JPS6458469A - Die for wire electric discharge machine - Google Patents
Die for wire electric discharge machineInfo
- Publication number
- JPS6458469A JPS6458469A JP21041487A JP21041487A JPS6458469A JP S6458469 A JPS6458469 A JP S6458469A JP 21041487 A JP21041487 A JP 21041487A JP 21041487 A JP21041487 A JP 21041487A JP S6458469 A JPS6458469 A JP S6458469A
- Authority
- JP
- Japan
- Prior art keywords
- divided
- projections
- face
- die
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 abstract 3
- 238000003780 insertion Methods 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 2
- 238000003754 machining Methods 0.000 abstract 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
PURPOSE:To maintain wire positioning accuracy by providing projections on one face of the opposed faces of a divided die so that the projections contact the other face at points or a line, and a wire insertion hole is not enlarged even if dirt particles enter the gap between divided dies. CONSTITUTION:Projections 1-1 are provided on one opposed face 1-2 of one divided die body 1, and brought into contact with the other opposed face 1-3 of the other divided die body 1 at points or on a line. A projection 2-10 of the same shape as the projection 1-1 is provided on a die body 2. The height of these projections is designed to be larger than the diameter of dirt particles produced by wire electric discharge machining, so that the mutual approach of divided dies can be performed without hindrance even if the dirt particles enter the gap between the opposed faces 1-2 and 1-3 of the divided die. As a result, a wire insertion hole is not enlarged, and the wire positioning accuracy is thus not reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21041487A JPS6458469A (en) | 1987-08-25 | 1987-08-25 | Die for wire electric discharge machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21041487A JPS6458469A (en) | 1987-08-25 | 1987-08-25 | Die for wire electric discharge machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6458469A true JPS6458469A (en) | 1989-03-06 |
Family
ID=16588922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21041487A Pending JPS6458469A (en) | 1987-08-25 | 1987-08-25 | Die for wire electric discharge machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6458469A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008023668A (en) * | 2006-07-21 | 2008-02-07 | Sodick Co Ltd | Wire positioning device |
| WO2011036924A1 (en) * | 2009-09-24 | 2011-03-31 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method |
-
1987
- 1987-08-25 JP JP21041487A patent/JPS6458469A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008023668A (en) * | 2006-07-21 | 2008-02-07 | Sodick Co Ltd | Wire positioning device |
| WO2011036924A1 (en) * | 2009-09-24 | 2011-03-31 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method |
| JP5172019B2 (en) * | 2009-09-24 | 2013-03-27 | 三菱電機株式会社 | Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method |
| US9950379B2 (en) | 2009-09-24 | 2018-04-24 | Mitsubishi Electric Corporation | Wire electric discharge machining apparatus |
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