JPS6466228A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS6466228A JPS6466228A JP22475087A JP22475087A JPS6466228A JP S6466228 A JPS6466228 A JP S6466228A JP 22475087 A JP22475087 A JP 22475087A JP 22475087 A JP22475087 A JP 22475087A JP S6466228 A JPS6466228 A JP S6466228A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- thermosetting resin
- molecule
- containing diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the titled composition, containing a polymaleimide compound, specific polyepoxy compound and spiroacetal ring-containing diamine in a specific proportion, capable of improving brittleness, having excellent moldability, heat and impact resistance and useful for producing molded products and sealing. CONSTITUTION:The aimed composition consisting of (A) 2-10wt.% polymaleimide compound having >=2 maleimide groups in one molecule (e.g., diaminodiphenylmethanebismaleimide), (B) 40-80wt.% polyepoxy compound, having >=2 epoxy groups in one molecule and capable of providing a liquid state at 80 deg.C and (C) 15-50wt.% spiroacetal ring-containing diamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22475087A JPS6466228A (en) | 1987-09-08 | 1987-09-08 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22475087A JPS6466228A (en) | 1987-09-08 | 1987-09-08 | Thermosetting resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6466228A true JPS6466228A (en) | 1989-03-13 |
Family
ID=16818651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22475087A Pending JPS6466228A (en) | 1987-09-08 | 1987-09-08 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466228A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949034A (en) * | 1988-09-07 | 1990-08-14 | Mitsubishi Kinzoku Kabushiki Kaisha | Method for contactless evaluation of characteristics of semiconductor wafers and devices |
| JP2017071705A (en) * | 2015-10-08 | 2017-04-13 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition and cured product thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010900A (en) * | 1973-06-01 | 1975-02-04 | ||
| JPS5046799A (en) * | 1972-10-31 | 1975-04-25 | ||
| JPS6121132A (en) * | 1984-07-10 | 1986-01-29 | Mitsubishi Petrochem Co Ltd | Resin composition for solder resist |
-
1987
- 1987-09-08 JP JP22475087A patent/JPS6466228A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5046799A (en) * | 1972-10-31 | 1975-04-25 | ||
| JPS5010900A (en) * | 1973-06-01 | 1975-02-04 | ||
| JPS6121132A (en) * | 1984-07-10 | 1986-01-29 | Mitsubishi Petrochem Co Ltd | Resin composition for solder resist |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949034A (en) * | 1988-09-07 | 1990-08-14 | Mitsubishi Kinzoku Kabushiki Kaisha | Method for contactless evaluation of characteristics of semiconductor wafers and devices |
| JP2017071705A (en) * | 2015-10-08 | 2017-04-13 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition and cured product thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57143320A (en) | Novel curable resin composition | |
| DE60036038D1 (en) | Adhesive, adhesive article, circuit substrate for semiconductor mounting with an adhesive and a semiconductor device containing the same | |
| ATE107677T1 (en) | EPOXY RESIN BLENDS. | |
| DE3561397D1 (en) | Chemically curable resins derived from 1-oxa-3-aza-tetralin groups containing compounds and cycloaliphatic epoxy resins, process for their preparation and cure as well as the use of such resins | |
| JPS57179268A (en) | Epoxy resin adhesive composition | |
| JPS56110760A (en) | Curable resin composition | |
| JPS6466228A (en) | Thermosetting resin composition | |
| FR2609467B1 (en) | THERMOSETTING COMPOSITIONS BASED ON IMIDE AND EPOXY GROUPS | |
| JPS54142298A (en) | Heat-resistant curable resin composition | |
| JPS5230837A (en) | Thermostable compositions for use in adhesives and thermostable lamina ted boards | |
| JPS5236141A (en) | Process for manufacturing mica-thermoplastic resin composite materials | |
| DE3474556D1 (en) | Process for producing a coating comprising a mixture of an epoxy resin and a curing agent | |
| JPS56127630A (en) | Curable resin composition | |
| EP0428863A3 (en) | Epoxy resin mixtures | |
| JPS5471197A (en) | Curable resin composition | |
| JPS55165915A (en) | Thermosetting resin composition | |
| JPS5770119A (en) | Production of modified pehnol resin | |
| JPS6448826A (en) | Thermosetting resin composition | |
| JPS5229851A (en) | Epoxy resin composition for press molding and its preparation | |
| JPS6433118A (en) | Epoxy resin composition and its cured product | |
| JPS5397097A (en) | Preparation of heat resistant molding articles | |
| JPS6420262A (en) | Thermosetting resin composition | |
| JPS57170957A (en) | Heat-resistant and flame-resistant resin composition | |
| JPS6429456A (en) | Resin composition | |
| JPS5643745A (en) | Base material for heat sink of power transistor |