JPS6472541A - Conveying apparatus for semiconductor device - Google Patents
Conveying apparatus for semiconductor deviceInfo
- Publication number
- JPS6472541A JPS6472541A JP22933587A JP22933587A JPS6472541A JP S6472541 A JPS6472541 A JP S6472541A JP 22933587 A JP22933587 A JP 22933587A JP 22933587 A JP22933587 A JP 22933587A JP S6472541 A JPS6472541 A JP S6472541A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- semiconductor device
- conveying
- lead
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To make it possible to deliver a plurality of semiconductor devices connected in an aligned form to lead electrodes to the apparatus of the succeeding process in such aligned array by separating an intermediate frame and a bottom frame by leaving only one lead electrode which connects the semiconductor to a top frame, while conveying at a preset pitch a long size metal frame formed by bending. CONSTITUTION:A conveying means, which operates at a preset pitch a conveying of formed parts including an intermediate frame 74 of a long size frame consisting of a semiconductor device 44 which is connected through a plurality of lead wires 71-73 to a top frame 75, a bottom frame 76, an intermediate frame 74 being placed at a preset interval, and to the intermediate frame 74 between the top frame 75 and the bottom frame 76 is provided. Such conveying means has an electrode cutting means which performs a cutting of electrodes 72 and 73 for the semiconductor device 44 delivered at the preset pitch as referred to above, while leaving only one lead electrode connected to the top frame 75; a separating means which performs, after cutting the electrodes, the separation of the bottom frame 76 and the intermediate frame 74 which surround the semiconductor device 44 delivered at the preset pitch as referred to above; and a feeding means which performs a feeding of the semiconductor 44 which has been connected only by one lead wire 71 to the top frame 75 as it is.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22933587A JPS6472541A (en) | 1987-09-11 | 1987-09-11 | Conveying apparatus for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22933587A JPS6472541A (en) | 1987-09-11 | 1987-09-11 | Conveying apparatus for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6472541A true JPS6472541A (en) | 1989-03-17 |
Family
ID=16890543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22933587A Pending JPS6472541A (en) | 1987-09-11 | 1987-09-11 | Conveying apparatus for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6472541A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438845A (en) * | 1990-06-04 | 1992-02-10 | Mitsubishi Electric Corp | Electrical characteristic inspection device for semiconductor device |
-
1987
- 1987-09-11 JP JP22933587A patent/JPS6472541A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438845A (en) * | 1990-06-04 | 1992-02-10 | Mitsubishi Electric Corp | Electrical characteristic inspection device for semiconductor device |
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