JPS6465847A - Sealing/molding device for semiconductor electronic component - Google Patents

Sealing/molding device for semiconductor electronic component

Info

Publication number
JPS6465847A
JPS6465847A JP22332587A JP22332587A JPS6465847A JP S6465847 A JPS6465847 A JP S6465847A JP 22332587 A JP22332587 A JP 22332587A JP 22332587 A JP22332587 A JP 22332587A JP S6465847 A JPS6465847 A JP S6465847A
Authority
JP
Japan
Prior art keywords
molding
lead
resin
sealing
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22332587A
Other languages
Japanese (ja)
Inventor
Shoji Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22332587A priority Critical patent/JPS6465847A/en
Publication of JPS6465847A publication Critical patent/JPS6465847A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a molding resin, which flows out of molding parts after a sealing and a molding are performed, from adhering on leads by a method wherein a groove interpenetrated to the molding parts is provided at an opposed part to the unnecessary lead of a lead frame along the unnecessary lead. CONSTITUTION:A lead frame 2 is set at a prescribed position on a molding device main body 7 and one half of the main body 7 is set on the main body 7 in such a way as to cover the lead frame 2. A resin molding is performed at molding parts 8, but a groove 11 interpenetrated to the molding parts 8 is provided at an opposed part to an unnecessary lead 4 of the lead frame 2 of the main body 7 along the unnecessary lead 4. The air remained at the time of resin sealing and resin molding is exhausted to the outside passing through this groove 11. As an necessary resin 6 is removed along with the unnecessary lead 4 when the lead 4 is removed, a work is simplified.
JP22332587A 1987-09-07 1987-09-07 Sealing/molding device for semiconductor electronic component Pending JPS6465847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22332587A JPS6465847A (en) 1987-09-07 1987-09-07 Sealing/molding device for semiconductor electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22332587A JPS6465847A (en) 1987-09-07 1987-09-07 Sealing/molding device for semiconductor electronic component

Publications (1)

Publication Number Publication Date
JPS6465847A true JPS6465847A (en) 1989-03-13

Family

ID=16796383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22332587A Pending JPS6465847A (en) 1987-09-07 1987-09-07 Sealing/molding device for semiconductor electronic component

Country Status (1)

Country Link
JP (1) JPS6465847A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (en) * 1975-03-03 1980-05-10
JPS5923554A (en) * 1982-07-30 1984-02-07 Hitachi Ltd Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (en) * 1975-03-03 1980-05-10
JPS5923554A (en) * 1982-07-30 1984-02-07 Hitachi Ltd Lead frame for semiconductor device

Similar Documents

Publication Publication Date Title
JPS51131274A (en) Tip bonding method
MY117837A (en) Lead frame with slots and a method for molding integrated circuit packages
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS6465847A (en) Sealing/molding device for semiconductor electronic component
DE3468949D1 (en) Device for controlling the drive of the movement of tools, especially of the mould parts of an injection moulding machine
JPS538884A (en) Process and apparatus for assembling automobile
JPS57158174A (en) Car assembly method and its device
JPS5764956A (en) Semiconductor device
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS533165A (en) Wire bonding apparatus
JPS5275180A (en) Package for integrated circuits
JPS53133371A (en) Lead frame of plastic package for integrated circuit
JPS57105872A (en) Magnetic disc device
JPS5298472A (en) Lead frame for resin molding
JPS52827A (en) Method for bonding metals to polyolefins
KR920005449B1 (en) Sealing/molding device for semiconductor electronic component
JPS53136962A (en) Frame for semiconductor device
JPS52127007A (en) Voice recognition method
JPS528636A (en) Method for mounting the upper and lower frames of sliding door
JPS5441073A (en) Frame potting method of ic chips on substrate and automatic potting device for the same
JPS5414676A (en) Carrier tape and electronic parts using it
JPS5285470A (en) Lead frame fixing jig for wire bonding
JPS6414007A (en) Deburring method and device therefor
JPS5214364A (en) Process for production of can-sealed power transistor
JPS54577A (en) Resin seal semiconductor device