JPS646038U - - Google Patents
Info
- Publication number
- JPS646038U JPS646038U JP1987100847U JP10084787U JPS646038U JP S646038 U JPS646038 U JP S646038U JP 1987100847 U JP1987100847 U JP 1987100847U JP 10084787 U JP10084787 U JP 10084787U JP S646038 U JPS646038 U JP S646038U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- conductive pattern
- chip
- chip mount
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100847U JPS646038U (US20050065096A1-20050324-C00069.png) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100847U JPS646038U (US20050065096A1-20050324-C00069.png) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646038U true JPS646038U (US20050065096A1-20050324-C00069.png) | 1989-01-13 |
Family
ID=31329295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987100847U Pending JPS646038U (US20050065096A1-20050324-C00069.png) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646038U (US20050065096A1-20050324-C00069.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0922961A (ja) * | 1995-07-06 | 1997-01-21 | Nec Corp | Ｂｇａ型半導体装置 |
| JP2007059837A (ja) * | 2005-08-26 | 2007-03-08 | Stanley Electric Co Ltd | 表面実装型ｌｅｄ |
-
1987
- 1987-06-30 JP JP1987100847U patent/JPS646038U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0922961A (ja) * | 1995-07-06 | 1997-01-21 | Nec Corp | Ｂｇａ型半導体装置 |
| JP2007059837A (ja) * | 2005-08-26 | 2007-03-08 | Stanley Electric Co Ltd | 表面実装型ｌｅｄ |
