JPS6463108A - Method and apparatus for dressing internal peripheral blade - Google Patents
Method and apparatus for dressing internal peripheral bladeInfo
- Publication number
- JPS6463108A JPS6463108A JP22126787A JP22126787A JPS6463108A JP S6463108 A JPS6463108 A JP S6463108A JP 22126787 A JP22126787 A JP 22126787A JP 22126787 A JP22126787 A JP 22126787A JP S6463108 A JPS6463108 A JP S6463108A
- Authority
- JP
- Japan
- Prior art keywords
- internal peripheral
- peripheral blade
- cut
- face
- dressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Abstract
PURPOSE:To eliminate the difference between the griding capabilities at both end faces of an internal peripheral blade by a method wherein the curve of the cut-off surface by the internal peripheral blade is detected and one end face of the internal peripheral blade and the internal peripheral surface of a grindstone part are dressed in response to the detection result. CONSTITUTION:During the cutting of silicon wafer 31, the cut-off surface 31a of a silicon block 30 or the bows of the cut-off surfaces 32 and 31a are intermittently checked. If the bow is detected, the grindstone part 21 of an internal peripheral blade 20 is dressed in accordance with the curvature. If the cut-off surfaces 32 or 31a of the silicon block 30 or of the silicon wafer 31 bows upwards or the cut-off surface 30, which is ground by the end face 21a of the grindstone part 21 of the internal peripheral blade 20, bends projectedly, dressing is done by abutting the peripheral surface 11a of a dressing tool 11 against the end face 21a of the internal peripheral blade 20.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221267A JPH0829495B2 (en) | 1987-09-04 | 1987-09-04 | Inner peripheral blade dressing method and inner peripheral blade dressing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221267A JPH0829495B2 (en) | 1987-09-04 | 1987-09-04 | Inner peripheral blade dressing method and inner peripheral blade dressing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6463108A true JPS6463108A (en) | 1989-03-09 |
JPH0829495B2 JPH0829495B2 (en) | 1996-03-27 |
Family
ID=16764098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62221267A Expired - Lifetime JPH0829495B2 (en) | 1987-09-04 | 1987-09-04 | Inner peripheral blade dressing method and inner peripheral blade dressing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0829495B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998007065A1 (en) * | 1996-08-08 | 1998-02-19 | Seiko Epson Corporation | Method for coating semiconductor element with resin, coating resin, and liquid crystal display device |
CN107971876A (en) * | 2017-11-09 | 2018-05-01 | 中国航发北京航科发动机控制系统科技有限责任公司 | A kind of end face reticulate pattern processing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930667A (en) * | 1982-08-06 | 1984-02-18 | Tokyo Seimitsu Co Ltd | Dressing device for slicer |
-
1987
- 1987-09-04 JP JP62221267A patent/JPH0829495B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930667A (en) * | 1982-08-06 | 1984-02-18 | Tokyo Seimitsu Co Ltd | Dressing device for slicer |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998007065A1 (en) * | 1996-08-08 | 1998-02-19 | Seiko Epson Corporation | Method for coating semiconductor element with resin, coating resin, and liquid crystal display device |
CN107971876A (en) * | 2017-11-09 | 2018-05-01 | 中国航发北京航科发动机控制系统科技有限责任公司 | A kind of end face reticulate pattern processing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0829495B2 (en) | 1996-03-27 |
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