JPS645882Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a draining and drying device that uses centrifugal force to remove and dry drippings adhering to the surface of a semiconductor material such as a semiconductor silicon wafer or a glass photomask.

This device is used to drain and dry semiconductor materials that have been washed with water, and consists of a rotor that is driven to rotate and a casing that surrounds it.A cage-shaped carrier that houses the semiconductor material is supported on the substrate of the rotor. A carrier holder is provided. A lid with an intake port in the center is installed on the casing, and an exhaust port is provided on the casing peripheral wall. Then, due to the centrifugal force caused by the rotation of the rotor, water droplets adhering to the semiconductor material in the carrier are blown toward the peripheral wall, and since the central area of the rotor becomes negative pressure, air is sucked through the inlet port of the lid. , the air flows circumferentially within the casing and exits through the exhaust port, and the semiconductor material is dried by this air flow.

As a result, water droplets adhere to the peripheral wall of the casing,
At the same time, dirt and grime also adhere to it. However, in this type of device, the air that is drawn into the rotor and flows inside the casing does not necessarily flow in the circumferential direction; instead, there is a flow that bounces upward from the casing bottom plate, and a convection flow that bounces off the peripheral wall and rises and flows radially inward. However, such a flow brings moisture and dirt on the bottom plate and peripheral wall of the casing back to the semiconductor material, which has the drawback of lowering drying efficiency and impairing the cleaning effect.

The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and therefore to provide a drain drying device that can enhance the drying effect and prevent soil retention.

The feature of the drain drying device according to the present invention is that a plurality of blades are fixed in a well-balanced manner to the underside of the rotor substrate, thereby preventing the air flow from bouncing off the casing bottom plate and actively draining water. That's true.

Next, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, this draining/drying device consists of a rotating rotor 1, a casing 2, and a lid 3 above the casing, and these members are housed in an exterior case 4. 5 is a support portion that supports the carrier. A semiconductor material to be processed is housed in a carrier and is supported by a support portion 5 on a substrate 1a of a rotor 1. . There is an intake port 7 in the center of the lid 3, into which a mesh is stretched. An exhaust port 8 is provided at a suitable position on the peripheral wall 2a of the casing 2, and air introduced from the intake port by rotation of the rotor 1 circulates inside the casing 2 and flows out from the exhaust port 8. As shown in FIG. 2, the center of the rotor 1 is connected to a main shaft 9, and the main shaft 9 is configured to be rotated by a motor or the like. 3a is a sealing material, and 3b is an intake air guide attached to the bottom surface of the lid.

The feature of the present invention is that, as shown in FIGS. 2 and 4, a plurality of blades 10 are fixed to the lower surface of the substrate 1a of the rotor 1, and these blades are designed to maintain dynamic balance. are provided and preferably arranged at equal angular intervals and symmetrically about the main axis 9 of the rotor. In FIG. 4, two blades 10 are attached to the lower surface of the rotor, but as shown in FIG. 5, three or several other blades may be attached at equal intervals around the main shaft. Preferably, as clearly shown in FIG. 2, a guide vane 11 is placed between the bottom plate 2b of the casing 2 and the base plate 1a of the rotor, which guides the airflow descending to the bottom plate 2b and also guides the air flow above the bottom plate. This prevents the airflow from bouncing upwards. When such a guide vane 11 is present, the height t of the vane 10 on the lower surface of the rotor is determined by taking the guide vane 11 into consideration.

As shown in FIGS. 2 and 3, it is preferable that the distance between the rotor 1 and the peripheral wall of the casing gradually increase in the direction of rotation of the rotor toward the exhaust port 8, and to improve drainage. Therefore, it is preferable that the bottom plate 2b of the casing also gradually descends toward the exhaust port 8.

When draining and drying a semiconductor material using this device, the semiconductor material is housed in the carrier, and the carrier is set on the support part 5 of the rotor, and the lid 3 is opened.
, and rotate rotor 1. As the rotor rotates, each semiconductor material is also rotated, and water droplets attached to it are blown away by centrifugal force.
Draining is done. At the same time, the central area of the rotor 1 is under negative pressure, fresh air enters through the inlet 7 and flows radially outwards through the semiconductor material and circumferentially along the peripheral wall 2a of the casing 2, It is discharged from the exhaust port 8. The semiconductor material is thus dried by this air flow.

In this device, vanes 10 are attached to the lower surface of the rotor 1, so that the air under the rotor is forcibly moved, and the water droplets and air stagnant on the guide vanes 11 below are moved downward. It moves towards the bottom plate 2b of the casing. Such air flow actively moves water droplets 12 adhering to the guide vanes 11 and the bottom plate 2b toward the exhaust port 8, thus improving drainage. Furthermore, since airflow is forcibly generated downward in the circumferential direction on the lower surface of the rotor, it serves to prevent convection from rising along the casing peripheral wall 2a, and removes moisture and dirt attached to the bottom plate and peripheral wall of the casing. There is very little chance of it returning to the semiconductor material on the rotor.

Therefore, according to the present invention, in order to improve the drainage of water droplets adhering to the bottom plate of the casing and the guide vanes thereon, and to prevent convection within the casing,
Dirt and moisture on the bottom plate and peripheral wall of the casing are prevented from splashing back onto the semiconductor material, and the drying efficiency of the semiconductor material can be improved.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view of a drain dryer according to an example of the present invention, Fig. 2 is a schematic sectional view thereof, Fig. 3 is a plan view showing the inside thereof, and Fig. 4 is a line taken along the line of Fig. 2. FIG. 5 is a sectional view similar to FIG. 4 showing another embodiment, and FIG. 6 is a partially enlarged sectional view showing the operating state. In the figure, 1...rotor, 2...casing, 2a
... Peripheral wall of the casing, 2b... Bottom plate of the casing, 5... Support portion, 10... Vane, 11... Guide vane.

Claims (1)

[Claims for Utility Model Registration] (1) In a drain drying device including a rotor installed in a casing and equipped with a supporting part for a carrier containing a semiconductor material such as a silicon wafer, a balance is provided on the lower surface of the substrate of the rotor. A drain drying device that is often characterized by having multiple blades fixed to it. (2) Utility model registration Claim 1: The drain dryer according to claim 1, wherein the blades are arranged at equal angular intervals or symmetrically.