JPS6463802A - Detecting method for positional slippage of mask and wafer - Google Patents

Detecting method for positional slippage of mask and wafer

Info

Publication number
JPS6463802A
JPS6463802A JP62221538A JP22153887A JPS6463802A JP S6463802 A JPS6463802 A JP S6463802A JP 62221538 A JP62221538 A JP 62221538A JP 22153887 A JP22153887 A JP 22153887A JP S6463802 A JPS6463802 A JP S6463802A
Authority
JP
Japan
Prior art keywords
wafer
mask
diffraction gratings
lfzp
detectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62221538A
Other languages
Japanese (ja)
Other versions
JPH054604B2 (en
Inventor
Ryoji Tanaka
Hidekazu Kono
Joji Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62221538A priority Critical patent/JPS6463802A/en
Priority to US07/145,355 priority patent/US4815854A/en
Publication of JPS6463802A publication Critical patent/JPS6463802A/en
Publication of JPH054604B2 publication Critical patent/JPH054604B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Control Of Position Or Direction (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To simplify an apparatus by a method wherein a difference between signals from two adjacent diffraction gratings is used as a positional slippage signal. CONSTITUTION:A mask 1 and a wafer 2 are set with a prescribed gap S between them, and an LFZP (Linear Fresnel Zone Plate) 3 whose focal distance is equal to the gap S is provided on the mask 1, while first and second diffraction gratings 4 and 5 having different pitches from each other and having a large width W are provided on the wafer 2 so that they are adjacent to each other in the direction of an arrow (x). A laser beam 6 is applied to the LFZP 3 on the mask 1, primary reflection diffracted lights from the first and second diffraction gratings 4 and 5 on the wafer 2 are detected by detectors 7 and 8, and a difference between outputs of these two detectors 7 and 8 is determined. According to the above-described constitution, an optical system comprising two lenses and an oscillating mirror are dispensed with, and therefore an apparatus is simplified.
JP62221538A 1987-01-19 1987-09-03 Detecting method for positional slippage of mask and wafer Granted JPS6463802A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62221538A JPS6463802A (en) 1987-09-03 1987-09-03 Detecting method for positional slippage of mask and wafer
US07/145,355 US4815854A (en) 1987-01-19 1988-01-19 Method of alignment between mask and semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221538A JPS6463802A (en) 1987-09-03 1987-09-03 Detecting method for positional slippage of mask and wafer

Publications (2)

Publication Number Publication Date
JPS6463802A true JPS6463802A (en) 1989-03-09
JPH054604B2 JPH054604B2 (en) 1993-01-20

Family

ID=16768288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221538A Granted JPS6463802A (en) 1987-01-19 1987-09-03 Detecting method for positional slippage of mask and wafer

Country Status (1)

Country Link
JP (1) JPS6463802A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1206035A2 (en) * 2000-11-09 2002-05-15 Nec Corporation Saw filter device and package for accommodating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1206035A2 (en) * 2000-11-09 2002-05-15 Nec Corporation Saw filter device and package for accommodating the same
EP1206035A3 (en) * 2000-11-09 2008-10-22 Nihon Dempa Kogyo Co., Ltd. Saw filter device and package for accommodating the same

Also Published As

Publication number Publication date
JPH054604B2 (en) 1993-01-20

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