JPS6472589A - Thick film resistance circuit device - Google Patents

Thick film resistance circuit device

Info

Publication number
JPS6472589A
JPS6472589A JP62229039A JP22903987A JPS6472589A JP S6472589 A JPS6472589 A JP S6472589A JP 62229039 A JP62229039 A JP 62229039A JP 22903987 A JP22903987 A JP 22903987A JP S6472589 A JPS6472589 A JP S6472589A
Authority
JP
Japan
Prior art keywords
thick film
substrate
circuit device
employed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62229039A
Other languages
Japanese (ja)
Inventor
Tomio Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62229039A priority Critical patent/JPS6472589A/en
Publication of JPS6472589A publication Critical patent/JPS6472589A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE:To obtain an inexpensive thick film resistance circuit device by connecting a conductor circuit to a thick film resistor by using conductive paste in which metal powder coated with Ag is employed as a conductive material. CONSTITUTION:Conductive circuits 12a, 12b formed on a substrate 11 of base metal, a polymer series thick film resistor 14 formed on the substrate 11, and connecting electrodes 13a, 13b so formed of polymer series conductive paste in which metal powder coated with Ag is employed as a conductive material as to connect the circuits 12a, 12b to a polymer series thick film resistor 14 are provided. For example, the electrodes 13a, 13b are formed by printing and baking resin conductive paste in which less expensive metal powder than the Ag, such as Cu, Ni, etc., is coated with the Ag and employed as a conductive material on the substrate 11 so that both ends are superposed on the circuits 12a, 12b. The resistor 14 is so formed on the substrate 11 that the electrode connectors 14a, 14b of both ends are superposed on the electrodes 13a, 13b.
JP62229039A 1987-09-11 1987-09-11 Thick film resistance circuit device Pending JPS6472589A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62229039A JPS6472589A (en) 1987-09-11 1987-09-11 Thick film resistance circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62229039A JPS6472589A (en) 1987-09-11 1987-09-11 Thick film resistance circuit device

Publications (1)

Publication Number Publication Date
JPS6472589A true JPS6472589A (en) 1989-03-17

Family

ID=16885786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62229039A Pending JPS6472589A (en) 1987-09-11 1987-09-11 Thick film resistance circuit device

Country Status (1)

Country Link
JP (1) JPS6472589A (en)

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