JPS646054U - - Google Patents
Info
- Publication number
- JPS646054U JPS646054U JP1987101134U JP10113487U JPS646054U JP S646054 U JPS646054 U JP S646054U JP 1987101134 U JP1987101134 U JP 1987101134U JP 10113487 U JP10113487 U JP 10113487U JP S646054 U JPS646054 U JP S646054U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- light emitting
- chip
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987101134U JPH0644117Y2 (ja) | 1987-06-30 | 1987-06-30 | 2色発光ダイオ−ド素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987101134U JPH0644117Y2 (ja) | 1987-06-30 | 1987-06-30 | 2色発光ダイオ−ド素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS646054U true JPS646054U (US06818201-20041116-C00086.png) | 1989-01-13 |
JPH0644117Y2 JPH0644117Y2 (ja) | 1994-11-14 |
Family
ID=31329850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987101134U Expired - Lifetime JPH0644117Y2 (ja) | 1987-06-30 | 1987-06-30 | 2色発光ダイオ−ド素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0644117Y2 (US06818201-20041116-C00086.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0539270U (ja) * | 1991-10-30 | 1993-05-28 | ダイワ精工株式会社 | 覆面型魚釣用リ−ル |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS531196A (en) * | 1976-06-25 | 1978-01-07 | Hitachi Metals Ltd | Static regenerating furnace for active carbon |
JPS5891688A (ja) * | 1981-11-26 | 1983-05-31 | Toshiba Corp | 二色発光ダイオ−ドおよびその製造方法 |
JPS61181176A (ja) * | 1985-02-06 | 1986-08-13 | Toshiba Corp | 光半導体装置 |
JPS6255975A (ja) * | 1985-09-05 | 1987-03-11 | Mitaka Denshi Kagaku Kenkyusho:Kk | Led多色発光システム |
JPS6247154U (US06818201-20041116-C00086.png) * | 1985-09-10 | 1987-03-23 |
-
1987
- 1987-06-30 JP JP1987101134U patent/JPH0644117Y2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS531196A (en) * | 1976-06-25 | 1978-01-07 | Hitachi Metals Ltd | Static regenerating furnace for active carbon |
JPS5891688A (ja) * | 1981-11-26 | 1983-05-31 | Toshiba Corp | 二色発光ダイオ−ドおよびその製造方法 |
JPS61181176A (ja) * | 1985-02-06 | 1986-08-13 | Toshiba Corp | 光半導体装置 |
JPS6255975A (ja) * | 1985-09-05 | 1987-03-11 | Mitaka Denshi Kagaku Kenkyusho:Kk | Led多色発光システム |
JPS6247154U (US06818201-20041116-C00086.png) * | 1985-09-10 | 1987-03-23 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0539270U (ja) * | 1991-10-30 | 1993-05-28 | ダイワ精工株式会社 | 覆面型魚釣用リ−ル |
Also Published As
Publication number | Publication date |
---|---|
JPH0644117Y2 (ja) | 1994-11-14 |