JPS6461089A - Surface mounting structure of printed board - Google Patents

Surface mounting structure of printed board

Info

Publication number
JPS6461089A
JPS6461089A JP21986387A JP21986387A JPS6461089A JP S6461089 A JPS6461089 A JP S6461089A JP 21986387 A JP21986387 A JP 21986387A JP 21986387 A JP21986387 A JP 21986387A JP S6461089 A JPS6461089 A JP S6461089A
Authority
JP
Japan
Prior art keywords
solder
lead wire
pad
rise
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21986387A
Other languages
Japanese (ja)
Inventor
Yasunori Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21986387A priority Critical patent/JPS6461089A/en
Publication of JPS6461089A publication Critical patent/JPS6461089A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To make solder connection between a lead wire and a connecting pad rigid, by providing a preventing means for rise-up of solder on the surface of the lead wire in the vicinity of the end part of an electronic component. CONSTITUTION:A resin layer 11 comprising the same resin, which is used for resin molding, is applied on a lead wire, which is guided out of a resin molded body 4, in the vicinity of the molded body 4. A cream state solder 3 is applied on the surface of a lead-wire connecting pad 2 with a screen printing machine. The device is introduced into a heating furnace under the state the lead wire 5 is provided on the pad 2. The fused solder 3 tends to rise up on the lead wire 5 from the connecting pad 2. Since the lead wire 5 is covered with the resin layer 11, however, the rise-up of the solder 3 is prevented. Therefore, the sufficient amount of the solder 5 remains on the pad 2. The surface of the pad 2 is activated with the flux included in the solder. Thus, the lead wire 5 and the pad 2 are sufficiently connected with the solder.
JP21986387A 1987-09-01 1987-09-01 Surface mounting structure of printed board Pending JPS6461089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21986387A JPS6461089A (en) 1987-09-01 1987-09-01 Surface mounting structure of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21986387A JPS6461089A (en) 1987-09-01 1987-09-01 Surface mounting structure of printed board

Publications (1)

Publication Number Publication Date
JPS6461089A true JPS6461089A (en) 1989-03-08

Family

ID=16742235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21986387A Pending JPS6461089A (en) 1987-09-01 1987-09-01 Surface mounting structure of printed board

Country Status (1)

Country Link
JP (1) JPS6461089A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0658074A1 (en) * 1993-12-06 1995-06-14 Koninklijke Philips Electronics N.V. Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board
FR2797554A1 (en) * 1999-08-12 2001-02-16 Valeo Electronique METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED THEREBY
JP2012002242A (en) * 2010-06-14 2012-01-05 Denso Corp Device for control of automatic transmission

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0658074A1 (en) * 1993-12-06 1995-06-14 Koninklijke Philips Electronics N.V. Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board
FR2797554A1 (en) * 1999-08-12 2001-02-16 Valeo Electronique METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED THEREBY
WO2001013687A1 (en) * 1999-08-12 2001-02-22 Valeo Electronique Method for assembling electronic components on a support and resulting device
JP2012002242A (en) * 2010-06-14 2012-01-05 Denso Corp Device for control of automatic transmission

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