronic packages

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134560A (en) * 1978-04-11 1979-10-19 Toshiba Corp Resin-sealed semiconductor device
JPS59161846A (en) * 1983-03-07 1984-09-12 Nec Corp Semiconductor device
JPS61147555A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134560A (en) * 1978-04-11 1979-10-19 Toshiba Corp Resin-sealed semiconductor device
JPS59161846A (en) * 1983-03-07 1984-09-12 Nec Corp Semiconductor device
JPS61147555A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004729A1 (en) * 1990-09-10 1992-03-19 Olin Corporation Leadframe for molded plastic electronic packages
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions

Similar Documents

Publication Publication Date Title
KR950013744B1 (en) Printed circuit devices using thermoplastic resin cover plate
KR970053752A (en) L.O.C (Lead On Chip) Package and Manufacturing Method
ATE154167T1 (en) METHOD AND DEVICE FOR ELIMINating SHORT-CIRCUIT AREAS IN SEMICONDUCTOR ELEMENTS
DE3584917D1 (en) METHOD FOR FORMING HERMETICALLY CLOSED ELECTRICAL APPLICATION LADDERS.
DE3879021D1 (en) ELECTRICAL FUSE AND METHOD FOR THEIR PRODUCTION.
SG60102A1 (en) Lead frame semiconductor package having the same and method for manufacturing the same
KR910007094A (en) Resin Sealed Semiconductor Device
JPS6473751A (en) Resin sealed semiconductor device
HK106694A (en) Resin-sealed type semiconductor device and method for manufacturing the same
KR850006259A (en) Manufacturing method of resin-sealed semiconductor device
JPS57130437A (en) Sealing method of ic
JPS57173948A (en) Manufacture of semiconductor device
JPS55138241A (en) Sealing structure for semiconductor device
JPS5516449A (en) Semiconductor device
JPH0382059A (en) Resin sealed type semiconductor device
JPS59188947A (en) Manufacture of resin sealed type semiconductor device
JPS6477152A (en) Lead frame
JPS6435921A (en) Manufacture of semiconductor device
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS57177538A (en) Manufacturing method for semiconductor device
JPS6449249A (en) Resin sealed semiconductor device
JPS57118657A (en) Lead frame for resin sealed type semiconductor device
JPH02181460A (en) Semiconductor device
JPS574146A (en) Package of semiconductor device
JPS57194560A (en) Lead frame