JPS6465847A - Sealing/molding device for semiconductor electronic component - Google Patents
Sealing/molding device for semiconductor electronic componentInfo
- Publication number
- JPS6465847A JPS6465847A JP22332587A JP22332587A JPS6465847A JP S6465847 A JPS6465847 A JP S6465847A JP 22332587 A JP22332587 A JP 22332587A JP 22332587 A JP22332587 A JP 22332587A JP S6465847 A JPS6465847 A JP S6465847A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- lead
- resin
- sealing
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a molding resin, which flows out of molding parts after a sealing and a molding are performed, from adhering on leads by a method wherein a groove interpenetrated to the molding parts is provided at an opposed part to the unnecessary lead of a lead frame along the unnecessary lead. CONSTITUTION:A lead frame 2 is set at a prescribed position on a molding device main body 7 and one half of the main body 7 is set on the main body 7 in such a way as to cover the lead frame 2. A resin molding is performed at molding parts 8, but a groove 11 interpenetrated to the molding parts 8 is provided at an opposed part to an unnecessary lead 4 of the lead frame 2 of the main body 7 along the unnecessary lead 4. The air remained at the time of resin sealing and resin molding is exhausted to the outside passing through this groove 11. As an necessary resin 6 is removed along with the unnecessary lead 4 when the lead 4 is removed, a work is simplified.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22332587A JPS6465847A (en) | 1987-09-07 | 1987-09-07 | Sealing/molding device for semiconductor electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22332587A JPS6465847A (en) | 1987-09-07 | 1987-09-07 | Sealing/molding device for semiconductor electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6465847A true JPS6465847A (en) | 1989-03-13 |
Family
ID=16796383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22332587A Pending JPS6465847A (en) | 1987-09-07 | 1987-09-07 | Sealing/molding device for semiconductor electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6465847A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517382B2 (en) * | 1975-03-03 | 1980-05-10 | ||
JPS5923554A (en) * | 1982-07-30 | 1984-02-07 | Hitachi Ltd | Lead frame for semiconductor device |
-
1987
- 1987-09-07 JP JP22332587A patent/JPS6465847A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517382B2 (en) * | 1975-03-03 | 1980-05-10 | ||
JPS5923554A (en) * | 1982-07-30 | 1984-02-07 | Hitachi Ltd | Lead frame for semiconductor device |
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