JPS63265430A - Moisture removing drier for semiconductor material - Google Patents

Abstract

PURPOSE:To move an air current forward and prevent bouncing from a bottom plate, and to obviate the generation of fouling by mounting a plurality of air guides onto a substrate for a rotor turned in a casing while forming a vent hole in each area of the rotor surrounded by the air guide. CONSTITUTION:Vent holes 11 are shaped into each area surrounded by respective air guide 5 in a substrate 10 for a rotor 1. Consequently, air currents are also generated in space surrounded by the air guides 5 in the rotor. As a result, when a semiconductor material is dried for hydro-extracting, the semiconductor material is housed into a carrier, the carrier is installed into a cradle and set to a support section for the rotor, and a cover 3 is closed and the rotor 1 is rotated. Moisture adhering on the semiconductor material is scattered to the periphery by centrifugal force at the time of first acceleration, and moisture is removed. The central section of the rotor is brought to negative pressure during revolution, fresh air flows in from a suction port 6, flows to the outside in the radial direction through sections among wafers and flows in the circumferential direction along the peripheral wall of a casing, and is discharged from an exhaust port 7, and the wafers are dried by the air currents. Accordingly, the positions of generation of fouling are decreased while the rotor is lightened, thus improving acceleration characteristics.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention is an improvement in a drain drying device for removing and drying moisture attached to the surface of semiconductor materials such as silicon sea urchins and glass photomasks using centrifugal force. Regarding.

(Prior Art) This type of dewatering drying device consists of a casing and a rotor that is rotated within the casing, and in a preferred form, a plurality of air guides are installed on the base of the rotor, and the semiconductor material to be dried is placed in a carrier. and is further set in a cradle and attached at a predetermined position between the air guides.

A lid with an intake port in the center is installed on the casing, and exhaust ports are provided at appropriate positions on the peripheral wall of the casing, so that moisture adhering to the semiconductor material is blown away toward the peripheral wall by the centrifugal force caused by the rotation of the rotor. , and the central region of the rotor is under negative pressure so that air is drawn in through the inlet, flows circumferentially within the casing and is discharged through the outlet, the air flow drying the semiconductor material.

Therefore, in addition to water droplets, dirt and grime adhere to the casing peripheral wall, and as these drop down and accumulate on the bottom of the casing, the airflow that bounces back from the bottom removes the moisture and dirt that had accumulated on the bottom. In some cases, the contaminants were transferred back to the semiconductor material.

In order to prevent this, some have provided guide vanes between the rotor and the casing bottom plate, or have vanes on the lower surface of the rotor substrate, but these have had the following problems.

(Problems to be Solved by the Invention) In a device in which guide vanes are provided between the rotor and the bottom cutout in order to promote the downward movement of airflow and prevent air from rebounding from the bottom plate of the casing, cleaning is not easy due to the presence of the guide vanes. Also, dirt adheres to the guide vanes, causing new dirt.

Further, in the case where the blades are fixed to the lower surface of the rotor, the weight of the rotor increases, and therefore the inertia increases accordingly, which deteriorates the acceleration characteristics of the rotor and makes water drainage difficult. Furthermore, with conventional equipment, air gets trapped inside the air guide above the rotor.

6 The object of the present invention is to solve the above problems, and therefore promotes airflow to prevent splashing from the bottom, prevents dirt from forming, and improves the acceleration characteristics of the rotor. Another object of the present invention is to provide a preferred device for draining and drying semiconductor materials.

(Means for Solving the Problems) The structure that characterizes the drain drying device according to the present invention is that a plurality of air guides are installed on the substrate of a rotor that is rotated within a casing, and a rotor surrounded by each air guide is A ventilation hole was formed in each area to create a downward airflow through the rotor.

(Effects of the above means) It promotes airflow downward through the ventilation holes, prevents the airflow from bouncing back from the bottom, and also prevents the air from becoming a source of contamination because the air inside the air guide also circulates. 1 ventilation holes make the rotor lighter, reducing inertia and improving acceleration characteristics.

(Example) Next, an example of the present invention will be described with reference to the drawings. Figures 1 and 2 show the overall structure of this drain dryer, in which (1) is a rotating rotor, (2)
is a casing surrounding it, and a lid (3) that can be opened and closed is installed on the casing. These members are housed in an exterior case (4). Rotor board (1
0) A support part is provided on the top in which a cradle containing a carrier is set, and each support part is arranged between air guides (5) provided on the substrate.6 In the illustrated example, four air guides are provided. (5) and thus there are four supports. Usually the air guide (5) consists of a bent plate.

There is an air intake port (6) in the center of the lid (3), into which a filter is placed. An exhaust port (7) is provided at a suitable position in the casing (2). Air introduced from the intake port (6) due to the rotation of the rotor (1) circulates within the casing (2) and flows out from the exhaust port (7). As shown in FIG. 3, the center of the rotor substrate (10) is connected to a main shaft (8), and the main shaft is rotated by a motor or the like. Preferably, the bottom plate of the casing is high at the center through which the main shaft (8) passes and is low at one periphery.

As shown in Fig. 1, the feature of this drain drying device is that ventilation holes (11) are formed in each area surrounded by each air guide (5) on the rotor substrate (lO). This allows airflow to also occur in the space surrounded by the air guide (5) inside the rotor.

The shape of the ventilation hole (11) is preferably a circular hole as shown in FIG. 4 because it is easy to form, but it may have another shape. For example, it may have a substantially trapezoidal shape as shown in FIG. In any case, the holes must be provided in a well-balanced manner, and therefore, it is preferable that the holes be provided point-symmetrically with respect to the center of the substrate (10).

Incidentally, such ventilation holes (11) may also be formed in the area between the air guides (5), that is, in the support part (12) where the cradle is set, as shown in FIG. It has the advantage of being lighter and having better speed rise characteristics.

The vent hole (11) formed in the rotor preferably has an inner circumferential surface (lla) sloped to promote airflow through the vent hole, as shown in FIG. As shown in the figure, a protrusion (llb) may be provided along the edge of the lower surface of the vent hole (11). This protrusion may be partially present.

When draining and drying semiconductor materials using this equipment,
A semiconductor material is placed in a carrier, the carrier is mounted in a cradle, and the carrier is set on the rotor support, the lid (3) is closed, and the rotor (1) is rotated. Moisture adhering to the semiconductor material is blown away by the centrifugal force during the initial acceleration, and during the 0 revolutions when the water is drained, the center of the rotor becomes negative pressure, and fresh air flows in from the intake port (6). The air flows radially outwardly between the wafers, flows circumferentially along the peripheral wall of the casing, is discharged through the exhaust port (7), and is dried by the air flow.

Moisture adhering to the peripheral wall of the casing descends and accumulates on the bottom of the casing, but the air flow inside the casing is directed not only in the circumferential direction but also through one ventilation hole (11
) since there is a downward flow through the air guide (5)
The air does not stagnate in the area surrounded by the bottom, and the moisture on the bottom is blown toward the outlet, suppressing the airflow that rolls back upward from the bottom. Therefore, moisture and dirt on the casing bottom plate are not lifted up and treated as semiconductor materials again.

(Effects of the Invention) As described above, according to the present invention, air flow can be promoted to prevent splashing from the casing bottom plate, and cleaning is easy because there is no need to provide guide vanes under the rotor. Moreover, since airflow is also generated within the air guide, there are no areas where air stagnates, and therefore there are fewer spots where dirt can occur.

It also makes the rotor lighter and improves acceleration characteristics.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the main parts of an example of the device of the present invention. Fig. 2 is a perspective view of this drain drying device, Fig. 3 is a schematic vertical sectional view thereof, Fig. 4 is a plan view of the main part shown in Fig. 1, and Fig. 5
The figure is a plan view of the main part of another embodiment, and Figure 6 is line B in Figure 4.
-B sectional view, and FIG. 7 is a sectional view similar to FIG. 6 showing another example. In the figure, l: rotor, 5: air guide, 10: rotor substrate, 11: ventilation hole 1 Yukihisa Asano; ゛ Figure 1 Figure 3 Figure 6 Figure 7

Claims (3)

[Claims] (1) A plurality of air guides are installed on a substrate of a rotor that rotates within a casing, and a carrier containing a semiconductor material is placed in a cradle and installed at a predetermined position between the air guides. 1. An apparatus for draining and drying semiconductor materials, characterized in that each area of the rotor surrounded by each of the air guides is formed with a vent hole for allowing downward airflow. (2) The drain drying device according to claim 1, wherein a protrusion is provided along the edge of the lower surface of the ventilation hole. (3) The drain drying device according to claim 1, wherein the inner circumferential surface of the vent hole is sloped to promote airflow.